SSF20N60H

SSF20N60H
600V N-Channel MOSFET
Main Product Characteristics
VDSS
600V
RDS(on)
0.2ohm(typ.)
ID
20A
TO247
High dv/dt and avalanche capabilities

100% avalanche tested

Low input capacitance and gate charge

Low gate input resistance

Lead free product
Schematic Diagram
Assignment
Features and Benefits

Marking and Pin
Description
The SSF20N60H series MOSFET is a new technology, which combines an innovative super junction
technology and advance process. This new technology achieves low RDS (ON), energy saving, high
reliability and uniformity, superior power density and space saving.
Absolute Max Rating
Symbol
Parameter
Max.
Units
ID @ TC = 25°C
Continuous Drain Current, VGS @ 10V①
20
ID @ TC = 100°C
Continuous Drain Current, VGS @ 10V①
13
IDM
Pulsed Drain Current②
80
Power Dissipation③
208
W
Linear Derating Factor
1.66
W/°C
VDS
Drain-Source Voltage
600
V
VGS
Gate-to-Source Voltage
± 30
V
EAS
Single Pulse Avalanche Energy @ L=32mH
400
mJ
IAS
Avalanche Current @ L=32mH
5
A
-55 to + 150
°C
PD @TC = 25°C
TJ
TSTG
www.goodark.com
Operating Junction and Storage Temperature Range
Page 1 of 7
A
Rev.1.3
SSF20N60H
600V N-Channel MOSFET
Thermal Resistance
Symbol
Characteristics
RθJC
RθJA
Typ.
Max.
Units
Junction-to-case③
—
0.6
℃/W
Junction-to-ambient (t ≤ 10s) ④
—
62
℃/W
Junction-to-Ambient (PCB mounted, steady-state) ④
—
40
℃/W
Electrical Characteristics @TA=25℃
Symbol
Parameter
V(BR)DSS
Drain-to-Source breakdown voltage
RDS(on)
Static Drain-to-Source on-resistance
VGS(th)
Gate threshold voltage
IDSS
Drain-to-Source leakage current
IGSS
Gate-to-Source forward leakage
Qg
unless otherwise specified
Min.
Typ.
Max.
Units
V
Conditions
600
—
—
—
0.2
0.3
—
0.55
—
2
—
4
—
2.4
—
—
—
1
—
—
50
—
—
100
-100
—
—
Total gate charge
—
90
—
Qgs
Gate-to-Source charge
—
12
—
Qgd
Gate-to-Drain("Miller") charge
—
34
—
VGS = 10V
td(on)
Turn-on delay time
—
12
—
VGS=10V, VDS=380V,
tr
Rise time
—
6
—
td(off)
Turn-Off delay time
—
65
—
tf
Fall time
—
6
—
ID=10A
Ciss
Input capacitance
—
2334
—
VGS = 0V
Coss
Output capacitance
—
856
—
Crss
Reverse transfer capacitance
—
3
—
Ω
V
μA
nA
VGS = 0V, ID = 250μA
VGS=10V,ID = 13A
TJ = 125°C
VDS = VGS, ID = 250μA
TJ = 125°C
VDS =600V,VGS = 0V
TJ = 125°C
VGS =30V
VGS = -30V
ID = 20A,
nC
ns
pF
VDS=480V,
RL=38Ω,
RGEN=4.7Ω
VDS = 25V
ƒ = 1MHz
Source-Drain Ratings and Characteristics
Symbol
IS
ISM
Parameter
Continuous Source Current
(Body Diode)
Pulsed Source Current
(Body Diode)
Min.
Typ.
Max.
Units
—
—
20
A
—
—
80
A
Conditions
MOSFET symbol
showing the
integral reverse
p-n junction diode.
VSD
Diode Forward Voltage
—
—
1.2
V
IS=20A, VGS=0V
trr
Reverse Recovery Time
—
480
—
ns
TJ = 25°C, IF =20A, di/dt =
Qrr
Reverse Recovery Charge
—
10
—
nC
100A/μs
www.goodark.com
Page 2 of 7
Rev.1.3
SSF20N60H
600V N-Channel MOSFET
Test Circuits and Waveforms
Switch Waveforms:
Notes:
①The maximum current rating is limited by bond-wires.
②Repetitive rating; pulse width limited by max. junction temperature.
③The power dissipation PD is based on max. junction temperature, using junction-to-case thermal
resistance.
④The value of RθJA is measured with the device mounted on 1in 2 FR-4 board with 2oz. Copper, in a
still air environment with TA =25°C
⑤These curves are based on the junction-to-case thermal impedance which is measured with the
device mounted to a large heatsink, assuming a maximum junction temperature of TJ(MAX)=150°C.
⑥ The maximum current rating is limited by bond-wires.
www.goodark.com
Page 3 of 7
Rev.1.3
SSF20N60H
600V N-Channel MOSFET
Typical Electrical and Thermal Characteristics
Figure 2. Typ. Gate to source cut-off voltage
Figure 1: Power dissipation
Figure 3. Typ. gate charge
www.goodark.com
Figure 4: Typ. Capacitances
Page 4 of 7
Rev.1.3
SSF20N60H
600V N-Channel MOSFET
Typical Electrical and Thermal Characteristics
Figure 5. Drain-source breakdown voltage
www.goodark.com
Figure 6. Drain-source on-state resistance
Page 5 of 7
Rev.1.3
SSF20N60H
600V N-Channel MOSFET
Mechanical Data
TO247 PACKAGE OUTLINE DIMENSION
Dim.
A
B
C
D
E
F
G
H
J
K
L
M
N
www.goodark.com
Millimeter
Min.
Max.
19.81
20.81
20.8
21.46
15.57
16.26
3.55
3.65
4.32
5.49
5.4
6.2
1.65
2.13
―
4.5
1
1.4
10.8
11
4.7
5.3
0.4
0.8
1.5
2.49
Inches
Min.
Max.
0.78
0.819
0.819
0.845
0.61
0.64
0.14
0.144
0.17
0.216
0.212
0.244
0.065
0.084
―
0.177
0.04
0.055
0.426
0.433
0.185
0.209
0.016
0.031
0.087
0.102
Page 6 of 7
Rev.1.3
SSF20N60H
600V N-Channel MOSFET
Ordering and Marking Information
Device Marking: SSF20N60H
Package (Available)
TO247
Operating Temperature Range
C : -55 to 150 ºC
Devices per Unit
Package
Type
Units/
Tube
TO247
Tubes/Inner
Box
30
8
Reliability Test Program
Test Item
Conditions
High
Temperature
Reverse
Bias(HTRB)
High
Temperature
Gate
Bias(HTGB)
www.goodark.com
Units/Inner Inner
Box
Boxes/Carton
Box
240
5
Duration
Sample Size
Tj=125℃ to 175℃ @
80% of Max
VDSS/VCES/VR
168 hours
500 hours
1000 hours
3 lots x 77 devices
Tj=150℃ or 175℃ @
100% of Max VGSS
168 hours
500 hours
1000 hours
3 lots x 77 devices
Page 7 of 7
Units/Carton
Box
1200
Rev.1.3