Datasheet

NICHIA STS-DA1-1935 <Cat.No.110930>
NICHIA CORPORATION
SPECIFICATIONS FOR GREEN LED
NSPG520AS
● RoHS Compliant
NICHIA STS-DA1-1935 <Cat.No.110930>
SPECIFICATIONS
(1) Absolute Maximum Ratings
Symbol
Absolute Maximum Rating
Unit
Forward Current
Item
IF
35
mA
Pulse Forward Current
IFP
110
mA
Reverse Voltage
VR
5
V
Power Dissipation
PD
123
mW
Operating Temperature
Topr
-30~85
°C
Storage Temperature
Tstg
-40~100
°C
Junction Temperature
TJ
100
°C
* Absolute Maximum Ratings at TA=25°C.
* IFP conditions with pulse width ≤10ms and duty cycle ≤10%.
(2) Initial Electrical/Optical Characteristics
Symbol
Condition
Typ
Unit
Forward Voltage
Item
VF
IF=20mA
3.2
V
Luminous Intensity
Iv
IF=20mA
6.5
cd
x
-
IF=20mA
0.17
-
y
-
IF=20mA
0.70
-
Chromaticity Coordinate
* Characteristics at TA=25°C.
* Chromaticity Coordinates as per CIE 1931 Chromaticity Chart.
1
NICHIA STS-DA1-1935 <Cat.No.110930>
RANKS
Item
Rank
Min
Max
Unit
Forward Voltage
-
2.6
3.5
V
Reverse Current
-
-
50
µA
V
6.64
9.20
U
4.60
6.64
T
3.32
4.60
Luminous Intensity
cd
Color Ranks
Rank G
Rank H
x
0.14
0.14
0.22
0.22
x
0.21
0.21
0.28
0.28
y
0.64
0.74
0.74
0.64
y
0.65
0.73
0.73
0.65
* Ranking at TA=25°C.
* Reverse Current at VR=5V.
* Tolerance of measurements of the Forward Voltage is ±3%.
* Tolerance of measurements of the Luminous Intensity is ±10%.
* Tolerance of measurements of the Chromaticity Coordinate is ±0.01.
* A shipment shall consist of LEDs in a combination of the above ranks.
The percentage of each rank in the shipment shall be determined by Nichia.
2
NICHIA STS-DA1-1935 <Cat.No.110930>
CHROMATICITY DIAGRAM
0.80
535
540
0.75
545
0.70
550
H
y
G
555
0.65
0.60
0.55
0.10
0.15
0.20
0.25
0.30
0.35
x
3
NICHIA STS-DA1-1935 <Cat.No.110930>
OUTLINE DIMENSIONS
* 本製品はRoHS指令に適合しております。
This product complies with RoHS Directive.
管理番号 No.
NSPG520AS
STS-DA7-1567
(単位 Unit:±0.2)
mm)
(単位 Unit: mm, 公差 Tolerance:
1.5 MAX
1
5.6
5.3
Φ5
1.1
(2.5)
Cathode
□0.5±0.05
Anode
6.6
7.6
11.3±0.5
27.8±1
内容 Description
樹脂材質
Resin Materials
エポキシ樹脂
Epoxy Resin
リードフレーム材質
Lead Frame
Materials
銅合金+銀メッキ
Ag-plated Copper Alloy
質量
Weight
0.28g(TYP)
* タイバーを切り取った部分は銅合金が露出しております。
またLEDには鋭利な部分があります。特にリード部分は、人体を傷つける
ことがありますので、取り扱いに際しては十分注意して下さい。
The tie bar cut-end surface exhibits exposed copper alloy base metal.
Care must be taken to handle the LEDs, as it may contain sharp parts
such as lead, and can cause injury.
ストッパー部詳細図
Lead Standoff
0.3
項目 Item
0.3
(2)
1
4
NICHIA STS-DA1-1935 <Cat.No.110930>
SOLDERING
• Recommended Hand Soldering Condition
• Recommended Dip Soldering Condition
Temperature
350°C Max
Pre-Heat
120°C Max
Soldering Time
3sec Max
Pre-Heat Time
60sec Max
No closer than 3mm from
Solder Bath
the base of the lens.
Temperature
Position
Dipping Time
Dipping Position
260°C Max
10sec Max
No closer than 3mm from
the base of the lens.
* For a better thermal performance, copper alloy is used for the leadframe of the product.
