Modules – Explanations – SEMIPONT
SEMIPONT®, Bridge Rectifiers and AC
controller
Features
•
Various cases and configurations with diode and thyristor rectifiers, rectifier/brake chopper or AC controller
•
Compact plastic packages with screw, fast-on or PCBmountable lead terminals
•
High blocking voltages up to 1800 V, high surge currents: high ruggedness for hard industrial applications
•
High isolation voltage
•
Large, isolated baseplate (except some Miniature rectifier and SEMIPONT® 5/6)
•
Some types of miniature rectifiers available with
avalanche characteristics
•
Hard or soft moulded
•
UL recognized types available, e. g. File E 63532 for
SEMIPONT® 5/6
•
SEMIPONT® 5/6: Bridge Rectifiers for PCB assembly
with thermal pressure contact, base plate free for low
thermal impedance, soft moulded
•
Integrated temperature sensor in SEMIPONT® 6
•
Terminals of leadable bridges are available for wave
soldering to PCB
•
Fast rectifier bridges including CAL-diodes
For rectifier brigdes and AC controller in SEMITOP ® technology see chapter SEMITOP®. For low power bridge rectifiers for consumer and less rugged applications see in
chapter Low Power Rectifier.
Principal configurations and cases
Uncontrolled Bridges
Case
Connectors
Footprint
dimensions
Miniature
bridge rectifier,
inline,
wired
Miniature rectifier
with
screw connectors
Square bridge
28,5x
28,5mm 2,
wired
136
Diode
bridge
1~
x
x
Diode
bridge
3~
Avalanche
char. avail.
(some types)
x
x
x
Modules – Explanations – SEMIPONT
Case
Connectors
Footprint
dimensions
Square
bridge, fast-on
connectors
Rectangular
bridge, PCB
leadable connectors, 63,5x
29,5mm2
Rectangular
bridge, faston, 80x29mm2
Square
bridge, screw
conn.,
55x55mm2
Square
bridge, screw
conn.,
71x71mm2
SEMIPONT 1,
fast- on,
63x32mm2
SEMIPONT 2,
screw conn.,
65x48mm2
SEMIPONT 3,
screw conn.,
57x42 mm2
SEMIPONT 4,
screw conn.,
94x54 mm2
SEMIPONT 5,
PCB leadable,
81x45,6mm2
SEMIPONT 7,
screw conn.,
94x54mm2
Diode
bridge
1~
Diode
bridge
3~
x
x
Avalanche
char. avail.
(some types)
x
x
x
x
x
x
x
x
x
x
x
x
x
x
Controllable Bridges, Bridges with Brake Chopper,
AC Controller
Case
concon3 ~ dioAC
Connectors
trollable trollable des with controlFootprint
bridge
bridge
brake
ler 3 ~
dimensions
1~
3~
chopper
x
Square
Bridge, screw
conn., 71x
71mm2
SEMIPONT 1,
x
fast-on, 63x
32mm2
15-04-2005
© by SEMIKRON
Modules – Explanations – SEMIPONT
Case
concon3 ~ dioAC
Connectors
trollable trollable des with controlFootprint
bridge
bridge
brake
ler 3 ~
dimensions
1~
3~
chopper
SEMIPONT 2,
x
x
screw conn.,
65x 48mm 2
SEMIPONT 5,
x
x
PCB leadable,
81x 45,6mm2
SEMIPONT 6,
x
PCB leadable,
100x 44,6mm2
SEMIPONT 7,
x
x
screw conn.,
94x 54mm 2
C: Single-phase bridge with freewheeling diode
D: Three-phase bridge
U: Three-phase AC controller W3C
Functional circuit elements
D: Diode bridge
H: Half-controlled diode/thyristor bridge, common cathode
T: Fully controlled thyristor circuit
Direct output current (ID [A]), but SEMIPONT® 5 and 6:
(ID/10 [A])
then last digit is SEMIPONT® case size ("5"; or "6" )
Voltage class (VDRM, VRRM / 100 [V])
Special options:
L: including IGBT brake or PFC chopper
Type Designation Systems
_xx Type current of the IGBT IC [A]
Ambient rated miniature bridge rectifiers with pins for
PCB
Captions of the Figures
Fig. 1 For ambient rated devices: Maximum rated direct
output current ID against ambient temperature Ta for resistive (R) and capacitive (C) loads
SK B B 40 C 1000 L5B
SEMIKRON component
Bridge rectifier, single phase
Two-pulse bridge circuit
Recommended max. AC input voltage (Vrms)
Max. capacitive load current specified in datasheet
Direct output current (freely suspended) (mA)
pin out configuration
Ambient rated miniature bridge rectifiers with screw
terminals
/
_ SK B B 250 / 220 _ 4
SEMIKRON component
