CLD-AP75 Rev 5E soldering & handling Cree® XLamp® MT Family and MK Family LEDs Introduction Table of Contents This application note applies to XLamp® MT Family and MK Handling XLamp® MT Family and MK Family LEDs.................... 2 Family LEDs, which have order codes in the following fomats. Circuit Board Preparation & Layouts............................................ 4 Case Temperature (Ts) Measurement Point................................ 5 MTxxxx-xx-xxxx-xxxxxxxxx Notes on Soldering XLamp® MT Family and MK Family LEDs... 6 MKxxxx-xx-xxxx-xxxxxxxxx Moisture Sensitivity...................................................................... 7 Low Temperature Operation......................................................... 7 This application note explains how XLamp MT Family and MK XLamp® MT Family and MK Family LED Reflow Soldering Family LEDs and assemblies containing these LEDs should be Characteristics.............................................................................. 8 handled during manufacturing. Please read the entire document Chemicals & Conformal Coatings................................................ 9 to understand how to properly handle XLamp MT Family and MK Assembly Storage & Handling.................................................... 10 Family LEDs. Tape and Reel.............................................................................. 11 www.cree.com/Xlamp Packaging & Labels.................................................................... 12 Copyright © 2013-2016 Cree, Inc. All rights reserved. The information in this document is subject to change without notice. Cree® and XLamp® are registered trademarks and the Cree logo is a trademark of Cree, Inc. Other trademarks, product and company names are the property of their respective owners and do not imply specific product and/or vendor endorsement, sponsorship or association. This document is provided for informational purposes only and is not a warranty or a specification. For product specifications, please see the data sheets available at www.cree.com. Cree, Inc. 4600 Silicon Drive Durham, NC 27703 USA Tel: +1.919.313.5300 1 XLamp ® MT Family & MK Family LED Soldering & Handling Handling XLamp® MT Family and MK Family LEDs Manual Handling Use tweezers to grab XLamp MT Family or MK Family LEDs at the base. Do not touch the lens with the tweezers. Do not touch the lens with fingers. Do not push on the lens. Do not apply more than 1000 g of shear force directly onto the lens. Excessive force on the lens could damage the LED. P CORRECT X WRONG Cree recommends the following at all times when handling XLamp MT Family or MK Family LEDs or assemblies containing these LEDs: • Avoid putting mechanical stress on the LED lens. • Never touch the optical surface with fingers or sharp objects. The LED lens surface could be soiled or damaged, which would affect the optical performance of the LED. • Cree recommends always handling XLamp MT Family or MK Family LEDs with appropriate ESD grounding. • Cree recommends handling XLamp MT Family or MK Family LEDs wearing clean, lint‑free gloves. Copyright © 2013-2016 Cree, Inc. All rights reserved. The information in this document is subject to change without notice. Cree® and XLamp® are registered trademarks and the Cree logo is a trademark of Cree, Inc. Other trademarks, product and company names are the property of their respective owners and do not imply specific product and/or vendor endorsement, sponsorship or association. This document is provided for informational purposes