Care must be taken for the soldering conditions and handling of the products after soldering.
* Solder the LED no closer than 3mm from the base of the lens.
Soldering beyond the base of the tie bar is recommended.
* Dip soldering/hand soldering must not be performed more than once.
* Care should be taken to avoid cooling at a rapid rate and ensure the peak temperature ramps down slowly.
* When soldering, do not apply stress to the lead frame while the LED is hot.
* After soldering, the LED position must not be corrected.
* After soldering, NO mechanical shock or vibration should be applied to LED lens
until the LEDs cool down to room temperature.
* In order to avoid damage on the lens during cutting and clinching the leads,
it is not recommended to solder the LEDs directly on customer PCB without any gap between the lens and the board.
If it is unavoidable, customer is advised to check whether such soldering will not cause wire breakage or lens damage.
Direct soldering to double-sided PCBs must be avoided due to an increased effect of heat on the lens.
* When it is necessary to clamp the LEDs to prevent soldering failure,
it is important to minimize the mechanical stress on the LEDs.
* Cut the LED lead frames at room temperature. Cutting the lead frames at high temperature may cause failure of the LEDs.
5
NICHIA STS-DA1-1935 <Cat.No.110930>
PACKAGING - BULK
管理番号 No.
Nxxxxxxx
STS-DA7-0001B
袋の表示 Label printed on the bag
帯電防止袋
Anti-electrostatic Bag
XXXX LED
Type Nxxxxxxx
*******
Lot YMxxxx-RRR
Qty
pcs
RoHS
NICHIA CORPORATION
491 OKA, KAMINAKA, ANAN, TOKUSHIMA, JAPAN
CAUTION TO
ELECTROSTATIC DAMAGE
静電気に注意
帯電防止袋を並べて入れ、ダンボールで仕切ります。
Anti-electrostatic bags are packed in cardboard boxes
with corrugated partitions.
ラベル Label attached to the box
XXXX LED
TYPE Nxxxxxxx
*******
RANK RRR
QTY.
PCS
RoHS
NICHIA CORPORATION
491 OKA, KAMINAKA, ANAN, TOKUSHIMA, JAPAN
Nichia
LED
* 客先型名を*******で示します。
客先型名が設定されていない場合は空白です。
******* is the customer part number.
If not provided, it is not indicated on the label.
* ロット表記方法についてはロット番号の項を
参照して下さい。
For details, see "LOT NUMBERING SCHEME"
in this document.
* 本製品は帯電防止袋に入れたのち、輸送の衝撃から保護するためダンボールで梱包します。
Products are packed in an anti-electrostatic bag.
They are shipped in cardboard boxes to protect them from external forces during transportation.
* 取り扱いに際して、落下させたり、強い衝撃を与えたりしますと、製品を損傷させる原因になりますので注意して下さい。
Do not drop or shock the box. It may damage the products.
* ダンボールには防水加工がされておりませんので、梱包箱が水に濡れないよう注意して下さい。
Do not expose to water, the box is not water-resistant.
* 輸送、運搬に際して弊社よりの梱包状態あるいは同等の梱包を行って下さい。
Using an original packaging material or equivalent in transit is recommended.
6
NICHIA STS-DA1-1935 <Cat.No.110930>
LOT NUMBERING SCHEME
Lot Number is presented by using the following alphanumeric code.
YMxxxx - RRR
Y - Year
Year
Y
2009
9
2010
A
2011
B
2012
C
2013
D
2014
E
M - Month
Month
M
Month
M
1
1
7
7
2
2
8
8
3
3
9
9
4
4
10
A
5
5
11
B
6
6
12
C
xxxx-Nichia's Product Number
RRR-Ranking by Color Coordinates, Ranking by Luminous Intensity
7
NICHIA STS-DA1-1935 <Cat.No.110930>
DERATING CHARACTERISTICS
管理番号 No.
NSPG520AS
STS-DA7-1500
周囲温度-許容順電流特性
Ambient Temperature vs
Allowable Forward Current
Derating1
許容順電流
Allowable Forward Current(mA)
50
40
(40, 35.0)
30
20
10
(85, 8.50)
0
0
20
40
60
80
100
120
周囲温度
Ambient Temperature(°C)
デューティー比-許容順電流特性
Duty Ratio vs
Allowable Forward Current
Duty
TA =25°C
許容順電流
Allowable Forward Current(mA)
1000
110
100
35
10
1
10
100
デューティー比
Duty Ratio(%)
8
NICHIA STS-DA1-1935 <Cat.No.110930>
OPTICAL CHARACTERISTICS
* 本特性は参考です。
All characteristics shown are for reference only and are not guaranteed.