Bridge rectifier (single phase)
Two-pulse bridge circuit
Recommended max. AC input voltage (Vrms)
Fig. 2 For ambient rated devices: Typical power dissipation P v against direct output current ID for resistive (R) and
capacitive (C) loads
Fig. 3
Left: For case rated devices: Typical power dissipation P V
against maximum direct current ID for resistive (R) and
capacitive (C) loads
Right: For case rated devices: case temperature Tc
against ambient temperature Ta for various cooling conditions
I: Freely suspended or mounted on an insulator
M: Mounted on a painted metal sheet 250 x 250 x 1 mm3
P ... : Mounted on heatsink P ...
P ... F: Mounted on heatsink P ... with forced air cooling.
For a particular power dissipation Pv on the left hand scale
the corresponding case temperature Tc is given by the
right hand scale. Recommended current: IN = 0,8 ID
Direct output voltage (R/L load) (V)
Fig. 4
Direct output current (freely suspended) (A)
Left: For case rated thyristor devices: Total power dissipation PVTOT of the bridge rectifier against direct output current ID for various conduction angles of the current through
each thyristor (typical values)
SKB a B... Avalanche types
Case rated power input bridge rectifiers SEMIPONT®
/ _
SK DH 116 / 12 _ L100
SEMIKRON component
Circuit
B: Single-phase bridge
© by SEMIKRON
15-04-2005
Right: For case rated thyristor devices: Case temperature
Tc against ambient temperature Ta for various thermal
resistances Rth(c-a) case to ambient of the heatsinks (including contact thermal resistances Rth(c-s) case to heatsink.
For a particular power dissipation on the left vertical scale
the corresponding case temperature is given by the right
scale
Modules – Explanations – SEMIPONT
137
Modules – Explanations – SEMIPONT
Fig. 5 For case rated power rectifiers: Ratio of the permissible overload current IT(OV) under fault conditions to the
surge on-state current ITSM (or IFSM) for 10 ms (50 Hz)
against duration t of the overload (time t = 1 to 1000 ms).
Parameter: Peak value of the reverse voltage applied between the on-state current pulses
Fig. 6 Rated overload characteristic vs. time: Maximum
direct output current ID for short time overload against
duration of overload after operating the bridge at IN = 0,8
ID for times t = 0,1 s to 10 min.
Fig. 7 For avalanche diode devices: Rated reverse power
dissipation. Allowable non-repetitive peak reverse power
dissipation PRSM of the avalanche diode types against
duration of reverse voltage surge time t = 1 µs to 0,1 s,
during operation at IN = 0,8 ID or INCL = 0,8 IDCL
Fig. 8 For thyristor devices: Typical recovered charge Qrr
against rate of decrease of on-state current -diF/dt at maximum virtual junction temperature. Parameter: on-state
current before turn-off
Fig. 9 Forward characteristics of a diode arm. Typical
values
Fig. 10 On-state characteristics of a thyristor arm. Typical
values
Fig. 11 Gate characteristic of a thyristor device: Gate
voltage VG against gate current IG showing the region of
possible (BMZ) and certain (BSZ) triggering for various virtual junction temperatures Tvj. The current and voltage of
the triggering pulse must lie in the region of certain triggering (BSZ), but the peak pulse power PG must not exceed
that given for the pulse length tp used.The curve 20 V;
20 Ω is the output characteristic of an adequate trigger
equipment
Fig. 12 Transient thermal impedance junction to case
Z(th)j-c of a single thyristor (diode) against the time t elapsed after a step change in power dissipation. (For computing intermittend loads)
Avalanche breakdown voltage V(BR)
This value is given for avalanche types only (indicated in
the type number by the letter "a"). At this value of reverse
voltage the reverse current starts to increase rapidly.
