Application Note

V I S H AY I N T E R T E C H N O L O G Y, I N C .
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Film Capacitors
Application Note
Soldering Guidelines for Film Capacitors
Vishay recommends that users observe the following guidelines for soldering our film capacitors. Adherence to these
recommendations will help to safeguard product specifications and reliability while preventing damage to the capacitors during
soldering.
SOLDERING GUIDELINES AND RECOMMENDED WAVE SOLDERING PROFILE
With regard to the resistance to soldering heat and the solderability, our products comply with “IEC 60384-1” and the additional
type specifications.
The recommended wave soldering profile for our leaded components is defined as follows:
Temperature (°C)
Total contact time < 5 s
260
Maximum solder temperature
tp
Tp
Tp - 5 °C
Tpreheat
Tmax.
t
Tcomponent (body)
Tsolder profile
Preheating
< 150
Time (s)
Tp: Peak temperature of the component body (top)
Tmax.: Maximum application temperature of the component
Temperature of the component body (top)
Revision: 04-Aug-15
Document Number: 28171
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For technical questions, contact: dc-film@vishay.com
THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT
ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000
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Application Note
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Vishay
Soldering Guidelines for Film Capacitors
The PSL (Process Sensitivity Level) is classified according JEDEC standard J-STD-075 “Classification of Non-IC Electronic
Components for Assembly Processes” and summarized in following tables per product family and pitch size of the component:
RADIAL POLYESTER TYPES
PRODUCT PITCH SIZE
FAMILY
5 mm
7.5 mm
22.5 mm
27.5 mm
W4C (1)(3)
W4C (1)(3)
W4C (1)(3)
W4C (1)(3)
W4C (1)(3)
W4C (1)(3)
W4C (1)(3)
W4C (1)(3)
W4C (1)(3)
W4C (1)(3)
W4C (1)(3)
W4C (1)(3)
W4C (1)(3)
MKT 1820
W4C (1)(3)
W4C (1)(3)
W4C (1)(3)
W4C (1)(3)
W4C (1)(3)
MKT 1822
W4C (1)(3)
W4C (1)(3)
W4C (1)(3)
W4C (1)(3)
W4C (1)(3)
MKT 1710
W4C (1)(3)
W4C (1)(3)
W4C (1)(3)
W4C (1)(3)
W4C (1)(3)
MKT 303
MKT 365
W4Y (2)(4))
W4Y (2)(4)
MKT 366
W4Y (2)(4)
W4Y (2)(4)
MKT 367
W4Y (2)(4)
W4Y (2)(4)
MKT 368
MKT 369
MKT 370
10 mm
15 mm
W4C (1)(3)
W4C (1)(3)
W4C (1)(3)
W4C (1)(3)
W4Y (2)(4)
W4C (1)(3)
MKT 372
MKT 373/MKT 373M
MKT 468
MKT 470
W4Y (2)(4)
MKT 1817
W4Y (2)(4)
MKT 1772
52.5 mm
W4Y (2)(4)
MKT 371
MKT 1818
37.5 mm
W4Y (2)(4)
W4C (1)(3)
Notes
(1) No risk
(2) Risk for parameter change if PSL is not strictly followed
(3) C: The component has a preheat limitation of 150 °C
(4) Y: Temperature is measured at the body top and must be kept as follows:
During preheating: Tmax.  125 °C
During soldering: Tp  135 °C, tp  30 s, t  50 s
Document Number: 28171
2
For technical questions, contact: dc-film@vishay.com
THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT
ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000
APPLICATION NOTE
Revision: 04-Aug-15
Application Note
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Vishay
Soldering Guidelines for Film Capacitors
RADIAL POLYPROPYLENE TYPES
PRODUCT PITCH SIZE
FAMILY
5 mm
7.5 mm
10 mm
15 mm
22.5 mm
27.5 mm
MKP 375
W4C (1)(6)
W4C (1)(6)
W4C (1)(6)
MKP 376
W4C (1)(6)
W4C (1)(6)
