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TSL2771
Light-to-Digital Converter with
Proximity Sensing
General Description
The TSL2771 family of devices provides both ambient light
sensing (ALS) and proximity detection (when coupled with an
external IR LED). The ALS approximates human eye response to
light intensity under a variety of lighting conditions and
through a variety of attenuation materials. The proximity
detection feature allows a large dynamic range of operation for
use in short distance detection behind dark glass such as in a
cell phone or for longer distance measurements for
applications such as presence detection for monitors or
laptops. The programmable proximity detection enables
continuous measurements across the entire range. In addition,
an internal state machine provides the ability to put the device
into a low power mode in between ALS and proximity
measurements providing very low average power
consumption.
While useful for general purpose light sensing, the device is
particularly useful for display management with the purpose of
extending battery life and providing optimum viewing in
diverse lighting conditions. Display panel and keyboard
backlighting can account for up to 30 to 40 percent of total
platform power. The ALS features are ideal for use in tablets,
notebook PCs, LCD monitors, flat-panel televisions, and cell
phones.
The proximity function is targeted specifically towards cell
phone, LCD monitor, laptop, and flat-panel television
applications. In cell phones, the proximity detection can detect
when the user positions the phone close to their ear. The device
is fast enough to provide proximity information at a high
repetition rate needed when answering a phone call. It can also
detect both close and far distances so the application can
implement more complex algorithms to provide a more robust
interface. In laptop or monitor applications, the product is
sensitive enough to determine whether a user is in front of the
laptop using the keyboard or away from the desk. This provides
both improved green power saving capability and the added
security to lock the computer when the user is not present.
Ordering Information and Content Guide appear at end of
datasheet.
ams Datasheet
[v1-00] 2016-Mar-22
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TSL2771 − General Description
Key Benefits & Features
The benefits and features of TSL2771, Light-to-Digital
Converter with Proximity Sensing are listed below:
Figure 1:
Added Value of Using TSL2771
Benefits
Features
• Enables Operation in IR Light Environments
• Patented Dual-Diode Architecture
• Enables Operation in 10k Lux Sunlight and Accurate
Sensing Behind Spectrally Distorting Materials
• 1M:1 Dynamic Range
• Allows Multiple Power-Level Selection Without
External Passives
• Programmable LED Drive Current
• Reduces Micro-Processor Interrupt Overhead
• Programmable Interrupt Function
• Reduces board Space Requirements while Simplifying
Designs
• Area Efficient 2mm x 2mm Dual Flat No-Lead
(FN) Package
• Ambient Light Sensing and Proximity Detection in a Single
Device
• Ambient Light Sensing (ALS)
• Approximates Human Eye Response
• Programmable Analog Gain
• Programmable Integration Time
• Programmable Interrupt Function with Upper and
Lower Threshold
• Resolution Up to 16 Bits
• Very High Sensitivity — Operates Well Behind
Darkened Glass
• Up to 1,000,000:1 Dynamic Range
• Proximity Detection
• Programmable Number of IR Pulses
• Programmable Current Sink for the IR LED — No
Limiting Resistor Needed
• Programmable Interrupt Function with Upper and
Lower Threshold
• Covers a 2000:1 Dynamic Range
• Programmable Wait Timer
• Programmable from 2.72 ms to > 8 Seconds
• Wait State — 65 mA Typical Current
• I²C Interface Compatible
• Up to 400 kHz (I²C Fast Mode)
• Dedicated Interrupt Pin
• Sleep Mode – 2.5 mA Typical Current
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ams Datasheet
[v1-00] 2016-Mar-22
TSL2771 − General Description
Applications
TSL2771, Light-to-Digital Converter with Proximity Sensing is
ideal for:
• Cell Phone Backlight Dimming
• Cell Phone Touch Screen Disable
• Notebook/Monitor Security
• Automatic Speakerphone Enable
• Automatic Menu Popup
Functional Block Diagram
The functional blocks of this device are shown below:
Figure 2:
TSL2771 Block Diagram
Interrupt
IR LED Constant
Current Sink
LDR
Prox Control
GND
Prox
Integration
Prox
ADC
INT
Upper Limit
Prox
Data
Lower Limit
SCL
Wait Control
Upper Limit
CH0
ADC
CH0
Data
ALS Control
CH0
CH1
ADC
Lower Limit
I2C Interface
VDD
SDA
CH1
Data
CH1
ams Datasheet
[v1-00] 2016-Mar-22
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TSL2771 − Detailed Description
Detailed Description
The TSL2771 light-to-digital device provides on-chip
photodiodes, integrating amplifiers, ADCs, accumulators,
clocks, buffers, comparators, a state machine, and an I²C
interface. Each device combines a Channel 0 photodiode (CH0),
which is responsive to both visible and infrared light, and a
channel 1 photodiode (CH1), which is responsive primarily to
infrared light. Two integrating ADCs simultaneously convert the
amplified photodiode currents into a digital value providing up
to 16 bits of resolution. Upon completion of the conversion
cycle, the conversion result is transferred to the data registers.
This digital output can be read by a microprocessor through
which the illuminance (ambient light level) in Lux is derived
using an empirical formula to approximate the human eye
response.
Communication to the device is accomplished through a fast
(up to 400 kHz), two-wire I²C serial bus for easy connection to
a microcontroller or embedded controller. The digital output of
the device is inherently more immune to noise when compared
to an analog interface.
