APL5523

APL5523
Dual-Channel, 3.3V/500mA and 1.8V/300mA Linear Regulator
Features
•
General Description
Fixed Output Voltage :
The APL5523 is a dual low dropout regulator with out-
VOUT1=3.3V/500mA
put1 with 3.3V/0.5A and output2 with 1.8V/0.3A output
capability. In order to obtain lower dropout voltage and
VOUT2=1.8V/300mA
•
faster transient response, which is critical for low voltage applications, the APL5223 has been optimized. The
Low Dropout Voltage (Defined as the Minimum
Input/Output Voltage difference):
Output 1 Dropout Voltage : 0.6V (at 500mA)
dropout voltages are guaranteed at 0.6V at 0.5A for output1 and 0.9V at 0.3A for output 2. Current limit is trimmed
Output 2 Dropout Voltage : 0.9V (at 300mA)
•
to ensure specified output current and controlled shortcircuit current. On-chip thermal limiting provides protec-
Stable with 4.7µF Output Capacitor(at VOUT1)
Stable with 2.2µF Output Capacitor(at VOUT2)
•
Built-In Thermal Protection
tion against any combination of overload that would create excessive junction temperatures. The APL5523 regu-
•
Built-In Current-Limit Protection
lator comes in a SOP-8 and SOP-8P packages.
•
Fast Transient Response
•
Short Setting Time
•
SOP-8 and SOP-8P Packages Available
•
Lead Free and Green Devices Available
Pin Configuration
V
(RoHS Compliant)
V
Applications
1
8
G N D
1
8
N C
V
IN
2
7
G N D
V
IN
2
7
G N D
V
IN
3
6
G N D
V
IN
3
6
N C
O U T 2
4
5
G N D
O U T 2
4
5
N C
O U T 1
SOP−8 (Top View)
•
Desktop Computer
•
Networking Systems
•
Optical Data Storage Systems
V
V
O U T 1
SOP-8P (Top View)
= Thermal Pad (connected to the GND plane for better heat
dissipation)
Ordering and Marking Information
Package Code
K : SOP-8
KA : SOP-8P
Operating Junction Temperature Range
C : 0 to 150 oC
Handling Code
TR : Tape & Reel
Assembly Material
G : Halogen and Lead Free Device
APL5523
Assembly Material
Handling Code
Temperature Range
Package Code
APL5523 K/KA :
APL5523
XXXXX
XXXXX - Date Code
Note: ANPEC lead-free products contain molding compounds/die attach materials and 100% matte tin plate termination finish; which
are fully compliant with RoHS. ANPEC lead-free products meet or exceed the lead-free requirements of IPC/JEDEC J-STD-020C for
MSL classification at lead-free peak reflow temperature. ANPEC defines “Green” to mean lead-free (RoHS compliant) and halogen
free (Br or Cl does not exceed 900ppm by weight in homogeneous material and total of Br and Cl does not exceed 1500ppm by
weight).
ANPEC reserves the right to make changes to improve reliability or manufacturability without notice, and
advise customers to obtain the latest version of relevant information to verify before placing orders.
Copyright  ANPEC Electronics Corp.
Rev. A.2 - Jan., 2009
1
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APL5523
Absolute Maximum Ratings
Symbol
VIN, VOUT
Parameter
Rating
Unit
6
V
SOP-8
150
°C/W
SOP-8-P
75
Input Voltage or Out Voltage
Thermal Resistance – Junction to Ambient
RTH,JA
Thermal Resistance – Junction to Case
RTH,JC
PD
SOP-8
30
SOP-8-P
5
Power Dissipation
°C/W
Internally Limited
W
Control Section
0 to 125
°C
Power Transistor
0 to 150
Operating Junction Temperature
TJ
TSTG
TL
Storage Temperature Range
-65 to +150
°C
260
°C
Maximum Lead Soldering Temperature, 10 Seconds
Electrical Characteristics
Unless otherwise noted these specifications apply over full temperature, CIN=1µF, COUT1=4.7µF, COUT2=2.2µF, TJ=0 to 125°C. Typical
values refer to TJ=25°C.
Symbol
VIN
Parameter
OTS
Typ.
Max.
2.7
-
6
V
-
50
-
mA
-
150
-
°C
-
20
-
°C
-
100
-
ppm/°C
IOUT1=500mA, IOUT2=300mA
-
900
1000
IOUT1=0mA, IOUT2=0mA
-
100
200
VOUT –2%
3.3
VOUT +2%
V
-
900
-
mA
500
-
-
mA
-
5
10
mV
VOUT=0V
Over-Temperature
Shutdown
Over-Temperature
Shutdown Hysteresis
TC
Output-Voltage Temperature
Coefficient
IQ
Quiescent Current
Unit
Min.
