EM MICROELECTRONIC - MARIN SA
EM8500
EMDVK8500
DEVELOPMENT KIT
USER MANUAL
Description
The EMDVK8500 is a powerful development kit for the configuration, evaluation, prototyping and measurement of integrated energy harvesting
solutions based on EM8500 family devices.
The development kit offers a complete set of features to characterize and configure your hardware application.
The EMDVK8500 consists of three boards:
The IPS Base board
The EMDVK8500 daughter board
The application board
Main features
Hardware
Modular architecture for prototyping, test and customer
application
Flexible load and harvester source selection
Ready to measure nodes for lab equipment (oscilloscope,
power analyzer, …)
Up to eight channel high speed acquisition
Expansion header for prototyping and external connection
Application board
On-board EM8500 configuration
EM8500 registers and EEProm configuration
Self USB powered and stand-alone mode
Copyright 2015, EM Microelectronic-Marin SA
EMDVK8500-MN01, Version 1.0, 29-Sep-15
Software
Friendly GUI
Multi-window environment
User friendly graphical interface
Register and EEProm view and configuration
Configurable connection matrix
Support for I2C and SPI access
Selectable operation modes
Advanced real-time energy voltage profile recording
Waveform display
Cursors and zooming capabilities
Monitoring and advanced measurement
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1.
CONTENT DESCRIPTION
The EMDVK8500 kit consists of:
1x Base board
1x Daughter board
1x Application board
1x Memory stick - USB dongle 4GB containing EM8500 DevExplorer software installation setup
1x Cable - USB cable type A to B
1x Power supply - AC/DC +5V plug
1x Solar cell
AC/DC plug +5V
Additional +5V supply
Daughter board
8500 board
Application board
Application PCB
USB dongle
Install Setup
USB stick
Base board
PC Control board
Solar cell
USB cable
PC to Base board cable
Figure 1-1 EMDVK8500 deliverables
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2.
INSTALLATION AND SOFTWARE/FIRMWARE UPDATE
2.1.
INITIAL INSTALLATION
To install the software EM8500 DevExplorer, an installation setup file is available on the memory stick.
Simply connect the memory stick to the Base board (USB MEM connector) and connect the Base board (USB Host) to the PC through the
USB cable.
Skip and close the installation driver window that may pop-up.
Open an explorer window
Click on the relevant USB stick drive (EM8500 DevKit)
Double click on the EM8500 DevExplorer setup executable file and accept the installation invitation.
The following installation wizard appears. Click Next.
You can answer No to the following question and check for update later.
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Accept the license agreement (Next)
Choose your installation folder path then click Next.
Choose your shortcuts then click Next
Select the FTDI USB driver installation and click Next
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Then install the FTDI driver.
Once the FTDI driver installed, the installation is complete.
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After installation, the Start Menu now contains the following shortcuts
From this Menu, two update tools are available.
The shortcut Online Update Check is used to check for new EM8500 DevExplorer software release. Use this shortcut to check for
updates.
The shortcut Firmware Loader (Third-Party tool) is used to udpate the firmware of the EM8500 base board.
Each EM8500 DevExplorer software contains a programming Hex file for the Base Board firmware.
Use this shortcut to do the firmware update if required
Note:
In case you decide to directly check for an update during your initial installation (answering yes to the below message requires that your PC has
an active internet connection), the following message will be displayed.
Click Yes.
In the below installation example, an update has been found.
Click Yes.
Then the normal procedure installation needs to be followed. Click OK and follow the normal installation flow.
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2.2.
SOFTWARE UPDATE
EM8500 DevExplorer features an Online Update check that allows checking and installing available updates. To obtain the latest version, use
the shortcut “OnLine Update Check” from the EM8500 DevExplorer.
DevExplorer starts checking for updates and downloads them automatically. If a more recent version is available, the following message will be
displayed. Click Yes
Once the download is done, the normal procedure installation needs to be followed. Click Yes and follow the normal installation flow.
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2.3.
FIRMWARE UPDATE
If it isn’t already installed, run the EM8500 DevExplorer setup and plug in the hardware at least once, so drivers are installed.
The installer has created a firmware directory for you, from which all subsequent steps shall be performed.
Note:
Firmware loader requires installation of MS Visual C++ Libraries which are commonly installed on PCs. If these are not installed on your PC,
you may either download them from Microsoft or install the full Flash Loader Demonstrator package from ST Microelectronics, part
number STSW-MCU005
Follow the steps below to update the firmware.
Confirm that the DevExplorer is closed.
Navigate to the EM8500 DevExplorer start menu entries.
Click on “Firmware Loader (Third-Party tool)” “Flash Loader” to start this tool
All settings except the COM port are already preset. To identify the correct COM port, use the Device Manager and check the
corresponding “USB Serial Port (COM x)” used.
Select the correct port from the drop-down-field Port Name:
On the IPS Base Board:
place the BOOT jumper J108 to select the controller’s boot mode (1) and
press the RESET button SW101 - (2).
The green status LED D103 stops flashing while in boot mode (3)
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1
J108 - MCU_BOOT
Place boot jumper for
for firmware update
D103 - MCU_STAT
Chec k that LED stop
blinking (boot mode)
3
2
SW101 - MCU_RESET
Press button
to enter boot
Figure 2-1 Configure boot mode (firmware update)
The flash loader tool will guide you through the firmware download process.