only and is not a warranty or a specification. For product specifications, please see the data sheets available at www.cree.com. 2 XLamp ® MT Family & MK Family LED Soldering & Handling Handling XLamp® MT Family and MK Family LEDs - Continued Whenever possible, Cree recommends the use of the following pick and place tool to remove XLamp MT Family LEDs from the factory tape and reel packaging. All measurements are ±.13 mm unless otherwise indicated. Whenever possible, Cree recommends the use of the following pick and place tool to remove XLamp MK Family LEDs from the factory tape and reel packaging. All measurements are ±.13 mm unless otherwise indicated. Copyright © 2013-2016 Cree, Inc. All rights reserved. The information in this document is subject to change without notice. Cree® and XLamp® are registered trademarks and the Cree logo is a trademark of Cree, Inc. Other trademarks, product and company names are the property of their respective owners and do not imply specific product and/or vendor endorsement, sponsorship or association. This document is provided for informational purposes only and is not a warranty or a specification. For product specifications, please see the data sheets available at www.cree.com. 3 4.85 ±.25 9.113 .650 XLamp MT Family & MK Family LED Soldering & Handling ® C Circuit Board Preparation & Layouts 9.113 Printed circuit boards (PCBs) should be prepared and/or cleaned according to the manufacturer’s specifications before placing or soldering XLamp MT Family or MK Family LEDs onto the PCB. The diagrams below show the recommended PCB solder pad layout for XLamp MT Family LEDs. All 66 55 NOTICE NOTICE CREE CONFIDENTIAL. THIS PLOT AND THE INFORMATION CREE CONFIDENTIAL. THISTHE PLOT AND THE INFORMATION CONTAINED WITHINARE ARE PROPRIETARY AND CONTAINED WITHIN THE PROPRIETARY AND CONFIDENTIALINFORMATION INFORMATIONOF OFCREE, CREE,INC. INC.THIS THISPLOT PLOT CONFIDENTIAL MAYNOT NOTBE BECOPIED, COPIED,REPRODUCED REPRODUCED ORDISCLOSED DISCLOSED TO ANY MAY OR 8.900 UNAUTHORIZEDPERSON PERSON THE WITHOUT WRITTEN CONSENT TO ANY UNAUTHORIZED THE WITHOUT WRITTEN CONSENT OFCREE CREEINC. INC. OF MT-G .500 8.839 .889 1.090 6.000 DD 1.090 9.11 9.11 8.900 .937 4.85 4.85 ±.25 ±.25 .65 .65 8.072 CC .950 6.198 1.722 3.175 8.90 8.90 .937 1.072 .950 1.905 1.905 R4.10 R4.10 6 5 6.00 6.00 .95 .95 .50 .50 PRIMARY PRIMARY 4 8.90 8.90 UNLESS OT DIMEN MILLIMETER TOLERANCE .X .X X FOR SHEET .X .X .X X SURFACE 3 8.90 8.90 .50 .50 .50 .50 .95 .95 6.00 6.00 BB THIRD ANGLE PROJECTION Recommended Stencil Pattern RECOMMENDED STENCIL PATTERN (Shaded Area Is Open) RECOMMENDED BOARD SOLDER RecommendedPC PCB Solder Pad PAD MT-G2 8.90 8.90 3.175 9.11 9.11 A 2 REV REV AA ADDEDA BB ADDED .889 .500 B measurements ±.13 mm unless otherwise indicated. 44 are R4.100 33 .95 .95 1.35 1.35 8.90 8.90 .25 .25 8.90 8.90 .30 .30 .58 .58 AA DRAW .25 .25 1.35 1.35 .95 .95 .95 .95 ALLDIMENSIONS DIMENSIONSARE ARE ± ± .13MM .13MMUNL UN ALL 1.23 1.23 RECOMMENDEDPC PCBOARD BOARDSOLDER SOLDERPAD PAD RECOMMENDED RECOMMENDEDSTENCIL STENCILPATTERN PATTERN RECOMMENDED Recommended Pattern (HATCHEDAREA AREAISStencil ISOPENING) OPENING) (HATCHED Recommended PCB Solder Pad 66 55 (Shaded Area Is Open) 44 33 DRAWN UNLESSOTHERWISE OTHERWISESPECIFIED SPECIFIE UNLESS CRO DIMENSIONSARE AREININ D.D.CRON DIMENSIONS CHEC MILLIMETERS ANDAFTER AFTER FINI CHECK MILLIMETERS AND FINIS TOLERANCE UNLESS SPECIFIE TOLERANCE UNLESS SPECIFIED .XX ± .25 APPR .XX ± ± .25 .XXX .125 APPRO .XXX ± .125 X°X° ± ± .5°.5° MATE MATER FORSHEET SHEETMETAL METALPARTS PARTS ON