Input Voltage
ISHORT Short Current
APL5523
Test Conditions
Hysteresis
µA
Output1 (500mA)
VOUT
Output Voltage
ILIMIT
Circuit Current Limit
VIN=5V
VIN=VOUT+1V
IOUT
Load Current
VIN=VOUT+1V
REGLINE Line Regulation
VOUT+1V< VCC< 6.0V, IOUT=1mA
REGLOAD Load Regulation
VIN =VOUT+1V, 0mA< IOUT < IMAX
PSRR
Ripple Rejection
F≤1kHz, 1Vpp at IOUT=50mA
(Note1)
VDROP
Dropout Voltage
COUT
Output Capacitor
IOUT =500mA
ESR
Copyright  ANPEC Electronics Corp.
Rev. A.2 - Jan., 2009
2
-
40
60
mV
40
48
-
dB
-
0.6
0.7
V
-
4.7
-
µF
0.01
0.1
1
Ohm
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APL5523
Electrical Characteristics (Cont.)
Unless otherwise noted these specifications apply over full temperature, CIN=1µF, COUT1=4.7µF, COUT2=2.2µF, TJ=0 to 125°C. Typical
values refer to TJ=25°C.
Symbol
Parameter
APL5523
Test Conditions
Unit
Min.
Typ.
Max.
VOUT –2%
1.8
VOUT +2%
V
Output2 (300mA)
VOUT
Output Voltage
VIN=5V
ILIMIT
Circuit Current Limit
VIN=VOUT+1V
-
900
-
mA
IOUT
Load Current
VIN=VOUT+1V
300
-
-
mA
REGLINE Line Regulation
VOUT+1V< VCC<6.0V, IOUT=1mA
-
4
10
mV
REGLOAD Load Regulation
VIN =VOUT+1V, 0mA< IOUT < IMAX
-
20
40
mV
PSRR
Ripple Rejection
F≤1kHz, 1Vpp at IOUT=50mA
VDROP
Dropout Voltage (Note1)
IOUT =300mA
COUT
Output Capacitor
ESR
45
55
-
dB
-
0.9
1
V
-
2.2
-
µF
0.01
0.1
1
Ohm
Note 1: Dropout voltage definition : VIN-VOUT when VOUT is 2% below the value of VOUT for VIN = VOUT+1V.
Pin Description
PIN
I/O
FUNCTION
VOUT1
O
VOUT1 output Voltage 3.3V. Sources up to 500mA.
2
VIN
I
Supply Voltage.
3
VIN
I
Supply Voltage.
4
VOUT2
O
VOUT2 output Voltage 1.8V. Sources up to 300mA.
5
GND
6
GND
7
GND
8
GND
NO.
NAME
1
Ground also functions as a heatsink. Solder to the ground plane to maximize thermal
dissipation
Block Diagram
VIN
Thermal
Shutdown
VOUT1
MOS
Driver
With
Iimit
_
Error
AMP
+
Reference
Voltage
_
+
Error
AMP
MOS
Driver
With
Iimit
VOUT2
GND
Copyright  ANPEC Electronics Corp.
Rev. A.2 - Jan., 2009
1
3
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APL5523
Typical Application Circuit
VOUT1
1
8
2
7
3
6
4
5
4.7µF
VIN
1µF
VOUT2
2.2µF
APL5523
Copyright  ANPEC Electronics Corp.
Rev. A.2 - Jan., 2009
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APL5523
Typical Operating Characteristics
Quiescent Current vs. Input Voltage
Quiescent Current vs. Output Current
160
600
VOUT1
IOUT1=IOUT2=0mA
VIN=5V
500
120
Quiescent Current (µA)
Quiescent Current (µA)
140
100
80
60
40
VOUT2
400
300
200
100
20
0
0
0
1
2
3
4
5
0
6
100
200
300
400
Output Current (mA)
Input Voltage (V)
Output1 Voltage vs. Temperature
Output Voltage vs. Input Voltage
3.310
3.5
IOUT1=IOUT2=0mA
IOUT1=0mA
VOUT1
3.305
Output1 Voltage (V)
3
2.5
Output Voltage (V)
500
2
1.5
VOUT2
1
3.300
3.295
3.290
3.285
0.5
0
3.280
0
1
2
3
4
5
-40
Input Voltage (V)
Copyright  ANPEC Electronics Corp.
