For more information, please visit the product page. date 11/07/2014 page 1 of 30 SERIES: NEB-N │ DESCRIPTION: FULLY REGULATED ADVANCED BUS CONVERTERS GENERAL CHARACTERISTICS FEATURES • • • • • • • pin and function compatible with Architects of Modern Power™ product standards • industry standard eighth-brick 58.4 x 22.7 x 10.2 mm (2.299 x 0.894 x 0.402 in) • industry-leading power density for telecom and datacom 129~147W / sq. in • high efficiency, typ. 95.2% at half load, 12 Vout • fully regulated advanced bus converter from 36~75Vin • 2,250 Vdc input to output isolation • fast feed forward regulation to manage line transients • optional baseplate for high temperature applications • droop load sharing with 10% current share accuracy • 2.9 million hours MTBF • ISO 9001/14001 certified supplier industry standard footprint isolated topology high power density fast transient response high conversion efficiency wide range of input and output characteristics available MODEL input voltage output voltage output current output wattage (Vdc) (Vdc) max (A) max (W) NEB-264NWA-AN 36~75 12 22 264 NEB-300NMA-AN 40~60 12 25 300 NEB-261NWB-AN 36~75 12.45 22 261 cui.com For more information, please visit the product page. CUI Inc │ SERIES: NEB-N │ DESCRIPTION: FULLY REGULATED ADVANCED BUS CONVERTERS date 11/07/2014 │ page 2 of 30 PART NUMBER KEY NEB- XXX N X X - X X X X - XXX -ES X Base Number Engineering Phase: A~Z Design Output Power: 1~999 Engineering Sample: ES No Digital Interface Firmware Configuration: 000~ZZZ Input Voltage Range: W = wide (36~75 V) M = medium (40~60 V) Heatsink Option: "blank" = open frame H = heatsink flat G = heatsink with GND pin Nominal Output Voltage: A = 12.0 V B = 12.45 V C = 9.6 V Load Sharing Function: D = 9.0 V D = Vout droop Enable Logic Sense: N = negative logic P = positive logic Pin Description: A = 5.33 mm (0.210 in.) B = 4.57 mm (0.180 in.) C = 3.69 mm (0.145 in.) D = 2.79 mm (0.110 in.) S = SMT Example part number: NEB-264NWA-AN-001 Packaging: 20 converters(through hole pin)/tray, PE foam dissipative 20 converters(surface mount pin)/tray, Antistatic PPE 264 W output power, no digital pins wide input voltage range, 12.0 V output 5.33 mm pins, negative enable logic firmware revision 001 CONTENTS Part Number Key........................................................2 General Information...................................................3 Safety Specification....................................................3 Absolute Maximum Ratings..........................................4 Electrical Specification: 12V, 22A, 264W, 36~75Vin; NEB-264NWA-AN.....................5 12V, 25A, 300W, 40~60Vin; NEB-300NMA-AN.....................9 12.45V, 22A, 261W, 36~75Vin; NEB-261NWB-AN...............13 12.45 V, 25 A, 296 W, 40~60 Vin; NEB-296NMB-AN...............16 cui.com EMC Specification.........................................19 Operating Information...................................19 Thermal Consideration..................................21 Connections............................................22 Mechanical Information.................................23 Soldering Information...................................26 Delivery Package Information.........................27 Product Qualification Specification...................29 For more information, please visit the product page. CUI Inc │ SERIES: NEB-N │ DESCRIPTION: FULLY REGULATED ADVANCED BUS CONVERTERS date 11/07/2014 │ page 3 of 30 General Information Reliability The failure rate (λ) and mean time between failures (MTBF= 1/ λ) is calculated at max output power and an operating ambient temperature (TA) of +40°C. CUI Power Modules uses Telcordia SR-332 Issue 2 Method 1 to calculate the mean steady-state failure rate and standard deviation (σ). Telcordia SR-332 Issue 2 also provides techniques to estimate the upper confidence levels of failure rates based on the mean and standard deviation. Mean steady-state failure rate, λ Std. deviation, σ 421 n F ailures/h 60.9 nF ailures/h the responsibility of the installer to ensure that the final product housing these components complies with the requirements of all applicable safety standards and regulations for the final product. Component power supplies for general use should comply with the requirements in IEC/EN/UL 60950 1 Safety of Information Technology Equipment. Product related standards, e.g. IEEE 802.3af Power over Ethernet, and ETS 300132 2 Power interface at the input to telecom equipment, operated by direct current (dc) are based on IEC/EN/UL 60950 1 with regards to safety. CUI Power Modules DC/DC converters and DC/DC regulators are UL 60950-1 recognized and certified in accordance with EN 60950-1. The flammability rating for all construction parts of the products meet requirements for V-0 class material according to IEC 60695-11-10, Fire hazard testing, test flames – 50 W horizontal and vertical flame test methods. MTBF (mean value) for the NEB series = 2.91 Mh. MTBF at 90% confidence level = 2.37 Mh Compatability with RoHS requirements The products are compatible with the relevant clauses and requirements of the RoHS directive 2011/65/EU and have a maximum concentration value of 0.1% by weight in homogeneous materials for lead, mercury, hexavalent chromium, PBB and PBDE and of 0.01% by weight in homogeneous materials for cadmium. Isolated DC/DC converters Galvanic isolation between input and output is verified in an electric strength test and the isolation voltage (Viso) meets the voltage strength requirement for basic insulation according to IEC/EN/UL 60950-1. Exemptions in the RoHS directive utilized in CUI Power Modules products are found in the Statement of Compliance document. It is recommended to use a slow blow fuse at the input of each DC/DC converter. If an input filter is used in the circuit the fuse should be placed in front of the input filter. In the rare event of a component problem that imposes a short circuit on the input source, this fuse will provide the following functions: Safety Specification General Information CUI Power Modules DC/DC converters and DC/DC regulators are designed in accordance with the safety standards IEC60950-1, EN60950-1 and UL60950-1 Safety of Information Technology Equipment • Isolate the fault from the input power source so as not to affect the operation of other parts of the system • Protect the distribution wiring from excessive current and power loss thus preventing hazardous overheating IEC/EN/UL60950-1 contains requirements to prevent injury or damage due to the following hazards: The DC/DC converter output is considered as safety extra low voltage (SELV) if one of the following conditions is met: • • • • • • Electrical Shock Energy hazards Fire Mechanical and heat hazards Radiation hazards Chemical hazards On-board DC/DC converters and DC/DC regulators are defined as component power supplies. As components they cannot fully comply with the provisions of any safety requirements without “conditions of acceptability”. Clearance between conductors and between conductive parts of the component power supply and conductors on the board in the final product must meet the applicable safety requirements. Certain conditions of acceptability apply for