The device provides a separate pin for level-style interrupts.
When interrupts are enabled and a pre-set value is exceeded,
the interrupt pin is asserted and remains asserted until cleared
by the controlling firmware. The interrupt feature simplifies and
improves system efficiency by eliminating the need to poll a
sensor for a light intensity or proximity value. An interrupt is
generated when the value of an ALS or proximity conversion
exceeds either an upper or lower threshold. In addition, a
programmable interrupt persistence feature allows the user to
determine how many consecutive exceeded thresholds are
necessary to trigger an interrupt. Interrupt thresholds and
persistence settings are configured independently for both ALS
and proximity.
Proximity detection requires only a single external IR LED. An
internal LED driver can be configured to provide a constant
current sink of 12.5 mA, 25 mA, 50 mA, or 100 mA of current. No
external current limiting resistor is required. The number of
proximity LED pulses can be programmed from 1 to 255 pulses.
Each pulse has a 16-μs period. This LED current, coupled with
the programmable number of pulses, provides a 2000:1
contiguous dynamic range.
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ams Datasheet
[v1-00] 2016-Mar-22
TSL2771 − Pin Assignments
The TSL2771 pin assignments are described below:
Pin Assignments
Figure 3:
Package FN Dual Flat No-Lead (Top View)
VDD 1
6 SDA
SCL 2
5 INT
GND 3
4 LDR
Figure 4:
Terminal Functions
Terminal
Type
Description
Name
No
VDD
1
SCL
2
GND
3
LDR
4
O
LED driver for proximity emitter — up to 100 mA, open drain.
INT
5
O
Interrupt — open drain (active low).
SDA
6
I/O
I²C serial data I/O terminal — serial data I/O for I²C
ams Datasheet
[v1-00] 2016-Mar-22
Supply voltage.
I
I²C serial clock input terminal — clock signal for I²C serial data.
Power supply ground. All voltages are referenced to GND.
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TSL2771 − Absolute Maximum Ratings
Absolute Maximum Ratings
Stresses beyond those listed under Absolute Maximum Ratings
may cause permanent damage to the device. These are stress
ratings only, and functional operation of the device at these or
any other conditions beyond those indicated under
Recommended Operating Conditions is not implied. Exposure
to absolute-maximum-rated conditions for extended periods
may affect device reliability.
Figure 5:
Absolute Maximum Ratings Over Operating Free-Air Temperature Range (unless otherwise noted)
Symbol
VDD(1)
Parameter
Min
Max
Units
3.8
V
-0.5
3.8
V
Supply voltage
VO
Digital output voltage range
IO
Digital output current
-1
20
mA
Storage temperature range
-40
85
ºC
Tstg
ESDHBM
ESD tolerance, human body model
±2000
V
Note(s):
1. All voltages are with respect to GND.
Figure 6:
Recommended Operating Conditions
Symbol
Parameter
Min
Nom
Max
Unit
VDD
Supply voltage
2.6
3
3.6
V
TA
Operating free-air
temperature
-30
70
ºC
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ams Datasheet
[v1-00] 2016-Mar-22
TSL2771 − Absolute Maximum Ratings
Figure 7:
Operating Characteristics; VDD = 3 V, TA = 25ºC (unless otherwise noted)
Symbol
Parameter
IDD
Supply current
INT, SDA output low
voltage
VOL
ILEAK
Leakage current, SDA,
SCL, INT pins
ILEAK
Leakage current, LDR
pin
VIH
SCL, SDA input high
voltage
VIL
ams Datasheet
[v1-00] 2016-Mar-22
SCL, SDA input low
voltage
Test Conditions
Min
Typ
Max
Active — LDR pulse OFF
175
250
Wait mode
65
Sleep mode - no I²C activity
2.5
Unit
μA
4
3 mA sink current
0
0.4
6 mA sink current
0
0.6
−5
5
V
±10
TSL27711, TSL27715
0.7 VDD
TSL27713, TSL27717
1.25
μA
μA
V
TSL27711, TSL27715
0.3 VDD
TSL27713, TSL27717
0.54
V
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TSL2771 − Absolute Maximum Ratings
Figure 8:
ALS Characteristics; VDD = 3 V, TA = 25ºC, Gain = 16, AEN = 1 (unless otherwise noted) (1) (2) (3)
Parameter
Dark ADC count value
ADC integration time step
size
Test Conditions
Ee = 0, AGAIN = 120x,
ATIME = 0xDB (100 ms)
Channel
Min
Typ
Max
Unit
CH0
0
1
5
CH1
0
1
5
2.58
2.72
2.9
ms
1
256
steps
counts
ATIME = 0xFF
ADC Number of integration
steps
ADC counts per step
ATIME = 0xFF
0
1024
counts
ADC count value
ATIME = 0xC0
0
65535
counts
λp = 625 nm,
Ee
ADC count value
CH0
ATIME = 0xF6 (27 ms) (2)
CH1
λp = 850 nm,
CH0
ATIME = 0xF6 (27 ms) (3)
Irradiance responsivity
Gain scaling, relative to 1x
gain setting
6000
790
4000
CH1
λp = 625 nm, ATIME 0xF6 (27 ms) (2)
5000
6000
2800
10.8
15.8
20.8
41
56
68
%
λp = 850 nm, ATIME 0xF6 (27 ms)
(3)
CH0
29.1
CH1
4.6
λp = 850 nm,
CH0
22.8
ATIME = 0xF6 (27 ms) (3)
CH1
12.7
λp = 625 nm,
Re
5000
counts
Ee = 219.7 μW/cm2
ADC count value ratio:
CH1/CH0
4000
= 171.6 μW/cm2,
ATIME = 0xF6 (27 ms)
(2)
counts/
(μW/cm2)
8x
−10
10
16x
−10
10
120x
−10
10
%
Note(s):
1. Optical measurements are made using small-angle incident radiation from light-emitting diode optical sources. Visible 625 nm LEDs
and infrared 850 nm LEDs are used for final product testing for compatibility with high-volume production.
