Datasheet

1.66 +/- 0.06
®
(0.066" +/- 0.003”)
1.04
PULSE-GUARD
ESD Suppressors
(0.041") REF
0.15 +/- 0.08
(0.006" +/- 0.003”)
Surface Mount Polymeric Electrostatic Discharge Suppressors
0.36 (0.014")
0.84 +/- 0.05
(0.033" +/- 0.002”)
PGB2 0402 Series
RoHS
0.43 +/- 0.18
(0.017" +/- 0.007”)
Description
Wave Solder
Reflow Solder
0.51 (0.020")
PULSE-GUARD® ESD Suppressors help protect sensitive
electronic equipment against electrostatic discharge (ESD).
0.76 (0.030")
3.30
(0.130")
3.05
(0.120")
1.27 (0.050")
1.27 (0.050")
0.76 (0.030")
They supplement the on-chip protection of integrated
circuitry and are best suited for low-voltage, high-speed
applications where low capacitance is important to ensure
minimal interference of data signal integrity.
0.76 (0.030")
The new and ultra-small surface mount PGB2 0402 series
offers a RoHS Compliant, Halogen Free, and 100% Lead
Free circuit protection alternative.
Equivalent Circuits
Equivalent Circuit
2
1
Features
Product Characteristics
Part Number
Lines Protected
Component Package
1
0402
PGB2010402KRHF
They use polymer composite materials to suppress fastrising ESD transients (as specified in IEC 61000-4-2), while
adding virtually no capacitance to the circuit.
• Halogen-free, Lead-free
and RoHS compliant
• Ultra-low capacitance
• Low leakage current
• Fast response time
• One line of protection
• Bi-directional
• Withstands multiple
ESD strikes
• Compatible with
pick-and-place processes
Applications
• HDTV Hardware
• Laptop/Desktop
Computer
• Network Hardware
• Computer Peripherals
• Digital Camera
• External Storage
• Set-Top Box
• Antenna
Electrical Characteristics
Specification
PGB2010402
ESD Capability:
IEC 61000-4-2 Direct Discharge (typical)
IEC 61000-4-2 Air Discharge (maximum)
8kV
15kV
Trigger Voltage (typical)
Clamping Voltage (typical)
Trigger Voltage (typical)
Clamping Voltage (typical)
250V
40V
150V
40V
Rated Voltage (maximum)
Capacitance (typical)
Notes
The ESD capability measured by direct and air discharge method is
subject to testing equipment and conditions. Numerous factors could
affect the reliability and reproducibility of the direct and air discharge
test results.
Measured per IEC 61000-4-2
8kV Direct Discharge Method
Measured using 500 V TLP Direct Discharge Method
12VDC, max
0.07 pF, typical
Measured at 250 MHz
Response Time
<1nS
Measured per IEC 61000-4-2
8kV Direct Discharge Method
Leakage Current (typical)
<1nA
Measured at 12 VDC
ESD Pulse Withstand
1000 pulses min
Some shifting in characteristics may occur when tested over multiple
pulses at a very rapid rate
Life Support Note:
Not Intended for Use in Life Support or Life Saving Applications
The products shown herein are not designed for use in life sustaining or life saving applications unless otherwise expressly indicated.
© 2016 Littelfuse, Inc.
Specifications are subject to change without notice.
Revised: 05/23/16
PULSE-GUARD® ESD Suppressors
Surface Mount Polymeric Electrostatic Discharge Suppressors
50
75
Time (ns)
1.55
(0.061")
-25
0
25
50
200
75
Time (ns)
Typical
TLP Response Curve
100
100
125
150
Recommended for
reflow soldering only
0.38
(0.015")
100 .58 125
(0.023")
175
150
175
400
25
50
75
100+/1.00
(0.039" +/Time (ns)
125
0.05
0.002")
150
175
100
100
0
200
0.50 +/- 0.05
(0.020" +/- 0.002")
0.27 +/- 0.09
(0.011" +/- 0.004")
-25
0
150
175
25
50
0.381
(0.015")
75
100
Time (ns) .584
(0.023")
125
150
175
0 0
25
Recommended
Pad Layout
50
75
100
15
30
Time (ns)
Time (ns)