component power supplies with limited stand-off (see Mechanical Information for further information). It is •The input source has double or reinforced insulation from the AC mains according to IEC/EN/UL 60950-1 •The input source has basic or supplementary insulation from the AC mains and the input of the DC/DC converter is maximum 60 Vdc and connected to protective earth according to IEC/EN/UL 60950-1 •The input source has basic or supplementary insulation from the AC mains and the DC/DC converter output is connected to protective earth according to IEC/EN/UL 60950-1 Non - isolated DC/DC regulators The DC/DC regulator output is SELV if the input source meets the requirements for SELV circuits according to IEC/ EN/UL 60950-1. cui.com For more information, please visit the product page. CUI Inc │ SERIES: NEB-N │ DESCRIPTION: FULLY REGULATED ADVANCED BUS CONVERTERS date 11/07/2014 │ page 4 of 30 Absolute Maximum Ratings parameter conditions/description min max units operating temperature (TP1) see thermal consideration section -40 +125 °C -55 +125 °C -0.5 +80 +65* V storage temperature (TS) input voltage (VI) typ isolation voltage (Viso) input to output test voltage, see note 1 2250 Vdc input voltage transient (Vtr) according to ETSI EN 300 132-2 and Telcordia GR1089-CORE +100 +80* V remote control pin voltage (VRC) see operating information section 18 V -0.3 Stress in excess of Absolute Maximum Ratings may cause permanent damage. Absolute Maximum Ratings, sometimes referred to as no destruction limits, are normally tested with one parameter at a time exceeding the limits in the Electrical Specification. If exposed to stress above these limits, function and performance may degrade in an unspecified manner. Note 1: Isolation voltage (input/output to base-plate) max 750 Vdc. * Applies for the narrow input version VI= 40-60 V Fundamental Circuit Diagram +IN Driver +OUT -OUT -IN Auxillary Supply Driver Control RC RC isolation Functional Description TP1, TP3 = -40 to +90ºC, VI = 36 to 75 V. Typical values given at: TP1, TP3 = +25°C, VI= 53 V, max IO , unless otherwise specified under Conditions Configuration File: 190 10-CDA 102 0315/001 parameter conditions/description min typ max units fault protection characteristics input under voltage lockout (UVLO) fault limit setpoint accuracy hysteresis delay output voltage - under voltage protection fault limit fault response time 0 200 V μs output voltage - over voltage protection fault limit fault response time 15.6 200 V μs over current protection (OCP) setpoint accuracy (IO) fault limit fault response time over temperature protection (OTP) fault limit hysteresis fault response time 0 -6 32 0.5 2 300 25 200 125 10 300 cui.com 1 6 V V V μs % A μs C C μs º º For more information, please visit the product page. CUI Inc │ SERIES: NEB-N │ DESCRIPTION: FULLY REGULATED ADVANCED BUS CONVERTERS date 11/07/2014 │ page 5 of 30 Electrical Specification 12 V, 22 A, 264 W TP1 = -40 to +90ºC, VI = 36 to 75V. Typical values given at: TP1 = +25°C, VI = 53 V, max IO, unless otherwise specified under Conditions. Additional Cin= 0.1 mF, Cout = 0.1 mF. See Operating Information section for selection of capacitor types. Configuration File: 19010-CDA 102 0315/001 parameter conditions/description min input voltage range (VI) typ 36 max units 75 V turn-off input voltage (VIoff) decreasing input voltage 32 33 34 V turn-on input voltage (VIon) increasing input voltage 34 35 36 internal input capacitance (CI) 11 output power (PO) 0 V μF 264 W efficiency (η) 50% of max IO max IO 50% of max IO, VI = 48 V max IO, VI = 48 V 94.7 94.5 95.2 94.8 power dissipation (Pd) max IO 15.5 input idling power (Pli) IO = 0 A, VI = 53 V 3.5 W input standby power (PRC) VI = 53 V (turned off with RC) 0.4 W switching frequency (fs) 0-100% of max IO 180 kHz output voltage setting and accuracy (VOi) TP1 = +25°C, VI = 53 V, IO = 12 A 11.88 output voltage tolerance band (VO) 0-100% of max IO idling voltage (VO) IO = 0 A line regulation (VO) max IO load regulation (VO) VI = 53 V, 1-100% of max IO load transient voltage deviation (Vtr) VI = 53 V, load step 25-75-25% of max IO, di/dt = 1 A/μs, Cout = 2.2 mF OSCON type ±350 mV load transient recovery time (ttr) VI = 53 V, load step 25-75-25% of max IO, di/dt = 1 A/μs, Cout = 2.2 mF OSCON type 200 µs ramp-up time (tr) - (from 10−90% of VOi) 10-100% of max IO 8 ms start-up time (ts) - (from VI connection to 90% of VOi) 10-100% of max IO 23 ms VI shut-down fall time (tf) (from VI off to 10% of VO) max IO IO = 0 A 0.7 6 ms s RC start-up time (tRC) max IO 12 ms RC shut-down fall time (tRC) (from RC off to 10% of VO) max IO IO = 0 A 3 6 ms s output current (IO) VO = 10.8 V, TP1 < max TP1 short circuit current (Isc) TP1 = 25ºC, see Note 1 recommended capacitive load (Cout) TP1 = 25ºC, see Note 2 output ripple & noise (VOac) See ripple & noise section, VOi over voltage protection (OVP) TP1 = +25°C, VI = 53 V, 10-100 % of max IO remote control (RC) sink current (note 3), see operating information trigger level, decreasing RC-voltage trigger level, increasing RC-voltage 22 V 11.76 12.24 V 11.88 12.12 V 100 200 mV 30 100 mV 24 25 22 A 26 A 1.1 0 A 2.2 6 mF 50 100 mVp-p 0.7 mA V V 15.6 2.6 2.9 1: OCP in hic-up mode 2: Low ESR-value 3: Sink current drawn by external device connected to the RC pin. Minimum sink current required to guarantee activated RC function. cui.com W 12.12 0 current limit threshold (Ilim) Note 12.0 % % % % V For more information, please visit the product page. CUI Inc │ SERIES: NEB-N │ DESCRIPTION: FULLY REGULATED ADVANCED BUS CONVERTERS date 11/07/2014 │ page 6 of 30 Typical Characteristics 12 V, 22 A, 264 W Efficiency Power Dissipation [W] 20 [%] 100 16 95 36 V 90 53 V 85 36 V 12 48 V 48 V 8 75 V 53 V 75 V 4 80 0 75 0 5 10 15 20 0 25 [A] 5 10 15 20 25 [A] Dissipated power vs. load current and input voltage at T P1 = +25°C. Efficiency vs. load current and input voltage at T P1 = +25°C. Output Characteristics Current Limit Characteristics [V] [V] 12.20 15.00 12.10 36 V 48 V 12.00 53 V 75 V 11.90 11.80 12.00 36 V 9.00 48 V 53 V 6.00 75 V 3.00 0.00 0 5 10 15 20 15 25 [A] Output voltage vs. load current at T P1 = +25°C. 18 21 24 27 [A] Output voltage vs. load current at I O > max I O , T P1 = +25°C. cui.com For more information, please visit the product page. CUI Inc │ SERIES: NEB-N │ DESCRIPTION: FULLY REGULATED ADVANCED BUS CONVERTERS date 11/07/2014 │ page 7 of 30 Typical Characteristics 12 V, 22 A, 264 W Start-up Start-up enabled by connecting V I at: T P1 = +25°C, V I = 53 V, I O = 22 A resistive load. Shut-down Top trace: output voltage (5 V/div). Bottom trace: input voltage (50 V/div). Time scale: (5 mS/div) Output Ripple & Noise Output voltage ripple at: T P1 = +25°C, V I = 53 V, I O = 22 A resistive load. Shut-down enabled by disconnecting V I at: T P1 = +25°C, V I = 53 V, I O = 22 A resistive load. Output Load Transient Response Trace: output voltage (20 mV/div). Time scale: (2 uS/div). Output voltage response to load current step- Top trace: output voltage (0.5 V/div). change (5.5 – 16.5 – 5.5 A) at: Bottom trace: load current (5 A/div). T P1 =+25°C, V I = 53 V. C O = 2.2 mF. Time scale: (0.5 mS/div) Input Voltage Transient Response Output voltage response