DOCUMENT : SM0W0000NH REVISION : A1 PAGE : 1 OF 6 SPECIFICATION FOR APPROVAL 3W, 2512, SL Type Low Resistance Chip Resistor (Lead / Halogen Free) 1. Scope This specification applies to 3.2mm x 6.4mm size 3W, fixed metal foil current sensing resistors used in electronic equipment. 2. Type Designation RL32640W – □□□□ – □ (1) (2) (3) Where (1) Series No. (2) Resistance value : For example : Four digits of number R005 = 5mΩ (3) Tolerance : Refer to paragraph 4 3. Dimensions and schematic L Code Letter R005 W t a a Dimensions (mm) 3264 L 6.35 ± 0.25 W 3.15 ± 0.25 a 0.95 ± 0.30 t 0.80 ± 0.20 Note:Marking (No Direction) Figure 1. Construction and Dimensions DOCUMENT : SM0W0000NH REVISION : A1 PAGE : 2 OF 6 SPECIFICATION FOR APPROVAL 4. Specification Characteristics Feature Power Rating* 3W Resistance Value Temperature Coefficient of Resistance 2~4 mΩ 5~50 mΩ ± 200 ppm/℃ ± 100 ppm/℃ Operation Temperature Range -55℃ ~ +170℃ Resistance Tolerance ± 1%(F) , ± 2%(G) , ± 5%(J) Insulation Resistance Over 100MΩ ( P*R)1/2 Maximum Working Voltage (V) RATED LOAD(%) Note * : Power rating is based on continuous full load operation at rated ambient temperature of 70℃. For resistors operated at ambient temperature in excess of 70℃, the maximum load shall be derated in accordance with the following curve. 100 0 -55 70 170 AMBIENT TEMPERATURE(℃) Figure 2.：Power Temperature Derating Curve DOCUMENT : SM0W0000NH REVISION : A1 PAGE : 3 OF 6 SPECIFICATION FOR APPROVAL 5. Reliability Performance Test Item Short Time Overload Condition of Test 5 x Rated power for 5 seconds Refer to JIS C 5201-1 4.13 Thermal Shock Requirements ΔR：± 2.0% -55 ~125℃ 100 cycles, 15 min at each extreme condition ΔR：± 0.5% Refer to JIS C 5201-1 4.19 Low Temperature Storage Kept at -55℃, 1,000 hours Refer to JIS C 5201-1 4.23.4 Resistance to Soldering Heat ΔR：± 1.0% Dipped into solder at 270 ± 5℃ for 20 ± 1 seconds ΔR：± 0.5% Refer to JIS C 5201-1 4.18 Load Life Rated voltage for 1.5hours followed by a pause 0.5hour at 70 ± 3℃ Cycle repeated 1,000 hours ΔR：± 2.0% Refer to JIS C 5201-1 4.25 Damp Heat with Load 40 ± 2℃ with relative humidity 90% to 95%. D.C. rated voltage for 1.5 hours ON 30 minutes OFF. ΔR：± 1.0% Cycle repeated 1,000 hours Refer to JIS C 5201-1 4.24 High Temperature Exposure Kept at 170℃ for 1,000 hours Refer to JIS C 5201-1 4.23.2 Solderability Mechanical Shock Temperature of Solder : 245 ± 5℃ Uniform coating of solder Immersion Duration : 3 ± 0.5 second cover minimum of 95% Refer to JIS C 5201-1 4.17 surface being immersed 100 G’s for 6milliseconds. 5 pulses ΔR：± 0.5% Refer to JIS C 5201-1 4.21 Substrate Bending ΔR：± 1.0% Glass-Epoxy board thickness : 1.6mm Bending width : 2mm Between the fulcrums : 90mm Refer to JIS C 5201-1 4.33 ΔR：± 1.0% DOCUMENT : SM0W0000NH REVISION : A1 PAGE : 4 OF 6 SPECIFICATION FOR APPROVAL 6. Recommended Solder Pad Dimensions L D 3264 W L (mm) (mm) D (mm) t (μm) 4.00 3.35 105 8.00 t: Copper foil minimum thickness of PCB W Cu Trace Sensing Trace Note : We recommend there is no circuit design between pads to avoid circuit short DOCUMENT : SM0W0000NH REVISION : A1 PAGE : 5 OF 6 SPECIFICATION FOR APPROVAL 7. Packaging 7-1 Dimensions 7-1-1 Tape packaging dimensions 0.3 max. 1.5+0.1 -0.0 4.0 ± 0.1 Feed forward hole 2.0 ± 0.05 1.5 ± 0.1 1.75 ± 0.10 5.50 ± 0.05 B 12.0 ± 0.3 1.5 max. A Cavity 4.0 ± 0.1 Pulling direction A = 3.60 ± 0.20 Unit : mm B = 6.80 ± 0.20 7-1-2 Reel dimensions 13.0±0.5 4.0 0 +0 -0 .5 2.0±0.5 178.0±2.0 60.2±0.5 13.2±1.5 16.0±0.2 Unit : mm DOCUMENT : SM0W0000NH REVISION : A1 PAGE : 6 OF 6 SPECIFICATION FOR APPROVAL 7-2 Peel Strength of Top Cover Tape The peel speed shall be about 300mm/min. The peel force of top cover tape shall between 0.1 to 0.7N Top Cover Tape 165 ~ 180° 0.1 ~ 0.7N Carrier tape 7-3 Number of Taping 2,000 pieces / reel 7-4 Label marking The following items shall be marked on the reel. (1) Type designation (2) Quantity (3) Manufacturing date code (4) Manufacturer’s name (5) The country of origin