Reverse voltage peaks of short duration (< 10 µs) may
exceed the avalanche voltage without causing damage,
but if these peaks are of long duration or are repetitive,
care must be taken that over-dissipation does not occur
(see Fig.7 of those datasheets).
Recommended alternating input voltage VVRMS
This is the sinusoidal r.m.s. input voltage which may be
used with due allowance made for voltage transients. An
efficient transient suppressing network may still be required if the voltage transients are of excessive amplitude,
duration or power.
Maximum value of reservoir capacitor Cmax, and minimum value of surge limiting resistor Rmin with capacitive loads
The values of the surge limiting resistor and the reservoir
capacitor are limited by two requirements:
a) when the current first is switched on, the amplitude and
duration of the initial charging current should not over-load
the rectifier, and
b) the continuous current rating with a capacitive load IDCL
should not be exceeded. This is determined by the form
factor, which is dependent upon Rmin, C max and the load
impedance. Taking account of the above conditions, the
maximum value of reservoir capacitor is given by the following equation:
Cmax = 107 * ID / f * VD
where
Cmax: capacitance of the reservoir capacitor in µF
ID: direct output current in A
VD: direct voltage across the capacitor in V
Technical Explanations
For the caption of all ratings und parameters please refer
to chapters SEMIPACK® and DISCRETE THYRISTORS
AND DIODES or (for brake chopper IGBTs) the chapter
SEMITRANSTM. Below are only the most important definitions for bridge rectifiers.
a) Absolute maximum ratings
f: operating frequency in Hz.
The value for Rmin given in the datasheets includes the
resistances of all components in the charging circuit of the
reservoir capacitor. If a transformer is used which has an
AC resistance of its windings Rmin, then no additional
surge limiting resistor is required. In other cases the winding resistance may be deducted from Rmin to arrive at the
value of resistance which should be used.
Rmin = V VRMS / 1,6 * IFSM
Non-repetitive peak reverse voltage VRSM
where
Maximum allowable peak value of single transient reverse
voltages.
Rmin: minimum value of surge limiting resistance in Ω
Repetitive peak off-state and reverse voltages VDRM
and VRRM
Maximum allowable peak value of repetitive transient offstate and reverse voltages.
138
Modules – Explanations – SEMIPONT
VVRMS: open circuit alternating r.m.s. voltage in V
IFSM: surge current rating of the bridge at maximum
junction temperature in A
15-04-2005
© by SEMIKRON
Modules – Explanations – SEMIPONT
Permissible overload current I(OV)
The diagrams fig. 5 resp. fig. 6 (for small ambient rated
devices) of the datasheet show the ratio of the highest permissible overload current I(OV) to the maximum steadystate output current ID or IDCL, resp., of the bridge rectifier
freely suspended or mounted on an insulator (cooling
mode "isolated"), against the duty cycle ED.