to input voltage transient at: T P1 = +25°C, V I = 36-75 V, I O = 11 A resistive load, C O = 2.2 mF Top trace: output voltage (5 V/div). Bottom trace: input voltage (50 V/div). Time scale: (2 mS/div). Top trace: output voltage (2 V/div.). Bottom trace: input voltage (20 V/div.). Time scale: (0.5 ms/div.). cui.com For more information, please visit the product page. CUI Inc │ SERIES: NEB-N │ DESCRIPTION: FULLY REGULATED ADVANCED BUS CONVERTERS date 11/07/2014 │ page 8 of 30 Typical Characteristics 12 V, 22 A, 264 W Output Current Derating – Open frame [A] 25 3.0 m/s 20 2.0 m/s 15 1.5 m/s 1.0 m/s 10 0.5 m/s 5 Nat. Conv. 0 0 20 40 60 80 100 [°C] Available load current vs. ambient air temperature and airflow at V I = 53 V. See Thermal Consideration section. Output Current Derating – Base plate Thermal Resistance – Base plate [A] 25 [°C/W] 3.0 m/s 20 2.0 m/s 15 1.5 m/s 10 1.0 m/s 0.5 m/s 5 Nat. Conv. 6 5 4 3 2 1 0 0 0 20 40 60 80 0.0 100 [°C] Available load current vs. ambient air temperature and airflow at V I = 53 V. See Thermal Consideration section. Output Current Derating – Base plate + Heat sink [A] 25 0.5 1.0 1.5 2.0 2.5 3.0 [m/s] Thermal resistance vs. airspeed measured at the converter. Tested in wind tunnel with airflow and test conditions as per the Thermal consideration section. V I = 53 V. Output Current Derating – Cold wall sealed box A 3.0 m/s 25 20 2.0 m/s 20 15 1.5 m/s 10 1.0 m/s 0.5 m/s 5 10 5 Nat. Conv. 0 0 20 40 60 80 Tamb 85°C 15 0 100 [°C] 0 Available load current vs. base plate temperature. V I = 53 V. See Thermal Consideration section. Tested with Plate Fin Transverse heatsink, height 0.23 In, P0114 Thermal Pad. 20 40 60 80 100 [°C] Available load current vs. base plate temperature at 85ºC ambient. V I = 53 V. See Thermal Consideration section. cui.com For more information, please visit the product page. CUI Inc │ SERIES: NEB-N │ DESCRIPTION: FULLY REGULATED ADVANCED BUS CONVERTERS date 11/07/2014 │ page 9 of 30 Electrical Specification 12 V, 25 A, 300 W TP1 = -40 to +90ºC, VI = 40 to 60 V. Typical values given at: TP1 = +25°C, VI= 53 VI max IO, unless otherwise specified under Conditions. Additional Cout = 0.1 mF. See Operating Information section for selection of capacitor types. Configuration File: 19010-CDA1020315/002 parameter conditions/description min input voltage range (VI) typ 40 max units 60 V turn-off input voltage (VIoff) decreasing input voltage 36 37 38 V turn-on input voltage (VIon) increasing input voltage 38 39 40 V internal input capacitance (CI) 11 output power (PO) 0 μF 300 95.2 94.6 95.1 94.5 W efficiency (η) 50% of max IO max IO 50% of max IO, VI = 48 V max IO, VI = 48 V power dissipation (Pd) max IO 17 input idling power (Pli) IO = 0 A, VI = 53 V 4.4 input standby power (PRC) VI = 53 V (turned off with RC) 0.4 W switching frequency (fs) 0-100% of max IO 180 kHz output voltage setting and accuracy (VOi) TP1 = +25°C, VI = 53 V, IO = 12 A 11.88 output voltage tolerance band (VO) 0-100% of max IO 11.76 idling voltage (VO) IO = 0 A 11.88 12.12 V line regulation (VO) max IO 50 220 mV load regulation (VO) VI = 53 V, 1-100% of max IO 45 100 mV load transient voltage deviation (Vtr) VI = 53 V, load step 25-75-25% of max Io, di/dt = 1 A/μs, Cout = 2.5 mF OSCON type ±300 mV load transient recovery time (ttr) VI = 53 V, load step 25-75-25% of max Io, di/dt = 1 A/μs, Cout = 2.5 mF OSCON type 250 µs ramp-up time (tr) - (from 10−90% of VOi) 10-100% of max IO 8 ms start-up time (ts) - (from VI connection to 90% of VOi) 10-100% of max IO 23 ms VI shut-down fall time (tf) (from VI off to 10% of VO) max IO IO = 0 A 0.7 6 ms s RC start-up time (tRC) max IO 14 ms RC shut-down fall time (tRC) (from RC off to 10% of VO) max IO IO = 0 A 4 6 ms s output current (IO) 0 current limit threshold (Ilim) TP1 < max TP1 short circuit current (Isc) TP1 = 25ºC, see Note 1 recommended capacitive load (Cout) TP1 = 25ºC, see Note 2 output ripple & noise (VOac) See ripple & noise section, VOi over voltage protection (OVP) TP1 = +25°C, VI = 53 V, 10-100 % of max IO remote control (RC) sink current (note 3), see operating information trigger level, decreasing RC-voltage trigger level, increasing RC-voltage Note 12.0 27 30 % % % % 24 W 12.12 V 12.24 V 25 A 33 A 1.1 0 A 2.5 10 mF 70 140 mVp-p 15.6 2.6 2.9 1: OCP in hic-cup mode 2: Low ESR-value 3: Sink current drawn by external device connected to the RC pin. Minimum sink current required to guarantee activated RC function. cui.com W V 0.7 mA V V For more information, please visit the product page. CUI Inc │ SERIES: NEB-N │ DESCRIPTION: FULLY REGULATED ADVANCED BUS CONVERTERS date 11/07/2014 │ page 10 of 30 Typical Characteristics 12 V, 25 A, 300 W Efficiency Power Dissipation [%] 100 [W] 20 95 16 40 V 90 53 V 85 60 V 80 40 V 12 53 V 8 60 V 4 75 0 5 10 15 20 0 25 [A] 0 5 10 15 20 25 [A] Dissipated power vs. load current and input voltage at T P1 = +25°C. Efficiency vs. load current and input voltage at T P1 = +25°C. Output Characteristics Current Limit Characteristics [V] [V] 12.20 15.00 12.10 12.00 11.90 40 V 12.00 53 V 9.00 60 V 6.00 40 V 53 V 60 V 3.00 11.80 0 5 10 15 20 25 30 [A] 0.00 15 Output voltage vs. load current at T P1 = +25°C. 20 25 30 35 [A] Output voltage vs. load current at I O > max I O , T P1 = +25°C. cui.com For more information, please visit the product page. CUI Inc │ SERIES: NEB-N │ DESCRIPTION: FULLY REGULATED ADVANCED BUS CONVERTERS date 11/07/2014 │ page 11 of 30 Typical Characteristics 12 V, 25 A, 300 W Start-up Start-up enabled by connecting V I at: T P1 = +25°C, V I = 53 V, I O = 25 A resistive load. Shut-down Top trace: output voltage (5 V/div). Bottom trace: input voltage (50 V/div). Time scale: (10 mS/div) Output Ripple & Noise Output voltage ripple at: T P1 = +25°C, V I = 53 V, I O = 25 A resistive load. Shut-down enabled by disconnecting V I at: T P1 = +25°C, V I = 53 V, I O = 25 A resistive load. Output Load Transient Response Trace: output voltage (20 mV/div). Time scale: (2 uS/div). Output voltage response to load current step- Top trace: Output voltage (500 mV/div). change (6.25-18.75 -6.25 A) at: Bottom trace: load current (10 A/div). T P1 =+25°C, V I = 53 V. Time scale: (0.5 mS/div) Input Voltage Transient Response Output voltage response to input voltage transient at: T P1 = +25°C, V I = 40-60 V, I O = 25 A resistive load, C O = 3.3 mF Top trace: output voltage (5 V/div). Bottom trace: input voltage (20 V/div). Time scale: (1 mS/div). Top trace: output voltage (2 V/div.). Bottom trace: input voltage (20 V/div.). Time scale: (0.5 ms/div.). cui.com For more information, please visit the product page. CUI Inc │ SERIES: NEB-N │ DESCRIPTION: FULLY REGULATED ADVANCED BUS CONVERTERS date 11/07/2014 │ page 12 of 30 Typical Characteristics 12 V, 25 A, 300 W Output Current Derating – Open frame [A] 25 3.0 m/s 20 2.0 m/s 15 1.5 m/s 1.0 m/s 10 0.5 m/s 5 Nat. Conv. 0 0 20 40 60 80 100 [°C] Available load current vs. ambient air temperature and airflow at V I = 53 V. See Thermal Consideration section. Output Current Derating – Base plate Thermal Resistance – Base plate [°C/W] [A] 25 3.0 m/s 20 2.0 m/s 15 1.5 m/s 10 5 20 40 60 80 5 4 1.0 m/s 3 0.5 m/s 2 Nat. Conv. 1 0 0 6 0 100 [°C] 0.0 Available load current vs. ambient