Product Change Notices PCN No.: 20110805 Date: September 1, 2011 Subject: Apply Cu bonding wire on below products This is to inform you that Cu bonding wire will be applied on the products stated in below (table 1) with below conditions: 1. AME to ensure " Electrical Characteristic" of Cu bonding wire package is 100% compliance AME specifications. 2. AME qualified this new material package reliability. 3. The Part Number of each product is unchanged, but identification through D/C is available. Table 1 Part Number Package Part Number Package SOT-25 AME8802 Family SOT-25 TSOT-23 AME8861 Family TSOT-25 SOT-23 AME8800 Family TSOT-25 AME8801 Family SOT-25 AME8808 Family AME8804 Family SOT-26 AME8810 Family AME8812 Family TSOT-25 AME8847 Family AME8840 Family TSOT-26 AME8848 Family SOT-223 AME8806 Family SOT-25 AME8807 Family SOT-26 AME8809 Family AME8841 Family SOP-8 AME8850 Family AME8842 Family SOP-8 AME8803 Family AME8814 Family SOT-26 AME8824 Family TSOT-26 AME8863 Family TSOT-25 TSOT-26 AME8805 Family SOT-23 SOT-223 This notification is for your information and concurrence. If you require AME Qual/Rel data or samples to qualify this change, please contact AME, Inc. directly or AME’s authorized Sales Representative or Distributor. Please note this PCN will be effective after 30 days of issuing date automatically If we do not receive any response, comment or questions from you within 30 calendar days. If you have any questions concerning this change, please contact: PCN Originator: Name: Bill Chou – Director, Engineering Department I Email: [email protected] Phone: +886.2.2627.8687 # 2110 Expected 1st Device Shipment Date: 10/1/2011 Effective Year/Work Week of Changed Product: NA Cu bonding wire identification through D/C is available. A line on top of the last character represents Cu bonding wire such as AAAww For example : Reason of Change: Add Cu bonding wire to ensure the sufficient material source. Qual/Rel Report: Test Item HTOL ESD Latch-up MSL HTS Result Description MIL-STD-883F 1005.8 TSTRESS=125℃, Duration= 1000hrs Biased Pass MIL-STD-883G Human Body Model, Class 2, Pass Method 3015.7 2kV minimum Method JEDEC STANDARD Level A, 100mA minimum Pass J-STD-020C 85/85 168 hours, IR-reflow 3 cycles Peak Temp.= 260℃ MSL1 JESD22-A103D 150℃, 1000 hrs Pass 85℃,85% RH, 1000hrs Pass Pass NO.78 MARCH 1997 IPC/JEDEC THT (85/85) JESD22-A101C PCT JESD22-A102D 121℃, 100% RH, 2atm, 168hrs TCT JESD22-A104D -65℃ ~ 150℃, 500 cycles, DWELL=15min Pass Solderability J-STD-D02C IR-reflow JESD22-A113F Temp.=260℃, Duration=5sec Pass See IR reflow Profile, Perform 3 cycles test Pass REL-2095-W-A AME88xx Cu Wire Reliability Report Products of this PCN were listed under below Part Number Package Part Number Package SOT-25 AME8802 Family SOT-25 TSOT-23 AME8861 Family TSOT-25 SOT-23 AME8800 Family TSOT-25 AME8801 Family SOT-25 AME8808 Family AME8804 Family SOT-26 AME8810 Family AME8812 Family AME8840 Family TSOT-25 TSOT-26 AME8847 Family AME8848 Family SOT-223 AME8806 Family SOT-25 AME8807 Family AME8809 Family SOT-26 TSOT-25 SOP-8 AME8850 Family AME8841 Family TSOT-26 AME8842 Family SOP-8 AME8803 Family AME8814 Family SOT-26 AME8824 Family TSOT-26 AME8805 Family SOT-23 SOT-223 AME8863 Family Approved by Prepared by Amy Shen Quality & Reliability Dept. Jess Lin Quality & Reliability Dept. Manager Engineer Table of Contents I、Failures In Time Calculation II、Product Reliability Test Result III、Package Reliability Test Result IV、IR-reflow Test Result I、Failures In Time Calculation: Use HTOL test information mentioned in sectionⅣ, FIT (Failures In Time) can be calculated as below: FIT = ( x 2 (ν , CL ) × 10 9 ) /( 2 × S × H × AF ) = ( 4 .61 × 10 9 ) /( 2 × 77 × 1000 × 280 .59 ) =106.69 (pieces per 109 hours) @ 40℃ with 90% Confidence Level. Where AF is acceleration factor setting activation energy to 1.0eV as zero failure. II、Product Reliability Test Result: Test Item Test Condition Sample Size / Failures Result HTOL TSTRESS=125℃ 77 pcs / 0 pcs Pass 3 pcs per pin pair / 0 pcs Pass 3 pcs per pin pair / 0 pcs Pass Duration= 1000hrs Biased, Read at 168/504/1000 hours ESD Human Body Model Pin-to-Pin test Class 2, 2kV minimum Latch-up Level A, 100mA minimum III、Package Reliability Test Result: Test Item Test Condition Sample Size / Failures Result MSL 85/85 168 hours 22 pcs / 0 pcs Level 1 77 pcs / 0 pcs Pass 77 pcs / 0 pcs Pass 77 pcs / 0 pcs Pass 77 pcs / 0 pcs Pass 5 pcs / 0 pcs Pass IR-reflow 3 cycles Peak Temp.= 260℃ IPC/JEDEC J-STD-020C HTS Precondition NOTE 2 Temp.=150℃ Duration=1000 hours Unbiased, Read at 1000 hours THT Precondition NOTE 2 Temp.=85℃, R.H.=85% Duration=1000 hours Unbiased, Read at 1000 hours PCT Precondition NOTE 2 Temp.=121℃, R.H.=100% 15PSIG, Unbiased Duration=168 hours Read at 168 hours TCT Precondition NOTE 2 -65℃ ~ 150℃ 500 cycles Unbiased, Read at 500 cycles Solderability Temp.=260℃ (lead-free) Duration=5sec NOTE 2: 85/85 168 hours + IR-reflow 3 cycles with Peak Temp.= 260℃ IV、IR-reflow Test Result: Test Item Test Condition Sample Size / Failures Result IR-reflow See IR reflow Profile 22 pcs / 0 pcs Pass Perform 3 cycles test IR reflow Profile: Profile Feature Average Ramp-Up Rate (Tsmax to Tp) Preheat - Temperature Min (Tsmin) - Temperature Max (Tsmax) - Time (tsmin to tsmax) Time maintained above - Temperature (TL) - Time (tL) Peak/Classification Temperature (Tp) Time within 5℃ of actual Peak Temperature (tp) Ramp-Down Rate Time 25℃ to Peak Temperature Pb-Free Assembly 3℃/second max. 150℃ 200℃ 60~180 seconds 217℃ 60~150 seconds 260℃ 20~40 seconds 6℃/second max. 8 minutes max.