Rev. A.2 - Jan., 2009
-20
0
20
40
60
80
100
120
140
Temperature (°C)
5
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APL5523
Typical Operating Characteristics (Cont.)
Output2 Voltage vs. Temperature
Dropout Voltage vs. Output Current
1000
1.804
IOUT2=0mA
900
800
VOUT2
700
1.800
Dropout Voltage (mV)
Output2 Voltage (V)
1.802
1.798
1.796
1.794
600
500
400
300
VOUT1
200
100
0
1.792
-40
-20
0
20
40
60
80
0
100 120 140
100
200
300
Temperature (°C)
Output Current (mA)
PSRR vs. Frequency
Load-Transient Response
400
500
0
-10
VIN = 5V
IOUT1 = IOUT2 = 50mA
VOUT1(100mv/div)
PSRR (dB)
-20
-30
V OUT1
-40
-50
V OUT2
IOUT1=1mA~500mA
COUT1=4.7µF(Aluminum)
Tr=1µs
-60
-70
-80
10
100
1k
10k
100k
Frequency (Hz)
Copyright  ANPEC Electronics Corp.
Rev. A.2 - Jan., 2009
Time (0.1ms/div)
6
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APL5523
Typical Operating Characteristics (Cont.)
Load-Transient Response
Line-Transient Response
VOUT2 (100mV/div)
VIN = 4.5 ~ 5.5V
VOUT1(20mV/div)
IOUT1=10mA
COUT1=4.7µF
IOUT2 =1mA~300mA
COUT2=2.2µF(Aluminum)
Tr=1µs
VOUT2(20mV/div)
IOUT2=10mA
COUT2=2.2µF
Time(0.1ms/div)
Time(20µs/div)
Output Current vs. VIN
450
Mounted on recommend mimimum footprint(RθJA=75°C/W)
400
, 2OZ Copper PCB area.(TJ,MAX=150°C )
300
200mil
Output Current mA)
350
TA=25°C
250
200
TA=55°C
150
100mil
100
50
0
4.75
20mil
5
5.25
5.5
5.75
20mil
6
VIN (V)
Copyright  ANPEC Electronics Corp.
Rev. A.2 - Jan., 2009
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APL5523
Package Information
SOP-8P
D
SEE VIEW
A
E
E1
THERMAL
PAD
E2
D1
h X 45
°
c
A
0.25
b
L
0
GAUGE PLANE
SEATING PLANE
A1
A2
e
VIEW A
S
Y
M
B
O
L
SOP-8P
MILLIMETERS
MIN.
MAX.
MAX.
MIN.
0.063
1.60
A
A1
INCHES
0.006
0.000
0.15
0.00
0.049
A2
1.25
b
0.31
0.51
0.012
0.020
c
0.17
0.25
0.007
0.010
D
4.80
5.00
0.189
0.197
D1
2.25
3.50
0.098
0.138
E
5.80
6.20
0.228
0.244
E1
3.80
4.00
0.150
0.157
E2
2.00
3.00
0.079
0.118
e
1.27 BSC
0.050 BSC
h
0.25
0.50
0.010
0.020
L
0.40
1.27
0.016
0.050
0
0o
8o
0o
8o
Note : 1. Follow JEDEC MS-012 BA.
2. Dimension "D" does not include mold flash, protrusions
or gate burrs. Mold flash, protrusion or gate burrs shall not
exceed 6 mil per side .
3. Dimension "E" does not include inter-lead flash or protrusions.
Inter-lead flash and protrusions shall not exceed 10 mil per side.
Copyright  ANPEC Electronics Corp.
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APL5523
Package Information
SOP-8
D
E
E1
SEE VIEW A
h X 45
°
c
A
0.25
b
GAUGE PLANE
SEATING PLANE
A1
A2
e
L
VIEW A
S
Y
M
B
O
L
SOP-8
MILLIMETERS
MIN.
INCHES
MAX.
A
MIN.
MAX.
1.75
0.069
0.004
0.25
0.010
A1
0.10
A2
1.25
b
0.31
0.51
0.012
0.020
c
0.17
0.25
0.007
0.010
D
4.80
5.00
0.189
0.197
E
5.80
6.20
0.228
0.244
E1
3.80
4.00
0.150
0.157
h
0.25
0.50
0.010
0.020
L
0.40
1.27
0.016
0.050
0
0°
8°
0°
e
0.049
1.27 BSC
0.050 BSC
8°
Note: 1. Follow JEDEC MS-012 AA.
