NSC DS89C387_06NNN

DS89C387
Twelve Channel CMOS Differential Line Driver
The driver's input (DI) is compatible with both TTL and CMOS
signal levels.
General Description
The DS89C387 is a high speed twelve channel CMOS differential driver that meets the requirements of TIA/EIA-422-B.
The DS89C387 features a low ICC specification of 1.5 mA
maximum, which makes it ideal for battery powered and power conscious applications. The device replaces three
DS34C87s and offers a PC board space savings up to 30%.
The twelve channel driver is available in a SSOP package.
The device is ideal for wide parallel bus applications.
Each TRI-STATE® enable (EN) allows the driver outputs to
be active or in a HI-impedance off state. Each enable is common to only two drivers for flexibility and control. The drivers
may be disabled to turn off load current and to save power
when data is not being transmitted.
Connection Diagram
Features
■ Low power ICC: 1.5 mA maximum
■ Meets TIA/EIA-422-B (RS-422)
■ Guaranteed AC parameters:
— Maximum driver skew −3 ns
— Maximum transition time −10 ns
■ Available in SSOP packaging:
— Requires 30% less PCB space than 3 DS34C87TMs
Functional Diagram
48L SSOP
DS89C387
1208602
1/6 of package
Truth Table
Enable
Input
EN
DI
Outputs
DO
DO*
Z
L
X
Z
H
H
H
L
H
L
L
H
1208601
Order Number DS89C387TMEA
See NS Package Number MS48A
TRI-STATE® is a registered trademark of National Semiconductor Corporation.
© 2007 National Semiconductor Corporation
12086
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DS89C387 Twelve Channel CMOS Differential Line Driver
December 2006
DS89C387
Absolute Maximum Ratings (Notes 1, 2)
If Military/Aerospace specified devices are required,
please contact the National Semiconductor Sales Office/
Distributors for availability and specifications.
Supply Voltage (VCC)
−0.5 to 7.0V
DC Voltage (VIN)
−1.5 to VCC +1.5V
DC Output Voltage (VOUT)
−0.5 to 7V
Clamp Diode Current (IIK, IOK)
±20 mA
DC Output Current, per pin (IOUT)
±150 mA
DC VCC or GND Current (ICC)
±500 mA
Storage Temperature Range (TSTG)
−65°C to +150°C
Junction Temperature
+150°C
Maximum Power Dissipation (PD) @ 25°C (Note 3)
SSOP Package
1359 mW
Thermal Resistance
DC Electrical Characteristics
θJA
81.7°C/W
θJC
Lead Temperature (TL)
(Soldering 4 sec.)
31.7°C/W
260°C
This device does not meet 2000V ESD rating. (Note 11)
Operating Conditions
Supply Voltage (VCC)
DC Input or Output Voltage (VIN, VOUT)
Operating Temperature Range (TA)
DS89C387T
Input Rise or Fall Times (tr, tf)
Min Max Units
4.50 5.50 V
0 VCC
V
−40 +85
500
°C
ns
(Notes 2, 4)
VCC = 5V ±10% (unless otherwise specified)
Symbol
VIH
Parameter
Conditions
High Level Input
Min
Max
Units
2.0
Typ
VCC
V
GND
0.8
V
Voltage
VIL
Low Level Input
Voltage
VOH
High Level Output
VIN = VIH or VIL,
Voltage
IOUT = −20 mA
Low Level Output
VIN = VIH or VIL,
Voltage
IOUT = 48 mA
Differential Output
RL = 100Ω
Voltage
(Note 5)
Difference In
RL = 100Ω
Differential Output
(Note 5)
Common Mode
RL = 100Ω
Output Voltage
(Note 5)
Difference In
RL = 100Ω
Common Mode Output
(Note 5)
IIN
Input Current
VIN = VCC, GND, VIH, or VIL
ICC
Quiescent Supply
IOUT = 0 μA,
Current
VIN = VCC or GND
VOL
VT
|VT|–|VT|
VOS
|VOS–VOS|
IOZ
ISC
IOFF
2.5
3.4
0.3
2.0
V
0.5
V
3.1
V
0.4
V
3.0
V
0.4
V
±1.0
μA
600
1500
μA
VIN = 2.4V or 0.5V (Note 6)
0.8
2.0
mA
TRI-STATE Output
VOUT = VCC or GND
±0.5
±5.0
μA
Leakage Current
Control = VIL
Output Short
VIN = VCC or GND
−115
−150
mA
Circuit Current
(Notes 5, 7)
Power Off Output
VCC = 0V
VOUT = 6V
100
μA
Leakage Current
(Note 5)
VOUT = −0.25V
−100
μA
2.0
−30
Note 1: Absolute Maximum Ratings are those values beyond which the safety of the device cannot be guaranteed. They are not meant to imply that the device
should be operated at these limits. The table of “Electrical Characteristics” provide conditions for actual device operation.