FOR ONL 1.5 .X.X ± ±± 1.5 .XX .75 .XX ± ± .75 .XXX .25 FINAL P .XXX ± .25 FINAL PR X°X° ± ± .5°.5° 1.6 SURFACEFINISH: FINISH: 1.6 SURFACE 2 Copyright © 2013-2016 Cree, Inc. All rights reserved. The information in this document is subject to change without notice. Cree® and XLamp® are registered trademarks and the Cree logo is a trademark of Cree, Inc. Other trademarks, product and company names are the property of their respective owners and do not imply specific product and/or vendor endorsement, sponsorship or association. This document is provided for informational purposes only and is not a warranty or a specification. For product specifications, please see the data sheets available at www.cree.com. 4 6.76 7.00 C XLamp ® MT Family & MK Family LED Soldering & Handling .70 R 3.25 3.90 ALTERNA PRIMARY Circuit Board Preparation & Layouts - Continued The diagram below shows the recommended PCB solder pad layout for XLamp MK Family LEDs. All measurements are ±.13 mm unless otherwise indicated. .70 .70 .70 .25 1.29 B 6.76 6.76 3.90 1.24 1.29 6.70 A .25 6.70 Recommended PCB Solder Pad Recommended Stencil Pattern RECOMMENDED STENCIL PATTERN (Shaded Is Open) SHADED AREAArea IS OPENING RECOMMENDED PCB SOLDER PAD THIRD ANGLE PROJECTION Case Temperature (Ts) Measurement Point 6 UNLESS OTHERWISE SPECIF DIMENSIONS ARE IN MILLIMETERS AND AFTER FIN TOLERANCE UNLESS SPECIF .XX ± .2 .XXX ± .1 X° ± .5 FOR SHEET METAL PARTS O .X ± 1 .XX ± .7 .XXX ± .2 X° ± .5 SURFACE FINISH: 5 4 3 XLamp MT Family and MK Family LED case temperature (Ts) should be measured on the PCB surface, as close to the LED’s thermal pad as possible. This measurement point is shown in the pictures below. MT-G MT-G2 MK-R MK-R2 It is not required to use a solder footprint for the thermal pad that is larger than the XLamp MT Family or MK Family LED itself. In testing, Cree has found such a solder pad to have insignificant impact on the resulting Ts measurement. Copyright © 2013-2016 Cree, Inc. All rights reserved. The information in this document is subject to change without notice. Cree® and XLamp® are registered trademarks and the Cree logo is a trademark of Cree, Inc. Other trademarks, product and company names are the property of their respective owners and do not imply specific product and/or vendor endorsement, sponsorship or association. This document is provided for informational purposes only and is not a warranty or a specification. For product specifications, please see the data sheets available at www.cree.com. 5 1.6 XLamp ® MT Family & MK Family LED Soldering & Handling Notes on Soldering XLamp® MT Family and MK Family LEDs Notes on Soldering XLamp XP Family LEDs XLamp MT Family and MK Family LEDs are designed to be reflow soldered to a PCB. Reflow soldering may be done by a reflow oven or XLamp XPthe Family LEDs are designed to bethe reflow a PCB. Reflow may be done by a reflow oven or by placing PCB on a hotplate and following reflowsoldered soldering to profile listed on the soldering previous page. by placing the PCB on a hotplate and following the reflow soldering profile listed on the previous page. Do not notwave wave solder XLamp XP Family LEDs. not Do hand XLamp XP Family LEDs. Do solder XLamp MT Family or MK FamilyDo LEDs. not solder hand solder XLamp MT Family or MK Family LEDs. P P CORRECT CORRECT X WRONG WRONG P CORRECT CORRECT Solder SolderPaste PasteType Type Cree strongly recommends using “no clean” solder paste with XLamp MT Family or MK Family LEDs so that cleaning the PCB after reflow Cree strongly recommends using “no