TVS Diode Arrays (SPA® Diodes) Low Capacitance ESD Protection - SP3003 Series SP3003 Series 0.65pF Diode Array RoHS Pb GREEN Description The SP3003 has ultra low capacitance rail-to-rail diodes with an additional zener diode fabricated in a proprietary silicon avalanche technology to protect each I/O pin providing a high level of protection for electronic equipment that may experience destructive electrostatic discharges (ESD). These robust diodes can safely absorb repetitive ESD strikes at the maximum level specified in the IEC 61000-4-2 international standard (Level 4, ±8kV contact discharge) without performance degradation. Their very low loading capacitance also makes them ideal for protecting high speed signal pins such as HDMI, DVI, USB2.0, and IEEE 1394. Pinout Features SP3003-02X/J SP3003-04X/J SP3003-02UTG (AEC-Q101 qualified) NC I/O 1 GND I/O 2 VCC I/O 1 I/O 4 GND VCC I/O 2 I/O 3 SP3003-04A SP3003-08A I/O 1 NC I/O 1 I/O 8 I/O 2 NC I/O 2 I/O 7 VCC GND I/O 3 NC I/O 3 NC I/O 4 I/O 6 I/O 4 NC GND I/O 5 • E SD protection of ±8kV contact discharge, ±15kV air discharge, (IEC61000-4-2) • Low capacitance of 0.65pF (TYP) per I/O • E FT protection, IEC61000-4-4, 40A (5/50ns) • C omplete line of small packaging helps save board space (SC70, SOT553, SOT563, MSOP10, µDFN-6L) • L ow leakage current of 0.5μA (MAX) at 5V • L ightning Protection, IEC61000-4-5, 2.5A (8/20µs) • A EC-Q101 qualified (µDFN package) Applications Functional Block Diagram SP3003-04J/XTG 6 5 4 SP3003-04ATG 10 9 8 7 6 SP3003-02UTG • LCD/ PDP TVs • Set Top Boxes • DVD Players • Mobile Phones • Desktops • Notebooks • MP3/ PMP • Computer Peripherals • Digital Cameras 1 2 3 1 SP3003-02J/XTG 5 4 2 3 4 Application Example 5 SP3003-08ATG 10 9 8 7 DVI/ HDMI Port 6 *Package is shown as transparent D2+ GND D2D1+ Vcc/NC GND 1 2 3 1 2 3 4 D1- 5 IC D0+ GND Additional Information D0CLK+ Vcc/NC GND CLK- Datasheet Resources Samples Life Support Note: Not Intended for Use in Life Support or Life Saving Applications The products shown herein are not designed for use in life sustaining or life saving applications unless otherwise expressly indicated. © 2015 Littelfuse, Inc. Specifications are subject to change without notice. Revised: 01/26/15 GND GND Signal GND A single, 4 channel SP3003-04 device can be used to protect four (4) of the data lines in a HDMI/DVI interface so two (2) SP3003-04 devices provide protection for all eight (8) TMDS lines. TVS Diode Arrays (SPA® Diodes) Low Capacitance ESD Protection - SP3003 Series Thermal Information Absolute Maximum Ratings Symbol Parameter Value IPP Peak Current (tp=8/20μs) TOP TSTOR Parameter Rating Units –55 to 150 °C Maximum Junction Temperature 150 °C Maximum Lead Temperature (Soldering 20-40s) 260 °C Units 2.5 A Operating Temperature –40 