Datasheet White LED Driver with PWM Brightness Control for up to 8 LEDs in Series BD6067GU ●Key Specifications Operating power supply voltage range: 2.7V to 5.5V Switching frequency: 1.0MHz(Typ.) Quiescent Current: 0.1μA (Typ.) Operating temperature range: -30°C to +85°C ●General Description BD6067GU is boost DC/DC converters possible to boost output voltage up to 30V (Max.) and drive the white LEDs at constant. It is possible that turning on white LED steadily by a series connection which has no current variation, and by a fast transient response with current mode. ●Package W(Typ.) x D(Typ.) x H(Max.) ●Features ■ Boost DC/DC converter ■ Adjustment of brightness by external PWM pulse ■ Possible to driving 8 LEDs ■ Soft start function VCSP85H1 1.68mm x 1.68mm x 1.00mm ●Applications These drivers are applicable for various fields such as mobile phones, portable game machines, Inter-phone camera, audio player, portable DVD player, back light for printer display etc… and support light of the camera for the mobile phone, simple flash. And, these can use power supply for OEL. ●Typical Application Circuit L1 22µH ●Pin Configuration [Bottom View] D1 VIN CIN 1µF COUT 1µF VIN SW C1 C2 C3 VOUT 20mA B3 B1 BD6067GU VFB A1 A2 A3 VDAC R1 10Ω Figure 1. Pin Configuration EN GND GNDA OFF ON ○Product structure：Silicon monolithic integrated circuit www.rohm.com © 2012 ROHM Co., Ltd. All rights reserved. TSZ22111・14・001 ○This product is not designed protection against radioactive rays 1/14 TSZ02201-0G3G0C200080-1-2 5.OCT.2012 Rev.001 Datasheet BD6067GU ●Absolute Maximum Ratings (Ta=25°C) Parameter Symbol Ratings Unit Terminal voltage 1 VMAX1 7 *1 V Terminal voltage 2 VMAX2 40 *1 V Operating temperature range Topr -30 to +85 °C Storage temperature range Tstg -55 to +150 °C Pd 800 *2 mW Power dissipation *1 *2 Conditions Applicable to VIN, EN, VFB and VDAC pins Applicable to SW and VOUT pins 50mm×58mm×1.75mm Glass epoxy PCB mounting This value is based on GND. This loss decreases approximate 6.4mW/°C when Ta is 25°C or more. ●Recommended Operating Ratings (Ta=-30°C to +85°C) Parameter Symbol Ratings Unit VIN 2.7 to 5.5 V Operating supply voltage Conditions VIN pin ●Electrical Characteristics (Unless otherwise stated, Ta = 25°C and VIN = 3.6V.) Limits Parameter Symbol Unit Min. Typ. Max. Conditions <EN pin> ‘L’ level input voltage VthL - - 0.4 V ‘H level input voltage VthH 1.4 - - V ‘H’ level input current IIH - 18.3 30.0 μA EN=5.5V ‘L’ level input current IIL -2.0 -0.1 - μA EN=0V VDAR 56 112 168 kΩ Quiescent current Iq - 0.1 2.0 μA EN=0V Operating current Idd - 0.9 1.4 mA EN=3.6V, VFB=1.0V VFB pin control voltage VFB 0.18 0.20 0.22 V Over current limit Icoil 450 600 750 mA SW transistor ON resistance Ronn - 0.5 1.4 Ω Switching frequency fSW 0.8 1.0 1.2 MHz Maximum duty Duty 92.5 95.0 - % Vo - - 30.0 V Over voltage protection Ovp 30.0 31.0 32.0 V Output open protection Ovl - 0.7 1.4 V Startup time Ts - 0.5 1.0 ms <DAC control pin> VDAC-VFB resistance <Switching regulator> Output voltage range *1 *1 Isw=200mA VFB=0V VFB=0V VOUT=24V The DC current is measured in this item. www.rohm.com © 2012 ROHM Co., Ltd. All rights reserved. TSZ22111・15・001 2/14 TSZ02201-0G3G0C200080-1-2 5.OCT.2012 Rev.001 Datasheet BD6067GU ●Pin Description Pin Pin name number In/Out Function A1 GNDA - Analog GND A2 EN In Enable control (pull-down by internal resistance) A3 VDAC In Analog signal input for current adjustment B1 VIN - Supply voltage input B3 VFB In Feedback voltage input C1 VOUT In Over voltage protection input SBD open protection input C2 SW In Switching pin C3 GND - Power GND ●Block Diagram VIN VOUT SW Over voltage protect Thermal Shutdown TSD Output open protect PWM comp S Q1 Control Q R Current Sense + www.rohm.com © 2012 ROHM Co., Ltd. All rights reserved. TSZ22111・15・001 + - ERRAMP + 14kΩ VFB 98kΩ VDAC OSC 300kΩ GND GNDA + + - EN 3/14 