REL-1221 -A-A Reliability Report for AME8570 Series Product Approved by Prepared by Amy Shen Quality & Reliability Dept. Manager Eric Chen Quality & Reliability Dept. Engineer Conclusion: The AME8570 series product has successfully met AME’s reliability standard that is required on all AME, Inc products. Furthermore, QRA Dept. of AME, Inc monitors the reliability continuously to make sure that all AME8570 series product will still meet AME’s reliability standard in the future. Table of Contents: Ⅰ、General Description Ⅱ、Product Information Ⅲ、Failures In Time Calculation Ⅳ、Product Reliability Test Result Ⅴ、Package Reliability Test Result Ⅵ、IR-reflow Test Result Ⅰ、General Description: The AME8570 family allows the user to customize the CPU reset function without any external components.The user has serveral choice of reset voltage thresholds, reset time intervals, and output driver configurations, all of which are preset at the factory. These circuits monitor the power supply voltage of µP based systems. When the power supply voltage drops below the voltage threshold a reset is asserted immediately ( within an interval TD1 ). The reset remains asserted after the supply voltage rises above the voltage threshold for a time interval, TD2. The reset output may be either active high ( RESET ) or active low ( RESETB ). The reset output may be configured as either push/pull or open drain. The state of the reset output is guaranteed to be correct only when supply voltage is greater than 1V. The AME8570 also provide a reset manually by pulling the MRB input to ground. Space saving SC-70 package and micropower quiescent current ( < 3.0µA ) make this family a natural for portable battery powered equipment. Ⅱ、Product Information: Operating Pin Ambient Package Configuration Temperature Type Range A: SOT-23 TSOT-23 SC-70-3 1. GND 2. Reset/ ResetB 3. IN B: SOT-23 TSOT-23 1. Reset/ ResetB 2. GND 3. IN C: SOT-23 TSOT-23 1. Reset/ ResetB 2. IN 3. GND A: SC-70-4 1. GND 2. Reset/ ResetB 3. MRB 4. IN E:-40℃ to 85℃ E: SOT-2X I: SC-70 Numb er of Reset Time VIN Threshold Special (TD2NOM) Voltage (VTH) Feature 16: VTH=1.60V 20: VTH=2.00V 21: VTH=2.10V 23: VTH=2.32V 26: VTH=2.63V 27: VTH=2.70V 28: VTH=2.80V 29: VTH=2.93V 31: VTH=3.08V 40: VTH=4.00V 44: VTH=4.38V 46: VTH=4.63V Y: Lead free & Output Options Pins T: 3 A: RESETB/PP A: 1.5ms U: 5 B: RESETB/OD E: 150ms C: RESET/PP F: 210ms (RESET=Active High) (RESETB=Active Low) (PP=Push-pull out) (OD=Open-Drain output) Low profile Z: Lead free Ⅲ、Failures In Time Calculation: Use HTOL test information mentioned in sectionⅣ, FIT (Failures In Time) can be calculated as below: FIT = ( x 2 (ν , CL ) × 10 9 ) /( 2 × S × H × AF ) = ( 4 .61 × 10 9 ) /( 2 × 77 × 1000 × 280 .59 ) =106.69 (pieces per 109 hours) @ 40℃ with 90% Confidence Level. Where AF is acceleration factor setting activation energy to 1.0eV as zero failure. Ⅳ、Product Reliability Test Result: Test Item HTOL Test Condition Precondition NOTE 1 Sample Size / Failures Result 77 pcs / 0 pcs Pass 3 pcs per pin pair / 0 pcs Pass 3 pcs per pin pair / 0 pcs Pass 3 pcs per pin pair / 0 pcs Pass TSTRESS=125℃ Duration=1000hrs Biased, Read at 168/504/1000 hours ESD Human Body Model Pin-to-Pin test Level 2, 2kV minimum ESD Machine Model Pin-to-Pin test Level 2, 200V minimum Latch-up Level 3, 100mA minimum NOTE 1: 85/85 168 hours + IR-reflow 3 cycles with Peak Temp.= 245℃ (leaded) or 260℃ (lead-free). Ⅴ、Package Reliability Test Result: Test Item Test Condition Sample Size / Failures Result MSL 85/85 168 hours 22 pcs / 0 pcs Level 1 45 pcs / 0 pcs Pass 45 pcs / 0 pcs Pass 45 pcs / 0 pcs Pass 45 pcs / 0 pcs Pass 45 pcs / 0 pcs Pass 5 pcs / 0 pcs Pass IR-reflow 3 cycles Peak Temp.= 260℃ (lead-free) IPC/JEDEC J-STD-020C HTS Precondition NOTE 2 Temp.=150℃ Duration=1000 hours Unbiased, Read at 168/504/1000 hours THT Precondition NOTE 2 Temp.=85℃, R.H.=85% Duration=1000 hours Unbiased, Read at 168/504/1000 hours PCT Precondition NOTE 2 Temp.=121℃, R.H.=100% 15PSIG, Unbiased Duration=168 hours Read at 168 hours TCT Precondition NOTE 2 -65℃ ~ 150℃ 1000 cycles Unbiased, Read at 500/1000 cycles TST PreconditionNOTE 2 -55℃~ 125℃ 200 cycles Unbiased, Dwell time:5min Read at 200 cycles Solderability Temp.=245℃ (leaded) Temp.=260℃ (lead-free) Duration=5sec NOTE 2: 85/85 168 hours + IR-reflow 3 cycles with Peak Temp.= 245℃ (leaded) or 260℃ (lead-free). Ⅵ、IR-reflow Test Result: Test Item Test Condition Sample Size / Failures Result IR-reflow See IR reflow Profile 22 pcs / 0 pcs Pass Perform 3 cycles test IR reflow Profile: Profile Feature Average Ramp-Up Rate (Tsmax to Tp) - Preheat Temperature Min (Tsmin) Temperature Max (Tsmax) Time (tsmin to tsmax) Time maintained above - Temperature (TL) - Time (tL) Peak/Classification Temperature (Tp) Time within 5℃ of actual Peak Temperature (tp) Ramp-Down Rate Time 25℃ to Peak Temperature Sn-Pb Eutectic Assembly Pb-Free Assembly 3℃/second max. 3℃/second max. 100℃ 150℃ 60~120 seconds 150℃ 200℃ 60~180 seconds 183℃ 60~150 seconds 217℃ 60~150 seconds 245℃ 260℃ 10~30 seconds 20~40 seconds 6℃/second max. 6 minutes max. 6℃/second max. 8 minutes max.