It's not recommended to change the pre-configured settings. In case of errors, press the IPS Base Board RESET button SW101 again (with the
BOOT jumper placed) and navigate back to the communication selection tab and retry.
After successfully downloading the new firmware click “Close” to exit the flash loader tool.
Remove the BOOT jumper and power-cycle the IPS Base Board.
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3.
HARDWARE DESCRIPTION OVERVIEW
The architecture of the EMDVK8500 is based on the following block diagram
IPS BASE BOARD
Power
supply
USB
MAIN MCU
UART
RF EM9301
CTRL
POWER_GROUND
ADC
MEAS.
USB
Memory Stick
EM6819 MCU
POWER
USB
Media Port
Level Shifter
I2C/SPI
USB
Hub
I2C/SPI
USB
APPLICATION BOARD
BTN, LEDS
DAUGHTER BOARD
Switch - Relays
HRV
+ +
LTS
+ +
EM8500
STS
+
Figure 3-1 EMDVK8500 System Architecture
The IPS Base board connects the PC to the EMDVK8500 daughter board through USB. The IPS base board contains a microcontroller (Main
MCU) to perform several tasks:
Communication to the PC (USB)
Communication to the EM8500 (support for I2C and SPI bus)
ADC acquisition (MEAS.)
Switch and relay control (CTRL)
The EMDVK8500 daughter board is the core of the harvesting system based on the EM8500 device. It features:
Switches for connecting the harvester source (HRV), the storage elements (Short Term Storage STS - Long Term Storage LTS)
Connections to the loads (POWER and POWER_GROUND).
Some access to the voltage nodes monitored by MEAS.
Multiple access to the different nodes of the system and shunt resistors (for current or power analysis) for HRV, LTS and STS
Jumpers for configuration
On board default HRV, STS and LTS with spare position (STS)
Additional expansion connector to connect external HRV, STS and LTS.
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The application board is the application load of the system. The application board implements an EM6819 8-bit low-power microcontroller, an
EM9301 2.4Ghz Bluetooth Low Energy Controller, push-buttons and LEDs able to implement various types of low-power applications. The
application board can also be removed and replaced by another application board or the user can connect external elements to the application
headers.
Due to its modular architecture and flexible design, the EMDVK8500 is a very versatile system and as such offers a lot of possibilities to the
user. The following operating modes are offered to the user:
3.1.
CONFIGURATION MODE
In this mode the Base Board is connected to and powered from the PC over the USB connection. The EM8500 SPI/I2C interface is connected to
the Base Board Main MCU and the Base Board can access the EM8500 registers. The application board is disconnected from the EM8500 lines
(Application board doesn’t need to be present). In this mode the ADC acquisition can be performed.
IPS BASE BOARD
Power
supply
USB
USB
Media Port
Level Shifter
Power
supply
ADC
CTRL
MEAS.
USB
Memory Stick
MAIN MCU
UART
POWER_GROUND
USB
Hub
POWER
USB
I2C/SPI
PC
DAUGHTER BOARD
HRV
+ +
LTS
+ +
EM8500
STS
+
Figure 3-2 EMDVK8500 Configuration Mode
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3.2.
APPLICATION MODE
In this mode the Base Board is connected to and powered from the PC over the USB connection. The EM8500 SPI/I2C interface is connected to
the application board and the EM8500 lines are not connected to the Base Board Main MCU. In this mode the ADC acquisition can be
performed.
IPS BASE BOARD
Power
supply
USB
USB
Media Port
Level Shifter
EM6819 MCU
RF EM9301
ADC
CTRL
MEAS.
USB
Memory Stick
MAIN MCU
UART
POWER_GROUND
USB
Hub
POWER
USB
APPLICATION BOARD
BTN, LEDS
I2C/SPI
PC
DAUGHTER BOARD
HRV
+ +
LTS
+ +
EM8500
STS
+
Figure 3-3 EMDVK8500 Application Mode
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3.3.
STAND-ALONE MODE
In this mode the Base Board is not powered from the PC (no USB over the USB connection) or is even detached from the other two boards. .
The EM8500 SPI/I2C interface is connected to the application board. The application is running. In this mode ADC acquisitions are not
performed.
The corresponding mode is shown on the Figure 3-4 EMDVK8500 Stand-alone Mode with default application board.
BTN, LEDS
APPLICATION BOARD
RF EM9301
POWER_GROUND
POWER
I2C/SPI
EM6819 MCU
DAUGHTER BOARD
HRV
+ +
LTS
+ +
EM8500
STS
+
Figure 3-4 EMDVK8500 Stand-alone Mode with default application board
The other application mode option is the application board without default application board. The user directly accesses the application header
available on the daughter board. The corresponding mode is shown on the Figure 3-5 EMDVK8500 Stand-alone Mode with user application
connections.
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POWER_GROUND
POWER
I2C/SPI
USER APPLICATION
CONNECTIONS
DAUGHTER BOARD
HRV
+ +
LTS
+
+
EM8500
STS
+
Figure 3-5 EMDVK8500 Stand-alone Mode with user application connections
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4.
APPLICATION INTERFACE
The application connector APP1 (J104) and APP2 (J107) provides all the connections for the application.
The application board can be connected to APP1 and APP2 or the user can access the connectors APP1 and APP2 and its test points.