For thyristor terms:
VT; VT(TO) ; rT ; R th(j-c); I GD; V GT; IGT; IH ; I L; (dv/dt)cr; (di/dt)cr
refer to chapter Thyristors
For IGBT-terms:
VCES; VGES; IC ; ICM ; VCEsat; td(on); tr; td(off) ; tf; E on+Eoff; Cies ;
R th(j-c) refer to chapter SEMITRANSTM IGBT- modules
Thermal resistance Rth(j-a); R th(j-c); R th(c-s)
Maximum direct output current ID, IDCL
ID is the maximum direct output current of the complete
rectifier bridge for the heatsink types and cooling conditions stated, with no margins allowed for overloads. IDCL is
the ID with capacitive load. See also fig. 1 (for ambient
rated devices) and fig. 3 (for case rated devices). In practical cases one should use only 80 % of these values (called the "recommended direct output current IN , INCL"), so
that short term overloads and small degradations in cooling conditions will not result in any damage.
Rth(j-a): thermal resistance junction to ambient air is specified for ambient rated devices for PCB mounting
Rth(j-c): thermal resistance junction to case and
Rth(c-s) : thermal contact resistance case to heatsink are
specified for case rated devices, for mounting on a heatsink.The main heat flow is through the base plate of the
bridge rectifier, if the bridge rectifier is built for mounting on
a heatsink. One must take careful note of the mounting
instructions, see down below clause "assembly instructions".
Single cycle surge forward current IFSM
Temperature sensor RTS
Maximum peak value of a single half sinewave current
surge of 10 ms duration which will not cause damage.
5 ms after this surge the reverse voltage may be allowed
to rise to 2/3 of VRRM.
SEMIPONT® 6 includes a temperature sensor as protective device, the resistance of which is specified for 25 °C
and for another high temperature (100 °C).
i2t value
Application Notes
This is the value of i2t, which should not be exceeded by
any fuse used to protect against damage due to short circuits. The i2t rating of the fuse over the specified time interval should be less than the specified value of i2t of the rectifier.
Temperatures Tvj; Tstg; Tsold
Tvjm: maximum junction temperature, this may be exceeded only in case of a fault (IFSM)
Tstg: minimum and maximum storage temperature without
applied voltage = max. operating temperature of the case
Tsold: maximum soldering temperature for the terminals
during solder process. See assembly instructions.
Isolation breakdown withstand voltage Visol
Max. RMS or DC value between the isolated terminals and
the baseplate, applied between the high potential terminals, all connected with each other, and the ground potential of the baseplate for a specified time at the final test procedure of the device. See chapter SEMIPACK, clause
"Isolation".
b) Characteristic values
ESD protection
IGBT circuit (only in SEMIPONT® 6) modules are sensitive
to electrostatic charges. All SEMIPONT® 6 modules are
ESD protected in the shipment box with an ESD cover.
During the modules handling and assembly, use conductive grounded wristlet and a conductive grounded working
place.
Isolation testing
The isolation breakdown withstand voltage Visol between
the live parts and the baseplate (resp. DBC substrate of
SEMIPONT® 5 and 6) of each SEMIKRON rectifier
module is tested during the 100 % final routine test according to the datasheet specifications. For details on relevant international standards about the specifications of
isolation withstand voltage Visol also for equipment (as
IEC, EN; DIN, VDE, UL) see chapter SEMIPACK®/Application notes.
Selection of voltage class
The table below shows the recommended selection
voltage class VRRM to the nominal input line voltage VVN
(examples).
of the functional circuit elements included in the rectifier
device, please refer to the relevant chapter as follows:
For diode terms:
VF; V(TO), rT; Rth(j-c); IRRM; Qrr; Eoff; Rth(j-s) refer to chapter
Diodes
© by SEMIKRON
15-04-2005
Modules – Explanations – SEMIPONT
139
Modules – Explanations – SEMIPONT
nom. AC-line voltage L-L
VVN / V
60
125
250
380
400
440
460
500
575
recommended voltage
class
VRRM, [VDRM] / V
200
400
800
1200
1400
1400
1600
1600
1800
Transient voltage suppression
Where only low-energy transients may occur, the snubber
network recommended in the individual data sheets is sufficient. Alternatively, a varistor may be used in place of the
RC network. For avalanche types with such transients no
suppression network may be necessary. Where highenergy transients are to be expected, more efficient suppression networks should be used for both normal and
avalanche types. It is recommended that the suppression
network be connected across the d.c. terminals. Please
note however that in the case of the controllable rectifiers
the protective network must be fitted across each thyristor
or the AC terminals in order that the suppression be effective when the thyristors are in the off-state. Where transients may occur on the DC side of the circuit, an additional suppression network is necessary.
