RU2H30S

RU2H30S
N-Channel Advanced Power MOSFET
Features
Pin Description
• 200V/30A,
RDS (ON) =75mΩ(Typ.) @ VGS=10V
• Ultra Low On-Resistance
• Fast Switching and Fully Avalanche Rated
• 100% avalanche tested
• 175°C Operating Temperature
• Lead Free and Green Available
D
G
S
TO220
D
Applications
• Switching Application Systems
• UPS
G
S
N-Channel MOSFET
Absolute Maximum Ratings
Parameter
Symbol
Rating
Unit
Common Ratings (TC=25°C Unless Otherwise Noted)
VDSS
Drain-Source Voltage
200
VGSS
Gate-Source Voltage
±25
Maximum Junction Temperature
175
°C
-55 to 175
°C
TC=25°C
30
A
TC=25°C
120
A
TC=25°C
30
TC=100°C
23
TC=25°C
176
TC=100°C
88
TJ
TSTG
IS
V
Storage Temperature Range
Diode Continuous Forward Current
Mounted on Large Heat Sink
①
300μs Pulse Drain Current Tested
②
Continuous Drain Current(VGS=10V)
IDP
ID
PD
Maximum Power Dissipation
A
W
RθJC
Thermal Resistance-Junction to Case
0.85
°C/W
RθJA
Thermal Resistance-Junction to Ambient
62.5
°C/W
81
mJ
Drain-Source Avalanche Ratings
EAS
③
Avalanche Energy, Single Pulsed
Ruichips Semiconductor Co., Ltd
Rev. A– SEP., 2013
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RU2H30S
Electrical Characteristics (TC=25°C Unless Otherwise Noted)
RU2H30S
Symbol
Parameter
Test Condition
Unit
Min.
Typ.
Max.
Static Characteristics
BVDSS
IDSS
Drain-Source Breakdown Voltage VGS=0V, IDS=250µA
Zero Gate Voltage Drain Current
200
V
VDS=200V, VGS=0V
1
TJ=125°C
VGS(th)
IGSS
④
RDS(ON)
Gate Threshold Voltage
VDS=VGS, IDS=250µA
Gate Leakage Current
VGS=±25V, VDS=0V
Drain-Source On-state Resistance VGS=10V, IDS=17A
µA
30
2
4
V
±100
nA
85
mΩ
1.2
V
75
Diode Characteristics
VSD
④
trr
Qrr
Diode Forward Voltage
Reverse Recovery Time
ISD=30A, VGS=0V
ISD=30A, dlSD/dt=100A/µs
Reverse Recovery Charge
Dynamic Characteristics
Gate Resistance
VGS=0V,VDS=0V,F=1MHz
Ciss
Input Capacitance
Coss
Output Capacitance
VGS=0V,
VDS=100V,
Frequency=1.0MHz
Crss
Reverse Transfer Capacitance
td(ON)
Turn-on Delay Time
tr
Turn-on Rise Time
td(OFF)
Turn-off Delay Time
nC
1
Ω
2140
pF
308
16
VDD=100V, RL=3Ω,
IDS=30A, VGEN=10V,
RG=6Ω
48
ns
38
33
⑤
Total Gate Charge
Qgs
Gate-Source Charge
Qgd
Gate-Drain Charge
Notes:
125
78
Turn-off Fall Time
Gate Charge Characteristics
Qg
ns
⑤
RG
tf
150
116
VDS=160V, VGS=10V,
IDS=30A
nC
23
52
①Pulse width limited by safe operating area.
②Calculated continuous current based on maximum allowable junction temperature.
③Limited by TJmax, IAS =18A, VDD = 60V, RG = 50Ω , Starting TJ = 25°C.
④Pulse test;Pulse width≤300µs, duty cycle≤2%.
⑤Guaranteed by design, not subject to production testing.