TSZ02201-0G3G0C200080-1-2 5.OCT.2012 Rev.001 Datasheet BD6067GU ●Typical Performance Curves 1.0 5.0 0.9 0.8 4.0 3.0 0.6 Iq [µA] Idd [mA] 0.7 Ta=85°C 2.0 Ta=25°C 0.5 Ta=85°C 0.4 Ta=25°C 0.3 1.0 Ta=-30°C 0.2 0.1 Ta=-30°C 0.0 2.5 3 3.5 4 VIN [V] 4.5 5 0.0 2.5 5.5 Figure 2. Operating current vs. Power Supply Voltage 3 3.5 4 VIN [V] 5 5.5 Figure 3. Quiescent current vs. Power Supply Voltage 100 1.4 1.3 VIN=5.5V 90 Ta=25°C 1.2 Ta=-30°C Efficiency [%] Switching freqency [MHz] 4.5 1.1 1 0.9 80 VIN=3.6V 70 VIN=3.1V Ta=85°C 0.8 60 0.7 0.6 2.5 50 3 3.5 4 4.5 VIN [V] 5 5 5.5 25 ILED [mA] 35 45 Figure 5. Efficiency vs. LED Current (6LED) (Ta=25°C) Figure 4. Oscillation Frequency vs. Power Supply Voltage www.rohm.com © 2012 ROHM Co., Ltd. All rights reserved. TSZ22111・15・001 15 4/14 TSZ02201-0G3G0C200080-1-2 5.OCT.2012 Rev.001 Datasheet BD6067GU 100 100 VIN=5.5V 80 VIN=3.6V 70 VIN=5.5V 90 Efficiency [%] Efficiency [%] 90 VIN=3.1V 60 80 70 VIN=3.6V VIN=3.1V 60 50 5 15 25 35 50 45 ILED [mA] 5 25 ILED [mA] Figure 6. Efficiency vs. LED Current (7LED) (Ta=25°C) Figure 7. Efficiency vs. LED Current (8LED) (Ta=25°C) 3500 15 35 45 230 3000 Ta=25°C 220 2500 Ta=-30°C 210 Ta=-30°C VFB [mV] Output power [mW]1 Ta=25°C 2000 1500 200 190 1000 180 500 0 2.5 Ta=85°C Ta=85°C 3 3.5 4 VIN [V] 4.5 5 170 2.5 5.5 Figure 8. Output Voltage vs. Power Supply Voltage (8LED) www.rohm.com © 2012 ROHM Co., Ltd. All rights reserved. TSZ22111・15・001 3 3.5 4 VIN [V] 4.5 5 5.5 Figure 9. VFB Pin Control Voltage vs. Power Supply Voltage (8LED) (ILED=20mA) 5/14 TSZ02201-0G3G0C200080-1-2 5.OCT.2012 Rev.001 Datasheet BD6067GU 25 25 20 20 VIN=3.6V 15 ILED [mA] ILED [mA] VIN=3.6V 10 15 10 VIN=3.1V VIN=3.1V 5 5 VIN=2.7V 0 0 20 40 60 EN Duty [%] 80 0 0.0 100 0.5 1.0 VDAC [V] 1.5 2.0 Figure 11. DAC Brightness Control Characteristic Figure 10. EN Pin PWM Brightness Control Characteristic (f=100Hz, Ta=25°C) www.rohm.com © 2012 ROHM Co., Ltd. All rights reserved. TSZ22111・15・001 VIN=2.7V 6/14 TSZ02201-0G3G0C200080-1-2 5.OCT.2012 Rev.001 Datasheet BD6067GU ●Release Circuit Protection 1) Operation BD6067GU is a constant frequency PWM current mode DC/DC converter. It is shown in the block diagram of Page 3 In a PWM comparator forming one of the PWM current mode features, one is an error element from the error amplifier and another is an element produced by superimposing the inductor current on a slope waveform that prevents sub-harmonic oscillation. This output controls Q1 via the RS latch. Energy is stored in an external inductor whileQ1 is ON and then it is moved to the COUT capacitor via D1 while Q1 is OFF. In this way, voltage VOUT higher than input voltage VIN can be obtained. Because the above operation is performed in a way that the VFB pin voltage equals the VFB voltage, the boost voltage is dominantly determined by the expression “Vf × number of LEDs.” VOUT voltage = (Vf × number of LEDs) + VFB 2) LED current control The LED current is determined depending on the VFB pin voltage “VFB” and the resistance connected to VFB. ILED is given below. ILED =200mV/ R1 ILED [mA] 5 10 12 15 20 BD6067GU 39 20 16 13 10 R1 [Ω] 3) Dimming control ▪ Control by PWM signal The startup condition of BD6067GU is controlled via the EN pin. It is powered OFF at 0.4V or less and powered ON at 1.4V or more. As shown in Figure 12, brightness is controlled in the BD6067GU via the PWM signal input the EN pin. In this way, the LED current is controlled in a range from 0 to the maximum current. The average LED current increases in proportion to the Duty cycle of the PWM signal. In the PWM off cycle, no current dissipation takes place in IC and LEDs, resulting in high efficiency. Duties below 5% and above 95% must no be used for brightness control because they significantly affects the leading and trailing edges. BD6067GU standard PWM frequency ranges from 100Hz to 300Hz. L1 22μH VIN VIN D1 