W4C (1)(6)
W4C (1)(6)
W4C (1)(6)
W4C (1)(6)
W4C (1)(6)
W4C (1)(6)
W4C (1)(6)
W4C (1)(6)
W4C (1)(6)
W4C (1)(6)
MKP 378
W4Y
(2)(5)
W4Y
(2)(5)
W4C (1)(6)
W4Y (2)(5)
W4C (1)(6)
W4C (1)(6)
W4C (1)(6)
MKP 336 1
W4Y (2)(5)
W4C (1)(6)
W4C (1)(6)
W4C (1)(6)
MKP 336 2
W4Y (2)(5)
W4C (1)(6)
W4C (1)(6)
W4C (1)(6)
MKP 336 6
W4Y (2)(5)
W4C (1)(6)
MKP 338 1
(2)(5)
W4C (1)(6)
W4C (1)(6)
W4C (1)(6)
W4Y (2)(5)
W4C (1)(6)
W4C (1)(6)
W4C (1)(6)
W4C (1)(6)
W4C (1)(6)
W4C (1)(6)
MKP 379
MKP 380
37.5 mm
52.5 mm
W4C (1)(6)
W4C (1)(6)
W4Y (3)(4)
MMKP 383
MKP 385
MKP 416/MKP 417/MKP 418/
MKP 419/MKP 420
W4Y (3)(4)
MKP 422
W4Y (3)(4)
W4Y (3)(5)
W4Y
W4Y (3)(5)
MKP 338 2
MKP 338 4
MKP 338 6
W4Y (3)(5)
W4Y (2)(5)
W4C (1)(6)
W4C (1)(6)
W4C (1)(6)
MKP 339
W4Y (3)(5)
W4Y (2)(5)
W4C (1)(6)
W4C (1)(6)
W4C (1)(6)
(3)(5)
(2)(5)
W4C (1)(6)
W4C (1)(6)
W4C (1)(6)
W4Y (2)(5)
W4C (1)(6)
W4C (1)(6)
W4C (1)(6)
W4Y (2)(5)
W4C (1)(6)
W4C (1)(6)
W4C (1)(6)
(2)(5)
W4C (1)(6)
W4C (1)(6)
W4C (1)(6)
W4C (1)
W4Y (3)(5)
W4Y (2)(5)
W4C (1)(6)
W4C (1)(6)
W4C (1)(6)
W4C (1)(6)
W4Y (2)(5)
W4Y (2)(5)
W4C (1)(6)
W4C (1)(6)
W4C (1)(6)
W4C (1)(6)
W4C (1)(6)
W4C (1)(6)
MKP 339M
W4Y
MKP 339T
W4Y (3)(5)
MKP 479
MKP 1778
KP1830
W4Y
W4Y (3)(4)
MKP 1840/MKP 1840M
MKP 1841/MKP 1841M
W4Y
W4Y (2)(4)
MKP 1848
W4C (1)(6)
Notes
No risk
(2)
Risk for parameter change if PSL is not strictly followed
(3)
Risk for product damage if PSL is not strictly followed
(4)
Y: Temperature is measured at the body top and must be kept as follows:
During preheating: Tmax.  100 °C
During soldering: Tp  110 °C, tp  20 s, t  30 s
(5) Y: Temperature is measured at the body top and must be kept as follows:
During preheating: Tmax.  110 °C
During soldering: Tp  120 °C, tp  20 s, t  30 s
(6)
C: The component has a preheat limitation of 150 °C
Revision: 04-Aug-15
Document Number: 28171
3
For technical questions, contact: dc-film@vishay.com
THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT
ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000
APPLICATION NOTE
(1)
Application Note
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Vishay
Soldering Guidelines for Film Capacitors
AXIAL POLYESTER TYPES
PRODUCT BODY LENGTH
FAMILY
MKT 1813
11 mm
14 mm
19 mm
26.5 mm
31.5 mm
41.5 mm
W4Y (3)(5)
W4Y (3)(5)
W4C (2)(4)
W4C (1)(4)
W4C (1)(4)
W4C (1)(4)
W4C (2)(4)
W4C (1)(4)
W4C (1)(4)
W4C (1)(4)
F1773
Notes
(1) No risk
(2) Risk for parameter change if PSL is not strictly followed
(3) Risk for product damage if PSL is not strictly followed
(4) C: The component has a preheat limitation of 150 °C
(5)
Y: Temperature is measured at the body top and must be kept as follows:
During preheating: Tmax.  125 °C
During soldering: Tp  135 °C, tp  30 s, t  50 s
AXIAL POLYPROPYLENE TYPES
PRODUCT BODY LENGTH
FAMILY
MKP 1839 / MKP 1839 HQ
MKP 1845
11 mm
14 (17) mm
19 (22) mm
26.5 (29) mm
31.5 (34) mm
41.5 (44) mm
W4Y (3)(4)
W4Y (3)(4)
W4Y (3)(5)
W4Y (2)(5)
W4Y (1)(5)
W4Y (1)(5)
W4Y (3)(4)
W4Y (3)(5)
W4Y (2)(5)
W4Y (1)(5)
W4Y (1)(5)
Notes
(1) No risk
(2) Risk for parameter change if PSL is not strictly followed
(3) Risk for product damage if PSL is not strictly followed
(4) Y: Temperature is measured at the body top and must be kept as follows:
During preheating: Tmax.  100 °C
During soldering: Tp  110 °C, tp  20 s, t  30 s
(5) Y: Temperature is measured at the body top and must be kept as follows:
During preheating: Tmax.  110 °C
During soldering: Tp  120 °C, tp  20 s, t  30 s
WARNINGS
Y
X
Revision: 04-Aug-15
Document Number: 28171
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For technical questions, contact: dc-film@vishay.com
THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT
ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000
APPLICATION NOTE
Excessive soldering heat (preheating or soldering above the recommended limits) can result in product damage and
malfunctioning and should be thus strictly avoided. If PSL limits have been exceeded at any point in time during the soldering
process, the products could possibly show a change in certain parameters (e.g. capacitance value, tan , insulation resistance,
breakdown level, etc.) Exceeding PSL limits can even result in destruction of the product. Warning signs include a bulged or
deformed product encapsulation. Such an appearance may also be the result of other causes, such as interruptions, cooling
malfunctioning of the soldering machine, etc.
Axial components can better protected from direct heat conducted by the PCB, when a distance is kept from the product to
the PCB as follows:
Application Note
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Soldering Guidelines for Film Capacitors
TRIMMER CAPACITORS
FAMILY
PRODUCT BODY LENGTH
ALL SIZES
808 / 809
W4Y (3)(4)
Notes
(1) No risk
(2) Risk for parameter change if PSL is not strictly followed
(3) Risk for product damage if PSL is not strictly followed
(4) Y: Temperature is measured at the body top and must be kept as follows:
During preheating: Tmax.  85 °C
During soldering: Tp  100 °C, tp  20 s, t  30 s
Due to the sensitivity of these electromechanical components, it is critical to solder these components in a wave soldering
method. We recommend to use manual soldering, see below.
SOLDERING CONDITIONS FOR MANUAL SOLDERING
1. Use a soldering iron with sufficient wattage and a regulated temperature. The adequacy of the soldering iron can be judged
by the amount of time needed to reflow the solder. Beginning at 650 °F (343 °C), adjust the temperature so that the solder
reflows within 1.5 s to 3 s.
- If the solder reflow occurs in less than 1 s to 1.5 s, this indicates that the tip temperature is excessive.
- If more than 3 s to 3.5 s are needed for solder reflow, either the tip temperature is insufficient or the tip is cooling down
when applied to the circuit board.
2. Apply a small amount of flux to the component termination and the pad layout.
3. After tinning the iron, place the iron tip on the circuit pad at the edge furthest from the component. The soldering should be
completed in 1.5 s to 3 s. If it is necessary to keep the iron on longer than 3 s, replace the component with a fresh device.
4. Add the solder at the solder tip to ensure that it flows from the pad to the termination of the component. Be careful not to
add too much solder. The minimum is the best.
5. Never touch the component being worked on or any adjacent components with the soldering iron.
Document Number: 28171
5
For technical questions, contact: dc-film@vishay.com
THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT
ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000
APPLICATION NOTE
Revision: 04-Aug-15