100
0
15
0.23 Nom.
(0.009")
30
45
60
75
0.30 +/- 0.08
(0.012" +/- 0.003")
Time (ns)
0
-15
2
0
15
50
0.20 30
+/- 0.09 45
(0.008"
Time+/(ns)0.004")
60
75
45
12560
150
75 175
0
-15
50
0
15
2
-4-15
0
15
Typical0Insertion Loss
30
45
60
75
Time (ns)
-6
-8 2 -15
-12-2
0 10
2
0
15
100
0
1000
Frequency (MHz)
10000
100000
-4
-10
-6
-12
10
100
0.1
1000
Frequency (MHz)
10000
100000
45
10000
45
75
100
100000
60
75
0.1
1000
Frequency (MHz)
10000
100000
1000
Frequency (MHz)
10000
100000
-10
10
100
1000
Frequency (MHz)
10000
100000
0.1
-12
0.01
ce (pF)
Capacitance (pF)
Capacitance (pF)
-12
100
0.1
10000
1000
1000
Frequency
(MHz)
Frequency
(MHz)
PENDING
10000
100000
10000
PENDING
To Be Determined
0.01
1000
Frequency (MHz)
100
To Be Determined
0.1
0.01
10
100
© 2016 Littelfuse, Inc.
Specifications are subject to change without notice.
Revised:
05/23/16
1000
10000
Frequency (MHz)
50
40
PENDING
2
0
50
Voltage (V)
40
-2
-4
-6
-8
10
1.00
To Be Determined
100
-15
0.01
0.10
100
PENDING
10
60
0
60
-10
0.10
0.01
1.00
100-12
To Be Determined
-6
-12
-10
60
PENDING
-4
-10
-8
40
1.00
0.10
To Be Determined
0-6
-12
-2-810
Capacitance (pF)
100
30
DEVICE
SIZE CODE:
Time (ns)
0402 = 0402 (1005)
1000
2-4
-10
-60
-12
75
QUANTITY &
PACKAGING CODE:
KR = 10,000 pieces
15 Frequency
30 (MHz)
-6
0.1
60
HALOGEN FREE
PENDING
Typical Device
Capacitance
Time (ns)
0
-4-15
-2
-8
-2 10
-8
45
Time (ns)
LINES PROTECTED:
50
-1001 = 1 line
-2
-8
-42
-10
30
70
1.00
PGB2 01 0402 KR HF
LEAD-FREE
-4
HALOGEN-FREE
®
100
PULSE-GUARD
-6
0
ESD SUPPRESSORS
-2
-8
100
50
50
70
0
0
70100
60
150
Insertion Loss (dB)
Insertion Loss (dB)
Insertion Loss (dB)
0
150
0.01
0.10 100
0.01
100
0.559
(0.022")
-20
150
100
Insertion Loss Insertion
(dB)
Insertion Loss (dB)
Loss (dB)
75
100
125
Time (ns) Recommended for
reflow soldering only
1.55
(0.061")
Voltage (V)
Voltage (V
50 -15
ce (pF)Capacitance (pF)Capacitance (pF)
50
-25
0.10
200
0.01
1.00
100
50
200
0
150
100
0.30 +/- 0.08
(0.012" +/- 0.003")
25
0
1.00
0.10
175
Part Numbering
System
2
50
200
100
0.1
0
150
00
200
-25
-15
Insertion Loss (dB) Voltage (V)
Voltage (V
150
150
0.23 +/- 0.10
(0.009" +/- 0.004")
200
400
0
150
-25
100
300
Voltage (V)