管理番号 No.
発光スペクトル
Spectrum
NSPG520AS
STS-DA7-1501
T A=25°C
IF=20mA
Spectrum
1.0
相対発光強度
Relative Emission Intensity(a.u.)
0.8
0.6
0.4
0.2
0.0
400
450
500
550
600
650
700
波長
Wavelength(nm)
Directivity1
指向特性
Directivity
T A=25°C
IFP=20mA
-20°
-10°
0°
10°
20°
30°
-30°
40°
放射角度
Radiation Angle
-40°
50°
-50°
-60°
60°
-70°
70°
80°
-80°
-90°
90°
1
0.5
0
0.5
1
相対光度
Relative Luminosity(a.u.)
9
NICHIA STS-DA1-1935 <Cat.No.110930>
FORWARD CURRENT CHARACTERISTICS / TEMPERATURE CHARACTERISTICS
* 本特性は参考です。
All characteristics shown are for reference only and are not guaranteed.
順電圧-順電流特性
Forward Voltage vs
Forward Current
管理番号 No.
周囲温度-順電圧特性
Ambient Temperature vs
Forward Voltage
VfIf
T A=25°C
NSPG520AS
STS-DA7-1502
IFP=5mA
IFP= 20mA
IFP= 60mA
TaVf
5.0
1000
110
100
順電圧
Forward Voltage(V)
順電流
Forward Current(mA)
4.5
20
10
4.0
3.5
3.0
2.5
1
2.0
2.0
2.5
3.0
3.5
4.0
4.5
5.0
-60 -40 -20
順電圧
Forward Voltage(V)
0
20
40
60
80
100 120
周囲温度
Ambient Temperature(°C)
周囲温度-相対光度特性
順電流-相対光度特性
Forward Current vs
Relative Luminosity
Ambient Temperature vs
Relative Luminosity
IfIv
T A=25°C
TaIv
IFP= 20mA
1.4
3.5
相対光度
Relative Luminosity(a.u.)
相対光度
Relative Luminosity(a.u.)
3.0
2.5
2.0
1.5
1.0
1.2
1.0
0.8
0.5
0.6
0.0
0
20
40
60
80
順電流
Forward Current(mA)
100
120
-60 -40 -20
0
20
40
60
80
100 120
周囲温度
Ambient Temperature(°C)
10
NICHIA STS-DA1-1935 <Cat.No.110930>
FORWARD CURRENT CHARACTERISTICS / TEMPERATURE CHARACTERISTICS
* 本特性は参考です。
All characteristics shown are for reference only and are not guaranteed.
順電流-色度(主波長)特性
Forward Current vs
Chromaticity Coordinate(λd)
管理番号 No.
NSPG520AS
STS-DA7-1503
TA=25°C
Ifxy
0.80
0.75
5mA(529nm)
20mA(525nm)
35mA(523nm)
1mA(533nm)
y
0.70
0.65
110mA(517nm)
0.60
0.55
0.05
0.10
0.15
0.20
0.25
0.30
x
周囲温度-主波長特性
Ambient Temperature vs
Dominant Wavelength
T A=25°C
IfλD
IFP= 20mA
TaλD
540
535
535
530
525
520
Dominant Wavelength(nm)
540
主波長
主波長
Dominant Wavelength(nm)
順電流-主波長特性
Forward Current vs
Dominant Wavelength
530
525
520
515
515
510
510
1
10
100
順電流
Forward Current(mA)
1000
-60 -40 -20
0
20
40
60
80
100 120
周囲温度
Ambient Temperature(°C)
11
NICHIA STS-DA1-1935 <Cat.No.110930>
RELIABILITY
(1) Tests and Results
Reference
Test
Test
Test Conditions
Standard
Duration
Resistance to
JEITA ED-4701
Tsld=260±5°C, 10sec, 1dip,
Soldering Heat
300 302
3mm from the base of the lens
JEITA ED-4701
Tsld=245±5°C, 5sec,
303 303A
Lead-free Solder(Sn-3.0Ag-0.5Cu)
JEITA ED-4701
-40°C(30min)~25°C(5min)~
100 105
100°C(30min)~25°C(5min)
Moisture Resistance
JEITA ED-4701
25°C~65°C~-10°C, 90%RH,
(Cyclic)
200 203
24hr per cycle
Terminal Bend
JEITA ED-4701
5N, 0°~90°~0°bend,
Strength
400 401
2bending cycles
Terminal Pull
JEITA ED-4701
Strength
400 401
High Temperature
JEITA ED-4701
Storage
200 201
Temperature Humidity
JEITA ED-4701
Storage
100 103
Low Temperature
JEITA ED-4701
Storage
200 202
Solderability
Temperature Cycle
Operating Life
Temperature Humidity
Operating Life
Low Temperature
Operating Life
#
Units
Failed/Tested
#1
0/50
#2
0/50
100cycles
#1
0/50
10cycles
#1
0/50
#1
0/50
#1
0/50
10N, 10±1sec
Room Temperature
Failure
Criteria
TA=100°C
1000hours
#1
0/50
TA=60°C, RH=90%
1000hours
#1
0/50
TA=-40°C
1000hours
#1
0/50
TA=25℃, IF=35mA
1000hours
#1
0/50
60°C, RH=90%, IF=20mA