Note 2: Unless otherwise specified, all voltages are referenced to ground. All currents into device pins are positive; all currents out of device pins are negative.
Note 3: Ratings apply to ambient temperature at 25°C. Above this temperature derate SSOP (MEA) Package 10.9 mW/°C.
Note 4: Unless otherwise specified, min/max limits apply across the −40°C to 85°C temperature range. All typicals are given for VCC = 5V and TA = 25°C.
Note 5: See TIA/EIA-422-B for exact test conditions.
Note 6: Measured per input. All other inputs at VCC or GND.
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2
(Note 4)
VCC = 5V ±10%, tr, tf ≤ 6 ns (Figures 1, 2, 3, 4)
Symbol
tPLH, tPHL
Parameter
Propagation Delay
Min
Typ
Max
Units
S1 Open
Conditions
2
6
11
ns
0
Input to Output
Skew
(Note 8)
S1 Open
0.5
3
ns
tTLH, tTHL
Differential Output Rise
S1 Open
6
10
ns
And Fall Times
tPZH
Output Enable Time
S1 Closed
12
25
ns
tPZL
Output Enable Time
S1 Closed
13
26
ns
tPHZ
Output Disable Time (Note 9)
S1 Closed
4
8
ns
tPLZ
Output Disable Time (Note 9)
S1 Closed
6
12
ns
CPD
Power Dissipation
100
pF
6
pF
Capacitance (Note 10)
CIN
Input Capacitance
Note 7: This is the current sourced when a high output is shorted to ground. Only one output at a time should be shorted.
Note 8: Skew is defined as the difference in propagation delays between complementary outputs at the crossing point.
Note 9: Output disable time is the delay from the control input being switched to the output transistors turning off. The actual disable times are less than indicated
due to the delay added by the RC time constant of the load.
Note 10: CPD determines the no load dynamic power consumption, PD = CPD V2CC f + ICC VCC, and the no load dynamic current consumption, IS = CPD VCC f +
ICC.
Note 11: ESD Rating: HBM (1.5 kΩ, 100 pF)
Inputs ≥ 1500V
Outputs ≥ 1000V
EIAJ (0Ω, 200 pF)
All Pins ≥ 350V
3
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DS89C387
Switching Characteristics
DS89C387
Logic Diagram
1208603
Parameter Measurement Information
1208604
C1 = C2 = C3 = 40 pF (including Probe and Jig Capacitance), R1 = R2 = 50Ω, R3 = 500Ω
FIGURE 1. AC Test Circuit
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DS89C387
1208605
FIGURE 2. Propagation Delays
1208606
FIGURE 3. Enable and Disable Times
1208607
Input pulse; f = 1 MHz, 50%, tr ≤ 6 ns, tf ≤ 6 ns
FIGURE 4. Differential Rise and Fall Times
5
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DS89C387
Typical Application
1208608
* RT is optional although highly recommended to reduce reflection.
FIGURE 5. Two-Wire Balanced System, RS-422
consistant. Therefore, skew calculated in this datasheet, may
not be calculated the same as skew defined in another. This
is important to remember whenever making a skew comparison.
Skew may be calculated for the DS89C387, from many different propagation delay measurements. They may be classified into three categories, single-ended, differential, and
complementry. Single-ended skew is calculated from tPHL and
tPLH measurements (see Figures 6, 7). Differential skew is
calculated from tPHLD and tPLHD measurements (see Figures
8, 9). Complementry skew is calculated from tPHL and tPLH
measurements (see Figures 10, 11).
Application Information
SKEW
Skew may be thought of in a lot of different ways, the next few
paragraphs should clarify what is represented by “Skew” in
the datasheet and how it is determined. Skew, as used in this
databook, is the absolute value of a mathematical difference
between two propagation delays. This is commonly accepted
throughout the semiconductor industry. However, there is no
standardized method of measuring propagation delay, from
which skew is calculated, of differential line drivers. Elucidating, the voltage level, at which propagation delays are measured, on both input and output waveforms are not always
(Circuit 1)
(Circuit 2)
1208609
1208610
FIGURE 6. Circuits for Measuring Single-Ended Propagation Delays (See Figure 7)
Waveforms for Circuit 1
Waveforms for Circuit 2
1208612
1208611
FIGURE 7. Propagation Delay Waveforms for Circuit 1 and Circuit 2 (See Figure 6)
(Circuit 3)
In Figure 2, VX, where X is a number, is the waveform voltage
level at which the propagation delay measurement either
starts or stops. Furthermore, V1 and V2 are normally identical. The same is true for V3 and V4. However, as mentioned
before, these levels are not standardized and may vary, even
with similar devices from other companies. Also note, NC (no
connection) in Figure 1 means the pin is not used in propagation delay measurement for the corresponding circuit.
The single-ended skew provides information about the pulse
width distortion of the output waveform. The lower the skew,
the less the output waveform will be distorted. For best case,
skew would be zero, and the output duty cycle would be 50%,
assuming the input has a 50% duty cycle.