2. The 625 nm irradiance Ee is supplied by an AlInGaP light-emitting diode with the following typical characteristics: peak wavelength
λp = 625 nm and spectral halfwidth Δλ½ = 20 nm.
3. The 850 nm irradiance Ee is supplied by a GaAs light-emitting diode with the following typical characteristics: peak wavelength
λp = 850 nm and spectral halfwidth Δλ½ = 42 nm.
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[v1-00] 2016-Mar-22
TSL2771 − Absolute Maximum Ratings
Figure 9:
Proximity Characteristics; VDD = 3 V, TA = 25°C, PEN = 1 (unless otherwise noted)
Parameter
Test Conditions
IDD
Supply current
LDR pulse ON
ADC conversion time step size
PTIME = 0xFF
Condition
2.58
PTIME = 0xFF
IR LED pulse count
pulse period
PDRIVE=0
mA
1
256
steps
0
1023
counts
0
255
pulses
75
2.72
Unit
ms
Two or more pulses
ISINK sink current @
600 mV, LDR pin
Max
2.9
LED pulse width — LED ON time
LED drive current
Typ
3
ADC number of integration
steps
ADC counts per step
Min
16
μs
7.3
μs
100
PDRIVE=1
50
PDRIVE=2
25
PDRIVE=3
12.5
125
mA
Operating distance (1)
18
inches
Note(s):
1. Proximity Operating Distance is dependent upon emitter properties and the reflective properties of the proximity surface. The
nominal value shown uses an IR emitter with a peak wavelength of 850nm and a 20º half angle. The proximity surface used is a 90%
reflective (white surface) 16 × 20-inch Kodak Gray Card. 60 mw/SR, 100 mA, 64 pulses, open view (no glass). Note: Greater distances
are achievable with appropriate system considerations.
Figure 10:
Wait Characteristics; VDD = 3 V, TA = 25°C, WEN = 1 (unless otherwise noted)
Parameter
Wait step size
Wait number of integration steps
ams Datasheet
[v1-00] 2016-Mar-22
Test
Conditions
WTIME = 0xFF
Channel
Min
Typ
Max
Unit
2.58
2.72
2.9
ms
256
steps
1
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TSL2771 − Absolute Maximum Ratings
Figure 11:
AC Electrical Characteristics; VDD = 3 V, TA = 25°C, (unless otherwise noted)
Symbol
Parameter (1)
f(SCL)
Clock frequency (I²C only)
0
t(BUF)
Bus free time between start and stop
condition
1.3
μs
t(HDSTA)
Hold time after (repeated) start
condition. After this period, the first
clock is generated.
0.6
μs
t(SUSTA)
Repeated start condition setup time
0.6
μs
t(SUSTO)
Stop condition setup time
0.6
μs
t(HDDAT)
Data hold time
0
μs
t(SUDAT)
Data setup time
100
ns
t(LOW)
SCL clock low period
1.3
μs
t(HIGH)
SCL clock high period
0.6
μs
tF
Clock/data fall time
300
ns
tR
Clock/data rise time
300
ns
Ci
Input pin capacitance
10
pF
Test Conditions
Min
Typ
Max
Unit
400
kHz
Note(s):
1. Specified by design and characterization; not production tested.
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ams Datasheet
[v1-00] 2016-Mar-22
TSL2771 − Absolute Maximum Ratings
Parameter Measurement Information
Figure 12:
Timing Diagrams
t(LOW)
t(R)
t(F)
VIH
SCL
VIL
t(HDSTA)
t(BUF)
t(HIGH)
t(HDDAT)
t(SUSTA)
t(SUSTO)
t(SUDAT)
VIH
SDA
VIL
P
Stop
Condition
S
S
Start
Condition
Start
P
Stop
t(LOWSEXT)
SCLACK
SCLACK
t(LOWMEXT)
t(LOWMEXT)
t(LOWMEXT)
SCL
SDA
ams Datasheet
[v1-00] 2016-Mar-22
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TSL2771 − Typical Operating Characteristics
Typical Operating
Characteristics
Figure 13:
Spectral Responsivity
1
Ch 0
Normalized Responsivity
0.8
0.6
0.4
Ch 1
0.2
0
300
400
500
600
700
800
900 1000 1100
λ − Wavelength − nm
Figure 14:
Typical LDR Current vs. Voltage
160
140
100 mA
LDR Current — mA
120
100
80
50 mA
60
40
25 mA
20
12.5 mA
0
0
0.5
1
1.5
2
2.5
3
LDR Voltage − V
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ams Datasheet
[v1-00] 2016-Mar-22
TSL2771 − Typical Operating Characteristics
Figure 15:
Normalized IDD vs.VDD and Temperature
VDD and TEMPERATURE
110%
108%
IDD Normalized @ 3 V, 25C
75C
106%
104%
50C
25C
102%
100%
0C
98%
96%
94%
92%
2.7
2.8
2.9
3
3.1
3.2
3.3
VDD — V
Figure 16:
Normalized Responsivity vs. Angular Displacement
1.0
Optical Axis
Normalized Responsivity
0.8
0.6
0.4
0.2
0
−90
ams Datasheet
[v1-00] 2016-Mar-22
-Q
+Q
−60
−30
0
30
60
Q − Angular Displacement − °
90
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TSL2771 − Principles Of Operation
Principles Of Operation
System State Machine
The device provides control of ALS, proximity detection, and
power management functionality through an internal state
machine (Figure 17). After a power-on-reset, the device is in the
sleep mode. As soon as the PON bit is set, the device will move
to the start state. It will then continue through the Prox, Wait,
and ALS states. If these states are enabled, the device will
execute each function. If the PON bit is set to 0, the state
machine will continue until all conversions are completed and
then go into a low power sleep mode.
