1 2 3 4 5 6 Q3 2 1 PB7 SOT23 3 GND U3 2 PA2 3 VBRD C37 10nF 4 PA3 PA0 PA1 PA2 0_REF VBRD VBRD PA3 NWP A PA1 7 C7 VBRD 6 VBRD 5 R5 DNI R19 100ohm PKG_8L_SOP GND PA5 8 NRESET 6 JCLK 4 PC3 2 PC2 PA5 PA4 NRESET PC4 JCLK GND PC3 PC0 PC2 VBRD 9 7 V_FILTER 1 ohm 100nF VDD_CORE_1V2 C6 GND 10 C8 R2 GND PA4 2.2uF GND VDDA_1V8 GND 1uF PC7 PC4 3 1 PC6 R13 0 ohm 5 PC0 2 PA0 8 1 1 748 893 0245 AT3 A R12 0 ohm C19 GND GND DNI VBRD J1 Y2 ABS07-32.768KHz-T(DNI) C5 VBRD 1 L22 1.8nH 2 PB0 GND 100nF C9 PC6 C10 C52 R4 R6 DNI DNI 22pFGND PC1 PB0 GND 33pF GND DNI PA1 PA0 PB4 PB3 PA7 DS2 YELLOW DS1 RED 2 VDDA_1V8 1 C12 OSCB GND ANT1 GND GND GND 2 1 ANT2 GND ANT1 15 14 13 GND 3 GND C53 1uF VBRD (0402) 4 OSCB 1 Y1 NC OSCB 24 MHz OSCA NC 3 GND DNI OSCA L21 1.8nH 2 C C21 GND DNI C1 VG1 10nFGND VDD_CORE_1V2 PA6 PB5 PB6 PB7 QFN-48_VIA_GRID A via grid array of nine vias spaced 1.6256mm apart is required to be placed centered under the Ember QFN-48 IC package to provide adequate gounding and thermal continuity EM357 -GPIO PBO PC5 Jumper to either PBO or GND PC1 Jumper to either PC6 or GND PC0 R1 VDDA_1V8 R3 100ohm VDD_MEM 10 ohm GND 748 893 0245 AT4 PC1 5 GND C17 8.0 pF GND VDDA_1V8 R7 510 ohm 6 4 GND C13 PA7 J13 MM8130-2600 GND 27pF GND R8 510 ohm GND 1 20 23 21 N/C ANTSEL VCCLNA GND GND GND OSCA 27pFGND RFP 16 3 GND C14 10nF VDDA_1V8 C11 GND RFn GND GND 4 6 2 RF_P 7 CT GND RF_N GND GND ANT2 N/C 4 3 L10 3.0nH GND GND 8 GND CE U5 RFFM6201 19 GND 18 GND 17 12 5 6 5 VBRD GND 4 C15 8.0 pF GND 11 RF_TX_ALT_P 3 VCC_PA 6 GND 2 10 PB0 GND DNI RF_TX_ALT_N L9 7 GND C_LNA VDDA_1V8 GND 9 8 1 B GND 1 48 C18 8.0 pF C_Rx_Tx VDDA_1V8 GND J12 MM8130-2600 5 22 PC5 8.0 pF PC5 C20 10nF C3 100nF DNI VCC_DIG 11 10 GND GND R15 0 ohm 24 C16 10nF NRESET OSCA VDD_24MHZ OSCB VDD_SYNTH VDD_VCO 47 46 VDD_PRE 45 PB0 44 PC4 VDD_CORE_1 RF_P PB5 RF_N PC3 PB6 PC2 12 R16 9 13 PC7 PC6 15 14 VREG_OUT 17 18 16 VDD_PADS_0 VDD_CORE_0 19 PB3 PA7 21 22 20 PB4 PA0 VDD_RF 43 36 RF_TX_ALT_P 42 PB0 35 PB2 PB7 PB5 GND PB6 PB7 PC0 PC1 PB0 PC4 PC3 PC2 JCLK 34 RF_TX_ALT_N JTCK VBRD VDDA_1V8 2 P11 P10 PC4 VBRD GND 33 PB1 37 33 32 31 30 29 28 27 26 25 24 23 22 21 20 32 VDD_IF 41 PC3 31 NC PA6 PC0 PC2 30 PC5 VDD_PADS_2 VDD_MEM JCLK 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 GND C PB2 LINK PA4 GND PA5 PA6 PB1 PB2 GND 29 VDDA_1V8 C27 VDD_PADSA 40 PB1 ACTIVITY PC5 PC6 PC7 PA7 PB3 NRESET PB4 PA0 PA1 PA2 PA3 GND PA6 U1 NRESET PA5 39 C4 100nF PA4 PC1 28 VBRD P10 P11 EM35X_RCM_INTERFACE 27 VDD_PADS_3 PA5 26 PA3 38 PA4 25 PA1 PA2 B PA3 VDD_PADS_1 24 R10 DNI 23 PA2 R9 0 ohm C2 0.47uF FM6201-CTRL-Pin# CE- pin2 C_RX_TX- pin24 LNA_EN- pin23 C_ANT1- pin21 C_ANT2- pin20 GND 1 2 3 4 5 6 7 8 9 GND GND VG2 QFN-24_VIA_GRID A via grid array of twenty five vias spaced 0.635mm apart is required to be placed centered under the RFMD QFN-24 IC package to provide adequate gounding and thermal continuity D D FID1 FAMILY P/N: RFFM6201 TITLE: FID RF6201EM357 EVAL SCHEM 7628 Thorndike Road Greensboro, NC 27409 Phone: 336−664−1233 DATE: 04/30/13 1 2 3 4 5 DRAWN BY: RFMD PCB PART NUMBER: FM6201-411 REV: DOC NO: FM6201-401 SIZE: 6 C PAGE: 1 of 1 A