clean” solder paste with XLamp XP Family LEDs so that cleaning the PCB after soldering is not required. Cree uses Kester® R276 solder paste internally. reflow soldering is not required. Cree uses the following solder paste internally: Indium Corporation of America® number 82676SnAgCu (tin/silver/copper) and SnAg (tin/silver). Cree recommends the following solderPart paste compositions: • Sn62/Pb36/Ag2 composition • Flux: NC-SMQ92J Solder Paste Thickness Cree recommends the following solder paste compositions: SnPbAg, SnAgCu and SnAg. The choice of solder and the application method will dictate the specific amount of solder. For the most consistent results, an automated dispensing system or a solder stencil printer is recommended. Cree has seen positive results using solder thickness that results in a 4-mil Solder Paste Thickness (102-μm) bond line, i.e., the solder joint thickness after reflow soldering. The choice of solder and the application method will dictate the specific amount of solder. For the most consistent results, an automated dispensing system or a solder stencil printer is recommended. Cree has seen positive results using solder thickness that results in a 3-mil (75-μm) bond line. P P CORRECT CORRECT X X WRONG WRONG Copyright © 2013-2016 Cree, Inc. All rights reserved. The information in this document is subject to change without notice. Cree® and XLamp® are registered trademarks and the Cree logo is a trademark of Cree, Inc. Other trademarks, product and company names are the property of their respective owners and do not imply specific product and/or vendor endorsement, sponsorship or association. This document is provided for informational purposes only and is not a warranty or a specification. For product specifications, please see the data sheets available at www.cree.com. This document is provided for informational purposes only and is not a warranty or a specification. For product specifications, please see the data sheets available at www.cree.com. For warranty information, please contact Cree Sales at [email protected]. Copyright © 2008-2009 Cree, Inc. All rights reserved. The information in this document is subject to change without notice. Cree, the Cree logo 6 Cree, Inc. 4600 Silicon Drive Durham, NC 27703 XLamp ® MT Family & MK Family LED Soldering & Handling Notes on Soldering XLamp® MT Family and MK Family LEDs - continued After Soldering After soldering, allow XLamp MT Family and MK Family LEDs to return to room temperature before subsequent handling. Premature handling of the device, especially around the lens, could result in damage to the LED. Cree recommends verifying the solder process by checking the consistency of the solder bond of several trial PCBs after reflow. After shearing selected devices from the circuit board the solder should appear completely re-flowed (no solder grains evident). The solder areas should show minimum evidence of voids on the backside of the package and the PCB. Cleaning PCBs After Soldering Cree recommends using “no clean” solder paste so that flux cleaning is not necessary after reflow soldering. If PCB cleaning is necessary, Cree recommends the use of isopropyl alcohol (IPA). Do not use ultrasonic cleaning. Moisture Sensitivity Cree recommends keeping XLamp LEDs in the provided, resealable moisture-barrier packaging (MBP) until immediately prior to soldering. Unopened MBPs that contain XLamp LEDs do not need special storage for moisture sensitivity. Once the MBP is opened, XLamp MT Family and MK Family LEDs may be stored as MSL 1 per