air temperature and airflow at V I = 53 V. See Thermal Consideration section. Output Current Derating – Base plate + Heat sink 0.5 1.0 1.5 2.0 2.5 3.0 [m/s] Thermal resistance vs. airspeed measured at the converter. Tested in wind tunnel with airflow and test conditions as per the Thermal consideration section. V I = 53 V. Output Current Derating – Cold wall sealed box [A] 25 [A] 30 3.0 m/s 20 15 10 5 2.0 m/s 25 1.5 m/s 20 1.0 m/s 15 0.5 m/s 10 Nat. Conv. Tamb 85°C 5 0 0 0 20 40 60 80 100 [°C] 0 Available load current vs. base plate temperature. V I = 53 V. See Thermal Consideration section. Tested with Plate Fin Transverse heatsink, height 0.23 In, P0114 Thermal Pad. 20 40 60 80 100 [°C] Available load current vs. base plate temperature at 85ºC ambient. V I = 53 V. See Thermal Consideration section. cui.com For more information, please visit the product page. CUI Inc │ SERIES: NEB-N │ DESCRIPTION: FULLY REGULATED ADVANCED BUS CONVERTERS date 11/07/2014 │ page 13 of 30 Electrical Specification 12.45 V, 22 A, 261 W TP1 = -40 to +90ºC, VI = 36 to 75V. Typical values given at: TP1 = +25°C, VI = 53 V, max IO, unless otherwise specified under Conditions. Additional Cin= 0.1 mF, Cout = 0.1 mF. See Operating Information section for selection of capacitor types. Configuration File: 19010-CDA 102 0315/014 parameter conditions/description min input voltage range (VI) typ 36 max units 75 V turn-off input voltage (VIoff) decreasing input voltage 32 33 34 V turn-on input voltage (VIon) increasing input voltage 34 35 36 internal input capacitance (CI) 11 output power (PO) 0 V μF 261 W efficiency (η) 50% of max IO max IO 50% of max IO, VI = 48 V max IO, VI = 48 V 94.7 94.5 95.2 94.8 power dissipation (Pd) max IO 15.3 input idling power (Pli) IO = 0 A, VI = 53 V 3.5 W input standby power (PRC) VI = 53 V (turned off with RC) 0.4 W switching frequency (fs) 0-100% of max IO 180 kHz output voltage setting and accuracy (VOi) TP1 = +25°C, VI = 53 V, IO = 0 A output voltage tolerance band (VO) 0-100% of max IO line regulation (VO) max IO load regulation (VO) VI = 53 V, 1-100% of max IO load transient voltage deviation (Vtr) VI = 53 V, load step 25-75-25% of max IO, di/dt = 1 A/μs, Cout = 2.2 mF OSCON type ±350 mV load transient recovery time (ttr) VI = 53 V, load step 25-75-25% of max IO, di/dt = 1 A/μs, Cout = 2.2 mF OSCON type 200 µs ramp-up time (tr) - (from 10−90% of VOi) 10-100% of max IO 23 ms start-up time (ts) - (from VI connection to 90% of VOi) 10-100% of max IO 38 ms VI shut-down fall time (tf) (from VI off to 10% of VO) max IO IO = 0 A 0.7 6 ms s RC start-up time (tRC) max IO 26 ms RC shut-down fall time (tRC) (from RC off to 10% of VO) max IO IO = 0 A 3.5 6 ms s 12.45 450 VO = 10.8 V, TP1 < max TP1 short circuit current (ISC) TP1 = 25ºC, see Note 1 24 recommended capacitive load (COut) TP1 = 25ºC, see Note 2 12.7 V 100 250 mV 600 700 mV output ripple & noise (VOac) See ripple & noise section, VOi over voltage protection (OVP) TP1 = +25°C, VI = 53 V, 10-100 % of max IO remote control (RC) sink current (note 3), see operating information trigger level, decreasing RC-voltage trigger level, increasing RC-voltage 25 22 A 26 A 7 0 A 2.2 6 mF 50 150 mVp-p 15.6 2.6 2.9 1: OCP in hic-cup mode 2: Low ESR-value 3: Sink current drawn by external device connected to the RC pin. Minimum sink current required to guarantee activated RC function. cui.com W V 0 current limit threshold (Ilim) 21 12.485 11.5 output current (IO) Note 12.415 % % % % V 0.7 mA V V For more information, please visit the product page. CUI Inc │ SERIES: NEB-N │ DESCRIPTION: FULLY REGULATED ADVANCED BUS CONVERTERS date 11/07/2014 │ page 14 of 30 Typical Characteristics 12.45 V, 40 A / 476 W, two products in parallel Efficiency Power Dissipation [W] 45 40 35 30 25 20 15 10 5 0 [%] 100 95 36 V 90 48 V 53 V 85 75 V 80 75 0 10 20 30 40 36 V 48 V 53 V 75 V 0 [A] 10 20 30 40 [A] Dissipated power vs. load current and input voltage at T P1 = +25°C Efficiency vs. load current and input voltage at T P1 = +25°C Output Characteristics Current Limit Characteristics [V] 13.0 [V] 12.6 12.5 11.0 12.4 36 V 12.3 48 V 9.0 12.2 53 V 12.1 75 V 7.0 36 V 48 V 53 V 75 V 5.0 12.0 11.9 3.0 11.8 0 10 20 30 40 40 [A] Output voltage vs. load current at T P1 , T P3 = +25°C 5VCTVWR Start-up enabled by connecting V I at: T P1 = +25°C, V I = 53 V, I O = 40 A resistive load. 42 44 46 48 50 52 [A] Output voltage vs. load current at I O > max I O , T P1 , T P3 = +25°C 1WVRWV.QCF6TCPUKGPV4GURQPUG Top trace: output voltage (5 V/div.). Bottom trace: input voltage (50 V/div.). Time scale: (20 ms/div.). Output voltage response to load current step-change (10-30-10 A) at: T P1 = +25°C, V I = 53 V, C O = 2.2 mF. cui.com Top trace: output voltage (0.5 V/div.). Bottom trace: output current (20 A/div.). Time scale: (0.5 ms/div.). For more information, please visit the product page. CUI Inc │ SERIES: NEB-N │ DESCRIPTION: FULLY REGULATED ADVANCED BUS CONVERTERS date 11/07/2014 │ page 15 of 30 Typical Characteristics 12.45 V, 22 A, 261 W Output Current Derating – Open frame [A] 25 3.0 m/s 20 2.0 m/s 15 1.5 m/s 1.0 m/s 10 0.5 m/s 5 Nat. Conv. 0 0 20 40 60 80 100 [°C] Available load current vs. ambient air temperature and airflow at V I = 53 V. See Thermal Consideration section. Output Current Derating – Base plate Thermal Resistance – Base plate [A] 25 [°C/W] 3.0 m/s 20 2.0 m/s 15 1.5 m/s 10 1.0 m/s 0.5 m/s 5 Nat. Conv. 6 5 4 3 2 1 0 0 0 20 40 60 80 0.0 100 [°C] Available load current vs. ambient air temperature and airflow at V I = 53 V. See Thermal Consideration section. Output Current Derating – Base plate + Heat sink [A] 25 0.5 1.0 1.5 2.0 2.5 3.0 [m/s] Thermal resistance vs. airspeed measured at the converter. Tested in wind tunnel with airflow and test conditions as per the Thermal consideration section. V I = 53 V. Output Current Derating – Cold wall sealed box A 3.0 m/s 25 20 2.0 m/s 20 15 1.5 m/s 10 1.0 m/s 0.5 m/s 5 10 5 Nat. Conv. 0 0 20 40 60 80 Tamb 85°C 15 0 100 [°C] 0 Available load current vs. base plate temperature. V I = 53 V. See Thermal Consideration section. Tested with Plate Fin Transverse heatsink, height 0.23 In, P0114 Thermal Pad. 20 40 60 80 100 [°C] Available load current vs. base plate temperature at 85ºC ambient. V I = 53 V. See Thermal Consideration section. cui.com For more information, please visit the product page. CUI Inc │ SERIES: NEB-N │ DESCRIPTION: FULLY REGULATED ADVANCED BUS CONVERTERS date 11/07/2014 │ page 16 of 30 Electrical Specification 12.45 V, 25 A, 296 W TP1 = -40 to +90ºC, VI = 40 to 60 V. Typical values given at: TP1 = +25°C, VI = 53 V, max IO, unless otherwise specified under conditions. Additional Cout = 0.1 mF. See Operating Information section for selection of capacitor types. Configuration File: 19010-CDA1020315/017 parameter conditions/description min input voltage range (VI) typ 40 max units 60 V turn-off input voltage (VIoff) decreasing input voltage 36 37 38 V turn-on input voltage (VIon) increasing input voltage 38 39 40 V internal input capacitance (CI) 11 output power (PO) 0 μF 296 95.2 94.6 95.1 94.5 W efficiency (η) 50% of max IO max IO 50% of max IO, VI = 48 V max IO, VI = 48 V power dissipation (Pd) max IO 17 input idling power (Pli) IO = 0 