Voltage (V
0
125
0.23 Nom.
(0.009")
200
50
100
(500
V Direct Discharge)
0.56
(0.022")
100
200
150
0
200
-25
75
Time (ns)
0.18 +/- 0.10
(0.007" +/- 0.004")
300
500
200
100
Reflow Solder
50
Capacitance (fF)
Voltage (V)
Capacitance (fF)
25
25
100
Capacitance (fF)
0
0
200
Insertion Loss (dB)
-25
-25
300
Voltage (V)
200
400
0
0.51 +/- 0.05
+/- 0.002")
(0.020"
0500
0.51 +/- 0.05
(0.020" +/- 0.002")
300
500
100
0
200
400
300
0.1
0.01
100
0.101.00
Capacitance (pF)
200
1.00
100
Voltage (V)
400
0.99 +/- 0.05
(0.039" +/- 0.002")
500
0.99 +/- 0.05
(0.039" +/- 0.002")
0.24 +/- 0.09
(0.009" +/- 0.004")
Dimensions: mm (inch)
200
Voltage(V
(V)
Voltage
Voltage (V
Voltage (V
Voltage (V
300
100
300
300
0.310 +/- 0.08
(0.012" +/- 0.003")
0.25
(0.010")
500
400
Dimensions
0.15 +/- 0.08
(0.006" +/- 0.003")
400
400
Capacitance (pF)
Capacitance (pF)
Capacitance (pF)
500
500
Capacitance (pF)
Capacitance (pF)
Capacitance (pF) Capacitance (pF)
Capacitance (pF)
citance (pF)
Capacitance (pF)
Capacitance (pF)
(8 kV IEC 61000-4-2 Direct Discharge)
Voltage (V
Typical ESD Response Curve
500
0.10
0.01
1.00
100
0.01
100
0.100.01
1.00 100
0.01
0.101.00
100
0.01
0.10
1.00
100
PULSE-GUARD® ESD Suppressors
Surface Mount Polymeric Electrostatic Discharge Suppressors
Physical Specifications
Environmental Specifications
Materials
Body: Epoxy / Glass Substrate
Terminations: Cu/Ni/Sn
Device Weight
0.349 mg
Solderability
MIL-STD-202, Method 208
Soldering
Parameters
Operating Temperature
-65°C to +125°C
Biased Humidity:
40°C, 95% RH, 1000 hours
Biased Heat:
85°C, 1000 hours
Thermal Shock
MIL-STD-202, Method 107,
-65°C to 125°C, 30 min. cycle,
10 cycles
Vibration
MIL-STD-202, Method 201
Chemical Resistance
MIL-STD-202, Method 215
Solder Leach Resistance and
Terminal Adhesion
IPC/EIA J-STD-002
Wave solder - 260°C, 10 seconds maximum
Reflow solder - 260°C, 30 seconds maximum
Design Consideration
Because of the fast rise-time of the ESD transient,
proper placement of PULSE-GUARD® suppressors are
a key design consideration to achieving optimal ESD
suppression. The devices should be placed on the circuit
board as close to the source of the ESD transient as
possible. Install PULSE-GUARD® suppressors (connected
from signal/data line to ground) directly behind the
connector so that they are the first board-level circuit
component encountered by the ESD transient.
Soldering Parameters
Pre Heat
Pb – Free assembly
- Temperature Min (Ts(min))
150°C
- Temperature Max (Ts(max))
200°C
- Time (min to max) (ts)
60 – 180 seconds
Average ramp up rate (Liquidus Temp
(TL) to peak
3°C/second max
TS(max) to TL - Ramp-up Rate
3°C/second max
Reflow
- Temperature (TL) (Liquidus)
217°C
- Temperature (tL)
60 – 150 seconds
tP
TP
Ramp-up
TL
tL
TS(max)
Temperature
Reflow Condition
Ramp-do
Ramp-down
TS(min)
25
Preheat
tS
time to peak temperature
Time
Peak Temperature (TP)
260°C
Time within 5°C of actual peak
Temperature (tp)
10 – 30 seconds
Ramp-down Rate
6°C/second max
- Recommended profile based on IPC/JEDED J-STD-020C
Time 25°C to peak Temperature (TP)
8 minutes max
- For recommended soldering pad layout dimensions,
please refer to Dimensions section of this data sheet
© 2016 Littelfuse, Inc.
Specifications are subject to change without notice.
Revised: 05/23/16
Notes:
- PGB2 Series recommended for reflow soldering only
PULSE-GUARD® ESD Suppressors
Surface Mount Polymeric Electrostatic Discharge Suppressors
Packaging
Part Number
Quantity &
Packaging Code
Quantity
Packaging Option
Packaging Specification
KR
10000
Tape & Reel (7” reel)
EIA RS-481-1 (IEC 286, part 3)
PGB2010402
Tape and Reel Specifications
Tt
Ds
Dd
Ph
Pd
Ct
Ps
Tw
Pw
Carrier Tape: 8mm, paper
Reel: 7” (178mm)
Description
0402 Series
(mm)
Ct - Cover tape thickness
0.053
Dd - Drive hole diameter
1.55
Ds - Drive hole spacing
4.00
Pd - Pocket depth
0.41
Ph - Pocket height
1.12
Ps - Pocket spacing
2.00
Pw - Pocket width
0.62
Tt - Carrier tape thickness
0.61
Tw - Carrier tape width
8.00
Typical ESD Pulse Test Setup
FARADAY CAGE
COMPUTER
AGILENT INFINIIUM
1.5 GHz 8 GS/s
30dB PASTERNAK ATTENUATOR
PE7025-30
TEKTRONIX LOW CAP PROBE
6158 (20x TIP)
QUADTECH 1865
RESISTANCE METER
RESISTANCE
TEST FIXTURE
ESD TEST FIXTURE
TEST BOARD W/ DUT
ESD PULSE GENERATOR
Notes:
- QuadQuadTech 1865 High Resistance Meter: Measures insulation resistance values
- KeyTek MiniZap ESD simulator with IEC tip: Simulates 8kV, direct discharge ESD event per IEC 61000-4-2
- Faraday cage: Shields the acquisition equipment from the electromagnetic fields generated by the simulator
- Agilent 2.25 GHz 54846A Oscilloscope: Records the voltage waveform from the device under test
- Tektronix 6158 probe with 30dB attenuator: Transmits the waveform from the device to the oscilloscope
© 2016 Littelfuse, Inc.