SW VOUT 1μF BD6067GU VFB VDAC GNDA GND ILED EN PWM 100Hz~300Hz R1 10Ω Figure 12. Example of Brightness Control by PWM signal at the EN Pin www.rohm.com © 2012 ROHM Co., Ltd. All rights reserved. TSZ22111・15・001 7/14 TSZ02201-0G3G0C200080-1-2 5.OCT.2012 Rev.001 Datasheet BD6067GU ▪ Control by DC Voltage BD6067GU has a built-in function for LED current control by DC voltage and can control the current by VDAC pin control voltage. L1 22μH 25 VIN VIN D1 SW 20 VOUT BD6067GU VFB ILED [mA] 1μF VFB VDAC GNDA GND EN 15 10 ILED 5 0 DAC 0 0.5 1 1.5 2 2.5 DAC [V] (VFB=200mV) R1 10Ω Figure 14. DAC Constant Current Characteristics by DAC Control Figure 13. Brightness Control by BD6067GU DAC ●Over voltage Protection BD6067GU has an over voltage protection feature. When a fault occurs, for example, IC is disconnected from LED, an excessive voltage rise may cause the SW pin and VOUT pin to exceed the absolute maximum ratings respectively, resulting in IC damage. For this reason, when VOUT is 30V or more, over voltage protection is activated to turn Q1 off so that the SW pin and VOUT pin don’t exceed the absolute maximum ratings. At this time, the IC state changes from active to inactive and the output voltage drops slowly. Then, when the output voltage falls below the over voltage protection hysteresis level, the output voltage continues to rise up to 30V again. This protection circuit is shown in Figure 15. D1 SW Q1 COUT VOUT Driver OVER Detector OVER VOLTAGE REF Control Figure 15. Block Diagram for Short-circuit Protection and over voltage Protection www.rohm.com © 2012 ROHM Co., Ltd. All rights reserved. TSZ22111・15・001 8/14 TSZ02201-0G3G0C200080-1-2 5.OCT.2012 Rev.001 Datasheet BD6067GU ●Startup and Rush Current BD6067GU has a built-in soft start function. This function prevents the rush current from being generated at startup time. L1 22µH D1 VIN CIN 1µF VIN SW VOUT Over voltage protect Thermal Shutdown COUT 1µF + - Output open protect ILED + - TSD Soft start circuit PWM comp Control Q Q1 ERRAMP + S R + 14kΩ VFB 98kΩ R1 10Ω VDAC Current Sense 300kΩ + VDAC 0~1.8V OSC GND GNDA EN OFF ON Figure 16. Soft Start Circuit ●Application Circuit Example The output maximum voltage range of BD6067GU is 30V. *** When LED has 8 lights, special care should be taken to prevent output voltage (VOUT) from exceeding 30V. VOUT = (LED Vf × number of LED lights) + VFB L1 22µH D1 VIN CIN 1µF VIN Over voltage protect Thermal Shutdown Output open protect TSD PWM comp Control Q R Current Sense OSC 300kΩ + 14kΩ VFB R1 10Ω 98kΩ VDAC 1µF R2 10kΩ 1kHz EN OFF ILED + ERRAMP + + GND GNDA + - - S Q1 COUT 1µF VOUT SW ON Figure 17. Example of Dimming Circuit Subject to PWM Control at the VDAC Pin www.rohm.com © 2012 ROHM Co., Ltd. All rights reserved. TSZ22111・15・001 9/14 TSZ02201-0G3G0C200080-1-2 5.OCT.2012 Rev.001 Datasheet BD6067GU ●External components Selection Method <<Constants in the standard circuit example>> R1: Determines the LED current ILED at power ON. <Recommended parts> ILED (mA) R1[Ω] 5 39 15 13 20 10 L1: Coil for boost. The recommended value is 22µH. be sure to use a sufficient DC current permissible value and a sufficient low DC resistance coil. <Recommended parts> Inductance value Model number/manufacturer 22µH NR3015T220M / TAIYO YUDEN CIN: Bypass capacitor of power supply. This capacitor must be provided to remove an instantaneous power supply noise for stable voltage supply to this IC. To obtain good characteristics, the low ESR parts like the ceramics capacitor must be used. The recommended capacitance is 1µF or more. <Recommended parts> Capacitance value Model number/manufacturer 1.0µF GRM188B11A105KA61B / MURATA COUT: Output smoothing capacitor. The capacitance recommended for BD6067GU is 1.0µF. <Recommended parts> Capacitance value Model number/manufacturer 1.0µF UMK107C105KA-B / TAIYO YUDEN When selecting capacitors for CIN