500hours
#1
0/50
TA=-30°C, IF=20mA
1000hours
#1
0/50
NOTES:
Measurements are performed after allowing the LEDs to return to room temperature.
(2) Failure Criteria
Criteria #
Items
Conditions
Failure Criteria
Forward Voltage(VF)
IF=20mA
>U.S.L.×1.1
#1
Luminous Intensity(IV)
IF=20mA
<L.S.L.×0.7
Reverse Current(IR)
VR=5V
>U.S.L.×2.0
#2
Solderability
-
Less than 95% solder coverage
U.S.L. : Upper Specification Limit
L.S.L. : Lower Specification Limit
12
NICHIA STS-DA1-1935 <Cat.No.110930>
CAUTIONS
(1) Lead Forming
● When forming leads, the leads should be bent at a point at lease 3mm from the base of the epoxy bulb.
Do not use the base of the leadframe as a fulcrum during lead forming.
● Lead forming should be done before soldering.
● Do not apply any bending stress to the base of the lead.
The stress to the base may damage the LED's characteristics or it may break the LEDs.
● When mounting the product onto a printed circuit board, the via-holes on the board should be exactly aligned
with the lead pitch of the product. If the LEDs are mounted with stress at the leads, it causes deterioration of the epoxy resin
and this will degrade the LEDs.
(2) Storage
● Shelf life of the products in unopened bag is 3 months(max.) at <30°C and 70% RH from the delivery date.
If the shelf life exceeds 3 months or more, the LEDs need to be stored in a sealed container
with silica gel desiccants to ensure their shelf life will not exceed 1 year.
● Nichia LED leadframe are silver plated copper alloy. This silver surface may be affected by environments
which contain corrosive substances. Please avoid conditions which may cause the LED to corrode, tarnish or discolor.
This corrosion or discoloration may cause difficulty during soldering operation.
It is recommended that the LEDs be used as soon as possible.
● To avoid condensation, the products must not be stored in the areas where temperature and humidity fluctuate greatly.
(3) Directions for Use
● When designing a circuit, the current through each LED must not exceed the Absolute Maximum Rating.
Operating at a constant current per LED is recommended. In case of operating at a constant voltage, Circuit B is recommended.
If the LEDs are operated with constant voltage using Circuit A, the current through the LEDs may vary due to the variation
in Forward Voltage characteristics of the LEDs.
(A)
(B)
...
...
● LEDs should be operated in forward bias. Driving circuits must not subject LEDs to either forward or reverse voltage while off.
Continuous reverse voltage can cause migration and LED damage.
● For stabilizing the LED characteristics, it is recommended to operate at greater than 10% nominal current.
● Care must be taken to ensure that the reverse voltage will not exceed the Absolute Maximum Rating
when using the LEDs with matrix drive.
● For outdoor use, necessary measures should be taken to prevent water, moisture and salt air damage.
(4) Handling Precautions
● Do not handle LEDs with bare hands, it may contaminate the LED surface and affect optical characteristics.
In the worst case, catastrophic failure from excess pressure through wire-bond breaks and package damage may result.
● Dropping the product may cause damage.
