Surface Mount Ceramic

KEMET Surface Mount Ceramic
Revision N, 31 August 2015
Note: Information subject to change without notice. Monitor website regularly for updates.
KEMET is not liable for any damages, direct or indirect, consequential or otherwise,
that the reader might incur as a result of ignoring this warning, or that any third party might suffer
as a result of the reader's ignoring this warning.
Characteristics and Typical Construction
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Ceramic Dielectric
Standard EIA Chip Sizes
C0G, X7R, X5R, Y5V, Z5U, X8L & Ultra Stable X8R Dielectrics
Termination code 'C' products support manufacture of RoHS-compliant EEE
4 - 3000 Volts
Tape & Reel Packaging
Bulk Cassette packaging available
Matte Tin finish terminations standard
SnPb terminations available beginning August, 2005
Termination
Internal Electrode
RoHS Restricted Substance Content
Key for Determining Adherence to China RoHS and 2011/65/EU Content Criteria1
O = ≤ MCV, X = > MCV, X = > MCV, but EU RoHS Compliant with Exemption(s)
Restricted Substance
Substance and MCV
KEMET Product
3
High Temperature (175ºC) X7R
High Temperature (200ºC) C0G
KEMET Commercial-Off-The-Shelf (COTS)
Low Profile Ceramic Chip / Standard
Floating Electrode
Floating Electrode w/ Flexible Termination
Flexible Termination
Ceramic Chip / Standard
Ceramic Chip / High Voltage
Ceramic Open Mode Capacitors X7R
High Temperature (200ºC) C0G
KEMET Commercial-Off-The-Shelf (KCOTS)
Low Profile Ceramic Chip / Standard
Floating Electrode
Cd
Cr6+
Pb
Hg
PBB
PBDE
Termination
Code
Voltage
< 0.01%
< 0.1%
< 0.1%
< 0.1%
< 0.1%
< 0.1%
CxxxxC
C
<250 V DC
≥ 250 V DC
O
O
O
O
O
O
O
O
O
O
O
O
CxxxxF
CxxxxG
CxxxxR
CxxxxH
CxxxxT
CxxxxL
CxxxxS
CxxxxY
CxxxxX
C
C
C
C, E, F, G
C
C
C
C
C
O
O
O
O
O
O
O
O
X
O
O
O
Series
Ceramic Chip / Standard
Ceramic Chip / High Voltage
Ceramic Open Mode Capacitors
1
2
China RoHS Symbol
All
CxxxxC
CxxxxF
CxxxxH
CxxxxT
CxxxxL
CxxxxS
Floating Electrode w/ Flexible Termination
CxxxxY
Flexible Termination
CxxxxX
L
(not available
for 0201
products)
1
All
MCV = Maximum Concentration Values per 2011/65/EU and China RoHS criteria.
2
China RoHS Symbol based on current manufacturing.
3
All dielectrics unless otherwise noted.
Soldering Capability Characteristics
Termination Material
Termination Plating (Barrier)
Peak Temperature Capability
Soldering Process Compatibility
MSL Rating per J-STD-020C
Tin Whisker Test Results
based on JESD22-A121 and JESD201
4
5
Matte Tin Termination
Gold Termination
Tin/ Lead Termination
Silver or Copper
100% Matte Sn (Nickel)
260°C
Backward & Forward Compatible
Not Classified4
Silver or Copper
Au (Nickel)
260°C
Backward & Forward Compatible
4
Not Classified
Silver or Copper
90Sn10 Pb (Nickel)
260°C
Backward & Forward Compatible
Not Classified4
Class 2
Class 2
Class 2
MSL not classified for ceramic capacitors. J-STD-020 is applicable to non-hermetic surface mount devices, and is intended for plastic package components. KEMET ceramic chips are not encapsulated in a plastic package, so they are not
susceptible to these effects. If an MSL were required, the rating this product would be considered MSL 1 or better.
5
Ordering
Per EIA/ECA component bulletin CB19, tin whiskering is not considered a reliability risk within the capacitor industry for non-Military / Hi-Rel applications.
Note: Refer to the online KEMET product catalog for part numbering of
KEMET MIL Part Number equivalents.
MIL-PRF- and
Reel level KEMET EZ ID label indicates
product content relative to substance restrictions
of the EU RoHS Directive, 2011/65/EU and China RoHS.
RoHS-PRC = Meets criteria without exemption
RoHS-EU = Meets criteria with exemption
RoHS-NO = Does not meet criteria