and COUT, special care should be taken for rated voltage. The desirable rated voltage is about double the voltage actually applied to the capacitor. When the margin for rated voltage is not sufficient, the capacitance may be a half or less of the nominal value. D1: Schottky barrier diode (SBD) for output rectification. To achieve high conversion efficiency, use a diode characterized by of low Vf, low reverse leak and high current capacity. <Recommended parts> Model number/manufacturer RB160M-40 / ROHM ●Recommended PCB layout When a PCB designed, the power supply line should be wired in a way that the board impedance can be minimized. If necessary, the bypass capacitor must be connected. In particular, pins around the DC/DC converter must be wired in such a way that the wiring impedance can be minimized. In addition, when a DC/DC converter using a coil is used, it is necessary to place the output capacitor COUT, coil L1, rectification diode D1 and bypass capacitor CIN near this IC and keep the GND impedance low. To cell voltage source CIN EN GNDA VIN VOUT VDAC VFB SW R1 GND COUT D1 To battery GND L1 Figure 18. PCB Layout Image www.rohm.com © 2012 ROHM Co., Ltd. All rights reserved. TSZ22111・15・001 10/14 TSZ02201-0G3G0C200080-1-2 5.OCT.2012 Rev.001 Datasheet BD6067GU Top surface (Top view) Bottom surface (Top view) Figure 19. PCB Layout ***Bypass capacitor and GND It is necessary to place bypass capacitor CIN, coil L1 and power ground GND near this IC (CIN2 of Figure 19). To obtain good characteristics, as the need arises power supply, bypass capacitor CIN between analog GNDA must be added. (at LED8 lights). When LED has 8 lights, full assessment is required for characteristics prior to usage. www.rohm.com © 2012 ROHM Co., Ltd. All rights reserved. TSZ22111・15・001 11/14 TSZ02201-0G3G0C200080-1-2 5.OCT.2012 Rev.001 Datasheet BD6067GU ●Operational Notes 1) Absolute Maximum Ratings An excess in the absolute maximum ratings, such as supply voltage, temperature range of operating conditions, etc., can break down devices, thus making impossible to identify breaking mode such as a short circuit or an open circuit. If any special mode exceeding the absolute maximum ratings is assumed, consideration should be given to take physical safety measures including the use of fuses, etc. 2) Operating conditions These conditions represent a range within which characteristics can be provided approximately as expected. The electrical characteristics are guaranteed under the conditions of each parameter. 3) Reverse connection of power supply connector The reverse connection of power supply connector can break down ICs. Take protective measures against the breakdown due to the reverse connection, such as mounting an external diode between the power supply and the IC’s power supply terminal. 4) Power supply line Design PCB pattern to provide low impedance for the wiring between the power supply and the GND lines. In this regard, for the digital block power supply and the analog block power supply, even though these power supplies has the same level of potential, separate the power supply pattern for the digital block from that for the analog block, thus suppressing the diffraction of digital noises to the analog block power supply resulting from impedance common to the wiring patterns. For the GND line, give consideration to design the patterns in a similar manner. Furthermore, for all power supply terminals to ICs, mount a capacitor between the power supply and the GND terminal. At the same time, in order to use an electrolytic capacitor, thoroughly check to be sure the characteristics of the capacitor to be used present no problem including the occurrence of capacity dropout at a low temperature, thus determining the constant. 