Specifications are subject to change without notice.
Revised: 05/23/16
PULSE-GUARD® ESD Suppressors
Surface Mount Polymeric Electrostatic Discharge Suppressors
Characterization Methods for ESD Suppressors
ESD transient testing, which is based on the IEC 610004-2 standard waveform, consists of subjecting a ESD
suppressor to an subnanosecond risetime 8Kv transient
generated by a commercial ESD simulator and recording
trigger and clamp voltage levels. Clamp voltage level is
obtained at 25ns. The basic ESD simulator circuit consists
of a RC discharge network with R and C values of 330
ohms and 150 picofarads. Waveforms are captured using a
4 GHz oscilloscope(50 ohm input) with 20X resistive divider
probes and a 30dB attenuator. Figures 1 and 2 show IEC
current waveform and test setup.
Transmission line Pulse testing, commonly know as
TLP testing consists of subjecting a ESD suppressor
to a 50 ohm transmission line discharge pulse with a
subnanosecond risetime and a pulse width of 65ns. Trigger
values are obtained by varying the TLP voltage until a
device trigger voltage is determined. Once the device is
triggered, a clamp value is determined at 50ns. Waveforms
are captured using a 4 GHz oscilloscope(50 ohm input)
with 20X resistive divider probes and a 30dB attenuator.
Figures 3 and 4 show a typical TLP voltage waveform and
test setup.
It should be noted that no measurement standard exits
for obtaining trigger and clamp voltage levels. Trigger and
clamp values will vary from one test setup to another.
Due to the subnanosecond risetime of ESD and TLP
waveforms, any parasitic inductance and capacitance in
the test system will affect measurements. Any effects
due to inductance and capacitance need to be subtracted
from the final measurement. It is important to remember
that the test system will introduce a load across the
ESD suppressor under test and this will also affect
measurements. A high bandwidth 50 Ohm oscilloscope
and probes(>1Ghz) need to be used for obtaining best
results Attenuation values for the probe tip should be
at least 20X in order to obtain high input impedance for
measurements.
© 2016 Littelfuse, Inc.
Specifications are subject to change without notice.
Revised: 05/23/16
Figure 1
Current (I) %
100%
90%
I30
I60
10%
30n
60n
tr = 0.7 to 1.0ns
Figure 2
ESD Simulator
1
Scope Probe
30db Attenuator
2
330
950
46.93
50 Ohm
Scope Input
46.93
+
8000
150pf
DUT
3.165
50
-
Figure 3
600
500
400
Volts
Two of the most common methods used in industry for
characterizing the performance of ESD suppressors are
ESD transient testing, per IEC 61000-4-2 ESD waveform,
and TLP. Since no standards exist for measurement and
qualification of ESD suppressor performance, these
two methods have become the de-facto standard for
determining device trigger and clamp specifications. It
is common to see trigger values to be based on the TLP
method and clamping values based on the ESD transient
method. Low voltage TLP obtained trigger values most
closely resemble device DC turn-on .Since the two test
methods are different and no method exists to accurately
correlate suppressor response between the two test
methods, trigger and clamp values should be specified for
each method.
300
200
100
0
0
20
40
60
80
Time in nanoseconds
Figure 4
TLP
Scope Probe
1
30db Attenuator
2
950
46.93
50 Ohm
Scope Input
46.93
+
500
-
DUT
3.165
50
PULSE-GUARD® ESD Suppressors
Surface Mount Polymeric Electrostatic Discharge Suppressors
Competitor Comparison
Typical ESD Suppressor Response to 500 V TLP
Vpeak
450
400
50
Insulation Resistance at 12 VDC
Clamps at 50ns
55
12
*
10
*
250
Log-Ohms
45
300
Volts
Volts
350
*
8
6
40
4
200
35
150
100
2
30
Competitor Littelfuse
A
Competitor
B
0
Competitor Littelfuse
A
Competitor
B
Competitor Littelfuse Competitor
A
B
© 2016 Littelfuse, Inc.
Specifications are subject to change without notice.
Revised: 05/23/16