Over-current and short circuit protection
Against damage by a short circuit appropriate semiconductor fuses should be applied between input terminals
and mains.The i2t value of the fuses should be lower than
the i2t value stated for the device.
Thermal protection
For ambient rated plastic encapsulated bridge rectifiers
which are mounted by fixing bolts but which have no metal
case or metal base plate, the thermal resistance Rth(j-a)
between the silicon chips and the ambient air is specified.
It is valid for the device mounted onto an insulator, where
heat dissipation via the connecting leads plays an
important role. For this reason heavy leads should be
used. Mounting this type of rectifiers on a metal plate
results in only a very small reduction of the thermal resistance. With bridge rectifiers for PCB mounting the quoted
thermal resistances Rth(j-a) are valid for the rectifier seated
tightly on to a PCB having tinned tracks 2 to 3 mm wide.
Bridge rectifiers with long connecting wires can be spaced
5 to 10 mm away from the PCB. This method of mounting
will reduce the thermal resistance by 10 % or 15 % respectively due to the air cooling of the wires. Large area, tin plated PCB tracks can reduce the thermal resistance by 25 %
to 30 %. In this case the rectifier must be seated directly
on to the PCB. If the bridge rectifier is freely suspended by
140
Modules – Explanations – SEMIPONT
its leads from solder or screw terminals, a reduction of up
to 20 % in thermal resistance can be expected. For case
rated bridge rectifiers with metal base plate see also chapter SEMIPACK®.
In SEMIPONT® 6 a temperature sensor is included. This
sensor has RTS = 1000 Ω at 25 °C and 1670 Ω at 100 °C.
If a specified value (for instance 100 °C) is overp assed, a
signal should be formed to either set a warning or reduce
power or switch the equipment off. For the value of measuring current SEMIKRON recommends 1 mA, the maximum values are 10 mA at 25 °C and 1 mA at 125 °C.
Assembly instructions for ambient rated devices for
PCB mounting
Bridge rectifiers supplied with solder leads, resp. pins,
should be soldered at iron or bath temperatures of 245 ±
5 °C. The maximum allowable temperature is 255 °C f or
5 s. Please take note of the interrelationship between
mounting method and heat transfer given in the clause
"thermal protection" further below. For more soldering
details see also chapter Low Power Rectifiers.
Assembly instructions for case rated devices
In order to guarantee good thermal contact and to keep
the thermal contact resistance values specified in the data
sheets the contact area of the heatsink must be clean and
free from particles. The unevenness remaining after grinding those areas must be less than 20 µm, the roughness
less than 10 µm. The heatsinks used for devices with
metal base plate devices must have a flat mounting surface. The metal base or the mounting surface of the case
must be slightly coated with a heat conducting thermal
compound paste, e.g. Wacker-Chemie P12. It is recommended to use a rubber roller, recommended thickness 30
to 80 µm. A gauged manual torque spanner should be
used, not an electric or compressed air tool. Flat and
spring washers should always be used. Heatsinks must be
mounted so, that their cooling fins are in line with the flow
of cooling air. If possible mount the unit near the air inlet
so that the air is not preheated. When the device is mounted on a chassis ensure that the chassis area is at least
250 x 250 mm. If other items contribute to the heating of
the chassis, it will need to be of greater area. In all cases
check that the case temperature will never exceed that
given in the rating diagram, see fig. 1, resp. fig. 3 (case
rated devices). When devices are mounted on insulators,
care must be taken again that the maximum allowable
case temperature Tc = Tstgmax is not exceeded. The insulator must be able to withstand this maximum case temperature and, if this is not so, then the devices must be suspended on heat insulating distance washers.