5) GND voltage Make setting of the potential of the GND terminal so that it will be maintained at the minimum in any operating state. Furthermore, check to be sure no terminals are at a potential lower than the GND voltage including an actual electric transient. 6) Short circuit between terminals and erroneous mounting In order to mount ICs on a set PCB, pay thorough attention to the direction and offset of the ICs. Erroneous mounting can break down the ICs. Furthermore, if a short circuit occurs due to foreign matters entering between terminals or between the terminal and the power supply or the GND terminal, the ICs can break down. 7) Operation in strong electromagnetic field Be noted that using ICs in the strong electromagnetic field can malfunction them. 8) Inspection with set PCB On the inspection with the set PCB, if a capacitor is connected to a low-impedance IC terminal, the IC can suffer stress. Therefore, be sure to discharge from the set PCB by each process. Furthermore, in order to mount or dismount the set PCB to/from the jig for the inspection process, be sure to turn OFF the power supply and then mount the set PCB to the jig. After the completion of the inspection, be sure to turn OFF the power supply and then dismount it from the jig. In addition, for protection against static electricity, establish a ground for the assembly process and pay thorough attention to the transportation and the storage of the set PCB. 9) Input terminals In terms of the construction of IC, parasitic elements are inevitably formed in relation to potential. The operation of the parasitic element can cause interference with circuit operation, thus resulting in a malfunction and then breakdown of the input terminal. Therefore, pay thorough attention not to handle the input terminals, such as to apply to the input terminals a voltage lower than the GND respectively, so that any parasitic element will operate. Furthermore, do not apply a voltage to the input terminals when no power supply voltage is applied to the IC. In addition, even if the power supply voltage is applied, apply to the input terminals a voltage lower than the power supply voltage or within the guaranteed value of electrical characteristics. 10) Ground wiring pattern If small-signal GND and large-current GND are provided, It will be recommended to separate the large-current GND pattern from the small-signal GND pattern and establish a single ground at the reference point of the set PCB so that resistance to the wiring pattern and voltage fluctuations due to a large current will cause no fluctuations in voltages of the small-signal GND. Pay attention not to cause fluctuations in the GND wiring pattern of external parts as well. 11) External capacitor In order to use a ceramic capacitor as the external capacitor, determine the constant with consideration given to a degradation in the nominal capacitance due to DC bias and changes in the capacitance due to temperature, etc. 12) Thermal shutdown circuit (TSD) When junction temperatures become 175°C (Typ.) or higher, the thermal shutdown circuit operates and turns a switch OFF. The thermal shutdown circuit, which is aimed at isolating the LSI from thermal runaway as much as possible, is not aimed at the protection or guarantee of the LSI. Therefore, do not continuously use the LSI with this circuit operating or use the LSI assuming its operation. 