A, VI = 53 V 4.4 input standby power (PRC) VI = 53 V (turned off with RC) 0.4 W switching frequency (fs) 0-100% of max IO 180 kHz output voltage setting and accuracy (VOi) TP1 = +25°C, VI = 53 V, IO = 0 A output voltage tolerance band (VO) 0-100% of max IO line regulation (VO) max IO load regulation (VO) VI = 53 V, 1-100% of max IO load transient voltage deviation (Vtr) VI = 53 V, load step 25-75-25% of max IO, di/dt = 1 A/μs, COut = 2.5 mF OSCON type ±300 mV load transient recovery time (ttr) VI = 53 V, load step 25-75-25% of max IO, di/dt = 1 A/μs, COut = 2.5 mF OSCON type 250 µs ramp-up time (tr) - (from 10−90% of VOi) 10-100% of max IO 23 ms start-up time (ts) - (from VI connection to 90% of VOi) 10-100% of max IO 38 ms VI shut-down fall time (tf) (from VI off to 10% of VO) max IO IO = 0 A 0.7 6 ms s RC start-up time (tRC) max IO 14 ms RC shut-down fall time (tRC) (from RC off to 10% of VO) max IO IO = 0 A 4 6 ms s 12.45 400 TP1 < max TP1 27 short circuit current (ISC) TP1 = 25ºC, see Note 1 recommended capacitive load (COut) TP1 = 25ºC, see Note 2 output ripple & noise (VOac) See ripple & noise section, VOi over voltage protection (OVP) TP1 = +25°C, VI = 53 V, 10-100 % of max IO remote control (RC) sink current (note 3), see operating information trigger level, decreasing RC-voltage trigger level, increasing RC-voltage W 12.7 V 50 220 mV 500 700 mV 30 25 A 33 A 11 0 A 2.5 10 mF 70 140 mVp-p 0.7 mA V V 15.6 2.6 2.9 1: OCP in hic-cup mode, rms value were recorded. 2: Low ESR-value 3: Sink current drawn by external device connected to the RC pin. Minimum sink current required to guarantee activated RC function. cui.com W V 0 current limit threshold (Ilim) 24 12.485 11.5 output current (IO) Note 12.415 % % % % V For more information, please visit the product page. CUI Inc │ SERIES: NEB-N │ DESCRIPTION: FULLY REGULATED ADVANCED BUS CONVERTERS date 11/07/2014 │ page 17 of 30 Typical Characteristics 12.45 V, 45 A, 533 W, 2 products in parallel Efficiency Power Dissipation [%] 100 [W] 20 95 16 40 V 90 53 V 85 60 V 80 75 0 10 20 30 40 40 V 12 53 V 8 60 V 4 0 50 [A] 0 10 20 30 40 50 [A] Dissipated power vs. load current and input voltage at T P1 = +25°C. Efficiency vs. load current and input voltage at T P1 = +25°C. Output Characteristics Current Limit Characteristics [V] 12.60 [V] 15.00 12.40 40 V 12.20 12.00 53 V 9.00 60 V 6.00 12.00 40 V 53 V 60 V 3.00 11.80 0.00 0 12 24 36 48 60 [A] 20 Output voltage vs. load current at T P1 = +25°C. Start-up Start-up enabled by connecting V I at: T P1 = +25°C, V I = 53 V, I O = 25 A resistive load. 30 40 50 60 70 [A] Output voltage vs. load current at I O > max I O , T P1 = +25°C. Output Load Transient Response Top trace: output voltage (5 V/div). Bottom trace: input voltage (50 V/div). Time scale: (10 mS/div) Output voltage response to load current step- Top trace: Output voltage (500 mV/div). change (6.25-18.75 -6.25 A) at: Bottom trace: load current (10 A/div). T P1 =+25°C, V I = 53 V. Time scale: (0.5 mS/div) cui.com For more information, please visit the product page. CUI Inc │ SERIES: NEB-N │ DESCRIPTION: FULLY REGULATED ADVANCED BUS CONVERTERS date 11/07/2014 │ page 18 of 30 Typical Characteristics 12.45 V, 25 A, 296 W Output Current Derating – Open frame [A] 25 3.0 m/s 20 2.0 m/s 15 1.5 m/s 1.0 m/s 10 0.5 m/s 5 Nat. Conv. 0 0 20 40 60 80 100 [°C] Available load current vs. ambient air temperature and airflow at V I = 53 V. See Thermal Consideration section. Output Current Derating – Base plate Thermal Resistance – Base plate [°C/W] [A] 25 3.0 m/s 20 2.0 m/s 15 1.5 m/s 10 5 20 40 60 80 5 4 1.0 m/s 3 0.5 m/s 2 Nat. Conv. 1 0 0 6 0 100 [°C] 0.0 Available load current vs. ambient air temperature and airflow at V I = 53 V. See Thermal Consideration section. Output Current Derating – Base plate + Heat sink 0.5 1.0 1.5 2.0 2.5 3.0 [m/s] Thermal resistance vs. airspeed measured at the converter. Tested in wind tunnel with airflow and test conditions as per the Thermal consideration section. V I = 53 V. Output Current Derating – Cold wall sealed box [A] 25 [A] 30 3.0 m/s 20 15 10 5 2.0 m/s 25 1.5 m/s 20 1.0 m/s 15 0.5 m/s 10 Nat. Conv. Tamb 85°C 5 0 0 0 20 40 60 80 100 [°C] 0 Available load current vs. base plate temperature. V I = 53 V. See Thermal Consideration section. Tested with Plate Fin Transverse heatsink, height 0.23 In, P0114 Thermal Pad. 20 40 60 80 100 [°C] Available load current vs. base plate temperature at 85ºC ambient. V I = 53 V. See Thermal Consideration section. cui.com For more information, please visit the product page. CUI Inc │ SERIES: NEB-N │ DESCRIPTION: FULLY REGULATED ADVANCED BUS CONVERTERS date 11/07/2014 │ page 19 of 30 EMC Specification Conducted EMI measured according to EN55022, CISPR 22 and FCC part 15J (see test set-up). The fundamental switching frequency is 180 kHz for NEB at VI = 53 V, max IO. Conducted EMI Input terminal value (typ) Test set-up Layout recommendations The radiated EMI performance of the product will depend on the PWB layout and ground layer design. It is also important to consider the stand-off of the product. If a ground layer is used, it should be connected to the output of the product and the equipment ground or chassis. EMI without filter Optional external filter for class B Suggested external input filter in order to meet class B in EN 55022, CISPR 22 and FCC part 15J. 0 C4 L1 C1 L2 C2 + C3 C5 + Module - R Filter components: C1 = 1 µF C2 = 1 µF + 220 µF C3 = 1 µF + 220 µF C4 = 2.2 nF C5 = 2.2 nF L1 = 0.81 mH L2 = 0.81 mH A ground layer will increase the stray capacitance in the PWB and improve the high frequency EMC performance. Output ripple and noise Output ripple and noise measured according to figure below. 0 Output ripple and noise test setup Operating Information Power Management Overview This product includes protection features that continuously safeguard the load from damage due to unexpected system faults. EMI with filter Input Voltage The NEB consists of two different product families designed for two different input voltage ranges, 36 to 75 Vdc and 40 to 60 Vdc, see ordering information. The input voltage range 36 to 75 Vdc meets the requirements of the European Telecom Standard ETS 300 132-2 for normal input voltage range in –48 and –60 Vdc systems, -40.5 to -57.0 V and –50.0 to -72 V respectively. At input voltages exceeding 75 V, the power loss will be higher than at cui.com For more information, please visit the product page. CUI Inc │ SERIES: NEB-N │ DESCRIPTION: FULLY REGULATED ADVANCED BUS CONVERTERS Input Voltage (Continued) normal input voltage and TP1 must be limited to absolute max +125°C. The absolute maximum continuous input voltage is 80 Vdc. The input voltage range 40 to 60 Vdc meets the requirements for normal input voltage range in -48 V systems, -40.5 to -57.0 V. At input voltages exceeding 60 V, the power loss will be higher than at normal input voltage and TP1 must be limited to absolute max +125°C. The absolute maximum continuous input voltage is 65 Vdc. dynamic load changes. Ceramic capacitors will also reduce any high frequency noise at the load. It is equally important to use low resistance and low inductance PWB layouts and cabling. External decoupling capacitors will become