2. Dimension “D” does not include mold flash, protrusions or gate burrs.
Mold flash, protrusion or gate burrs shall not exceed 6 mil per side.
3. Dimension “E” does not include inter-lead flash or protrusions.
Inter-lead flash and protrusions shall not exceed 10 mil per side.
Copyright  ANPEC Electronics Corp.
Rev. A.2 - Jan., 2009
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APL5523
Carrier Tape & Reel Dimensions
P0
P2
P1
A
B0
W
F
E1
OD0
K0
A0
A
OD1 B
B
T
SECTION A-A
SECTION B-B
H
A
d
T1
Application
A
H
330.0±2.00 50 MIN.
SOP-8(P)
T1
C
d
D
W
E1
12.4+2.00 13.0+0.50
-0.00
-0.20 1.5 MIN. 20.2 MIN. 12.0±0.30 1.75±0.10
P0
P1
P2
4.0±0.10
8.0±0.10
2.0±0.05
D0
1.5+0.10
-0.00
D1
1.5 MIN.
F
5.5±0.05
T
A0
B0
K0
0.6+0.00
-0.40 6.40±0.20 5.20±0.20 2.10±0.20
(mm)
Devices Per Unit
Package Type
Unit
Quantity
SOP-8(P)
Tape & Reel
2500
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APL5523
Taping Direction Information
SOP-8(P)
USER DIRECTION OF FEED
Classification Profile
Copyright  ANPEC Electronics Corp.
Rev. A.2 - Jan., 2009
11
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APL5523
Classification Reflow Profiles
Profile Feature
Sn-Pb Eutectic Assembly
Pb-Free Assembly
100 °C
150 °C
60-120 seconds
150 °C
200 °C
60-120 seconds
3 °C/second max.
3°C/second max.
183 °C
60-150 seconds
217 °C
60-150 seconds
See Classification Temp in table 1
See Classification Temp in table 2
Time (tP)** within 5°C of the specified
classification temperature (Tc)
20** seconds
30** seconds
Average ramp-down rate (Tp to Tsmax)
6 °C/second max.
6 °C/second max.
6 minutes max.
8 minutes max.
Preheat & Soak
Temperature min (Tsmin)
Temperature max (Tsmax)
Time (Tsmin to Tsmax) (ts)
Average ramp-up rate
(Tsmax to TP)
Liquidous temperature (TL)
Time at liquidous (tL)
Peak package body Temperature
(Tp)*
Time 25°C to peak temperature
* Tolerance for peak profile Temperature (Tp) is defined as a supplier minimum and a user maximum.
** Tolerance for time at peak profile temperature (tp) is defined as a supplier minimum and a user maximum.
Table 1. SnPb Eutectic Process – Classification Temperatures (Tc)
Package
Thickness
<2.5 mm
≥2.5 mm
Volume mm
<350
235 °C
220 °C
3
Volume mm
≥350
220 °C
220 °C
3
Table 2. Pb-free Process – Classification Temperatures (Tc)
Package
Thickness
<1.6 mm
1.6 mm – 2.5 mm
≥2.5 mm
Volume mm
<350
260 °C
260 °C
250 °C
3
Volume mm
350-2000
260 °C
250 °C
245 °C
3
Volume mm
>2000
260 °C
245 °C
245 °C
3
Reliability Test Program
Test item
SOLDERABILITY
HOLT
PCT
TCT
ESD
Latch-Up
Method
JESD-22, B102
JESD-22, A108
JESD-22, A102
JESD-22, A104
JESD-22, A114; A115
JESD 78
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Rev. A.2 - Jan., 2009
12
Description
5 Sec, 245°C
1000 Hrs, Bias @ 125°C
168 Hrs, 100%RH, 2atm, 121°C
500 Cycles, -65°C~150°C
VHBM≧2KV, VMM≧200V
10ms, 1tr≧100mA
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APL5523
Customer Service
Anpec Electronics Corp.
Head Office :
No.6, Dusing 1st Road, SBIP,
Hsin-Chu, Taiwan, R.O.C.
Tel : 886-3-5642000
Fax : 886-3-5642050
Taipei Branch :
2F, No. 11, Lane 218, Sec 2 Jhongsing Rd.,
Sindian City, Taipei County 23146, Taiwan
Tel : 886-2-2910-3838
Fax : 886-2-2917-3838
Copyright  ANPEC Electronics Corp.
Rev. A.2 - Jan., 2009
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