TVS Diode Arrays (SPA® Diodes) Low Capacitance ESD Protection - SP5001 Series SP5001 Series 4 Channel Common Mode Filter with ESD Protection RoHS Pb GREEN Description The SP5001 Series can protect and filter two differential line pairs in a small RoHS-compliant TDFN-10 package, with cost and space savings over discrete solutions. Pinout Features • Large differential bandwidth > 2.5 GHz In 1+ 1 10 Out 1+ In 1- 2 9 Out 1- G ND 3 8 G ND In 2+ 4 7 Out 2+ In 2- 6 Out 2- 5 • High Common Mode Stop Band Attenuation: > 25 dB at 700 MHz > 30 dB at 800 MHz • ±15kV ESD protection per channel (IEC 610004-2 Level 4, contact discharge) Note :This drawing is not to scale. Functional Block Diagram External Pin10 Pin2 Pin9 Pin4 Pin7 Pin5 Pin6 (Connector) © 2014 Littelfuse, Inc. Specifications are subject to change without notice. Revised: 07/08/14 • RoHS-compliant, Leadfree packaging • AEC-Q101 qualified Applications Pin1 Pin3 • TDFN-10 2.50mm × 2.00mm × 0.75mm package with 0.50mm lead pitch Pin8 • HDMI/DVI Display in Mobile Phones Internal (ASIC) • MIPI D-PHY (CSI-2, DSI, etc) in Mobile Phones and Digital Still Cameras SP5001 The SP5001 Series is a highly integrated Common Mode Filter (CMF) providing both ESD protection and EMI common mode noise filtering for systems using high speed differential serial interfaces, such as MIPI D-PHY or HDMI. TVS Diode Arrays (SPA® Diodes) Low Capacitance ESD Protection - SP5001 Series Absolute Maximum Ratings Symbol IDC Thermal Information Parameter DC Current Per Line Value Units 100 mA Storage Temperature Range 0.5 Rating Units -55 to 150 °C W Maximum Junction Temperature 150 °C Maximum Lead Temperature (Soldering 20-40s) 260 °C PDC DC Package Power Rating TOP Operating Temperature -40 to 125 °C TSTOR Storage Temperature -55 to 150 °C Parameter CAUTION: Stresses above those listed in “Absolute Maximum Ratings” may cause permanent damage to the device. This is a stress only rating and operation of the device at these or any other conditions above those indicated in the operational sections of this specification is not implied. Electrical Characteristics (TOP=25ºC) Parameter Symbol Test Conditions RCH Pins 1−10, 2−9, 4−7 and 5−6 8.0 Total Channel Capacitance CTOTAL VI/O = 1.65VDC Reverse Bias; f=1MHz, 30mVAC 0.8 Reverse Standoff Voltage VRWM Channel Resistance Min Typ Max Units Ω 1.3 pF 5.0 V Breakdown Voltage VBR IT=1mA 6.0 8.0 10.0 V Forward Voltage at IF VF IF=1mA 0.4 0.7 1.5 V Reverse Leakage Current ILEAK VI/O =3.3V 0.01 0.10 µA Positive (tp=8/20µs) 1.3 Dynamic Resistance2 3 RDYN Negative (tp=8/20µs) 0.7 TLP, tp=100ns, I/O to GND 0.36 Ω IEC61000-4-2 (Contact Discharge) ±15 kV IEC61000-4-2 (Air Discharge) ±30 kV ESD Withstand Voltage1 2 VESD Differential Mode Cutoff Frequency2 F3dB ZSOURCE=50 Ω, ZLOAD50 Ω 2.5 GHz Fα f=800MHz 30 dB Common Mode Stop Band Attenuation2 Notes: 1 ESD zapping at I/O pins (1,2,4,5) with respect to GND. 2 Guaranteed by design. 