Figure 17:
Simplified State Diagram
Sleep
PON = 1 (r 0:b0)
PON = 0 (r 0:b0)
Start
Prox
ALS
Wait
Note(s): In this document, the nomenclature uses the bit field
name in italics followed by the register number and bit number
to allow the user to easily identify the register and bit that
controls the function. For example, the power ON (PON) is in
register 0, bit 0. This is represented as PON (r0:b0).
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ams Datasheet
[v1-00] 2016-Mar-22
TSL2771 − Principles Of Operation
Photodiodes
Conventional silicon detectors respond strongly to infrared
light, which the human eye does not see. This can lead to
significant error when the infrared content of the ambient light
is high (such as with incandescent lighting) due to the
difference between the silicon detector response and the
brightness perceived by the human eye.
This problem is overcome through the use of two photodiodes.
The Channel 0 photodiode, referred to as the CH0 channel, is
sensitive to both visible and infrared light, while the Channel 1
photodiode, referred to as CH1, is sensitive primarily to infrared
light. Two integrating ADCs convert the photodiode currents to
digital outputs. The ADC digital outputs from the two channels
are used in a formula to obtain a value that approximates the
human eye response in units of lux.
ALS Operation
The ALS engine contains ALS gain control (AGAIN) and two
integrating analog-to-digital converters (ADC) for the Channel
0 and Channel 1 photodiodes. The ALS integration time (ATIME)
impacts both the resolution and the sensitivity of the ALS
reading. Integration of both channels occurs simultaneously
and upon completion of the conversion cycle, the results are
transferred to the data registers (C0DATA and C1DATA). This
data is also referred to as channel count. The transfers are
double-buffered to ensure data integrity.
Figure 18:
ALS Operation
ATIME(r 1)
2.72 ms to 696 ms
CH0
ALS
CH0
Data
C0DATAH(r 0x15), C0DATA(r 0x14)
ALS Control
CH0
CH1
ADC
CH1
Data
C1DATAH(r 0x17), C1DATA(r 0x16)
CH1
AGAIN(r 0x0F, b1:0)
1, 8, 16, 120 Gain
ams Datasheet
[v1-00] 2016-Mar-22
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The registers for programming the integration and wait times
are a 2’s compliment values. The actual time can be calculated
as follows:
ATIME = 256 - Integration Time / 2.72 ms
Inversely, the time can be calculated from the register value as
follows:
Integration Time = 2.72 ms × (256 - ATIME)
In order to reject 50/60-Hz ripple strongly present in fluorescent
lighting, the integration time needs to be programmed in
multiples of 10 / 8.3 ms or the half cycle time. Both frequencies
can be rejected with a programmed value of 50 ms
(ATIME = 0xED) or multiples of 50 ms (i.e. 100, 150, 200, 400,
600).
The registers for programming the AGAIN hold a two-bit value
representing a gain of 1×, 8×, 16×, or 120×. The gain, in terms
of amount of gain, will be represented by the value AGAINx, i.e.
AGAINx = 1, 8, 16, or 120.
Lux Equation
The lux calculation is a function of CH0 channel count (C0DATA),
CH1 channel count (C1DATA), ALS gain (AGAINx), and ALS
integration time in milliseconds (ATIME_ms). If an aperture,
glass/plastic, or a light pipe attenuates the light equally across
the spectrum (300 nm to 1100 nm), then a scaling factor referred
to as glass attenuation (GA) can be used to compensate for
attenuation. For a device in open air with no aperture or
glass/plastic above the device, GA = 1. If it is not spectrally flat,
then a custom lux equation with new coefficients should be
generated. (See ams application note).
Counts per Lux (CPL) needs to be calculated only when ATIME
or AGAIN is changed, otherwise it remains a constant. The first
segment of the equation (Lux1) covers fluorescent and
incandescent light. The second segment (Lux2) covers dimmed
incandescent light. The final lux is the maximum of Lux1, Lux2,
or 0.