13) Thermal design Perform thermal design in which there are adequate margins by taking into account the permissible dissipation (Pd) in actual states of use. 14) Selection of coil Select the low DCR inductors to decrease power loss for DC/DC converter. Status of this document The Japanese version of this document is formal specification. A customer may use this translation version only for a reference to help reading the formal version. If there are any differences in translation version of this document formal version takes priority. www.rohm.com © 2012 ROHM Co., Ltd. All rights reserved. TSZ22111・15・001 12/14 TSZ02201-0G3G0C200080-1-2 5.OCT.2012 Rev.001 Datasheet BD6067GU ●Ordering Information B D 6 0 6 7 Part Number G U - E2 Package GU : VCSP85H1 Packaging and forming specification E2: Embossed tape and reel ●Marking Diagram VCSP85H1 (TOP VIEW) 1PIN MARK Part Number Marking 6067 LOT Number ●Physical Dimension Tape and Reel Information VCSP85H1 (BD6067GU) <Tape and Reel information> 1.68±0.1 Tape Embossed carrier tape Quantity 3000pcs Direction of feed 1.0MAX 0.25±0.1 1.68±0.1 1PIN MARK E2 The direction is the 1pin of product is at the upper left when you hold ( reel on the left hand and you pull out the tape on the right hand ) A (φ0.15)INDEX POST C B B A 1 0.34±0.1 2 P=0.5×2 0.08 S 8-φ0.3±0.05 0.05 A B 0.34±0.1 S 3 1pin P=0.5×2 (Unit : mm) www.rohm.com © 2012 ROHM Co., Ltd. All rights reserved. TSZ22111・15・001 Reel 13/14 Direction of feed ∗ Order quantity needs to be multiple of the minimum quantity. TSZ02201-0G3G0C200080-1-2 5.OCT.2012 Rev.001 Datasheet BD6067GU ●Revision History Date Revision 05.Oct.2012 001 Changes New Release www.rohm.com © 2012 ROHM Co., Ltd. All rights reserved. TSZ22111・15・001 14/14 TSZ02201-0G3G0C200080-1-2 5.OCT.2012 Rev.001 Datasheet Notice ●General Precaution 1) Before you use our Products, you are requested to carefully read this document and fully understand its contents. ROHM shall not be in any way responsible or liable for failure, malfunction or accident arising from the use of any ROHM’s Products against warning, caution or note contained in this document. 2) All information contained in this document is current as of the issuing date and subject to change without any prior notice. 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Unless otherwise agreed in writing by ROHM in advance, ROHM shall not be in any way responsible or liable for any damages, expenses or losses incurred by you or third parties arising from the use of any ROHM’s Products for Specific Applications. 2) ROHM designs and manufactures its Products subject to strict quality control system. However, semiconductor products can fail or malfunction at a certain rate. Please be sure to implement, at your own responsibilities, adequate safety measures including but not limited to fail-safe design against the physical injury, damage to any property, which a failure or malfunction of our Products may cause. The following are examples of safety measures: [a] Installation of protection circuits or other protective devices to improve system safety [b] Installation of redundant circuits to reduce the impact of single or multiple circuit failure 3) Our Products are designed and manufactured for use under standard conditions and not under any special or extraordinary environments or conditions, as exemplified below. Accordingly, ROHM shall not be in any way responsible or liable for any damages, expenses or losses arising from the use of any ROHM’s Products under any special or extraordinary environments or conditions. If you intend to use our Products under any special or extraordinary environments or conditions (as exemplified below), your independent verification and confirmation of product performance, reliability, etc, prior to use, must be necessary: [a] Use of our Products in any types of liquid, including water, oils, chemicals, and organic solvents [b] Use of our Products outdoors or in places where the Products are exposed to direct sunlight or dust [c] Use of our Products in places where the Products are exposed to sea wind or corrosive gases, including Cl2, H2S, NH3, SO2, and NO2 [d] Use of our Products in places where the Products are exposed to static electricity or electromagnetic waves [e] Use of our Products in proximity to heat-producing components, plastic cords, or other flammable items [f] Sealing or coating our Products with resin or other coating materials [g] Use of our Products without cleaning residue of flux (even if you use no-clean type fluxes, cleaning residue of flux is recommended); or Washing our Products by using water or water-soluble cleaning agents for cleaning residue after soldering [h] Use of the Products in places subject to dew condensation 4) The Products are not subject to radiation-proof design. 