JEDEC J-STD-033, meaning they have unlimited floor life in conditions of ≤ 30 ºC/85% relative humidity (RH). Regardless of storage condition, Cree recommends sealing any unsoldered LEDs in the original MBP. Low Temperature Operation The minimum operating temperature of these XLamp LED components is -40 °C. To maximize lifetime, Cree recommends avoiding applications where the lamps are cycled on and off more than 10,000 cycles at temperatures below 0 °C. Copyright © 2013-2016 Cree, Inc. All rights reserved. The information in this document is subject to change without notice. Cree® and XLamp® are registered trademarks and the Cree logo is a trademark of Cree, Inc. Other trademarks, product and company names are the property of their respective owners and do not imply specific product and/or vendor endorsement, sponsorship or association. This document is provided for informational purposes only and is not a warranty or a specification. For product specifications, please see the data sheets available at www.cree.com. 7 XLamp ® MT Family & MK Family LED Soldering & Handling XLamp® MT Family and MK Family LED Reflow Soldering Characteristics In testing, Cree has found XLamp MT Family and MK Family LEDs to be compatible with JEDEC J-STD-020C, using the parameters listed below. As a general guideline, Cree recommends that users follow the recommended soldering profile provided by the manufacturer of the solder paste used. Note that this general guideline may not apply to all PCB designs and configurations of reflow soldering equipment. tP TP Critical Zone TL to TP Temperature Ramp-up TL tS Tsmax Tsmin Ramp-down ts Preheat 25 t 25˚C to Peak IPC/JEDEC J-STD-020C Time Profile Feature Average Ramp-Up Rate (Tsmax to Tp) Lead-Free Solder 1.2 °C/second Preheat: Temperature Min (Tsmin) 120 °C Preheat: Temperature Max (Tsmax) 170 °C Preheat: Time (tsmin to tsmax) Time Maintained Above: Temperature (TL) Time Maintained Above: Time (tL) Peak/Classification Temperature (Tp) 65-150 seconds 217 °C 45-90 seconds 235 - 245 °C Time Within 5 °C of Actual Peak Temperature (tp) 20-40 seconds Ramp-Down Rate 1 - 6 °C/second Time 25 °C to Peak Temperature 4 minutes max. Note: All temperatures refer to topside of the package, measured on the package body surface. Copyright © 2013-2016 Cree, Inc. All rights reserved. The information in this document is subject to change without notice. Cree® and XLamp® are registered trademarks and the Cree logo is a trademark of Cree, Inc. Other trademarks, product and company names are the property of their respective owners and do not imply specific product and/or vendor endorsement, sponsorship or association. This document is provided for informational purposes only and is not a warranty or a specification. For product specifications, please see the data sheets available at www.cree.com. 8 XLamp ® MT Family & MK Family LED Soldering & Handling Chemicals & Conformal Coatings Below are representative lists of chemicals and materials to be used or avoided in LED manufacturing activities. For a complete and current list of recommended chemicals, conformal coatings and harmful chemicals consult Cree’s Chemical Compatibility Application Note. The video at www.youtube.com/watch?v=t24bf9D_1SA illustrates the process Cree has developed for testing the compatibility of chemicals and materials with LEDs. You should also consult your regional Cree Field Applications Engineer. Recommended Cleaning Solutions Cree has found the following chemicals to be safe to use with XLamp MT Family and MK Family