1
2
3
4
5
6
7
8
9
10
11
12
13
14
APP 2
GND
VSUP
VDD_HRV
VAUX_GND_0
VAUX_GND_1
VAUX_GND_2
3V3
N.C.
BAT_LOW
HRV_LOW
WAKE_UP
VDD_STS
APP_ADC_CHANNEL
GND
1
2
3
4
5
6
7
8
9
10
11
12
13
14
APP1
GND
VSUP
VAUX_0
VAUX_1
VAUX_2
N.C.
N.C.
SCL
SDA
SCLK
MOSI
MISO
CS
GND
Figure 4-1 EMDVK8500 Daughter board – application connections APP2 (J107) and APP1 (J104) - top view
NO.
PIN NAME
1
2
3
4
5
6
7
8
9
10
11
12
13
14
GND
VSUP
VAUX[0]
VAUX[1]
VAUX[2]
N.C.
N.C.
SCL(*)
SDA(*)
SCLK(*)
MOSI(*)
MISO
CS
GND
I/O TYPE
DIRECTION(*)
SUPPLY
Supply
Input
Input
Input
Input
–
–
–
Output
Inout
Output
Output
Input
Output
Supply
VSUP
VSUP
VSUP
VSUP
VSUP
VSUP
-
DESCRIPTION
System ground connection (EM8500 device ground)
Main supply
Auxiliary 0 supply input connection
Auxiliary 1 supply input connection
Auxiliary 2 supply input connection
Reserved
Reserved
I2C clock connection
I2C data connection
SPI clock connection
SPI MOSI connection
SPI MISO connection
SPI chip select and SPI/I2C selection mode (when at ‘1’)
System ground connection (EM8500 device ground)
Table 4-1 APP1 Pin-out description
(*):
DIRECTION is defined from the application point of view
(*):
Pin 8 (SCL I2C clock) and Pin 10 (SCLK SPI clock) are connected together on the Base Board.
(*):
Pin 9 (SDA I2C data) and Pin 11 (MOSI SPI data) are connected together on the Base Board.
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NO.
PIN NAME
1
2
3
4
5
6
7
8
9
10
11
12
13
14
GND
VSUP
VDD_HRV
VAUX_GND[0]
VAUX_GND[1]
VAUX_GND[2]
3V3
N.C.
BAT_LOW
HRV_LOW
WAKE_UP
VDD_STS
APP_ADC_CHANNEL
GND
I/O TYPE
DIRECTION(*)
SUPPLY
Supply
Output
Output
Input
Input
Input
Input
–
–
–
–
-
Input
Input
Output
I/O
Output
Supply
VSUP
VSUP
All
–
-
DESCRIPTION
System ground connection (EM8500 device ground)
Main supply Output
Connection to the energy harvester
Auxiliary 0 ground connection
Auxiliary 1 ground connection
Auxiliary 2 ground connection
+3.3V voltage
Reserved
Battery low indicator (when at ‘1’)
Energy harvester cell low indicator (when at ‘1’)
Wake-up pin
Connection for the Short Term energy Storage element
Application output for ADC channel acquisition
System ground connection (EM8500 device ground)
Table 4-2 APP2 Pin-out description
(*):
DIRECTION is defined from the application point of view
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5.
APPLICATION BOARD
5.1.
DESCRIPTION
A default Application Board is provided with the EM8500 development kit.
The board is equipped with:
An 8-bit low power microcontroller EM6819F6-B300 in package TSSOP28.
A Bluetooth smart controller, 2.4Ghz RF balun and chip antenna
2 push-buttons
2 LEDs
Access to different nodes for ADC measurements
Application headers APP1 and APP2 and APP_TP
The board dimensions are 50 x 55.3 mm. APP1 and APP2 are Headers with 14 pins each (2.54 mm pitch).
Based on the default application board features, some low power application can be developed. With the on-board EM9301 wireless device
some Bluetooth smart beacon applications can be implemented.
For the details concerning the EM9301 and the EM6819F6-B300, please refer to the corresponding datasheets.
The EM6819 can be programmed and debugged through the X1 connector (GASP connector). To develop EM6819 firmware, load firmware or
debug EM6819 firmware the EM6819 development tools need to be used. Contact EM Microelectronic for more information or visit the EM
Microelectronic Marin website http://www.emmicroelectronic.com.
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JP3 - VDD_HRV
when Jumper JP3 ON
VDD_HRV is connected
to PA0 (PA0_TP)
D2 - PC5 and PC6
The led D2 is driven
by PC5 and PC6
('1' to lite ON)
K1 - WAKE_UP
WAKE_UP = VDD_STS
when pressed
(default = pulled-down)
K2 - PA7
PA7 (PA7_TP) = Ground
when pressed
(default = HiZ)
APP 2
GND
VSUP
VDD_HRV
VAUX_GND_0
VAUX_GND_1
VAUX_GND_2
3V3
N.C.
BAT_LOW
HRV_LOW
WAKE_UP
VDD_STS
APP_ADC_CHANNEL
GND
JP2 - APP_ADC_CHANNEL
JP2 position to connect
to APP_ADC_CHANNEL
APP1
GND
VSUP
VAUX_0
VAUX_1
VAUX_2
N.C.
N.C.
