DOCUMENT : NP-23-A22 (Preliminary specification) SPECIFICATION FOR APPROVAL REVISION : A0 PAGE : 1 OF 4 2W, 2816, SL Type Low Resistance Chip Resistor (Lead / Halogen Free) 1. Scope This specification applies to 4.2mm x 7.1mm size 2W, fixed metal foil current sensing resistors used in electronic equipment. 2. Type Designation RL2816SL – 9 □□□□ □ (1) (2) (3) (4) Where (1) Series No. (2) 9 = 2W (3) Resistance value : For example : Four digits of number R040 = 40mΩ (4) Tolerance : Refer to paragraph 4 3. Dimensions and schematic L R 040 W t a a Code Letter Dimensions (mm) L 7.3 ± 0.3 W 4.4 ± 0.30 a 1.5 ± 0.30 t 0.70 ± 0.25 2816 Note:Marking (No Direction) Figure 1. Construction and Dimensions DOCUMENT : NP-23-A22 (Preliminary specification) SPECIFICATION FOR APPROVAL REVISION : A0 PAGE : 2 OF 4 4. Specification Characteristics Feature Power Rating* 2W 40 mΩ Resistance Value ± 75ppm/℃ Temperature Coefficient of Resistance -55℃ ~ +170℃ Operation Temperature Range Resistance Tolerance ± 1%(F) , ± 2%(G) , ± 5%(J) Insulation Resistance Over 100MΩ ( P*R)1/2 Maximum Working Voltage (V) Note * : Power rating is based on continuous full load operation at rated ambient temperature of 70℃. For resistors operated at ambient temperature in excess of 70℃, the maximum load shall be derated in RATED LOAD(%) accordance with the following curve. 100 0 -55 70 170 AMBIENT TEMPERATURE(℃) Figure 2.：Power Temperature Derating Curve DOCUMENT : NP-23-A22 (Preliminary specification) SPECIFICATION FOR APPROVAL REVISION : A0 PAGE : 3 OF 4 5. Reliability Performance Test Item Short Time Overload Condition of Test 2.5 x Rated power for 5 seconds Refer to JIS C 5201-1 4.13 Thermal Shock Requirements ∆R：± (0.5%) -55 ~125℃ 100 cycles, 15 min at each extreme condition ∆R：± (0.5%) Refer to JIS C 5201-1 4.19 Low Temperature Storage Kept at -55℃, 1,000 hours Refer to JIS C 5201-1 4.23.4 Resistance to Soldering Heat ∆R：± (0.5%) Dipped into solder at 270 ± 5℃ for 20 ± 1 seconds ∆R：± (0.5%) Refer to JIS C 5201-1 4.18 Load Life Rated voltage for 1.5hours followed by a pause 0.5hour at 70 ± 3℃ Cycle repeated 1,000 hours ∆R：± (1.0%) Refer to JIS C 5201-1 4.25 Biased Humidity + 85 °C, 85 % RH, 10 % bias, 1000 h Refer to MIL-STD-202 Method 103 High Temperature Exposure Solderability Substrate Bending ∆R：± (1.0%) Kept at 170℃ for 1,000 hours Refer to JIS C 5201-1 4.23.2 ∆R：± (1.0%) Temperature of Solder : 245 ± 5℃ Uniform coating of solder Immersion Duration : 3 ± 0.5 second cover minimum of 95% Refer to JIS C 5201-1 4.17 surface being immersed Glass-Epoxy board thickness : 1.6mm Bending width : 2mm Between the fulcrums : 90mm Refer to JIS C 5201-1 4.33 ∆R：± (0.5%) DOCUMENT : NP-23-A22 (Preliminary specification) SPECIFICATION FOR APPROVAL REVISION : A0 PAGE : 4 OF 4 6. Recommended Solder Pad Dimensions L D 2816 W L D 4.70 8.10 2.45 W Cu Trace Sensing Trace Note : We recommend there is no circuit design between pads to avoid circuit short