LEDs. • Water • Isopropyl alcohol (IPA) Chemicals Tested as Harmful In general, subject to the specifics in Cree’s Chemical Compatibility Application Note, Cree has found certain chemicals to be harmful to XLamp MT Family and MK Family LEDs. Cree recommends not using these chemicals anywhere in an LED system containing XLamp MT Family and MK Family LEDs. The fumes from even small amounts of the chemicals may damage the LEDs. • Chemicals that might outgas aromatic hydrocarbons (e.g., toluene, benzene, xylene) • Methyl acetate or ethyl acetate (i.e., nail polish remover) • Cyanoacrylates (i.e., “Superglue”) • Glycol ethers (including Radio Shack® Precision Electronics Cleaner - dipropylene glycol monomethyl ether) • Formaldehyde or butadiene (including Ashland® PLIOBOND® adhesive) Hermetically Sealing Luminaires For proper LED operation and to avoid potential lumen depreciation and/or color shift, LEDs of all types must operate in an environment that contains oxygen. Simply allowing the LEDs to ventilate to air is sufficient; no extraordinary measures are required. Hermetically sealing LEDs in an enclosed space is not recommended. Copyright © 2013-2016 Cree, Inc. All rights reserved. The information in this document is subject to change without notice. Cree® and XLamp® are registered trademarks and the Cree logo is a trademark of Cree, Inc. Other trademarks, product and company names are the property of their respective owners and do not imply specific product and/or vendor endorsement, sponsorship or association. This document is provided for informational purposes only and is not a warranty or a specification. For product specifications, please see the data sheets available at www.cree.com. 9 XLamp ® MT Family & MK Family LED Soldering & Handling Assembly Storage & Handling Do not stack PCBs or assemblies containing XLamp MT Family or MK Family LEDs so that anything rests on the LED lens. Force applied to the LED lens may result in the lens being damaged or displaced. PCBs or assemblies containing XLamp MT Family or MK Family LEDs should be stacked in a way to allow at least 1 cm clearance above the LED lens. Do not use bubble wrap directly on top of XLamp MT Family and MK Family LEDs. Force from the bubble wrap can potentially damage the LED. P CORRECT P CORRECT X WRONG Copyright © 2013-2016 Cree, Inc. All rights reserved. The information in this document is subject to change without notice. Cree® and XLamp® are registered trademarks and the Cree logo is a trademark of Cree, Inc. Other trademarks, product and company names are the property of their respective owners and do not imply specific product and/or vendor endorsement, sponsorship or association. This document is provided for informational purposes only and is not a warranty or a specification. For product specifications, please see the data sheets available at www.cree.com. 10 6 4 3 2 1 XLamp ® MT Family & MK Family LED Soldering & Handling REVISONS 5 4 3 2 REV 1 BY DESCRIPTION REVISONS Initial Release A REV B DESCRIPTION Added missing sprocket holes A Initial Release B Added missing sprocket holes DATE APP'D DC 1/28/11 BY DDS DATE 10/17/11 DC 1/28/11 DDS 10/17/11 APP'D Tape and Reel D D D All Cree carrier tapes conform to EIA-481D, Automated Component Handling Systems Standard. D All dimensions in mm. 1.5± .1 MT Family Carrier Tape User Feed Direction 1.5± .1 4±.10 User Feed Direction CATHODE SIDE 4±.10 12±.1 END 12±.1 END 6 5 1.75 ±.10 1.75 ±.10 START START CATHODE SIDE C 4 3 2 REVISONS NOTICE C CREE CONFIDENTIAL. THIS PLOT AND THE INFORMATION