5) Please verify and confirm characteristics of the final or mounted products in using the Products. 6) In particular, if a transient load (a large amount of load applied in a short period of time, such as pulse) is applied, confirmation of performance characteristics after on-board mounting is strongly recommended. Avoid applying power exceeding normal rated power; exceeding the power rating under steady-state loading condition may negatively affect product performance and reliability. 7) De-rate Power Dissipation (Pd) depending on Ambient temperature (Ta). When used in sealed area, confirm the actual ambient temperature. 8) Confirm that operation temperature is within the specified range described in the product specification. 9) ROHM shall not be in any way responsible or liable for failure induced under deviant condition from what is defined in this document. Notice - Rev.003 © 2012 ROHM Co., Ltd. All rights reserved. Datasheet ●Precaution for Mounting / Circuit board design 1) When a highly active halogenous (chlorine, bromine, etc.) flux is used, the residue of flux may negatively affect product performance and reliability. 2) In principle, the reflow soldering method must be used; if flow soldering method is preferred, please consult with the ROHM representative in advance. For details, please refer to ROHM Mounting specification ●Precautions Regarding Application Examples and External Circuits 1) If change is made to the constant of an external circuit, please allow a sufficient margin considering variations of the characteristics of the Products and external components, including transient characteristics, as well as static characteristics. 2) You agree that application notes, reference designs, and associated data and information contained in this document are presented only as guidance for Products use. Therefore, in case you use such information, you are solely responsible for it and you must exercise your own independent verification and judgment in the use of such information contained in this document. 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It is strongly recommended to confirm solderability before using Products of which storage time is exceeding the recommended storage time period. 3) Store / transport cartons in the correct direction, which is indicated on a carton with a symbol. Otherwise bent leads may occur due to excessive stress applied when dropping of a carton. 4) Use Products within the specified time after opening a humidity barrier bag. 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ROHM shall not be in any way responsible or liable for any damages, expenses or losses incurred by you or third parties resulting from inaccuracy or errors of or concerning such information. 2) This document may not be reprinted or reproduced, in whole or in part, without prior written consent of ROHM. 3) The Products may not be disassembled, converted, modified, reproduced or otherwise changed without prior written consent of ROHM. 4) In no event shall you use in any way whatsoever the Products and the related technical information contained in the Products or this document for any military purposes, including but not limited to, the development of mass-destruction weapons. 5) The proper names of companies or products described in this document are trademarks or registered trademarks of ROHM, its affiliated companies or third parties. Notice - Rev.003 © 2012 ROHM Co., Ltd. All rights reserved.