SCL
SDA
SCLK
MOSI
MISO
CS
GND
B
PB0 (PB0_TP)
D1 current accross
100ohm resistor
APP_TP
PA0_TP
PA7_TP
PB0_TP
PB3_TP
PC2_TP
VSUP
VAUX_0
VAUX_1
APP_ADC_CHANNEL
GND
Free application
connection
GASP 6819
Connect to
Rlink adapter
to program
or debug
EM6819
JP1 - VAUX_1 - D1
when Jumper JP1 ON
VAUX_1 is connected
to the led D1
Figure 5-1: Application board description
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5.2.
SCHEMATIC
Figure 5-2: Application board schematic
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5.3.
BOM
NT1
APP2
APP_TP
DESIGNATOR.
BFC1
C1
C2
C3
C5
C6
C7, C8
C9
C10
C11
C12
C13
JP1
JP2
JP3
K1, K2
L1
R8
R9, R10
R11, R12
U2
U3
X1
Y1
D1, D2
Part
Quantity
Chip antenna 2450AT45A100
HEADER 1x14
HEADER 1x10
Balun 2450FB15A0100E
100 nF
470 nF
1 uF
100 pF
1 uF
15 pF
100 pF
4.7 nF
10 nF
22pF
3.6pF
JP1
HEADER Selection_3 Positions
Jumper JP3
Button KRS211
12nH
470KOhms
100Ohms
10KOhms
EM9301
EM6818
HEADER 5X2
Quartz 26MHz
Led
1
2
1
1
1
1
1
1
1
2
1
1
1
1
1
1
1
1
2
1
1
2
2
1
1
1
1
2
Table 5-1 APP2 Pin-out description
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5.1.
INTERNAL MEASUREMENT: A/D ACQUISITION UNIT
One ADC single-ended channel is used for application board node voltage measurements. The node is shown in Figure 5-1: Application board
description as “APP_ADC_CHANNEL” or Figure 5-2: Application board schematic as “VAPP_CHANNEL_0” or summarized below in Figure 5-3:
Configuration for ADC application input.
The source of this ADC channel is selected through jumper JP2 as shown on the Figure 5-1: Application board description.
By connecting JP2 in position “PB0” the EM6819 pad PB0 (GPIO Port B bit 0) is connected to the A/D channel APP_ADC_CHANNEL
(“VAPP_CHANNEL_0”). See Figure 5-3: Configuration for ADC application input configuration A.
By connecting JP2 in position “D1” the voltage across the resistor R9 serially connected to the LED D1, is connected to the A/D
channel APP_ADC_CHANNEL (“VAPP_CHANNEL_0”). Additionally, to monitor the LED D1 current, the jumper JP1 must be placed
to power D1 from the VAUX1 output of the EM8500. See Figure 5-3: Configuration for ADC application input configuration B.
TEST POINT
DOMAIN
JP1/JP3
Led D1
SERIAL RESISTOR
NAME
VALUE
R9
DESCRIPTION
100 ohm
Led serial resistor
Table 5-2 D1 monitoring
I(t) D1 = V(t) R9 / R9
By connecting JP2 to position “USER” the user input is connected to A/D channel APP_ADC_CHANNEL (“VAPP_CHANNEL_0”). The
user signal can be applied on the connector APP_TP (pin 9). See Figure 5-3: Configuration for ADC application input configuration
C.
PB0 (PB0_TP)
B. CONFIG CURRENT D1
JP2
C. CONFIG USER INPUT
JP2
D1
JP1
<- USER
INPUT
USER
APP_TP
1
JP2
9
A. CONFIG VOLTAGE PB0
Figure 5-3: Configuration for ADC application input
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6.
DAUGHTER BOARD
6.1.
OVERVIEW
The EMDVK8500 daughter board development kit is the board containing the EM8500 device.
The board is equipped with:
The power management controller EM8500 in MLF24 package
External components for EM8500
Specific measurements nodes on HRV, LTS, STS, VSUP and VAUX to be measured by the A/D acquisition unit of the Base Board
Shunt resistors to monitor the current profiles of the HRV, LTS and STS.
Switches to independently connect the HRV, LTS and STS.
Switches to enable some discharge path on HRV, LTS and STS
Relays to select the SPI or I2C coming from the Base Board or the Application board.
Relays to connect the wake-up input from the Base Board or the Application board.
Connections to the EM8500 flags (HRV_LOW BAT_LOW) to the Base Board or the Application board.
Connection to HRV.