CPL = (ATIME_ms × AGAINx) / (GA × 53)
Lux1 = (C0DATA - 2 × C1DATA) / CPL
Lux2 = (0.6 × C0DATA - C1DATA) / CPL
Lux = MAX(Lux1, Lux2, 0)
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ams Datasheet
[v1-00] 2016-Mar-22
TSL2771 − Principles Of Operation
Proximity Detection
Proximity sensing uses an external light source (generally an
infrared emitter) to emit light, which is then viewed by the
integrated light detector to measure the amount of reflected
light when an object is in the light path (Figure 19). The amount
of light detected from a reflected surface can then be used to
determine an object’s proximity to the sensor.
Figure 19:
Proximity Detection
Surface Reflectivity (SR)
Glass Attenuation (GA)
Distance (D)
IR LED
Prox
Sensor
Background Energy (BGE)
Optical Crosstalk (OC)
The device has controls for the number of IR pulses (PPCOUNT),
the integration time (PTIME), the LED drive current (PDRIVE),
and the photodiode configuration (PDIODE) (Figure 20). The
photodiode configuration can be set to CH1 diode
(recommended), CH0 diode, or a combination of both diodes.
At the end of the integration cycle, the results are latched into
the proximity data (PDATA) register.
Figure 20:
Proximity Detection Operation
IR
LED
VDD
PDRIVE(r 0x0F, b7:6)
PTIME(r 2)
IR LED Constant
Current Sink
Prox Control
Prox
Integration
CH0
ams Datasheet
[v1-00] 2016-Mar-22
Prox
ADC
CH1
Prox
Data
PDATAH(r 0x019), PDATAL(r 0x018)
PPCOUNT(r 0x0E)
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TSL2771 − Principles Of Operation
The LED drive current is controlled by a regulated current sink
on the LDR pin. This feature eliminates the need to use a current
limiting resistor to control LED current. The LED drive current
can be configured for 12.5 mA, 25 mA, 50 mA, or 100 mA. For
higher LED drive requirements, an external P type transistor can
be used to control the LED current.
The number of LED pulses can be programmed to any value
between 1 and 255 pulses as needed. Increasing the number of
LED pulses at a given current will increase the sensor sensitivity.
Sensitivity grows by the square root of the number of pulses.
Each pulse has a 16-μs period.
Figure 21:
Proximity IR LED Waveform
Add IR +
Background
Subtract
Background
LED On
LED Off
16 ms
IR LED Pulses
The proximity integration time (PTIME) is the period of time that
the internal ADC converts the analog signal to a digital count.
It is recommend that this be set to a minimum of PTIME = 0xFF
or 2.72 ms.
The combination of LED power and number of pulses can be
used to control the distance at which the sensor can detect
proximity. Figure 22 shows an example of the distances covered
with settings such that each curve covers 2x the distance.
Counts up to 64 pulses provide a 16x range.
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ams Datasheet
[v1-00] 2016-Mar-22
TSL2771 − Principles Of Operation
Figure 22:
Proximity ADC Count vs. Relative Distance
1000
25 mA,
1 Pulse
100 mA,
64 Pulses
Proximity ADC Count
800
100 mA,
16 Pulses
600
400
100 mA,
4 Pulses
100 mA,
1 Pulse
200
0
1 2 4
8
16
Relative Distance
Interrupts
The interrupt feature simplifies and improves system efficiency
by eliminating the need to poll the sensor for light intensity or
proximity values outside of a user-defined range. While the
interrupt function is always enabled and it’s status is available
in the status register (0x13), the output of the interrupt state
can be enabled using the proximity interrupt enable (PIEN) or
ALS interrupt enable (AIEN) fields in the enable register (0x00).
Four 16-bit interrupt threshold registers allow the user to set
limits below and above a desired light level and proximity
range. An interrupt can be generated when the ALS CH0 data
(C0DATA) falls outside of the desired light level range, as
determined by the values in the ALS interrupt low threshold
registers (AILTx) and ALS interrupt high threshold registers
(AIHTx). Likewise, an out-of-range proximity interrupt can be
generated when the proximity data (PDATA) falls below the
proximity interrupt low threshold (PILTx) or exceeds the
proximity interrupt high threshold (PIHTx). It is important to
note that the low threshold value must be less than the high
threshold value for proper operation.
To further control when an interrupt occurs, the device provides
a persistence filter. The persistence filter allows the user to
specify the number of consecutive out-of-range ALS or
proximity occurrences before an interrupt is generated. The
persistence register (0x0C) allows the user to set the ALS
persistence (APERS) and the proximity persistence (PPERS)
values. See the persistence register for details on the
persistence filter values. Once the persistence filter generates
ams Datasheet
[v1-00] 2016-Mar-22
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TSL2771 − Principles Of Operation
an interrupt, it will continue until a special function interrupt
clear command is received (seeCommand Register).
Figure 23:
Programmable Interrupt
Prox
Integration
Prox
ADC
PIHTH(r 0x0B), PIHTL(r 0x0A)
PPERS(r 0x0C, b7:4)
Upper Limit
Prox Persistence
Prox
Data
Lower Limit
PILTH(r 09), PILTL(r 08)
AIHTH(r 07), AIHTL(r 06)
CH1
Upper Limit
CH0
ADC
APERS(r 0x0C, b3:0)
ALS Persistence
CH0
Data
Lower Limit
CH0
AILTH(r 05), AILTL(r 04)
Page 20
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ams Datasheet
[v1-00] 2016-Mar-22
TSL2771 − Principles Of Operation
State Diagram
Figure 24 shows a more detailed flow for the state machine. The
device starts in the sleep mode. The PON bit is written to enable
the device. A 2.72-ms delay will occur before entering the start
state. If the PEN bit is set, the state machine will step through
the proximity states of proximity accumulate and then
proximity ADC conversion. As soon as the conversion is
complete, the state machine will move to the following state.