part of the product’s control loop. The control loop is optimized for a wide range of external capacitance and the maximum recommended value that could be used without any additional analysis is found in the electrical specification. The ESR of the capacitors is a very important parameter. Stable operation is guaranteed with a verified ESR value of >10 mΩ across the output connections. For further information please contact your local CUI Power Modules representative. Turn-off Input Voltage The product monitors the input voltage and will turn on and turn off at predetermined levels. The minimum hysteresis between turn on and turn off input voltage is 2 V. Remote Control (RC) The products are fitted with a remote control function. The remote control is referenced to the primary negative input connection (-In). The RC function allows the converter to be turned on/off by an external device like a semiconductor or mechanical switch. The RC pin has an internal pull up resistor. The device should be capable of sinking 0.7 mA. When the RC pin is left open, the voltage generated on the RC pin is max 6 V. The standard product is provided with “negative logic” remote control and will be off until the RC pin is connected to the -In. To turn on the product the voltage between RC pin and -In should be less than 1 V. To turn off the product the RC pin should be left open for a minimum of time 150 µs, the same time requirement applies when the product shall turn on. In situations where it is desired to have the product to power up automatically without the need for control signals or a switch, the RC pin can be wired directly to –In Input and Output Impedance The impedance of both the input source and the load will interact with the impedance of the product. It is important that the input source has low characteristic impedance. Minimum recommended external input capacitance is 100 µF. The performance in some applications can be enhanced by addition of external capacitance as described under External Decoupling Capacitors. External Decoupling Capacitors When powering loads with significant dynamic current requirements, the voltage regulation at the point of load can be improved by addition of decoupling capacitors at the load. The most effective technique is to locate low ESR ceramic and electrolytic capacitors as close to the load as possible, using several parallel capacitors to lower the effective ESR. The ceramic capacitors will handle high-frequency dynamic load changes while the electrolytic capacitors are used to handle low frequency date 11/07/2014 │ page 20 of 30 Parallel Operation (Droop Load Share, DLS) The NEB DLS products are variants that can be connected in parallel. The products have a pre-configured voltage droop: The stated output voltage set point is at no load. The output voltage will decrease when the load current is increased. The voltage will droop 0.6 V while load reaches max load. This feature allows the products to be connected in parallel and share the current with 10% accuracy. Up to 90% of max output current can be used from each product. Feed Forward Capability The NEB products have a feed forward function implemented that can handle sudden input voltage changes. The output voltage will be regulated during an input transient and will typically stay within 10% when an input transient is applied. Soft-start Power Up The rise time of the ramp up is 10 ms. When starting by applying input voltage the control circuit boot-up time adds an additional 15 ms delay. The DLS variants have a pre-configured ramp up time of 25 ms. Temperature Protection (OTP, UTP) The products are protected from thermal overload by an internal temperature shutdown protection. When TP1 as defined in thermal consideration section is exceeded the product will shut down. The product will make continuous attempts to start up and resume normal operation cui.com For more information, please visit the product page. CUI Inc │ SERIES: NEB-N │ DESCRIPTION: FULLY REGULATED ADVANCED BUS CONVERTERS Temperature Protection (OTP, UTP) (Continued) automatically when the temperature has dropped below the temperature threshold; the hysteresis is defined in general electrical specification. The product also has an under temperature protection. Over Voltage Protection (OVP) The product includes over voltage limiting circuitry for protection of the load. The OVP limit is 30% above the nominal output voltage. The response from an over voltage fault is to immediately shut down. The device will continuously check for the presence of the fault condition, and when the fault condition no longer exists the device will be re-enabled. Over Current Protection (OCP) The product includes current limiting circuitry for protection at continuous overload. The setting for the product is hic-up mode if the maximum output current is exceeded and the output voltage is below 0.3×Vout. Above the trip voltage the product will continue to operate while maintaining the output current at the maximum output current. The load distribution should be designed for the maximum output short circuit current specified. date 11/07/2014 │ page 21 of 30 Thermal Consideration General The product is designed to operate in different thermal environments and sufficient cooling must be provided to ensure reliable operation. For products mounted on a PWB without a heat sink attached, cooling is achieved mainly by conduction, from the pins to the host board, and convection, which is dependant on the airflow across the product. Increased airflow enhances the cooling of the product. The Output Current Derating graph found in the output section for each model provides the available output current vs. ambient air temperature and air velocity at VI =53 V. The product is tested on a 254 x 254 mm, 35 µm (1 oz), 16-layer test board mounted vertically in a wind tunnel with a cross-section of 608 x 203 mm Droop Load Share variants (DLS) will enter hic-up mode, with a trip voltage, 0.04×Vout. Above the trip voltage the product will continue to operate while maintaining the output current at the maximum output current. Input Over/Under voltage protection The input of the product is protected from high input voltage and low input voltage. Pre-bias Start-up Capability The product has a Pre-bias start up functionality and will not sink current during start up if a Pre-bias source is present at the output terminals. If the Pre-bias voltage is lower than the target value, the product will ramp up to the target value. If the Pre-bias voltage is higher than the target value, the product will ramp down to the target value and in this case sink current for a limited time. For products with base plate used in a sealed box/cold wall application, cooling is achieved mainly by conduction through the cold wall. The Output Current Derating graphs are found in the output section for each model. The product is tested in a sealed box test set up with ambient temperatures 85, 55 and 25°C. 13.4 13.4 13.2 13.2 13.0 13.0 12.8 12.8 Vout [V] Vout [V] Output Voltage Regulation The NEB products are designed to be fully regulated within the plotted area. Operating outside this area is not recommended. 