MATERIAL DATA SHEET Material # SOD-123 series Product Line Date 2013/3/8 Rev. date D No. 1 2 3 Construction element Lead Frame Wire Mold Compound Material group Material weight (mg) SDI KangQiang HuaWei 2.469 0.01 6.783 4 Wafer YanDong 0.350 5 Plating YSTIN 0.142 Total weight 9.754 Comchip Technology CO., LTD. Material CAS if applicable Average mass (%) Nickel 7440-02-0 41.00% Manganese 7439-96-5 0.70% Cobalt 7440-48-4 0.40% Silicon 7440-21-3 0.20% Chromium 7440-47-3 0.05% Copper 7440-50-8 0.05% Carbon 7440-44-0 0.01% Iron 7439-89-6 56.59% Silver 7440-22-4 1.00% Copper 7440-50-8 100% Silica Fused 60676-86-0 80.00% Epoxy resin 29690-82-2 10.00% Phenolic Resin 9003-35-4 7.50% Brominated epoxy resin 40039-93-8 2.00% Carbon Black 1333-86-4 0.50% Silicon 7440-21-3 95.50% Gold 7440-57-5 3.50% Aluminum 7429-90-5 1.00% Tin 7440-31-5 100.00% www.comchiptech.com TEL: +886-2-86776675 FAX: +886-2-86776672 1/1 Sum(%) 25.313 0.10 69.54 3.59 1.46 Traces