If the WEN bit is set, the state machine will then cycle through
the wait state. If the WLONG bit is set, the wait cycles are
extended by 12× over normal operation. When the wait counter
terminates, the state machine will step to the ALS state.
The AEN should always be set, even in proximity-only operation.
In this case, a minimum of 1 integration time step should be
programmed. The ALS state machine will continue until it
reaches the terminal count at which point the data will be
latched in the ALS register and the interrupt set, if enabled.
Figure 24:
Expanded State Diagram
Up to 255 LED Pulses
Pulse Frequency: 62.5 kHz
Time: 16 ms − 4.2 ms
Maximum 4.2ms
Up to 256 steps
Step: 2.72 ms
Time: 2.72 ms − 696 ms
120 Hz Minimum − 8 ms
100 Hz Minimum − 10 ms
Sleep
2.72 ms
Prox
Delay
PON = 1
PON = 0
Start
Prox
Accum
ALS
PEN = 1
Prox
Check
ALS
Check
Prox
ADC
ALS
Delay
AEN = 1
Counts up to 256 steps
Step: 2.72 ms
Time: 2.72 mS − 696 ms
Recommended − 2.72 ms 1024 Counts
Wait
Check
Time: 2.72 ms
WEN = 1
Wait
WLONG = 0
Counts up to 256 steps
Step: 2.72 ms
Time: 2.72 ms − 696 ms
Minimum − 2.72 ms
ams Datasheet
[v1-00] 2016-Mar-22
WLONG = 1
Counts up to 256 steps
Step: 32.64 ms
Time: 32.64 ms − 8.35 s
Minimum − 32.64 ms
Page 21
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TSL2771 − Principles Of Operation
Power Management
Power consumption can be controlled through the use of the
wait state timing because the wait state consumes only 65 μA
of power. Figure 25 shows an example of using the power
management feature to achieve an average power
consumption of 155 μA current with four 100-mA pulses of
proximity detection and 50 ms of ALS detection.
Figure 25:
Power Consumption Calculations
4 IR LED Pulses
Prox Accum
64 ms (32 ms LED On Time)
Prox ADC
2.72 ms
Example: 100 ms Cycle TIme
WAIT
ALS
47 ms
50 ms
State
Duration (ms)
Current (mA)
Prox Accum (LED On)
Prox ADC
Wait
ALS
0.064 (0.032)
2.7
47
50
100.0
0.175
0.065
0.175
Avg = ((0.032 100) + (2.72 0.175) + (47 0.065) + (50 0.175)) / 100 = 155 mA
Page 22
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ams Datasheet
[v1-00] 2016-Mar-22
TSL2771 − Principles Of Operation
I²C Protocol
Interface and control are accomplished through an I²C serial
compatible interface (standard or fast mode) to a set of registers
that provide access to device control functions and output data.
The devices support the 7-bit I²C addressing protocol.
The I²C standard provides for three types of bus transaction:
read, write, and a combined protocol (Figure 26). During a write
operation, the first byte written is a command byte followed by
data. In a combined protocol, the first byte written is the
command byte followed by reading a series of bytes. If a read
command is issued, the register address from the previous
command will be used for data access. Likewise, if the MSB of
the command is not set, the device will write a series of bytes
at the address stored in the last valid command with a register
address. The command byte contains either control information
or a 5-bit register address. The control commands can also be
used to clear interrupts.
The I²C bus protocol was developed by Philips (now NXP). For
a complete description of the I²C protocol, please review the
NXP I²C design specification at
http://www.i2c-bus.org/references/.
A
N
P
R
S
S
W
...
ams Datasheet
[v1-00] 2016-Mar-22
Acknowledge (0)
Not Acknowledged (1)
Stop Condition
Read (1)
Start Condition
Repeated Start Condition
Write (0)
Continuation of protocol
Master-to-Slave
Slave-to-Master
Page 23
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TSL2771 − Principles Of Operation
Figure 26:
I²C Protocols
1
7
1
1
S
Slave Address
W
A
8
Command Code
1
8
1
A
Data Byte
A
8
1
1
...
P
I2C Write Protocol
1
S
7
Slave Address
1
R
1
A
8
1
Data
A
Data
A
1
...
P
I2C Read Protocol
1
7
1
1
8
1
1
7
1
1
S
Slave Address
W
A
Command Code
A
S
Slave Address
R
A
8
Data
1
8
1
A
Data
A
1
...
P
I2C Read Protocol — Combined Format
Page 24
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ams Datasheet
[v1-00] 2016-Mar-22
TSL2771 − Register Set
Register Set
The TSL2771 is controlled and monitored by data registers and
a command register accessed through the serial interface.
These registers provide for a variety of control functions and
can be read to determine results of the ADC conversions. The
register set is summarized in Figure 27.