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1208613
FIGURE 8. Circuit for Measuring Differential Propagation
Delays (See Figure 9)
6
DS89C387
Waveforms for Circuit 4
Waveforms for Circuit 3
1208614
1208616
FIGURE 9. Propagation Delay Waveforms
for Circuit 3 (See Figure 8)
FIGURE 11. Waveforms for Circuit 4 (See Figure 10)
For differential propagation delays, V1 should equal V2. Furthermore, the crossing point of DO and DO* corresponds to
zero volts on the differential waveform (see bottom waveform
in Figure 9). This is true whether V3 equals V4 or not. However, if V3 and V4 are specified voltages, then V3 and V4 are
less likely to be equal to the crossing point voltage. Thus, the
differential propagation delays will not be measured to zero
volts on the differential waveform.
The differential skew also provides information about the
pulse width distortion of the differential output waveform relative to the input waveform. The higher the skew, the greater
the distortion of the differential output waveform. Assuming
the input has a 50% duty cycle, the differential output will have
a 50% duty cycle if skew equals zero and less than a 50%
duty cycle if skew is greater than zero.
Complementary skew is calculated from single-ended propagation delay measurements on complementary output signals, DO and DO*. Note, when V3 and V4 are absolute
values, they are identical on DO and DO*; but vary whenever
they are relative values.
The complementary skew reveals information about the contour of the rising and falling edge of the differential output
signal of the driver. This is important information because the
receiver will interpret the differential output signal. If the differential transitions do not continuously ascend or decend
through the receivers threshold region, errors may occur. Errors may also occur if the transitions are too slow.
In addition, complementary skew provides information about
the common mode modulation of the driver. The common
mode voltage is represented by (DO–DO*)/2. This information may be used as a means for determining EMI affects.
Only “Skew” is specified in this datasheet for the DS89C387.
It refers to the complementary skew of the driver. Complementary skew is measured at both V3 and V4 (see
Figure 11).
More information can be calculated from the propagation delays. The channel to channel and device to device skew may
be calculated in addition to the types of skew mentioned previously. These parameters provide timing performance information beneficial when designing. The channel to channel
skew is calculated from the variation in propagation delay
from receiver to receiver within one package. The device to
device skew is calculated from the variation in propagation
delay from one DS89C387 to another DS89C387.
For the DS89C387, the maximum channel to channel skew is
9 ns (tp max–tp min) where tp is the low to high or high to low
propagation delay. The minimum channel to channel skew is
0 ns since it is possible for all 12 drivers to have identical
propagation delays. Note, this is best and worst case calculations used whenever Skew (channel) is not independently
characterized and specified in the datasheet. The device to
device skew may be calculated in the same way and the results are the same. Therefore, the device to device skew is 9
ns and 0 ns maximum and minimum respectively.
(Circuit 4)
1208615
FIGURE 10. Circuit for Measuring Complementary Skew
(See Figure 11)
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DS89C387
Note Skew (comp.) in Table 1 is the same as “Skew” in the
datasheet. Also Skew (channel) and Skew (device) are calculations, but are guaranteed by the propagation delay tests.
Both Skew (channel) and Skew (device) would normally be
tighter whenever specified from characterization data.
The information in this section of the datasheet is to help clarity how skew is defined in this datasheet. This should help
when designing the DS89C387 into most applications.
TABLE 1. DS89C387 Skew Table
Parameter
Min
Typ
Max
Units
Skew (comp.)
0
0.5
3
ns
Skew (channel)
0
9
ns
Skew (device)
0
9
ns
DS89C387 Equivalent Input/Output Circuits
1208617
FIGURE 12. Driver Output Equivalent Circuit
1208618
FIGURE 13. Driver Input or
Driver Enable Equivalent Circuit
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DS89C387
Pin Descriptions
TABLE 2. Device Pin Names and Descriptions
Pin #
Pin
Name
Pin Description
7, 8, 15, 16, 22, 23,
31, 32, 39, 40, 46, 47
DI
TTL/CMOS Compatible Driver Input
2, 6, 9, 13, 17, 21,
26, 30, 33, 37, 41, 45
DO
Non-Inverting Driver Output Pin
3, 5, 10, 12, 18, 20,
27, 29, 34, 36, 44, 44
DO*
Inverting Driver Output Pin
4, 11, 19, 28, 35, 43
EN
Active High Dual Driver Enabling Pin
38
VCC
Positive Power Supply Pin +5 ±10%
14, 24
GND
Device Ground Pin
1, 25, 48
NC
Unused Pin (NOT CONNECTED)
9
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DS89C387
Physical Dimensions inches (millimeters) unless otherwise noted
48-Lead (0.300″ Wide) Molded Shrink Small Outline Package, JEDEC
Order Number DS89C387TMEA
NS Package Number MS48A
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10
DS89C387
Notes
11
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DS89C387 Twelve Channel CMOS Differential Line Driver
Notes
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