Super cap and rechargeable battery independently connectable to the LTS output
Connection to external LTS
Connection to external STS and spare footprint for additional STS capacitor
Jumper to connect or disconnect the LTS electronic
Jumper to connect or disconnect the STS electronic
A/D
HRV
0.2Ω
shunt
0.2Ω
shunt
A/D
LTS
2Ω
shunt
J102
U101
User
HRV
CN101
LX1
CN102
2Ω
shunt
CN103
LTS
VDD_LTS
CN104
VDD_HRV
Q101
J105
U103
R111
J106
SuperCAP
Q102
EM8500
Q103:
B
2Ω
shunt
+USB
A/D
STS
CN106
User
LTS
J103
J101
Battery
STS
VDD_USB VDD_STS
I2C
SPI
APPLICATION
I2C - SPI
BASE BOARD
RL101-103
WAKE APPLICATION
BASE BOARD
UP
BASE BOARD
APPLICATION
BASE BOARD
FLAGS
APPLICATION
WAKE_UP
VSUP
BAT_LOW
HRV_LOW
VAUX2
VAUX1
VAUX0
Q103:
A
User
STS
C112
A/D
A/D VSUP
A/D VAUX2
A/D VAUX1
VAUX0
CN107
CN105
VAUX_GND2
VAUX_GND1
VAUX_GND0
Figure 6-1: Daughter board simplified schematic
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CN105 - STS_CURRMEAS
STS c urrent sense
c onnec tor
CN102 - HRV_CURRMEAS
HRV c urrent sense
c onnec tor
CN103 - L1_CURRMEAS
DC/DC induc tor c urrent
sense c onnec tor
J103 - STS_DISCONN
STS disconnector
(see external current
sensing schematic)
CN101 - HRV_EXT
External HRV
connector
J104 & J107 - APP_CON
Applic ation Board
c onnec tors
CN104 - LTS_CURRMEAS
LTS c urrent sense
c onnec tor
J101 - USB_PWR
plac e jumper to enable
USB power
CN107 - STS_EXT
External STS
connector
C112 - STS_CAP
Additional STS
capacitor footprint
CN106 - LTS_EXT
External LTS
connector
J105 - LTS_CAP
Place jumper to
connect the
supercap as
LTS storage element
J106 - LTS_BAT
Place jumper to
connect the
rechargeable battery as
LTS storage element
J102 - LTS_DISCONN
LTS disconnector
(see external current
sensing schematic)
Figure 6-2: Daughter board description
6.2.
INTERNAL MEASUREMENT: A/D ACQUISITION UNIT
Seven ADC single-ended channels are used for daughter board nodes voltage measurements. The nodes are shown on the Figure 6-1:
Daughter board simplified schematic as “A/D XXXX”. They concern the Harvester (A/D HRV), the Long-Term-Storage (A/D LTS), the Shortterm-Storage (A/D STS) the VSUP (A/D VSUP) and the three VAUX (A/D VAUX0, VAUX1 and VAUX2).
6.3.
EXTERNAL MEASUREMENT BY SHUNT RESISTORS
Beside the on-board voltage profiling and monitoring capabilities offered by the EMDVK8500, some shunt resistors and connector test points
are available in different places to allow voltage, current and power analysis with external lab equipment (oscilloscope or power analyser).
TEST POINT
DOMAIN
CN102
CN103
CN104
CN105
HRV
HRV
LTS
LTS
STS
SHUNT RESISTOR
NAME
VALUE
R101
R106
R108
R111
R109
0.2 ohm
0.2 ohm
2 ohm
2 ohm
2 ohm
DESCRIPTION
HRV DC shunt
HRV AC shunt
LTS shunt
LTS shunt – Reserved
STS shunt
Table 6-1 Shunt resistors description
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6.4.
CONNECTIONS FOR EXTERNAL HRV MEASUREMENTS
6.4.1.
OSCILLOSCOPE MEASUREMENTS
HRV DC measure
VSHHRV
HRV AC measure
V(t)HRV
CN102
CN103
R101
R106
HRV
VDCHRV
IDCHRV
i(t)HRV
LX1
VDD_HRV
EM8500
Figure 6-3: HRV measurements
In the DC domain the following measures can be performed:
(No jumper on CN102)
IDCHRV = VSHHRV / R101
VDCHRV
In the AC domain the following measures can be performed:
(No jumper on CN103)
6.4.2.
I(t)HRV = V(t) HRV / R106
POWER ANALYZER
Dedicated lab equipment (power analyser) can also be used to measure and analyse current flow, power, power efficiency etc … Its
connections depend on the lab equipment. Refer to the equipment manufacturer’s user manual for proper connections.
6.5.
CONNECTIONS FOR EXTERNAL LTS MEASUREMENTS
6.5.1.
OSCILLOSCOPE MEASUREMENTS
LTS AC measure
V(t)LTS
LTS DC measure
VSHLTS
CN104
i(t)LTS R108
U103
R111
VDCLTS
VDD_LTS
IDCLTS
EM8500
J105
J106
CN106
J102
User
LTS
LTS
SuperCAP
Battery
Figure 6-4: LTS measurements
In the DC domain the following measures can be performed:
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IDCLTS = VSHLTS / R111
VDCLTS
In the AC domain the following measures can be performed:
(No jumper on CN104)
6.5.2.
I(t)LTS = V(t) LTS / R108
POWER ANALYZER
Dedicated lab equipment (power analyser) can also be used to measure and analyse current flow, power, power efficiency etc. Its connections
depends on the lab equipment. Refer to the equipment manufacturer’s user manual for proper connections.
6.6.
CONNECTIONS FOR EXTERNAL STS MEASUREMENTS
6.6.1.
OSCILLOSCOPE MEASUREMENTS
STS AC measure
V(t)STS
STS DC measure
CN105
J103
STS
VDD_STS
User
STS
C112
EM8500
CN107
R109
VDCSTS
i(t)STS
Figure 6-5: STS measurements
In the DC domain the following measures can be performed:
VDCSTS
In the AC domain the following measures can be performed:
(No jumper on CN105)
6.6.2.
I(t)STS = V(t) STS / R109
POWER ANALYZER
Dedicated lab equipment (power analyser) can also be used to measure and analyse current flow, power, power efficiency etc. Its connections
depends on the lab equipment. Refer to the equipment manufacturer’s user manual for proper connections.
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7.1.
