V I S H AY I N T E R T E C H N O L O G Y, I N C . Multilayer Ceramic Chip Capacitors Road Map Multilayer Ceramic Chip Capacitors Road Map FEATURED PRODUCTS • • • • • • • • • • • • • Chip Capacitors in PME/NME Technology Chip Capacitors in BME Technology Automotive Grade Capacitors, AEC-Q200 Qualified Medical Grade Capacitors High Reliability, Military, DSCC, and Aerospace RF and High Q/Low ESR Series Non-Magnetic Series Ultra-Small Size 0201 and Chip Array Silver Palladium (AgPd) Termination for Hybrid Applications Board Flex Sensitive, Including Polymer Termination Surface Arc-Over Prevention for High Voltage Speciality Capacitors (e.g. Controlled Discharge Capacitor) Surface-Mount Ceramic Chip Antennae RESOURCES • For more information, visit: http://www.vishay.com/capacitors/ceramic/ceramic-multilayer-smd/ A WORLD OF SOLUTIONS Brochure Type 1/3 THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000 VMN-PL0380-1505 www.vishay.com V I S H AY I N T E R T E C H N O L O G Y, I N C . Multilayer Ceramic Chip Capacitors Road Map Surface-Mount Products • Vishay Vitramon Chip Capacitor – VJ series surface-mount product, a reliable replacement for leaded capacitors 3rd edition with X1/Y2 and X2 classification for 250 VAC applications • VJ...W1BC – Basic commodity series with base metal electrode (BME) for X7R/X5R/Y5V and noble metal electrodes (NME) for NP0 dielectric • RF Multilayer Ceramic Chip Capacitors – Offering high self-resonance, a high Q factor of ≥ 2000, and a low dissipation factor of ≤ 0.05 % for operation in highfrequency commercial applications. 0402, 0603, and 0805 case sizes with broad working voltages from 25 VDC to 250 VDC • Chip Arrays – Chip arrays for space-constrained applications and filtering in data communication lines. Four capacitors in one package, built on NP0, X7R, or Y5V dielectric • Quad RF Capacitors - High Q (> 2000) MLCCs for highfrequency applications in 0505, 1111, 2525, and 3838 body sizes, and application voltages up to 7200 VDC • High-Q Series – C0G (NP0) ultra-stable, high-frequency capacitors • Ultra-Small 0201 – Ultra-small series - Built with NP0, X5R, X7R, and Y5V dielectric for miniaturization in portable applications • 0402 High-Q – Excellent Q-factor and low ESR enable miniaturization in wireless data communication applications • Medical Grade Capacitors – For implantable cardiovascular control applications • Tunable Surface-Mount Ceramic Chip Antennas – With ultra-small outline, omni-directional, linear polarization and complete UHF band coverage (470 MHz to 860 MHz) up to 1.1 GHz for mobile devices • Automotive Grade Capacitors – Qualified to AEC-Q200 guidelines for reliable automotive electronics • MIL-PRF-55681 – Complies with Department of Defense specification requirements for CDR military grade series • Fixed-Frequency Surface-Mount Ceramic Chip Antennas – Small form-factor, high-performance, chip antennas designed for operation at 868 MHz , 915 MHz, 1.5 GHz, 2.4 GHz, and 5 GHz • X8R Dielectric – Stable capacitance with reliable performance up to +150 ºC • Cassette Packaging – Bulk case package increases pick and place productivity, reduces storage area and packaging materials Termination • Open Mode Design Capacitors (OMD-Cap) – Reduce risk of shorts and low insulation resistance from capacitor cracks due to board flex, with high voltage breakdown compared to standard designs • Silver/Palladium (Ag/Pd) Terminations – Used for conductive epoxy assembly • Flexible Polymer Terminations – Enhance the robustness of