The table below shows the recommended mounting hardware for some case rated rectifier bridges, for which SEMIKRON offers mounting hardware kits.
15-04-2005
© by SEMIKRON
Modules – Explanations – SEMIPONT
contents
®
SEMIPONT 2
for 8 thyristor
bridges
33701500
SEMIKRONIdent-No.
Baseplate screws 16 pcs. M5x16
Z4-1 DIN 79858.8
Terminal screws 40 pcs. M5x8 Z41 DIN 7985-4.8
Washers
included
on
combi-screw
Crincle washers included
on
combi-screw
gate plugs
48 pcs. B2,8-1 for
plug 2,8 x 0,8 mm
plug
f.
aux. 48 pcs. 2,8 x 0,8
cathode
inside
5,1mm
32409700
insulating
plug 48 pcs. 1-fold
caps
32769500
contents
SEMIPONT 3
for 8 diode bridges
33404200
SEMIKRONIdent-No.
Baseplate screws 16 pcs. M5x16
Z4-1 DIN 79848.8
Terminal screws 40 pcs. M5x12
Z4-1 DIN 79854.8
Washers
included
on
combi-screw
Crincle washers included
on
combi-screw
contents
SEMIKRON-Ident-No.
Baseplate screws
Terminal screws
Washers
Crincle washers
gate plugs
®
SEMIPONT 2
for 8 diode bridges
32759000
16 pcs. M5x16
Z4-1 DIN 79858.8
40 pcs. M5x8 Z41 DIN 7985-4.8
included
on
combi-screw
included
on
combi-screw
-
Heat sink specification
•
The mounting area on the heatsink must be clean and
free from grease and particles
•
Finger prints or discolorations on the bottom side do
not affect the thermal behaviour
The mechanical specifications for the heatsink are:
•
Flatness: 50 µm per 100 mm
•
Roughness RZ : 6,3 µm
•
Machined without overlaps
-
SEMIPONT 4
for 4 diode bridges
33404300
8 pcs. M6x20 Z41 DIN 7985-8.8
20 pcs. M6x12
Z4-1 DIN 79854.8
included
on
combi-screw
included
on
combi-screw
SKB 33, SKB/D 50 for 6
bridges
33404400
12 pcs. M4x8 Z4-1 DIN
7985-4.8
30 pcs. M5x10 Z4-1 DIN
7985-4.8
included on combi-screw
included on combi-screw
12 pcs. 13,5x4 for plug
1,3mm
15-04-2005
Special assembly instructions for SEMIPONT® 5 & 6
-
Recommended: posidrive screws M...x... DIN 7985-...(Z41) (with captive crincle washers and washers) are also
available from Muenchner Schraubenhandel, Dresselhaus KG., D-91126 Schwabach, Germany, Phone +49-
© by SEMIKRON
9122-0072-40;
fax
+49-9122-9972-13;
E-mail:
[email protected] homepage: www.dresselhaus.de
Fig. 1 Heat sink surface specification
Application of thermal grease
In order to avoid air gaps at the interface between the
module and the heat sink a thermal grease must be applied. The function of the grease is to flow according to the
shape of the interface, allowing a metal-to-metal contact
where it is possible, and filling the remaining gaps.
Recommended thermal grease material is Wacker-Chemie P 12.
SEMIKRON recommends to use an hard rubber roller or a
screen print for an even distribution of the grease.
The thickness of the applied grease layer should be:
Module
SEMIPONT® 5
SEMIPONT® 6
Thermal Grease (Wacker
P12) Thickness
50 - 55 µm
50 - 55 µm
The thickness of the applied grease can be checked by a
measuring gauge (e.g. Company ELCOMETER Instruments GmbH, Himmlingstr. 18, 73434 Aalen, Tel. +497366-919283: Sechseck-Kamm 5 - 150 µm).