OVERVIEW
Power
supply
USB
IPS BASE BOARD
External
Power
supply
USB
USB
Hub
MAIN MCU
UART
USB
Media Port
VSUP
ADC
MEAS.
USB
Memory Stick
Level Shifter
I2C/SPI
BASE BOARD
CTRL
7.
8 Ch.
Buffer
Figure 7-1: Base board simplified block diagram
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J108 - MCU_BOOT
Main MCU
bootload select
Place jumper only
for firmware update
D103 - MCU_STAT
Main MCU
status LED
CN110 - USB_MEM
USB connection
to SW installation
memory stick
SW101 - MCU_RESET
Main MCU
reset pushbutton
CN107 - MCU_DEBUG
Main MCU
debug c onnec tor
CN109 - USB_PC
USB c onnec tion
to PC
CN117 - EXT_SUPPLY
External +5V
supply c onnec tor
D110 & D111 - PWR_STA
5V & 3.3V power
status LED
D105 - USB_MEM_STA
USB memory
status LED
D106 - USB_COM_STA
USB c ommunic ation
status LED
Figure 7-2: Base board description
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8.
EM8500 DEVELOPMENT EXPLORER USER INTERFACE
The EMDVK8500 is driven by the EM8500 Development Explorer user interface.
The user interface allows easy communication and configuration of the EM8500 device through its EEProm registers bank (write, read
configuration). It supports loading and saving of EM8500 configurations, running measurements of the different EM8500 electrical nodes,
monitoring and displaying of EM8500 electrical nodes.
The main window is shown below (Figure 8-1 EM8500 DevExplorer Main Window Description)
Menu
Four Tab menus
DevExplorer
SW Revision
Load configuration
Load *.EM8500CFG
Save configuration
Save *.EM8500CFG
Read EM8500
Read all the devic e
EEProm c onfiguration
Write EM8500
Write all EEProm
configuration into
the device
Measure
Run the ADC
ac quisition
Last Activity
Display last
ac tivity report
Firmware
FW Revision
COM status
USB info
Figure 8-1 EM8500 DevExplorer Main Window Description
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8.1.
CONFIGURE MENU DESCRIPTION
This menu allows the user to control the EEProm registers, to load and to save different configurations.
EM8500 Device configuration. This refers to the content of the EM8500 device memory (EEProm registers).
The user interface (EM8500 Registers Configure window) is used to display or modify the content of the EEProm register view. Each
register group and register can be expanded. Each register or bit can be individually modified or read directly in this window.
The EM8500CFG file configuration. This refers to the content of the *.em8500cfg file. An EM8500CFG file is the project and
configuration file for the EM8500 DevExplorer. It contains different sections. The section referred as [Registers] is the memory
configuration definition.
EM8500CFG file example:
[Global]
Chip=EM8500 (V2.0 preliminary)
HWType=0x55
[Registers]
0x40=0x03
0x41=0x03
0x42=0x00
………. etc …
[Options]
MainMode=ConfigurationMode
CommMode= I2C
Switch_HRVenable=False
………. etc …
Figure 8-2 EM8500 CFG file format sample
Four different buttons (Load, Save, Read and Write) are used to transfer and update the content from one type of configuration to another.
Figure 8-3 EM8500 DevExplorer configuration flow description) shows the different possible actions and data flow transfers.
*.EM8500CFG
Configuration File
User interface
EM8500 Registers Configure window
Load EM8500CFG
into user interface
EM8500 Registers
Configure
window LOAD
Save user interface
EM8500 Registers
Configure window
into EM8500CFG
SAVE
READ
Update user interface EM8500 Registers
Configure window with EM8500 device
configuration
WRITE
EM8500
Device configuration
Write EM8500 device configuration from
the user interface EM8500 Registers
Configure window.
Figure 8-3 EM8500 DevExplorer configuration flow description
It is important to note that:
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the “EM8500 Registers” view is not necessarily reflecting the physical content of the EM8500 EEProm memory device and vice-versa.
the “EM8500 Registers” view is not necessarily reflecting the content of the EM8500CFG file and vice versa
8.2.
MEASURE WINDOW DESCRIPTION
This menu allows the user to control the different switches/selectors and to start measurements.
Figure 8-4 EM8500 DevExplorer measure window description) describes these selections.
The “Configure mode” and the “Application mode” (described in the paragraph 3) can be selected through the selector called “Mode selector” in
the Figure 8-4 EM8500 DevExplorer measure window description.
In Configure mode, the user is able to:
Use the Configure window to configure and access the EM8500 device
Control the HRV, STS and LTS switches (for hardware security reason some sequences are automatically managed or controlled by
the tool)
Select (for configure mode) communication bus (I2C or SPI).
Run an INIT sequence to initialize the system
Start the ADC acquisition
LTS discharge switch
Discharge LTS pin into resistor load
LTS switch
Connect LTS Switch
HRV switch
Connect HRV Switch
HRV short
Connect short resistor to HRV
Mode selector
Applic ation/Configure
mode switc h
Configure bus selector
Selec t I2C or SPI bus
for Configure mode
Measure
Run the ADC
ac quisition
INIT button
Runs an init sequence
STS discharge switch
Discharge STS into resistor load
Figure 8-4 EM8500 DevExplorer measure window description
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8.3 VISUALIZE WINDOW DESCRIPTION
8.3 visualize window descriptionThis menu allows the user to add signals to me monitored in real-time. Selected signals are displayed in the
two graphical windows shown below.
