PCN20120302

Product Change Notices
PCN No.: 20120302
Date: April 6, 2012
Subject: Apply Cu bonding wire on all of the AME’s products
This is to inform you that Cu bonding wire will be applied to all the AME’s products of
those packages that stated in table 1 with below conditions :
1. AME to ensure " Electrical Characteristic" of Cu bonding wire package is 100% meet
compliance of AME specifications.
2. AME had qualified this new material package with reliability test.
3. The Part Number of each product is unchanged, but identification by using D/C is
available.
Table 1
SOT-23、SOT-25、SOT-26、SOT-23A、SOT-89、SOT-143、SOT-223
TSOT-23、TSOT-25、TSOT-26、TSOT-23A、TSOT-25A、TSOT-26A
SOP-8、SOP-8/PP、MSOP8、MSOP10
DFN-6、DFN-8、DFN-10、DFN-12、QFN-12、QFN-16、QFN-20
TO-92、TO-220、TO-252、TO-263
DIP-8、DIP-40、PDIP-8、PQFP44 、SC-70
This notification is for your information and concurrence.
If you require AME Qual/Rel data or samples to qualify this change, please contact AME,
Inc. directly or through AME’s authorized Sales Representative or Distributor.
Please note this PCN will be effective 30 days after the issuing date automatically
if we do not receive any response, comment or questions from you.
REL- Cu Wire -B
If you have any questions concerning this change, please contact:
PCN Originator:
Name: Bill Chou – Director, Engineering Department
Email: [email protected]
Phone: +886.2.2627.8687 # 2110
Reason of Change:
Add Cu bonding wire to ensure the sufficient material source from supplier.
Qual/Rel Report:
Test Item
HTOL
ESD
Latch-up
MSL
HTS
Result
Description
MIL-STD-883F 1005.8 TSTRESS=125℃, Duration= 1000hrs Biased Pass
MIL-STD-883G
Human Body Model, Class 2,
Pass
Method 3015.7
2kV minimum
Method
JEDEC STANDARD
Level A, 100mA minimum
Pass
J-STD-020D
85/85 168 hours, IR-reflow 3 cycles
Peak Temp.= 260℃
MSL1
JESD22-A103C
150℃, 1000 hrs
Pass
85℃,85% RH, 1000hrs, without bias
Pass
Pass
NO.78 MARCH 1997
IPC/JEDEC
THT (85/85) JESD22-A101C
PCT
JESD22-A102C
121℃, 100% RH, 2atm, 168hrs
TCT
JESD22-A104D
-65℃ ~ 150℃, 500 cycles, DWELL=15min Pass
Solderability J-STD-002C
IR-reflow
JESD22-A113F
Temp.=260℃, Duration=5sec
Pass
See IR reflow Profile, Perform 3 cycles test Pass
REL- Cu Wire -B
AME Cu Wire Reliability Report
Packages related to this report were shown below :
SOT-23、SOT-25、SOT-26、SOT-23A、SOT-89、SOT-143、SOT-223
TSOT-23、TSOT-25、TSOT-26、TSOT-23A、TSOT-25A、TSOT-26A
SOP-8、SOP-8/PP、MSOP8、MSOP10
DFN-6、DFN-8、DFN-10、DFN-12、QFN-12、QFN-16、QFN-20
TO-92、TO-220、TO-252、TO-263
DIP-8、DIP-40、PDIP-8、PQFP44 、SC-70
______________________________________________________________________
Prepared by Jess Lin, Supervisor of Quality & Reliability Dept.
Approved by Amy Shen, Manager of Production Management Dept.
REL- Cu Wire -B
Table of Contents:
I、Failures In Time Calculation
II、Product Reliability Test Result
III、Package Reliability Test Result
IV、IR-reflow Test Result
REL- Cu Wire -B
I、Failures In Time Calculation:
Use HTOL test information mentioned in sectionⅣ, FIT (Failures In Time) can be calculated as below:
FIT  ( x 2 ( ,
CL )
 10 9 ) /( 2  S  H  AF )  ( 4 .61  10 9 ) /( 2  77  1000  280 .59 )
=106.57 (pieces per 109 hours) @ 40℃ with 90% Confidence Level.
Where AF is acceleration factor setting activation energy to 1.0eV as zero failure.
II、Product Reliability Test Result:
Test Item
Test Condition
Sample Size / Failures
Result
HTOL
TSTRESS=125℃
77 pcs / 0 pcs
Pass
3 pcs per pin pair / 0 pcs
Pass
3 pcs per pin pair / 0 pcs
Pass
Duration=1000hrs
Biased, Read at
168/504/1000 hours
ESD
Human Body Model
Pin-to-Pin test
Level 2, 2kV minimum
Latch-up
Level A, 100mA minimum
REL- Cu Wire -B
III、Package Reliability Test Result:
Test Item
Test Condition
Sample Size / Failures
Result
MSL
85/85 168 hours
22 pcs / 0 pcs
Level 1
77 pcs / 0 pcs
Pass
77 pcs / 0 pcs
Pass
77 pcs / 0 pcs
Pass
77 pcs / 0 pcs
Pass
5 pcs / 0 pcs
Pass
IR-reflow 3 cycles
Peak Temp.= 260℃
IPC/JEDEC J-STD-020C
HTS
Precondition NOTE 1
Temp.=150℃
Duration=1000 hours
Unbiased, Read at
1000 hours
THT
Precondition NOTE 1
Temp.=85℃, R.H.=85%
Duration=1000 hours
Unbiased,
Read at 1000 hours
PCT
Precondition NOTE 1
Temp.=121℃, R.H.=100%
15PSIG, Unbiased
Duration=168 hours
Read at 168 hours
TCT
Precondition NOTE 1
-65℃ ~ 150℃
200 cycles Unbiased,
Read at 500 cycles
Solderability
Temp.=260℃ (lead-free)
Duration=5sec
NOTE 1: 85/85 168 hours + IR-reflow 3 cycles with Peak Temp.= 260℃
REL- Cu Wire -B
IV、IR-reflow Test Result:
Test Item
Test Condition
Sample Size / Failures
Result
IR-reflow
See IR reflow Profile
22 pcs / 0 pcs
Pass
Perform 3 cycles test
IR reflow Profile:
Profile Feature
Average Ramp-Up Rate
(Tsmax to Tp)
Preheat
- Temperature Min (Tsmin)
- Temperature Max (Tsmax)
- Time (tsmin to tsmax)
Time maintained above
- Temperature (TL)
- Time (tL)
Peak/Classification Temperature
(Tp)
Time within 5C of actual Peak
Temperature (tp)
Ramp-Down Rate
Time 25C to Peak Temperature
Sn-Pb Eutectic Assembly
Pb-Free Assembly
3C /second max.
3C /second max.
100C
150C
60~120 seconds
150C
200C
60~180 seconds
183C
60~150 seconds
245C
217C
60~150 seconds
260C
10~30 seconds
20~40 seconds
6C /second max.
6 minutes max.
6C /second max.
8 minutes max.
REL- Cu Wire -B
The product has successfully met AME’s reliability standard that is required on all AME, Inc products.
Furthermore, QRA Dept. of AME, Inc monitors the reliability continuously to make sure that all product
will still meet AME’s reliability standard in the future.
REL- Cu Wire -B