RFCS - Solder Reflow Assembly Instructions www.vishay.com Vishay Electro-Films RFCS - Solder Reflow Assembly Instructions RECOMMENDED SOLDERING PROFILE (Sn 96.5 Ag 3 Cu 0.5 lead (Pb)-free solder) 250 Not to scale. For reference only 3 200 Temperature (°C) 5 4 2 150 100 6 1 50 0 50 100 150 Time (s) 200 250 NUMBER PARAMETER SPECIFICATION 1 Temperature gradient in pre-heating Maximum 3 °C/s 2 Soak time (T = 140 °C to 170 °C) 60 s to 120 s 3 Temperature gradient in reflow Maximum 3 °C/s 4 Time above 220 °C 30 s to 90 s 5 Peak temperature in reflow 240 °C ± 5 °C for 10 s 6 Temperature gradient in cooling Maximum - 3 °C/s ASSEMBLY CONSIDERATION • • • • Solder paste type 3 or finer with Halide free flux No-clean solder paste is preferred Qualified for up to 5 reflow operations (260 °C peak) For 0.004" stencil thickness, recommended aperture of 60 % from the pad size recommendation • Nitrogen purge is recommended during solder reflow • Level of oxygen is kept low in reflow chamber, below 100 ppm See datasheet for recommended footprint geometry. Assembly on larger pads is possible; however, careful control of solder volume should be exercised to avoid excess solder from touching the exposed silicon body of the component. Excess solder might cause the component to fail. Solder flux residue under the comonent can result in increase leakage current. Adequate flux cleaning is required for optimal performance. MANUAL ASSEMBLY RECOMMENDATION, WHEN USED 1. Hot-air station (for example www.jbctools.com/english/advanced/5000200.html): Adjust the iron temperature to 300 °C. Apply solder paste on the circuit pad. Place the component with fine tweezers. Move the nozzle tip to about 15 mm to 20 mm from the component terminal and direct the hot air flow against it. Wait until the paste flux liquefies. Move the tip closer to 8 mm to 10 mm and hold it until the paste melts and then immediately move away the heater. 2. Hot plate: Apply solder paste on the circuit pad. Place the component with fine tweezers. Adjust the temperature to 220 °C. Put the board on the plate and turn on the heater. Wait until it reaches 220 °C and wait 1 min. Turn off the heater. 3. Reflow oven: Apply solder paste on the circuit pad. Place the component with fine tweezers. See reflow recommendation profile. 4. Standard iron: Not recommended. The RFCS component is a flip chip device having hidden solder pads. In most cases, iron soldering results in excess solder, as shown in the image above. Excess solder that touches the bare silicon body of the component can cause the component to short. Revision: 03-May-13 Document Number: 61101 1 For technical questions, contact: [email protected] THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000