Figure 27:
Register Address
Address
Register Name
R/W
−−
COMMAND
W
0x00
ENABLE
0x01
Register Function
Reset Value
Specifies register address
0x00
R/W
Enables states and interrupts
0x00
ATIME
R/W
ALS ADC time
0xFF
0x02
PTIME
R/W
Proximity ADC time
0xFF
0x03
WTIME
R/W
Wait time
0xFF
0x04
AILTL
R/W
ALS interrupt low threshold low byte
0x00
0x05
AILTH
R/W
ALS interrupt low threshold high byte
0x00
0x06
AIHTL
R/W
ALS interrupt high threshold low byte
0x00
0x07
AIHTH
R/W
ALS interrupt high threshold high byte
0x00
0x08
PILTL
R/W
Proximity interrupt low threshold low
byte
0x00
0x09
PILTH
R/W
Proximity interrupt low threshold high
byte
0x00
0x0A
PIHTL
R/W
Proximity interrupt high threshold low
byte
0x00
0x0B
PIHTH
R/W
Proximity interrupt high threshold
high byte
0x00
0x0C
PERS
R/W
Interrupt persistence filters
0x00
0x0D
CONFIG
R/W
Configuration
0x00
0x0E
PPCOUNT
R/W
Proximity pulse count
0x00
0x0F
CONTROL
R/W
Control register
0x00
0x12
ID
R
Device ID
0x13
STATUS
R
Device status
0x00
0x14
C0DATA
R
CH0 ADC low data register
0x00
0x15
C0DATAH
R
CH0 ADC high data register
0x00
0x16
C1DATA
R
CH1 ADC low data register
0x00
0x17
C1DATAH
R
CH1 ADC high data register
0x00
ams Datasheet
[v1-00] 2016-Mar-22
ID
Page 25
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TSL2771 − Register Set
Address
Register Name
R/W
Register Function
Reset Value
0x18
PDATA
R
Proximity ADC low data register
0x00
0x19
PDATAH
R
Proximity ADC high data register
0x00
The mechanics of accessing a specific register depends on the
specific protocol used. See the section on I²C Protocols on the
previous pages. In general, the COMMAND register is written
first to specify the specific control/status register for following
read/write operations.
Page 26
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ams Datasheet
[v1-00] 2016-Mar-22
TSL2771 − Register Set
Command Register
The command registers specifies the address of the target
register for future read and write operations.
Figure 28:
Command Register
7
6
COMMAND
5
4
3
2
TYPE
Field
Bits
COMMAND
7
TYPE
6:5
1
0
ADD
Description
Select Command Register. Must write as 1 when addressing COMMAND register.
Selects type of transaction to follow in subsequent data transfers:
FIELD VALUE
DESCRIPTION
00
Repeated byte protocol transaction
01
Auto-increment protocol transaction
10
Reserved — Do not use
11
Special function — See description below
Transaction type 00 will repeatedly read the same register with each data access.
Transaction type 01 will provide an auto-increment function to read successive
register bytes.
ADD
4:0
Address register/special function field. Depending on the transaction type, see above,
this field either specifies a special function command or selects the specific
control-status-register for the following write and read transactions. The field values
listed below apply only to special function commands:
FIELD VALUE
DESCRIPTION
00000
Normal - no action
00101
Proximity interrupt clear
00110
ALS interrupt clear
00111
Proximity and ALS interrupt clear
other
Reserved — Do not write
ALS/Proximity Interrupt Clear clears any pending ALS/Proximity interrupt. This special
function is self clearing.
ams Datasheet
[v1-00] 2016-Mar-22
Page 27
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TSL2771 − Register Set
Enable Register (0x00)
The ENABLE register is used to power the device ON/OFF, enable
functions, and interrupts.
Figure 29:
Enable Register
7
6
Reserved
5
4
3
2
1
0
PIEN
AIEN
WEN
PEN
AEN
PON
Field
Bits
Description
Reserved
7:6
PIEN
5
Proximity interrupt mask. When asserted, permits proximity interrupts to be generated.
AIEN
4
ALS interrupt mask. When asserted, permits ALS interrupts to be generated.
WEN
3
Wait Enable. This bit activates the wait feature. Writing a 1 activates the wait timer.
Writing a 0 disables the wait timer.
PEN
2
Proximity enable. This bit activates the proximity function. Writing a 1 enables
proximity. Writing a 0 disables proximity.
AEN
1
ALS Enable. This bit actives the two channel ADC. Writing a 1 activates the ALS. Writing
a 0 disables the ALS.
PON(1)(2)
0
Power ON. This bit activates the internal oscillator to permit the timers and ADC
channels to operate. Writing a 1 activates the oscillator. Writing a 0 disables the
oscillator.
Reserved. Write as 0.
Note(s):
1. See Power Management section for more information.
2. A minimum interval of 2.72 ms must pass after PON is asserted before either a proximity or ALS can be initiated. This required time
is enforced by the hardware in cases where the firmware does not provide it.
Page 28
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ams Datasheet
[v1-00] 2016-Mar-22
TSL2771 − Register Set
ALS Timing Register (0x01)
The ALS timing register controls the internal integration time
of the ALS channel ADCs in 2.72 ms increments.
Figure 30:
ALS Timing Register
Field
Bits
ATIME
7:0
Description
VALUE
INTEG_CYCLES
TIME
MAX COUNT
0xFF
1
2.72 ms
1024
0xF6
10
27.2 ms
10240
0xDB
37
101 ms
37888
0xC0
64
174 ms
65535
0x00
256
696 ms
65535
Proximity Time Control Register (0x02)
The proximity timing register controls the integration time of
the proximity ADC in 2.72 ms increments. It is recommended
that this register be programmed to a value of 0xFF (1
integration cycle).
