TVS Diode Arrays (SPA® Diodes) Low Capacitance ESD Protection - SP3014 Series SP3014 Series 1.0pF,15kV Diode Array RoHS Pb GREEN The SP3014 series integrates 2 channels of low capacitance steering diodes and an additional zener diode to provide protection for electronic equipment that may experience destructive electrostatic discharges (ESD). The SP3014 can safely absorb repetitive ESD strikes above the maximum level specified in the IEC61000-4-2 international standard (±8kV contact discharge) without performance degradation. The low loading capacitance makes it ideal for protecting high-speed signal lines such as USB2.0 and 1Gb Ethernet with an extremely low dynamic resistance to protect the most sensitive, state of the art chipsets against ESD transients. Pinout Features • ESD, IEC61000-4-2, ±15kV contact, ±25kV air • Low leakage current of 1.0μA (MAX) at 5V • EFT, IEC61000-4-4, 80A (tP=5/50ns) mall form factor μDFN • S (JEDEC MO-229) package provides flow through routing to simplify PCB layout • Lightning, IEC61000-4-5, 8A (tP=8/20μs) • Low capacitance of 1.0pF (TYP) per I/O Functional Block Diagram • AEC-Q101 qualified Applications • LCD/PDP TVs • Ultrabooks/Notebooks • External Storages • Digital Cameras • DVD/Blu-ray Players • Portable Medical • Set Top Boxes • Automotive Electronics • Smartphones • Wearable Technology USB 2.0 Protection Application Example USB Port *Package is shown as transparent USB Controller VBUS Additional Information D+ D- SP1003 Datasheet Resources Samples IC SP3014 GND LifeSupportNote: Not Intended for Use in Life Support or Life Saving Applications The products shown herein are not designed for use in life sustaining or life saving applications unless otherwise expressly indicated. © 2016 Littelfuse, Inc. Specifications are subject to change without notice. Revised: 01/26/16 SP3012-04UTG-1 Description TVS Diode Arrays (SPA® Diodes) Low Capacitance ESD Protection - SP3014 Series Absolute Maximum Ratings Symbol Thermal Information —μDFN-6L Parameter Value Units Parameter Rating Units IPP Peak Current (tp=8/20μs) 8.0 A Thermal Resistance Junction to Ambient 124.21 °C/W TOP Operating Temperature -40 to 125 °C Thermal Resistance Junction to Case 190.54 °C/W TSTOR Storage Temperature -55 to 150 °C Power Dissipation 1 W CAUTION: Stresses above those listed in “Absolute Maximum Ratings” may cause permanent damage to the device. This is a stress only rating and operation of the device at these or any other conditions above those indicated in the operational sections of this specification is not implied. Electrical Characteristics (TOP=25ºC) Symbol Test Conditions Reverse Standoff Voltage Parameter VRWM IR ≤ 1µA 5.0 V Reverse Leakage Current ILEAK VR=5V, Any I/O to GND 1.0 µA Clamp Voltage1 VC Dynamic Resistance Min Typ IPP=1A, tp=8/20µs, Fwd 6.6 V 6.8 V Ω RDYN (VC2 - VC1) / (IPP2 - IPP1) 0.2 Dynamic Resistance2 RDYN TLP, tp=100ns, I/O to GND 0.25 VESD Units IPP=2A, tp=8/20µs, Fwd 1 ESD Withstand Voltage1 Max IEC61000-4-2 (Contact) ±15 IEC61000-4-2 (Air) ±25 Ω kV kV Diode Capacitance1 CI/O-GND Reverse Bias=0V, f=1 MHz 1.0 pF Diode Capacitance1 CI/O-I/O Reverse Bias=0V, f=1 MHz 0.5 pF Note: 1 Parameter is guaranteed by design and/or device characterization. 