CONTAINED WITHIN ARE THE PROPRIETARY AND CONFIDENTIAL INFORMATION OF CREE, INC. THIS PLOT MAY NOT BE COPIED, REPRODUCED OR DISCLOSED TO ANY UNAUTHORIZED PERSON WITHOUTTHE WRITTEN CONSENT OF CREE INC. REV ANODE SIDE Trailer 160mm (min) of empty pockets Trailer sealed tape 160mmwith (min) of (15empty pockets min.) pockets sealed with tape (15 pockets min.) D A 5.25 5.25 16 +.3 -.0 16 +.3 -.0 C 9.4 C 9.4 1 DESCRIPTION BY DATE Initial Release DC 12/7/12 APP'D Loaded Pockets ANODE SIDE (500 Lamps) Loaded Pockets (500 Lamps) MK Family Carrier Tape Leader 400mm (min) of empty pockets Leader sealed tape 400mmwith (min) of (35empty pockets min.) pockets sealed with tape (35 pockets min.) D 1.5± .1 User Feed Direction B 12±.1 END 4±.10 B 1.75 ±.10 START CATHODE SIDE B 4.31 B 6 6 NOTICE NOTICE THIS PLOT AND THE INFORMATION CREE CONFIDENTIAL. CREE CONFIDENTIAL. THIS PLOT AND PROPRIETARY THE INFORMATION CONTANED WITHIN ARE THE AND CONTANED WITHIN ARE THE PROPRIETARY AND CONFIDENTIAL INFORMATION OF CREE, INC. THIS PLOT CONFIDENTIAL INFORMATION OF CREE, INC. OR THIS PLOT MAY NOT BE COPIED, REPRODUCED DISCLOSED TO ANY C MAY NOT BE COPIED, REPRODUCED OR DISCLOSED TO ANY UNAUTHORIZED PERSON WITHOUT THE WRITTEN CONSENT UNAUTHORIZED PERSON WITHOUT THE WRITTEN CONSENT OF CREE INC. OF CREE INC. 6 5 5 4 A 4 3 3 4 ANODE SIDE INDEX Leader 1 THIRD ANGLE PROJECTION User Feed Direction 5 4 5 13mm C 330 +.25 -.75 1 .XXMETAL ± PARTS .25 ONLY FOR SHEET .XXX ± ± .125 .X 1.5 X° ±± .5 .XX .75° .XXX ± PARTS .25 ONLY FOR SHEET METAL X° .5 .X ±± 1.5° 1.6 ± .75 SURFACE.XX FINISH: .XXX ± .25 X° ± .5 ° 3 4 C C QTY UNLESS OTHERWISE SPECIFIED 2 2 420mm (min) DIMENSIONS AREof IN MILLIMETERS AFTER FINISH. empty AND pockets TOLERANCE UNLESS SPECIFIED: UNLESS OTHERWISE SPECIFIED sealed with tapeIN .XX ± ARE.25 DIMENSIONS (35 pockets .XXX ±AFTER .125FINISH. MILLIMETERS ANDmin.) X° UNLESS ± .5 ° TOLERANCE SPECIFIED: A ITEM DATE CHECK DATE DRAWN BY DATE APPROVED DATE CHECK DATE -D. CRONIN Fax (919) 313-5558 4600 Silicon Drive Durham, N.C 27703 TITLE --- MATERIAL APPROVED -- Phone (919) 313-5300 -1/28/11 --- A TITLE -- SIZE MATERIAL FINAL PROTECTIVE FINISH --- SCALE SIZE FINAL PROTECTIVE FINISH 2 -- C 3.000 C SCALE REV. DRAWING NO. MTG LOADING SPEC 2402-00016 DRAWING NO. SHEET OF SHEET OF 2402-00016 1 3.000 REV. 1 /1 B B 1 /1 1 C C 16.4 16.4 +0.2 +0.2 .0 .0 UNLESSAT OTHERWISE MEASURED HUB SPECIFIED MEASURED AT HUB DIMENSIONS ARE IN MILLIMETERS AND AFTER FINISH. TOLERANCE UNLESS SPECIFIED: .XX ± .25 .XXX ± .125 X° ± .5 ° DRAWN BY 1.9±.4 1.9±.4 DATE D. CRONIN 4600 Silicon Drive Durham, N.C 27703 12/7/12 CHECK DATE -- 21 ±.4 Fax (919) 313-5558 DATE APPROVED -- SURFACE FINISH: 3 A TITLE -- MKR LOADING SPEC MATERIAL 1.6 21 ±.4 Phone (919) 313-5300 -- -- 1.9±.4 SIZE C FINAL PROTECTIVE FINISH 4 D B C 16.4 FOR SHEET METAL PARTS ONLY +0.2 13.1 ±.2 .X ± 1.5 .XX ± 13.1 .75 ±.2 .0 .XXX ± .25 X° ± .5 ° MEASURED AT HUB 5 A Phone (919) 313-5300 (919) 313-5558 MTG LOADING Fax SPEC DATE -- D D 4600 Silicon Drive Durham, N.C 27703 2 THIRD ANGLE PROJECTION 6 1 COMMENTS 2400-00009-CORE 2400-00009-REEL D. CRONIN 1/28/11 3 13 " 330 +.25 -.75 C 7.4 12.4 12.4 +.2 +.2 .0 .0 MEASURED AT HUB MEASURED AT HUB 12.4 +.2 .0 MEASURED AT HUB 330 +.25 -.75 -.0 COMMENTS 0.36 DRAWN BY SURFACE FINISH: 1.6 6 COMMENTS 2400-00009 D 6 1 2400-00009-CORE 2400-00009-CORE 2 2400-00009-REEL 2400-00009-REEL 2 THIRD ANGLE PROJECTION B 1 1 16 2400-00009 2400-00009 +.3 ITEM 3 Loaded Pockets (1000 Lamps) empty pockets sealed with tape (15 pockets min.) QTY ITEM 1 1 2 2 1 2 5 2 2 INDEX QTY INDEX NOTICE