12.6 12.4 12.6 12.4 12.2 12.2 12.0 12.0 35 45 55 65 75 Vin [V] Vin range: 36-75Vdc 35 40 45 50 55 60 65 Vin [V] Vin range:40-60Vdc cui.com For more information, please visit the product page. CUI Inc │ SERIES: NEB-N │ DESCRIPTION: FULLY REGULATED ADVANCED BUS CONVERTERS Definition of product operating temperature The product operating temperature is used to monitor the temperature of the product, and proper thermal conditions can be verified by measuring the temperature at positions P1, P2, P3 and P4. The temperature at these positions (TP1, TP2, TP3, TP4) should not exceed the maximum temperatures in the table below. The number of measurement points may vary with different thermal design and topology. Temperatures above maximum TP1, measured at the reference point P1 (both for openframe and base plate versions) are not allowed and may cause permanent damage. Position Description P1 PWB (reference point, open TP1=125º C frame and base-plate) Max temperature P2 Opto-coupler TP2=105º C P3 Secondary MOSFET TP3=125º C P4 Magnetic Core TP4=125º C date 11/07/2014 │ page 22 of 30 Ambient Temperature Calculation For products with base plate the maximum allowed ambient temperature can be calculated by using the thermal resistance. 1. The power loss is calculated by using the formula ((1/η) - 1) × output power = power losses (Pd). η = efficiency of product. E.g. 95 % = 0.95 2. Find the thermal resistance (Rth) in the Thermal Resistance graph found in the Output section for each model. Note that the thermal resistance can be significantly reduced if a heat sink is mounted on the top of the base plate. Calculate the temperature increase (∆T). ∆T = Rth x Pd 3. Max allowed ambient temperature is: Max TP1 - ∆T. E.g. NEB-264 at 2m/s: 1. ((1/0.945) - 1) × 264 W = 15.4 W 2. 15.4 W × 3.4°C/W = 52°C 3. 125 °C – 52°C = max ambient temperature is 73°C The actual temperature will be dependent on several factors such as the PWB size, number of layers and direction of airflow. (Best air flow direction is from negative to positive pins.) Pin Designation Function 1 +In Positive Input 2 RC Remote Control 4 -In Negative Input 5 -Out Negative Output 16 +Out Positive Output cui.com For more information, please visit the product page. CUI Inc │ SERIES: NEB-N │ DESCRIPTION: FULLY REGULATED ADVANCED BUS CONVERTERS date 11/07/2014 │ page 23 of 30 Mechanical Information - Hole Mount, Open Frame Version Top View Pin Positions According To Recommended Footprint Table 1. X1 = Ordering information PIN SPECIFICATIONS Pin 1-5 Material: Copper alloy Plating: Min Au 0.1 µm over 1-3 µm Ni. Pin 5 Material: Brass Plating: Min Au 0.2 µm over 1-3 µm Ni. Stand-off to none conductive components min 0.15mm [0.006] Stand-off to conductive components min 1.25mm [0.049] Pin position 3 not present due to case to ground pin not available on NEB Recommended Footprint - Top View Recommended keep away area for user components. The stand-off in combination with insulating material ensures that requirements as per IEC/EN/UL60950 are met and 2250 V isolation maintained even if open vias or traces are present under the DC/DC converter. cui.com Weight: Typical 26 g All dimensions: mm [inch] Tolerances: x.x ±0.50 [0.02], x.xx ±0.25 [0.01] (not applied on footprint or typical values) For more information, please visit the product page. CUI Inc │ SERIES: NEB-N │ DESCRIPTION: FULLY REGULATED ADVANCED BUS CONVERTERS date 11/07/2014 │ page 24 of 30 Mechanical Information - Hole Mount, Base Plate Version Top View Pin Positions According To Recommended Footprint Table 1. X1 = Ordering Information CASE Material: Aluminum For screw attachment apply mounting torque of max 0.44 Nm [3.9 lbf in]. M3 screws must not protrude more than 2.7mm [0.106] into the base plate. PIN SPECIFICATIONS Pin 1-5 Material: Copper alloy Plating: Min Au 0.1 µm over 1-3 µm Ni. Recommended Footprint - Top View Stand-off to none conductive components min 0.15mm [0.006] Stand-off to conductive components min 1.25mm [0.049] Pin position 3 not present due to case to ground pin not available on NEB Recommended keep away area for user components. The stand-off in combination with insulating material ensures that requirements as per IEC/EN/UL60950 are met and 2250 V isolation maintained even if open vias or traces are present under the DC/DC converter. cui.com Weight: Typical 38 g All dimensions: mm [inch] Tolerances: x.x ±0.50 [0.02] x.xx ±0.25 [0.01] (not applied on footprint or typical values) For more information, please visit the product page. CUI Inc │ SERIES: NEB-N │ DESCRIPTION: FULLY REGULATED ADVANCED BUS CONVERTERS date 11/07/2014 │ page 25 of 30 Mechanical Information - Surface Mount Version Top View Pin Positions According To Recommended Footprint Recommended Footprint - Top View PIN SPECIFICATIONS Pin 1-5 Material: Copper alloy Plating: Min Au 0.1 µm over 1-3 µm Ni. Pin position 3 not present due to case to ground pin not available on NEB Stand-off to none conductive components min 0.15mm [0.006] Stand-off to conductive components min 1.25mm [0.049] Weight: Typical 24 g All dimensions: mm [inch] Tolerances: x.x ±0.50 [0.02] x.xx ±0.25 [0.01] (not applied on footprint or typical values) Recommended keep away area for user components. The stand-off in combination with insulating material ensures that requirements as per IEC/EN/UL60950 are met and 2250 V isolation maintained even if open vias or traces are present under the DC/DC converter. cui.com For more information, please visit the product page. CUI Inc │ SERIES: NEB-N │ DESCRIPTION: FULLY REGULATED ADVANCED BUS CONVERTERS Soldering Information - Surface Mounting Lead-free (Pb-free) solder processes For Pb-free solder processes, a pin temperature (TPIN) in excess of the solder melting temperature (TL, 217 to 221°C for SnAgCu solder alloys) for more than 60 seconds and a peak temperature of 245°C on all solder joints is recommended to ensure a reliable solder joint. The surface mount product is intended for forced convection or vapor phase reflow soldering in SnPb and Pb-free processes. The reflow profile should be optimised to avoid excessive heating of the product. It is recommended to have a sufficiently extended preheat time to ensure an even temperature across the host PWB and it is also recommended to minimize the time in reflow. Maximum Product Temperature Requirements Top of the product PWB near pin 2 is chosen as reference location for the maximum (peak) allowed product temperature (TPRODUCT) since this will likely be the warmest part of the product during the reflow process. A no-clean flux is recommended to avoid entrapment of cleaning fluids in cavities inside the product or between the product and the host board, since cleaning residues may affect long time reliability and isolation voltage. SnPb solder processes For SnPb solder processes, the product is qualified for MSL 1 according to IPC/JEDEC standard J STD 020C. General reflow process specifications SnPb eutectic Pb-free Average ramp-up (T PRODUCT ) Typical solder melting (liquidus) temperature TL Minimum reflow time above T L date 11/07/2014 │ page 26 of 30 3°C/s max 3°C/s max During reflow TPRODUCT must not exceed 225 °C at any time. 183°C 221°C 60 s 60 s Pb-free solder processes For Pb-free