Ruichips Semiconductor Co., Ltd
Rev. A– SEP., 2013
2
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RU2H30S
Ordering and Marking Information
Device
Marking
Package
RU2H30S
RU2H30S
TO263
Ruichips Semiconductor Co., Ltd
Rev. A– SEP., 2013
Packaging Quantity Reel Size Tape width
Tube
3
50
-
-
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RU2H30S
Typical Characteristics
Power Dissipation
200
180
30
ID - Drain Current (A)
160
PD - Power (W)
Drain Current
35
25
140
120
20
100
15
80
60
10
40
20
5
VGS=10V
0
0
0
25
50
75
100
125
150
25
175
50
100
125
150
175
Drain Current
Safe Operation Area
300
RDS(ON) - On - Resistance (mΩ)
1000.0
75
TJ - Junction Temperature (°C)
TJ - Junction Temperature (°C)
Ids=17A
RDS(ON) limited
ID - Drain Current (A)
250
100.0
10.0
200
10µs
100µs
1ms
10ms
1.0
DC
TC=25°C
150
100
50
0
0.1
0.1
1
10
100
0
1000
1
2
3
4
5
6
7
8
9
10
VGS - Gate-Source Voltage (V)
VDS - Drain-Source Voltage (V)
ZthJC - Thermal Response (°C/W)
Thermal Transient Impedance
Duty=0.5, 0.2, 0.1, 0.05, 0.02, 0.01, Single Pulse
1
0.1
Single Pulse
0.01
RθJC=0.85°C/W
0.001
1E-05
0.0001
0.001
0.01
0.1
1
Square Wave Pulse Duration (sec)
Ruichips Semiconductor Co., Ltd
Rev. A– SEP., 2013
4
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RU2H30S
Typical Characteristics
Output Characteristics
10
RDS(ON) - On Resistance (mΩ)
Vgs
8,9,10V
ID - Drain Current (A)
Drain-Source On Resistance
150
8
120
6V
6
4
5V
2
0
0
1
2
3
4
10V
90
60
30
0
5
0
5
10
VDS - Drain-Source Voltage (V)
25
30
Source-Drain Diode Forward
VGS=10V
IDS=17A
2.0
IS - Source Current (A)
Normalized On Resistance
20
ID - Drain Current (A)
Drain-Source On Resistance
2.5
15
1.5
1.0
0.5
TJ=25°C
Rds(on)=75mΩ
10.00
TJ=175°C
1.00
TJ=25°C
0.10
0.01
0.0
0.2
-50
-25
0
25
50
75
100
125
150
0.4
Capacitance
VGS - Gate-Source Voltage (V)
C - Capacitance (pF)
Frequency=1.0MHz
Ciss
2000
1500
1000
Coss
Crss
0
1
10
1
1.2
1.4
Gate Charge
3000
500
0.8
VSD - Source-Drain Voltage (V)
TJ - Junction Temperature (°C)
2500
0.6
100
1000
10
VDS=160V
IDS=30A
9
8
7
6
5
4
3
2
1
0
0
VDS - Drain-Source Voltage (V)
50
100
150
QG - Gate Charge (nC)
Ruichips Semiconductor Co., Ltd
Rev. A– SEP., 2013
5
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RU2H30S
Avalanche Test Circuit and Waveforms
Switching Time Test Circuit and Waveforms
Ruichips Semiconductor Co., Ltd
Rev. A– SEP., 2013
6
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RU2H30S
Package Information
TO263
A
E
L3
c1
L2
θ1
A1
H
D
DEP
A2
L1
θ1
b
C
L
b1
θ2
e
θ
θ2
SYMBOL
A
A1
A2
b
b1
c
c1
D
E
e
H
MM
MIN
4.40
0.00
2.59
0.77
1.23
0.34
1.22
8.60
10.00
14.70
NOM
4.55
0.10
2.69
*
*
*
*
8.70
10.13
2.54BSC
15.10
INCH
MAX
4.70
0.25
2.79
0.90
1.36
0.47
1.32
8.80
10.26
15.50
Ruichips Semiconductor Co., Ltd
Rev. A– SEP., 2013
MIN
0.173
0.000
0.102
0.030
0.048
0.013
0.048
0.339
0.394
NOM
0.179
0.005
0.106
MAX
0.185
0.010
0.110
0.035
0.054
0.019
0.052
0.346
0.404
0.343
0.399
0.100BSC
0.579 0.594 0.610
7
SYMBOL
L
L3
L1
L4
L2
θ
θ1
θ2
DEP
Φp1
L4
MM
MIN
2.00
1.17
*
NOM
2.30
1.29
*
0.25 BSC
2.50 REF
0°
*
5°
7°
1°
3°
0.05 0.10
1.40 1.50
INCH
MAX
2.60
1.40
1.70
MIN
0.079
0.046
*
8°
9°
5°
0.20
1.60
0°
5°
1°
0.002
0.055
NOM
0.091
0.051
*
0.01 BSC
0.098 REF
*
7°
3°
0.004
0.059
MAX
0.102
0.055
0.067
8°
9°
5°
0.008
0.063
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RU2H30S
Customer Service
Worldwide Sales and Service:
[email protected]
Technical Support:
[email protected]
Investor Relations Contacts:
[email protected]
Marcom Contact:
[email protected]
Editorial Contact:
[email protected]
HR Contact:
[email protected]
Legal Contact:
[email protected]
Shen Zhen RUICHIPS Semiconductor CO., LTD
Room 501, the 5floor An Tong Industrial Building,
NO.207 Mei Hua Road Fu Tian Area Shen Zhen City, CHINA
TEL: (86-755) 8311-5334
FAX: (86-755) 8311-4278
E-mail: [email protected]
Ruichips Semiconductor Co., Ltd
Rev. A– SEP., 2013
8
www.ruichips.com