CREE CONFIDENTIAL. THIS PLOT AND THE INFORMATION D CONTANED WITHIN ARE THE PROPRIETARY AND CONFIDENTIAL INFORMATION OF CREE, INC. THIS PLOT MAY NOT BE COPIED, REPRODUCED OR DISCLOSED Trailer TO ANY UNAUTHORIZED PERSON WITHOUT THE WRITTEN CONSENT 180mm (min) of OF CREE A INC. D -- SCALE 3.000 2 REV. DRAWING NO. 2402-00025 SHEET 1 A OF 1 /1 21 ±.4 B B B B A 5 NOTICE CREE CONFIDENTIAL. THIS 6 PLOT AND THE INFORMATION CONTAINED WITHIN ARE THE PROPRIETARY AND CONFIDENTIAL INFORMATION NOTICE OF CREE, INC. THIS PLOT MAY NOT BE COPIED, REPRODUCED DISCLOSED TO ANY CREE CONFIDENTIAL. THIS PLOT ANDOR THE INFORMATION UNAUTHORIZED PERSON WITHOUT THE WRITTEN CONTAINED WITHIN ARE THE PROPRIETARY AND CONSENT OF CREE INC. INFORMATION OF CREE, INC. THIS PLOT CONFIDENTIAL MAY NOT BE COPIED, REPRODUCED OR DISCLOSED TO ANY UNAUTHORIZED PERSON WITHOUTTHE WRITTEN CONSENT OF CREE INC. 13.1 ±.2 12.4 12.4 +1.0 +1.0 -.5 -.5 MEASURED AT EDGE MEASURED AT EDGE B B 60° 60° 60° 60° 12.4 +1.0 REVISONS -.5 REVISONS REV BY DATE MEASURED EDGE® are registered Copyright © 2013-2016 Cree, Inc. All rights reserved. The information in this document is subject to change without notice. Cree® andAT XLamp trademarksDESCRIPTION and the Cree logo isBYa trademark REV DATE APP'D DESCRIPTION A APP'D of Cree, Inc. Other trademarks, product and company names are the property of their respective owners and do not imply specific product and/or vendor endorsement, sponsorship or association. This document is provided for informational purposes only and is not a warranty or a specification. For product specifications, please see the data sheetsSPECIFIED availableD.at www.cree.com. UNLESS OTHERWISE 60° 4600 Silicon Drive CRONIN 60°09/29/09 DRAWN BY DRAWN BY DATE UNLESS OTHERWISE SPECIFIED DIMENSIONS ARE IN INCHES 09/29/09 DIMENSIONS ARE IN AFTER INCHESFINISH. D. CRONIN CHECK AND CHECK DATE AND TOLERANCE AFTER FINISH. UNLESS SPECIFIED: -TOLERANCE UNLESS.XX SPECIFIED: -- APPROVED -± .01 .XX ± .XXX .01 ± DATE .005APPROVED -.XXX ± X°.005 ± .5 ° --- DATE 11 4600 Silicon Drive Durham, N.C 27703 Durham, N.C Phone 27703 (919) 313-5300 DATE -- Phone (919) 313-5300 Fax (919) 313-5558 Fax (919) 313-5558 DATE -TITLE TITLE REVISONS A A XLamp ® MT Family & MK Family LED Soldering & Handling Packaging & Labels The diagrams below show the packaging and labels Cree uses to ship XLamp MT Family and MK Family LEDs. XLamp MT Family and MK Humidity Indicator Dessicant Family LEDs are shipped in tape loaded on a reel. Each box contains only one reel in a moisture barrier bag. bag) Card (inside (inside bag) Unpackaged Reel Label with Cree Bin Code, Quantity, Reel ID Packaged Reel Label with Cree Bin Code, Qty, Lot # Vacuum-Sealed Moisture Barrier Bag Label with Cree Order Code, Quantity, Reel ID, PO # Label with Cree Bin Code, Quantity, Reel ID Label with Custome Code, Qty, Reel ID, Boxed Reel Label with Cree Order Code, Quantity, Reel ID, PO # Patent Label Label with Cree Bin Code, Quantity, Reel ID Patent Label Copyright © 2013-2016 Cree, Inc. All rights reserved. The information in this document is subject to change without notice. Cree® and XLamp® are registered trademarks and the Cree logo is a trademark of Cree, Inc. Other trademarks, product and company names are the property of their respective owners and do not imply specific product and/or vendor endorsement, sponsorship or association. This document is provided for informational purposes only and is not a warranty or a specification. For product specifications, please see the data sheets available at www.cree.com. 12