solder processes, the product is qualified for MSL 3 according to IPC/JEDEC standard J-STD-020C. Minimum pin temperature T PIN 210°C 235°C Peak product temperature T PRODUCT 225°C 260°C Average ramp-down (T PRODUCT ) 6°C/s max 6°C/s max Maximum time 25°C to peak 6 minutes 8 minutes During reflow TPRODUCT must not exceed 260 °C at any time. Dry Pack Information Products intended for Pb-free reflow soldering processes are delivered in standard moisture barrier bags according to IPC/JEDEC standard J STD 033 (Handling, packing, shipping and use of moisture/reflow sensitivity surface mount devices). Temperature TPRODUCT maximum TPIN minimum Pin profile TL Time in preheat / soak zone Time 25°C to peak Time in reflow Product profile Using products in high temperature Pb-free soldering processes requires dry pack storage and handling. In case the products have been stored in an uncontrolled environment and no longer can be considered dry, the modules must be baked according to J STD 033. Time Minimum Pin Temperature Recommendations Pin number 5 chosen as reference location for the minimum pin temperature recommendation since this will likely be the coolest solder joint during the reflow process. Thermocoupler Attachment Top of PWB near pin 2 for measurement of maximum product temperature, TPRODUCT SnPb solder processes For SnPb solder processes, a pin temperature (TPIN) in excess of the solder melting temperature, (TL, 183°C for Sn63Pb37) for more than 60 seconds and a peak temperature of 220°C is recommended to ensure a reliable solder joint. For dry packed products only: depending on the type of solder paste and flux system used on the host board, up to a recommended maximum temperature of 245°C could be used, if the products are kept in a controlled environment (dry pack handling and storage) prior to assembly. Pin 5 for measurement of minimum pin (solder joint) temperature, TPIN cui.com For more information, please visit the product page. CUI Inc │ SERIES: NEB-N │ DESCRIPTION: FULLY REGULATED ADVANCED BUS CONVERTERS date 11/07/2014 │ page 27 of 30 Soldering Information - Hole Mounting The hole mounted product is intended for plated through hole mounting by wave or manual soldering. The pin temperature is specified to maximum to 270°C for maximum 10 seconds. A maximum preheat rate of 4°C/s and maximum preheat temperature of 150°C is suggested. When soldering by hand, care should be taken to avoid direct contact between the hot soldering iron tip and the pins for more than a few seconds in order to prevent overheating. A no-clean flux is recommended to avoid entrapment of cleaning fluids in cavities inside the product or between the product and the host board. The cleaning residues may affect long time reliability and isolation voltage. Delivery Package Information The products are delivered in antistatic injection molded trays (Jedec design guide 4.10D standard) and in antistatic trays Tray Specifications– SMD /Pin in paste Material Antistatic PPE Surface resistance Tray thickness 105 < Ohm/square < 1012 The trays can be baked at maximum 125°C for 48 hours 17.40 mm 0.685 [ inch] Box capacity 100 products (5 full trays/box) Tray weight 125 g empty, 605 g full tray Bakability JEDEC standard tray for 2x5 = 10 products. All dimensions in mm [inch] Tolerances: X.x ±0.26 [0.01], X.xx ±0.13 [0.005] Note: pick up positions refer to center of pocket. See mechanical drawing for exact location on product. cui.com For more information, please visit the product page. CUI Inc │ SERIES: NEB-N │ DESCRIPTION: FULLY REGULATED ADVANCED BUS CONVERTERS Tray Specifications - Through hole Version Material Surface resistance Bakability Tray capacity Box capacity Weight PE Foam, dissipative 105 < Ohm/square < 1012 The trays are not bakeable 25 converters/tray 75 products (3 full trays/box) Product – Open frame 790 g full tray, 140g empty tray Product – Base plate option 1090 g full tray, 140 g empty tray cui.com date 11/07/2014 │ page 28 of 30 For more information, please visit the product page. CUI Inc │ SERIES: NEB-N │ DESCRIPTION: FULLY REGULATED ADVANCED BUS CONVERTERS date 11/07/2014 │ page 29 of 30 Product Qualification Specification Characteristics External visual inspection IPC-A-610 Change of temperature (Temperature cycling) IEC 60068-2-14 Na Temperature range Number of cycles Dwell/transfer time -40 to 100°C 500 15 min/0-1 min Cold (in operation) IEC 60068-2-1 Ad Temperature T A Duration -45°C 72 h Damp heat IEC 60068-2-67 Cy Temperature Humidity Duration 85°C 85 % RH 1000 hours Dry heat IEC 60068-2-2 Bd Temperature Duration 125°C 1000 h Electrostatic discharge susceptibility IEC 61340-3-1, JESD 22-A114 IEC 61340-3-2, JESD 22-A115 Human body model (HBM) Machine Model (MM) Class 2, 2000 V Class 3, 200 V Immersion in cleaning solvents IEC 60068-2-45 XA, method 2 Water Glycol ether Isopropyl alcohol 55°C 35°C 35°C Mechanical shock IEC 60068-2-27 Ea Peak acceleration Duration 100 g 6 ms Moisture reflow sensitivity 1 J-STD-020C Level 1 (SnPb-eutectic) Level 3 (Pb Free) 225°C 260°C Operational life test MIL-STD-202G, method 108A Duration 1000 h Resistance to soldering heat 2 IEC 60068-2-20 Tb, method 1A Solder temperature Duration 270°C 10-13 s Robustness of terminations IEC 60068-2-21 Test Ua1 IEC 60068-2-21 Test Ue1 Through hole mount products Surface mount products All leads All leads Preconditioning Temperature, SnPb Eutectic Temperature, Pb-free 150°C dry bake 16 h 215°C 235°C Preconditioning Temperature, SnPb Eutectic Temperature, Pb-free Steam ageing 235°C 245°C Frequency Spectral density Duration 10 to 500 Hz 0.07 g2/Hz 10 min in each direction IEC 60068-2-58 test Td 1 Solderability IEC 60068-2-20 test Ta 2 Vibration, broad band random IEC 60068-2-64 Fh, method 1 1 Only for products intended for reflow soldering (surface mount products) Notes: 2 Only for products intended for wave soldering (plated through hole products) cui.com For more information, please visit the product page. CUI Inc │ SERIES: NEB-N │ DESCRIPTION: FULLY REGULATED ADVANCED BUS CONVERTERS date 11/07/2014 │ page 30 of 30 REVISION HISTORY rev. date 1.02 11/07/2014 The revision history provided is for informational purposes only and is believed to be accurate. Headquarters 20050 SW 112th Ave. Tualatin, OR 97062 800.275.4899 Fax 503.612.2383 cui.com [email protected] Novum and Architects of Modern Power are trademarks of CUI. All other trademarks are the property of their respective owners. CUI offers a two (2) year limited warranty. Complete warranty information is listed on our website. CUI reserves the right to make changes to the product at any time without notice. Information provided by CUI is believed to be accurate and reliable. However, no responsibility is assumed by CUI for its use, nor for any infringements of patents or other rights of third parties which may result from its use. CUI products are not authorized or warranted for use as critical components in equipment that requires an extremely high level of reliability. A critical component is any component of a life support device or system whose failure to perform can be reasonably expected to cause the failure of the life support device or system, or to affect its safety or effectiveness.