3 Transmission Line Pulse (TLP) with 100ns width and 200ps rise time. © 2014 Littelfuse, Inc. Specifications are subject to change without notice. Revised: 07/08/14 TVS Diode Arrays (SPA® Diodes) Low Capacitance ESD Protection - SP5001 Series Differential Mode Attenuation SDD21 vs. Frequency (Zdiff = 100Ω) Common Mode Attenuation SCC21 vs. Frequency (Zcomm= 50Ω) 0 0 -1 -5 -2 Inseron Loss(dB) Insertion Loss(dB) -4 -5 -6 -7 -20 -25 -35 -9 -10 -40 1 10 100 Frequency (MHz) 1 1000 Differential Return Loss SDD11 vs. Frequency (Zdiff = 100Ω) 10 100 Frequency (MHz) 1000 Differential Return Loss SDD22 vs. Frequency (Zdiff = 100Ω) 0 0 -5 -5 -10 Inseron Loss(dB) -10 -15 -20 -25 -15 -20 -25 -30 -30 -35 -35 -40 -40 1 10 100 Frequency (MHz) 1 1000 Transmission Line Pulsing (TLP) Plot 22 20 18 16 TLP Current (A) -15 -30 -8 Inseron Loss(dB) SP5001 -10 -3 14 12 10 8 6 4 2 0 0 2 4 6 8 10 TLP Voltage (V) © 2014 Littelfuse, Inc. Specifications are subject to change without notice. Revised: 07/08/14 12 14 16 10 100 Frequency (MHz) 1000 TVS Diode Arrays (SPA® Diodes) Low Capacitance ESD Protection - SP5001 Series Product Characteristics Soldering Parameters Lead Plating Pre-Plated Frame Lead Material Copper Alloy Lead Coplanarity 0.0004 inches (0.102mm) Substrate material Silicon Body Material Molded Epoxy Flammability UL 94 V-0 Reflow Condition Notes : Pre Heat tP Temperature TP Critical Zone TL to TP Ramp-up TL tL TS(max) 200°C - Time (min to max) (ts) 60 – 180 secs TS(max) to TL - Ramp-up Rate 3°C/second max 3. Dimensions are exclusive of mold flash & metal burr. 5. Package surface matte finish VDI 11-13. 150°C 3°C/second max Reflow 4. Blo is facing up for mold and facing down for trim/form, i.e. reverse trim/form. - Temperature Min (Ts(min)) - Temperature Max (Ts(max)) Average ramp up rate (Liquidus) Temp (TL) to peak 1. All dimensions are in millimeters 2. Dimensions include solder plating. Pb – Free assembly - Temperature (TL) (Liquidus) - Temperature (tL) 217°C 60 – 150 seconds Peak Temperature (TP) 260+0/-5 °C Time within 5°C of actual peak Temperature (tp) 20 – 40 seconds Ramp-down Rate 6°C/second max Time 25°C to peak Temperature (TP) 8 minutes Max. Do not exceed 260°C Ramp-do Ramp-down Preheat TS(min) 25 tS time to peak temperature Time Part Numbering System Part Marking System 32 *** SP 5001 – 04 T T G TVS Diode Arrays (SPA® Diodes ) G= Green Product Series 32 = SP5001 T= Tape & Reel Series Number of Channels 04 = 4 Channel TDFN-10 Package TDFN-10 (2.5x2.0mm) Date Code (Year / Week) Ordering Information Part Number Package Size Marking Min. Order Qty. SP5001-04TTG TDFN-10 2.5x2.0mm 32**** 3000 © 2014 Littelfuse, Inc. Specifications are subject to change without notice. Revised: 07/08/14 TVS Diode Arrays (SPA® Diodes) Low Capacitance ESD Protection - SP5001 Series Package Dimensions —TDFN-10 TDFN-10 A B L 2X 0.10 C L JEDEC MO-229 L1 Millimeters DETAIL A ALTERNATE TERMINAL CONSTRUCTIONS 2X Min Max Min Max A 0.70 0.80 0.028 0.031 A1 0.00 0.05 0.000 0.002 E PIN 1 MARKING 0.10 C TOP VIEW A3 MOLD CMPD EXPOSED Cu A3 b 0.05 C DETAIL B A3 A1 DETAIL B A 0.05 C A1 ALTERNATE CONSTRUCTIONS C SIDE VIEW 1 8X DETAIL A 0.30 0.15 0.25 0.008 REF 0.006 0.010 D 2.50 BSC 0.098 BSC E 2.00 BSC 0.079 BSC e 0.50 BSC 0.020 BSC L 0.70 0.90 0.028 0.035 L1 0.05 0.15 0.002 0.006 2.30 8X L 0.10 MIN 0.2 REF PACK AGE OUTLINE 8X 1.07 5 Inches 1 10 e 6 0.45 9X b 0.10 M C A B 0.05 M C 0.50 PITCH Recommended Soldering Footprint BOTTOM VIEW Tape & Reel Specification –TDFN-10 P0 T Top Cover Tape 5° Max K0 P2 A0 W 扑1.50 +0.10 Device Orientation in Tape Symbol F E 1.75+/- 0.10 F 3.5 +/- 0.05 P 4.0 +/- 0.10 B0 P © 2014 Littelfuse, Inc. Specifications are subject to change without notice. Revised: 07/08/14 Dimensions E ｖ1.00 ±0.05 Pin1 Location Millimetres P0 4.0 +/- 0.10 P2 2.0 +/- 0.05 W 8.00 +0.30/- 0.10 A0 2.19 +/- 0.05 B0 2.77 +/- 0.05 K0 1.05 +/- 0.05 T 0.25+/- 0.02 SP5001 D