● Do not stack assembled PCBs together. Failure to comply can cause the resin portion of the product to be cut, chipped,
delaminated and/or deformed. It may cause wire to break, leading to catastrophic failures.
(5) Design Consideration
● PCB warpage after mounting the products onto a PCB can cause the package to break.
The LED should be placed in a way to minimize the stress on the LEDs due to PCB bow and twist.
● The position and orientation of the LEDs affect how much mechanical stress is exerted on the LEDs placed near the score lines.
The LED should be placed in a way to minimize the stress on the LEDs due to board flexing.
● Board separation must be performed using special jigs, not using hands.
13
NICHIA STS-DA1-1935 <Cat.No.110930>
(6) Electrostatic Discharge (ESD)
● The products are sensitive to static electricity or surge voltage. ESD can damage a die and its reliability.
When handling the products, the following measures against electrostatic discharge are strongly recommended:
Eliminating the charge
Grounded wriststrap, ESD footwear, clothes, and floors
Grounded workstation equipment and tools
ESD table/shelf mat made of conductive materials
● Proper grounding is required for all devices, equipment, and machinery used in product assembly.
Surge protection should be considered when designing of commercial products.
● If tools or equipment contain insulating materials such as glass or plastic,
the following measures against electrostatic discharge are strongly recommended:
Dissipating static charge with conductive materials
Preventing charge generation with moisture
Neutralizing the charge with ionizers
● The customer is advised to check if the LEDs are damaged by ESD
when performing the characteristics inspection of the LEDs in the application.
Damage can be detected with a forward voltage measurement or a light-up test at low current (≤1mA).
● ESD damaged LEDs may have an increased leakage current, current flow at a low voltage or no longer illuminate at a low current.
Failure Criteria: VF<2.0V at IF=0.5mA
(7) Thermal Management
● Proper thermal management is an important when designing products with LEDs. LED die temperature is affected
by PCB thermal resistance and LED spacing on the board. Please design products in a way that the LED die temperature
does not exceed the maximum Junction Temperature (TJ).
● Drive current should be determined for the surrounding ambient temperature (TA) to dissipate the heat from the product.
(8) Cleaning
● If required, isopropyl alcohol (IPA) should be used. Other solvents may cause premature failure to the LEDs
due to the damage to the resin portion. The effects of such solvents should be verified prior to use.
In addition, the use of CFCs such as Freon is heavily regulated.
● Ultrasonic cleaning is not recommended since it may have adverse effects on the LEDs
depending on the ultrasonic power and how LED is assembled.
If ultrasonic cleaning must be used, the customer is advised to make sure the LEDs will not be damaged prior to cleaning.
(9) Eye Safety
● In 2006, the International Electrical Commission (IEC) published IEC 62471:2006 Photobiological safety of lamps
and lamp systems, which added LEDs in its scope.
On the other hand, the IEC 60825-1:2007 laser safety standard removed LEDs from its scope.
However, please be advised that some countries and regions have adopted standards
based on the IEC laser safety standard IEC 60825-1:20112001, which still includes LEDs in its scope.
Most of Nichia's LEDs can be classified as belonging into either the Exempt Group or Risk Group 1.
High-power LEDs, that emit light containing blue wavelengths, may be classified as Risk Group 2.
Please proceed with caution when viewing directly any LEDs driven at high current, or viewing LEDs
with optical instruments which may greatly increase the damages to your eyes.
● Viewing a flashing light may cause eye discomfort. When incorporating the LED into your product,
please be careful to avoid adverse effects on the human body caused by light stimulation.
14
NICHIA STS-DA1-1935 <Cat.No.110930>
(10) Others
● The LEDs described in this brochure are intended to be used for ordinary electronic equipment (such as office equipment,
communications equipment, measurement instruments and household appliances).
Consult Nichia's sales staff in advance for information on the applications in which exceptional quality
and reliability are required, particularly when the failure or malfunction of the LEDs may directly jeopardize life or
health (such as for airplanes, aerospace, submersible repeaters, nuclear reactor control system, automobiles,
traffic control equipment, life support systems and safety devices).
● The customer shall not reverse engineer by disassembling or analysis of the LEDs without having prior written consent
from Nichia. When defective LEDs are found, the customer shall inform Nichia directly before disassembling or analysis.
● Both the customers and Nichia will agree on official specifications of supplied products before a customer's volume production.
● Specifications and appearance subject to change for improvement without notice.
15