to 125 °C Storage Temperature –55 to 150 °C Storage Temperature Range CAUTION: Stresses above those listed in “Absolute Maximum Ratings” may cause permanent damage to the device. This is a stress only rating and operation of the device at these or any other conditions above those indicated in the operational sections of this specification is not implied. Electrical Characteristics (TOP=25ºC) Symbol Test Conditions Max Units Reverse Standoff Voltage Parameter VRWM IR ≤ 1µA 6 V Reverse Leakage Current ILEAK VR=5V 0.5 µA Clamp Voltage1 VC ESD Withstand Voltage1 VESD Diode Capacitance1 CI/O-GND Diode Capacitance1 CI/O-I/O Min Typ IPP=1A, tp=8/20µs, Fwd 10.0 12.0 V IPP=2A, tp=8/20µs, Fwd 11.8 15.0 V IEC61000-4-2 (Contact) ±8 kV IEC61000-4-2 (Air) ±15 Reverse Bias=0V 0.7 0.8 0.95 pF Reverse Bias=1.65V 0.55 0.65 0.8 pF kV Reverse Bias=0V 0.35 pF Note: 1. Parameter is guaranteed by design and/or device characterization. Insertion Loss (S21) I/O to GND Capacitance vs. Bias Voltage 1 1.00 0 0.95 0.90 -2 I/O Capacitance (pF) Insertion Loss [dB] -1 -3 -4 -5 -6 -7 0.80 VCC = Float 0.75 0.70 VCC = 3.3V 0.65 VCC = 5V 0.60 -8 0.55 -9 0.50 -10 1.E+06 0.85 1.E+07 1.E+08 Frequency [Hz] 1.E+09 1.E+10 0.0 0.5 1.0 1.5 2.0 2.5 3.0 3.5 4.0 4.5 5.0 I/O DC Bias (V) © 2015 Littelfuse, Inc. Specifications are subject to change without notice. Revised: 01/26/15 TVS Diode Arrays (SPA® Diodes) Low Capacitance ESD Protection - SP3003 Series Product Characteristics Capacitance [F] Capacitance vs. Frequency 1.4E-12 Lead Plating Matte Tin (SC70-x, MSOP-10) Pre-Plated Frame (SOT5x3, µDFN-6) 1.2E-12 Lead Material Copper Alloy 1E-12 Lead Coplanarity 0.0004 inches (0.102mm) 8E-13 Substitute Material Silicon Body Material Molded Epoxy Flammability UL 94 V-0 6E-13 4E-13 2E-13 0 1.E+06 1.E+07 1.E+08 1.E+09 Frequency [Hz] Notes : 1. All dimensions are in millimeters 2. Dimensions include solder plating. 3. Dimensions are exclusive of mold flash & metal burr. 4. Blo is facing up for mold and facing down for trim/form, i.e. reverse trim/form. 5. Package surface matte finish VDI 11-13. Soldering Parameters Pre Heat Pb – Free assembly - Temperature Min (Ts(min)) 150°C - Temperature Max (Ts(max)) 200°C - Time (min to max) (ts) 60 – 180 secs Average ramp up rate (Liquidus) Temp (TL) to peak 3°C/second max TS(max) to TL - Ramp-up Rate 3°C/second max Reflow - Temperature (TL) (Liquidus) 217°C - Temperature (tL) 60 – 150 seconds 260 °C Time within 5°C of actual peak Temperature (tp) 20 – 40 seconds Ramp-down Rate 6°C/second max Time 25°C to peak Temperature (TP) 8 minutes Max. Do not exceed 260°C © 2015 Littelfuse, Inc. Specifications are subject to change without notice. Revised: 01/26/15 Critical Zone TL to TP Ramp-up TL TS(max) tL Ramp-do Ramp-down Preheat TS(min) 25 Peak Temperature (TP) +0/-5 tP TP Temperature Reflow Condition tS time to peak temperature Time TVS Diode Arrays (SPA® Diodes) Low Capacitance ESD Protection - SP3003 Series Package Dimensions — SC70-5 5 6 Package e e Recommended Solder Pad Layout 4 not used E 5 JEDEC MO-203 Millimeters 3 2 1 HE SC70-5 Pins B D A2 A A1 C Min Max Min Max A 0.80 1.10 0.031 0.043 A1 0.00 0.10 0.000 0.004 A2 0.70 1.00 0.028 0.039 B 0.15 0.30 0.006 0.012 c 0.08 0.25 0.003 0.010 D 1.85 2.25 0.073 0.089 E 1.15 1.35 0.045 0.053 e L Inches 0.65 BSC 0.026 BSC HE 2.00 2.40 0.079 0.094 L 0.26 0.46 0.010 0.018 Package Dimensions — SC70-6 e e 6 5 Recommended Solder Pad Layout 4 E 1 2 Package SC70-6 Pins 6 JEDEC HE MO-203 Millimeters B D A2 A A1 C Max Min Max A 0.80 1.10 0.031 0.043 A1 0.00 0.10 0.000 0.004 A2 0.70 1.00 0.028 0.039 B 0.15 0.30 0.006 0.012 c 0.08 0.25 0.003 0.010 D 1.85 2.25 0.073 0.089 E 1.15 1.35 0.045 0.053 e L Inches Min 3 0.65 BSC 0.026 BSC HE 2.00 2.40 0.079 0.094 L 0.26 0.46 0.010 0.018 Package Dimensions — SOT553 A D 6 5 (not used) 2 4 3 e E L Package SOT 553 Pins 5 Millimeters Inches Min Max Min Max 0.50 0.60 0.020 0.024 B 0.17 0.27 0.007 0.011 c 0.08 0.18 0.003 0.007 D 1.50 1.70 0.059 0.067 E 1.10 1.30 0.043 0.051 HE A c B Recommended Solder Pad Layout e 0.50 BSC 0.020 BSC L 0.10 0.30 0.004 0.012 HE 1.50 1.70 0.059 0.067 © 2015 Littelfuse, Inc. Specifications are subject to change without notice. Revised: 01/26/15 TVS Diode Arrays (SPA® Diodes) Low Capacitance ESD Protection - SP3003 Series Package Dimensions — SOT563 A D 6 5 2 4 Package L E Recommended Solder Pad Layout HE 3 e c B SOT 563 Pins 6 Millimeters Inches Min Max Min Max A 0.50 B 0.17 0.60 0.020 0.024 0.27 0.007 c 0.011 0.08 0.18 0.003 0.007 D 1.50 1.70 0.059 0.067 E 1.10 1.30 0.043 0.051 0.50 BSC e 0.020 BSC L 0.10 0.30 0.004 0.012 HE 1.50 1.70 0.059 0.067 Package Dimensions — MSOP10 Package MSOP10 JEDEC MO-187 Pins 10 Millimeters Recommended Solder Pad Recommanded Solder Pad Layout Layout Inches Min Max Min Max A - 1.10 - 0.043 A1 0.00 0.15 0.000 0.006 B 0.17 0.27 0.007 0.011 c 0.08 0.23 0.003 0.009 D 2.90 3.10 0.114 0.122 E 4.67 5.10 0.184 0.200 E1 2.90 3.10 0.114 0.122 0.50 BSC e HE 0.40 0.020 BSC 0.80 0.016 0.031 Package Dimensions —µDFN-6L 0.48 0.05 0.35 0.5 0.55 0.25 0.4 Package µDFN-6L JEDEC MO-229 Pins 6 0.42 Millimeters 0.11 0.55 0.62 0.12 Recommended Solder Pad Layout 0.4 Min Max Min Max A 0.45 0.55 0.018 0.022 A1 0.00 0.05 0.000 0.002 0.125REF A3 0.005REF b 0.35 0.45 0.014 0.018 b1 0.15 0.25 0.006 0.010 0.065 D 1.55 1.65 0.062 D2 - - - - E 0.95 1.05 0.038 0.042 E2 - - - - 0.50REF e L © 2015 Littelfuse, Inc. Specifications are subject to change without notice. Revised: 01/26/15 Inches 0.33 0.020REF 0.43 0.013 0.017 TVS Diode Arrays (SPA® Diodes) Low Capacitance ESD Protection - SP3003 