Graph 2
Viewer 2
Graph 1
Viewer 1
Channels
displayed
Record
Save measured values
in csv file
Channels
Selection
.
Mouse viewer tool
Zoom-In : Mark top-left to bottom right
Zoom-Out : Mark bottom-right to top left
Move: Hold dow n right mouse button
Select : C lick legend to select channels
.
Figure 8-5 EM8500 DevExplorer visualize window description
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The channel to be processed is available through the channel section menu. The measurement tool is able to monitor and display the measured
values and threshold values. The selection menu can be access by a simple click on the “Click to add graph” button shown on the Figure 8-5
EM8500 DevExplorer visualize window description.
See below Figure 8-6 EM8500 DevExplorer visualize channel display selector
Figure 8-6 EM8500 DevExplorer visualize channel display selector
The user can also navigate within the waveforms. By using the mouse and the Mouse tool viewer the user is able to zoom in/out, move the
displayed area or select different channels. The four available functions are:
Zoom-In: Mark top-left to bottom right
Zoom-Out: Mark bottom-right to top left
Move: Hold down right mouse button
Select: Click legend to select channels
Additionally all measurements can be logged. A recording function is available. By checking the box “Record”, monitored signals are saved in a
CSV file.
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8.3.
MEASURE AND VISUALIZE WINDOWS - ACQUISITION UNIT INFORMATIONS
The graphs receive data from the analog-to-digital converters of the EMDVK8500 hardware.(Base Board)
The sampling rate is set by the drop-down menu below the graphs.
Sampling
Rate select
Figure 8-7 EM8500 DevExplorer visualize sampling rate selector
The time (x) axis is scaled dynamically as more and more samples are received.
The user may zoom into the time (x) or voltage (y) axis as required.
To maximize time resolution in the first seconds after starting a measurement, each sample received from the ADC is displayed, at up to 12.5
kSamples per second. After several seconds, a decimation of 10 starts (only 1 out of 10 samples is displayed). This decimation is required to
avoid excessive amounts of data being collected. After a few minutes, decimation factor is increased from 10 to 100, then from 100 to 1000, and
so on. The longer a measurement runs, the higher a decimation factor is applied. After stopping and restarting the measurement, decimation is
reset to 1.
Even with decimation, it is possible to zoom into the time axis until individual samples are visible. It is, however, not possible to zoom into
more detail than the decimation allows, because decimated values are discarded when reading from the ADC.
Data sample received from the ADC contain a time stamp. This time stamp is reset to zero when the EMDVK8500 is power-cycled. It increases
continuously in time, even when measurements are stopped. The time stamp designates the exact moment in time when a sample is taken,
regardless of decimation or stopping and restarting measurements.
Data from the graphs can be logged to CSV file.
Figure 8-8 EM8500 DevExplorer visualize Record and CSV save function
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Data in the log file is identical to the data graphed, including decimation and time stamp. The CSV file contains a header that identifies which
column of data represents which voltage node. There is virtually no limit of how long data logging may run, as decimation avoids memory and
hard disk overflows.
CSV file example:
Timestamp [ms], VHRV [V], VLTS [V], VSTS [V], VAUX0 [V], VAUX1 [V], VAUX2 [V], VSUP [V], VAPP [V], HRV_LOW [V], BAT_LOW [V],
16703461,0.9464,3.0440,3.0449,0.2779,0.0668,0.0484,2.6213,3.5980,0.0,0.0
16703461.16,0.9465,3.0440,3.0449,0.2779,0.0668,0.0484,2.6215,3.5942,0.0,0.0
16703461.32,0.9465,3.0441,3.0449,0.2779,0.0668,0.0484,2.6215,3.5928,0.0,0.0
16703461.48,0.9465,3.0441,3.0449,0.2780,0.0668,0.0484,2.6215,3.5938,0.0,0.0
16703461.64,0.9467,3.0441,3.0449,0.2779,0.0668,0.0484,2.6215,3.5936,0.0,0.0
16703461.8,0.9467,3.0440,3.0449,0.2779,0.0668,0.0484,2.6215,3.5939,0.0,0.0
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9.
TABLE OF CONTENTS
1.
Content description ................................................................................................................................................................................ 2
2.
Installation and software/firmware update .............................................................................................................................................. 3
2.1.
Initial installation..................................................................................................................................................................................... 3
2.2.
Software update ..................................................................................................................................................................................... 7
2.3.
Firmware update .................................................................................................................................................................................... 8
3.
Hardware Description Overview ........................................................................................................................................................... 10
3.1.
Configuration mode .............................................................................................................................................................................. 11
3.2.
Application mode ................................................................................................................................................................................. 12
3.3.
Stand-alone mode................................................................................................................................................................................ 13
4.
Application interface ............................................................................................................................................................................. 15
5.
Application board ................................................................................................................................................................................. 17
5.1.
Description ........................................................................................................................................................................................... 17
5.2.
Schematic ............................................................................................................................................................................................ 19
5.3.
Bom ..................................................................................................................................................................................................... 20
5.1.
Internal measurement: A/D acquisition unit .......................................................................................................................................... 21
6.
Daughter Board.................................................................................................................................................................................... 22
6.1.
Overview .............................................................................................................................................................................................. 22
6.2.