the terminations to resist board flexure failures • High-Reliability Series – A broad product range manufactured with a combination of design, materials, and tight process controls to achieve high field reliability • CDR Solder Coat Termination – Base metallizationbarrier metal-solder-coated tin/lead alloy (Sn/Pb), with a minimum of 4 % lead. Solder has a melting point +200 ºC or less. Solder coat thickness is a minimum of 60 µin • DSCC Part Numbers – 03029 (0402 case size), 03028 (0603 case size), 05006 (0805 case size), 05007 (1206 case size) • Tin/Lead (Sn/Pb) Termination Finish for CDR, DSCC, High-Reliability Series – Base metallization 100 % tin plate barrier with tin/lead plate matte finish with a minimum 4 % lead • High-Frequency DSCC – 05001 (0805 case size), 05002 (0603 case size), 05003 (0402 case size) • Non-Magnetic Copper Terminations (C) – Copper barrier 100 % tin plate matte finish for reflow soldering • HVArc Guard® Capacitor Series – Higher capacitance, surface-mountable, high-voltage, multilayer ceramic capacitors designed to prevent surface arc-over • Non-Magnetic Termination (N) – For Epoxy gluing assembly • X8R Dielectric Extension – Size 0402 (25 V/50 V/100 V) and 0603/0805 with 100 V range for stable capacitance with reliable performance up to +150 °C • Safety Certified Capacitors – Size 2008, 2012, and 2225 in C0G(NP0) and X7R. Approved IEC 60384-14-2005 Brochure Type 2/3 THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000 VMN-PL0380-1505 www.vishay.com V I S H AY I N T E R T E C H N O L O G Y, I N C . Multilayer Ceramic Chip Capacitors Road Map Surface-Mount Products 1948 Vishay Porcelain Caps 1967 Vishay Vitramon Chip Capacitor / Ag/Pd Termination 1985 Medical Grade Capacitors / High-Q Series 1989 Automotive Grade Capacitors / MIL-PRF-55681 CDR Series 1993 X8R Dielectric Capacitors Series / Tip ‘N Ring® Series until 2009 1994 High-Voltage Series / VTOP Series until 2009 1996 Low-Inductance Series (0612/0508) until 2009 2000 Cer-F (Y5E Dielectric) Series until 2009 2003 2004 2005 2006 2008 2009 2010 Basic Commodity Series (VJ…W1BC) RuGGed Chip Series until 2009 Open Mode Design (OMD) Series / High-Reliability Series Chip Array, Ultra-Small 0201 and 0402 High Q for Basic Commodity Series VJ…W1BC DSCC Series (03028,03029,05006,05007) / Tin/Lead Finish for CDR, DSCC, and HiRel Series HVArc Guard® Series / Hot Solder Finish for CDR / Flexible Polymer Termination Controlled Discharge Cap (CDC) N term = Non-Magnetic for Conductive Epoxy Assembly Surface-Mount Ceramic Chip Antenna Ultra High Q, Low ESR for Basic Commodity Series VJ…W1BC Flexible Polymer Terminations for Automotive DSCC High Frequency (05001, 05002, 05003) 2012 Fixed Frequency Surface-Mount Ceramic Chip Antennas RF Multilayer Ceramic Chip Capacitors (Commercial) QUAD HIFREQ Series 0505 and 1111 Body Size Ceramic Chip Capacitors X8R Capacitors Extension (0402 and 0603 / 0805 with 100 V) 2013 Surface-Mount Safety Capacitors (X1/Y2 and X2) Surface-Mount Ceramic Chip Antennas (1.575 GHz / 2.4 GHz / 5 GHz) Source Energy Capacitor QUAD HIFREQ Series 2525 and 3838 Body Size Ceramic Chip Capacitors 2014 C term = Improved Non-Magnetic for Reflow Assembly RF Multilayer Ceramic Chip Capacitors < 1 pF VJ 31X RoHS Automotive MLCC Series High-Voltage Surface-Mount Capacitors 3 kV - 5 kV 2015 High-Temperature Capacitors MIL-PRF-123 CKS Series Chip Capacitors RF Microstrip Capacitors Brochure Type 3/3 THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000 VMN-PL0380-1505 www.vishay.com