Series Embossed Carrier Tape & Reel Specification — MSOP-10 Millimetres Max Min Max E 1.65 1.85 0.065 0.073 F 5.40 5.60 0.213 0.220 D 1.50 1.60 0.059 0.063 1.50 Min D1 P0 10P0 User Feeding Direction 0.059 Min 3.90 4.10 40.0± 0.20 0.154 0.161 1.574±0.008 W 11.90 12.10 0.469 0.476 P 7.90 8.10 0.311 0.319 A0 5.20 5.40 0.205 0.213 B0 3.20 3.40 0.126 0.134 K0 1.20 1.40 0.047 0.055 t Pin 1 Location Inches Min 0.30 ± 0.05 0.012± 0.002 Millimetres Inches Embossed Carrier Tape & Reel Specifications — SC70-5 and SC70-6 Min Max Min Max E 1.65 1.85 0.064 0.073 F 3.45 3.55 0.135 0.139 P2 1.95 2.05 0.077 0.081 D 1.40 1.60 0.055 0.063 D1 1.00 1.25 0.039 0.049 P0 3.90 4.10 0.154 0.161 10P0 User Feeding Direction Pin 1 Location 40.0± 0.20 1.574±0.008 W 7.70 8.10 0.303 P 3.90 4.10 0.153 0.161 A0 2.14 2.34 0.084 0.092 B0 2.24 2.44 0.088 0.960 K0 1.12 1.32 0.044 0.052 0.27 max t 0.318 0.010 max Embossed Carrier Tape & Reel Specifications — SOT553 and SOT563 Millimetres Max Min Max E 1.65 1.85 0.064 0.073 F 3.45 3.55 0.135 0.139 P2 1.95 2.05 0.076 0.081 D 1.40 1.60 0.055 0.063 D1 0.45 0.55 0.017 0.021 P0 3.90 4.10 0.154 0.161 10P0 User Feeding Direction Pin 1 Location Inches Min 40.0± 0.20 1.574±0.008 W 7.70 8.10 0.303 P 3.90 4.10 0.153 0.318 0.161 A0 1.73 1.83 0.068 0.072 B0 1.73 1.83 0.068 0.072 K0 0.64 0.74 0.025 0.029 t 0.22 max 0.009 max © 2015 Littelfuse, Inc. Specifications are subject to change without notice. Revised: 01/26/15 TVS Diode Arrays (SPA® Diodes) Low Capacitance ESD Protection - SP3003 Series Embossed Carrier Tape & Reel Specification — µDFN-6L Millimetres Max Min Max E 1.65 1.85 0.064 0.073 F 3.45 3.55 0.135 0.139 P2 1.95 2.05 0.076 0.081 D 1.40 1.60 0.055 0.063 D1 0.45 0.55 0.017 0.021 P0 3.90 4.10 0.154 0.161 10P0 1.574±0.008 W 7.90 8.30 0.311 0.319 3.90 4.10 0.154 0.161 A0 1.15 1.25 0.045 0.049 B0 1.75 1.85 0.069 0.073 K0 0.65 0.75 0.026 0.03 0.22 max 0.009 max Ordering Information F** F** 40.0±0.20 P0 t Part Marking System Inches Min Product Series Number of Channels F=SP3003 series (varies) Assembly Site (varies) Part Numbering System SP3003-0x x T G TVS Diode Arrays (SPA® Diodes) G= Green T= Tape & Reel Series Package A = MSOP-10, 4000 quantity J = SC70-5 or SC70-6, 3000 quantity X = SOT553 or SOT563, 5000 quantity -02 = 2 channel (SC70-5, SOT553, µDFN-6L packages) U= µDFN-6L, 3000 quantity -04 = 4 channel (SC70-6, SOT563, MSOP-10 packages) -08 = 8 channel (MSOP-10 packages) Number of Channels © 2015 Littelfuse, Inc. Specifications are subject to change without notice. Revised: 01/26/15 Part Number Package Marking Min. Order Qty. SP3003-02JTG SC70-5 F*2 3000 SP3003-02UTG µDFN-6L FH2 3000 SP3003-02XTG SOT553 F*2 3000 SP3003-04ATG MSOP-10 F*4 4000 SP3003-04JTG SC70-6 F*4 3000 SP3003-04XTG SOT563 F*4 3000 SP3003-08ATG MSOP-10 F*8 4000