Internal measurement: A/D acquisition unit .......................................................................................................................................... 23
6.3.
External measurement by shunt resistors............................................................................................................................................. 23
6.4.
Connections for EXTERNAL HRV measuremenTs............................................................................................................................... 24
6.4.1.
Oscilloscope measurements ........................................................................................................................................................... 24
6.4.2.
Power analyzer ............................................................................................................................................................................... 24
6.5.
Connections for EXTERNAL LTS MEASUREMENTS .......................................................................................................................... 24
6.5.1.
Oscilloscope measurements ........................................................................................................................................................... 24
6.5.2.
Power analyzer ............................................................................................................................................................................... 25
6.6.
Connections for EXTERNAL STS measuremenTs ............................................................................................................................... 25
6.6.1.
Oscilloscope measurements ........................................................................................................................................................... 25
6.6.2.
Power analyzer ............................................................................................................................................................................... 25
7.
BASE BOARD...................................................................................................................................................................................... 26
7.1.
Overview .............................................................................................................................................................................................. 26
8.
EM8500 Development Explorer User Interface..................................................................................................................................... 28
8.1.
Configure menu description ................................................................................................................................................................. 29
8.2.
Measure window description ................................................................................................................................................................ 30
8.3
Visualize window description ................................................................................................................................................................ 31
8.3.
Measure and Visualize windows - Acquisition unit informations .......................................................................................................... 33
9.
Table of contents ................................................................................................................................................................................. 35
9.1.
List of Figures ...................................................................................................................................................................................... 36
9.2.
List of Tables ....................................................................................................................................................................................... 37
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9.1.
LIST OF FIGURES
Figure 1-1 EMDVK8500 deliverables .................................................................................................................................................................... 2
Figure 2-1 Configure boot mode (firmware update) ............................................................................................................................................... 9
Figure 3-1 EMDVK8500 System Architecture ..................................................................................................................................................... 10
Figure 3-2 EMDVK8500 Configuration Mode ...................................................................................................................................................... 11
Figure 3-3 EMDVK8500 Application Mode .......................................................................................................................................................... 12
Figure 3-4 EMDVK8500 Stand-alone Mode with default application board.......................................................................................................... 13
Figure 3-5 EMDVK8500 Stand-alone Mode with user application connections ................................................................................................... 14
Figure 4-1 EMDVK8500 Daughter board – application connections APP2 (J107) and APP1 (J104) - top view ................................................... 15
Figure 5-1: Application board description ............................................................................................................................................................ 18
Figure 5-2: Application board schematic ............................................................................................................................................................. 19
Figure 5-3: Configuration for ADC application input ............................................................................................................................................ 21
Figure 6-1: Daughter board simplified schematic ................................................................................................................................................ 22
Figure 6-2: Daughter board description............................................................................................................................................................... 23
Figure 6-3: HRV measurements ......................................................................................................................................................................... 24
Figure 6-4: LTS measurements .......................................................................................................................................................................... 24
Figure 6-5: STS measurements .......................................................................................................................................................................... 25
Figure 7-1: Base board simplified block diagram................................................................................................................................................. 26
Figure 7-2: Base board description ..................................................................................................................................................................... 27
Figure 8-1 EM8500 DevExplorer Main Window Description ................................................................................................................................ 28
Figure 8-2 EM8500 CFG file format sample ........................................................................................................................................................ 29
Figure 8-3 EM8500 DevExplorer configuration flow description .......................................................................................................................... 29
Figure 8-4 EM8500 DevExplorer measure window description ........................................................................................................................... 30
Figure 8-5 EM8500 DevExplorer visualize window description ........................................................................................................................... 31
Figure 8-6 EM8500 DevExplorer visualize channel display selector .................................................................................................................... 32
Figure 8-7 EM8500 DevExplorer visualize sampling rate selector ....................................................................................................................... 33
Figure 8-8 EM8500 DevExplorer visualize Record and CSV save function ......................................................................................................... 33
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9.2.
LIST OF TABLES
Table 4-1 APP1 Pin-out description .................................................................................................................................................................... 15
Table 4-2 APP2 Pin-out description .................................................................................................................................................................... 16
Table 5-1 APP2 Pin-out description ................................................................................................................................................................... 20
Table 5-2 D1 monitoring .................................................................................................................................................................................... 21
Table 6-1 Shunt resistors description ................................................................................................................................................................. 23
EM Microelectronic-Marin SA (“EM”) makes no warranties for the use of EM products, other than those expressly contained in EM's applicable
General Terms of Sale, located at http://www.emmicroelectronic.com. EM assumes no responsibility for any errors which may have crept into
this document, reserves the right to change devices or specifications detailed herein at any time without notice, and does not make any
commitment to update the information contained herein.
No licenses to patents or other intellectual property rights of EM are granted in connection with the sale of EM products, neither expressly nor
implicitly.
In respect of the intended use of EM products by customer, customer is solely responsible for observing existing patents and other intellectual
property rights of third parties and for obtaining, as the case may be, the necessary licenses.
Important note: The use of EM products as components in medical devices and/or medical applications, including but not limited to,
safety and life supporting systems, where malfunction of such EM products might result in damage to and/or injury or death of
persons is expressly prohibited, as EM products are neither destined nor qualified for use as components in such medical devices
and/or medical applications. The prohibited use of EM products in such medical devices and/or medical applications is exclusively at
the risk of the customer.
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