2. Transmission Line Pulse (TLP) with 100ns width and 200ps rise time. Insertion Loss (S21) I/O to GND Capacitance vs. Reverse Bias 1.5 Capacitance (pF) 1.2 0.9 0.6 0.3 0.0 Clamping Voltage vs. IPP 0 1 2 3 Bias Voltage (V) 4 5 Transmission Line Pulse (TLP) 22 12.0 20 18 16 8.0 TLP Current (A) Clamp Voltage (VC ) 10.0 6.0 4.0 12 10 8 6 2.0 0.0 14 4 2 1.0 2.0 3.0 4.0 5.0 6.0 Peak Pulse Current-I PP (A) 7.0 8.0 0 0 2 4 6 8 10 TLP Voltage (V) © 2016 Littelfuse, Inc. Specifications are subject to change without notice. Revised: 01/26/16 TVS Diode Arrays (SPA® Diodes) Low Capacitance ESD Protection - SP3014 Series Pulse Waveform 110% 100% 90% 70% SP3012-04UTG-1 Percent of IPP 80% 60% 50% 40% 30% 20% 10% 0% 0.0 5.0 10.0 15.0 Time (μs) 20.0 25.0 30.0 Soldering Parameters Pre Heat Pb – Free assembly - Temperature Min (Ts(min)) 150°C - Temperature Max (Ts(max)) 200°C - Time (min to max) (ts) 60 – 180 secs Average ramp up rate (Liquidus) Temp (TL) to peak 3°C/second max TS(max) to TL - Ramp-up Rate 3°C/second max Reflow - Temperature (TL) (Liquidus) 217°C - Temperature (tL) 60 – 150 seconds tP TP Temperature Reflow Condition TL TS(max) tL Ramp-do Ramp-down Preheat TS(min) 25 tS time to peak temperature Time Peak Temperature (TP) 260+0/-5 °C Time within 5°C of actual peak Temperature (tp) 20 – 40 seconds Ramp-down Rate 6°C/second max Part Number Package Marking Time 25°C to peak Temperature (TP) 8 minutes Max. SP3014-02UTG µDFN-6L V Do not exceed 260°C Product Characteristics Critical Zone TL to TP Ramp-up Ordering Information Min. Order Qty. H2 3000 Part Numbering System SP 3014 – xx x T G Lead Plating Pre-Plated Frame (µDFN) Lead Material Copper Alloy Lead Coplanarity 0.0004 inches (0.102mm) Substrate material Silicon Series Body Material Molded Epoxy Number of Channels Flammability UL 94 V-0 TVS Diode Arrays (SPA® Diodes) G= Green T= Tape & Reel Package U= µDFN-6L 02 = 2 channel Notes : 1. All dimensions are in millimeters 2. Dimensions include solder plating. 3. Dimensions are exclusive of mold flash & metal burr. 4. Blo is facing up for mold and facing down for trim/form, i.e. reverse trim/form. 5. Package surface matte finish VDI 11-13. © 2016 Littelfuse, Inc. Specifications are subject to change without notice. Revised: 01/26/16 Part Marking System V* * Number of Product Series Channels V = SP3014 Assembly Site 2 = 2 channel TVS Diode Arrays (SPA® Diodes) Low Capacitance ESD Protection - SP3014 Series Package Dimensions —µDFN-6L Recommended Solder Pad Layout JEDEC MO-229 Pins 6 Millimeters 0.11 0.42 µDFN-6L 0.48 0.05 0.35 0.5 0.4 0.25 0.55 Inches Min Max Min Max A 0.45 0.55 0.018 0.022 A1 0.00 0.05 0.000 0.002 0.55 0.62 0.12 0.4 Package 0.125 REF A3 0.005 REF b 0.35 0.45 0.014 0.018 b1 0.15 0.25 0.006 0.010 D 1.55 1.65 0.062 0.065 d 0.10 0.20 0.004 0.008 E 0.95 1.05 0.038 0.042 0.50 REF e L 0.43 0.33 0.020 REF 0.013 0.017 Embossed Carrier Tape & Reel Specification — µDFN-6L Millimetres Min Max Min Max E 1.65 1.85 0.064 0.073 F 3.45 3.55 0.135 0.139 P2 1.95 2.05 0.076 0.081 D 1.40 1.60 0.055 0.063 D1 0.45 0.55 0.017 0.021 P0 3.90 4.10 0.154 0.161 10P0 Pin 1 Location User Feeding Direction Inches 40.0+/-0.20 1.574+/-0.008 W 7.90 8.30 0.311 0.319 P0 3.90 4.10 0.154 0.161 A0 1.15 1.25 0.045 0.049 B0 1.75 1.85 0.069 0.073 K0 0.65 0.75 0.026 0.03 t 0.22 max 0.009 max © 2016 Littelfuse, Inc. Specifications are subject to change without notice. Revised: 01/26/16