Assembly on heatsink
After applying the recommended thickness of thermal
grease on the heatsink, tighten the screws applying first a
0,5 Nm torque to each one, in order to lean the module
against the heatsink, and then tighten each screw with the
corresponding mounting torque:
Modules – Explanations – SEMIPONT
141
Modules – Explanations – SEMIPONT
Module
SEMIPONT®
5
Mounting
Torque
2,5 Nm
Screw
Washer
DIN 912-M- DIN
6798
4x20
Form A + DIN
125
DIN 912-M- DIN
6798
4x20
Form A + DIN
125
+0/-10%
SEMIPONT® 3 Nm
6
+15/-15%
SEMIKRON recommends:
•
To use a torque wrench with automatic control;
•
To tighten the screws only once. After the mounting do
not re-tighten the screws to the nominal mounting torque value. Due to relaxation of the housing and flow of
thermal paste, the loosening torque is lower than the
mounting torque. However the construction of the housing, the washers and the adhesion of the thermal
paste still ensure sufficient thermal coupling of the
module to the heatsink.
•
Do not exceed the mounting torque because a further
increase of the maximum mounting torque will not
improve the thermal contact but could only damage the
module.
Connections SEMIPONT® 5 & 6 - PCB
The PCB has to be placed on the plastic posts present in
each corner on the top of the SEMIPONT 5&6 modules
(fig. 2).
The module could be additionally fixed to the PCB by
means of UNI EN ISO 7049 M2,9 self tapping screws.
•
Wave soldering process
•
Selective soldering
Independent of the soldering process used to solder
SEMIPONT® 5 & 6 modules to the PCB, SEMIKRON
recommends a thorough evaluation of the solder joints to
ensure an optimal connection between power module and
the PCB.
The time required to create a robust connection depend
on several parameters:
a) PCB thickness: When increasing the PCB thickness,
the heat dissipation capability of the PCB itself will be the
higher, and thus it will require a longer soldering time.
b) Copper wire area: Pins require large copper wire to
minimize resistive power losses during the current flowing.
Since copper has a good heat transmission coefficient, the
size of these copper wires directly affects the soldering
time necessary to heat the PCB pad.
c) Hand iron power: power, tip size and working temperature of the hand iron affect the soldering time. These
parameters have to be adjusted in order to keep the maximum temperature within the specified limit.
SEMIKRON recommends that the soldering joints should
be thoroughly checked to ensure a high quality soldering
joint. If necessary, different parameters should be adjusted in order to optimise the process.
Hand Soldering
SEMIKRON recommends to not exceed the maximum
temperature of 260 °C for a soldering time of 10 se conds.
The maximum penetration depth must not exceed 6 mm.
The minimum penetration depth has to be 4 mm.
Wave Soldering Profile
In order to avoid mechanical stress to the solder pins, the
PCB has to be additionally supported (e.g. using spacers).
•
Do not exceed the maximum wave soldering profile of
figure 3
•
The maximum preheating temperature has to be kept
under or equal to the maximum storage temperature
(125 °C)
•
Do not exceed the maximum preheating time of
100 seconds
•
During the soldering phase, do not exceed the maximum soldering time of 10 seconds at the maximum
temperature of 260 °C.
SEMIKRON recommends:
Post for PCB connections
Fig. 2 Mounting post details
The suggested hole diameter for the soldering signal and
power pins in the PCB is 2mm.
Soldering on PCB
SEMIPONT® 5 & 6 modules could be soldered to the PCB
using the most common soldering process:
•
Hand iron
142
Modules – Explanations – SEMIPONT
15-04-2005
© by SEMIKRON
Modules – Explanations – SEMIPONT
Fig. 3 Wave soldering profile
© by SEMIKRON
15-04-2005
Modules – Explanations – SEMIPONT
143