Figure 31:
Proximity Time Control Register
Field
Bits
PTIME
7:0
ams Datasheet
[v1-00] 2016-Mar-22
Description
VALUE
INTEG_CYCLES
TIME
MAX COUNT
0xFF
1
2.72 ms
1023
Page 29
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TSL2771 − Register Set
Wait Time Register (0x03)
Wait time is set 2.72 ms increments unless the WLONG bit is
asserted in which case the wait times are 12x longer. WTIME is
programmed as a 2’s complement number.
Figure 32:
Wait Time Register
Field
Bits
WTIME
7:0
Description
REGISTER
VALUE
WAIT TIME
TIME (WLONG = 0)
TIME (WLONG = 1)
0xFF
1
2.72 ms
0.032 s
0xB6
74
201 ms
2.4 s
0x00
256
696 ms
8.3 s
Note(s):
1. The Proximity Wait Time Register should be configured before PEN and/or AEN is/are asserted.
ALS Interrupt Threshold Registers (0x04 - 0x07)
The ALS interrupt threshold registers provides the values to be
used as the high and low trigger points for the comparison
function for interrupt generation. If C0DATA crosses below the
low threshold specified, or above the higher threshold, an
interrupt is asserted on the interrupt pin.
Figure 33:
ALS Interrupt Threshold Register
Register
Address
Bits
Description
AILTL
0x04
7:0
ALS low threshold lower byte
AILTH
0x05
7:0
ALS low threshold upper byte
AIHTL
0x06
7:0
ALS high threshold lower byte
AIHTH
0x07
7:0
ALS high threshold upper byte
Page 30
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ams Datasheet
[v1-00] 2016-Mar-22
TSL2771 − Register Set
Proximity Interrupt Threshold Registers (0x08 - 0x0B)
The proximity interrupt threshold registers provide the values
to be used as the high and low trigger points for the comparison
function for interrupt generation. If the value generated by
proximity channel crosses below the lower threshold specified,
or above the higher threshold, an interrupt is signaled to the
host processor.
Figure 34:
Proximity Interrupt Threshold Registers
Register
Address
Bits
Description
PILTL
0x08
7:0
Proximity low threshold lower byte
PILTH
0x09
7:0
Proximity low threshold upper byte
PIHTL
0x0A
7:0
Proximity high threshold lower byte
PIHTH
0x0B
7:0
Proximity high threshold upper byte
ams Datasheet
[v1-00] 2016-Mar-22
Page 31
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TSL2771 − Register Set
Persistence Register (0x0C)
The persistence register controls the filtering interrupt
capabilities of the device. Configurable filtering is provided to
allow interrupts to be generated after each ADC integration
cycle or if the ADC integration has produced a result that is
outside of the values specified by threshold register for some
specified amount of time. Separate filtering is provided for
proximity and ALS functions. ALS interrupts are generated
using C0DATA.
Figure 35:
Persistence Register
7
6
5
4
3
2
PPERS
Field
Bits
PPERS
7:4
Page 32
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1
0
APERS
Description
Proximity interrupt persistence. Controls rate of proximity interrupt to the host
processor
FIELD VALUE
MEANING
INTERRUPT PERSISTENCE FUNCTION
0000
-----
Every proximity cycle generates an interrupt
0001
1
1 proximity value out of range
0010
2
2 consecutive proximity values out of range
...
...
...
1111
15
15 consecutive proximity values out of range
ams Datasheet
[v1-00] 2016-Mar-22
TSL2771 − Register Set
Field
Bits
APERS
3:0
ams Datasheet
[v1-00] 2016-Mar-22
Description
Interrupt persistence. Controls rate of interrupt to the host processor.
FIELD VALUE
MEANING
INTERRUPT PERSISTENCE FUNCTION
0000
Every
Every proximity cycle generates an interrupt
0001
1
1 value outside of threshold range
0010
2
2 consecutive values out of range
0011
3
3 consecutive values out of range
0100
5
5 consecutive values out of range
0101
10
10 consecutive values out of range
0110
15
15 consecutive values out of range
0111
20
20 consecutive values out of range
1000
25
25 consecutive values out of range
1001
30
30 consecutive values out of range
1010
35
35 consecutive values out of range
1011
40
40 consecutive values out of range
1100
45
45 consecutive values out of range
1101
50
50 consecutive values out of range
1110
55
55 consecutive values out of range
1111
60
60 consecutive values out of range
Page 33
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TSL2771 − Register Set
Configuration Register (0x0D)
The configuration register sets the wait long time.
Figure 36:
Configuration Register
7
6
5
4
3
2
Reserved
1
0
WLONG
Reserved
Field
Bits
Description
Reserved
7:2
WLONG
1
Wait Long. When asserted, the wait cycles are increased by a factor 12x from that
programmed in the WTIME register.
Reserved
0
Reserved. Write as 0.
Reserved. Write as 0.
Proximity Pulse Count Register (0x0E)
The proximity pulse count register sets the number of proximity
pulses that will be transmitted. When proximity detection is
enabled, a proximity detect cycle occurs after each ALS cycle.
PPULSE defines the number of pulses to be transmitted at a
62.5-kHz rate.
Note(s): The ATIME register will be used to time the interval
between proximity detection events even if the ALS function is
disabled.
Figure 37:
Proximity Pulse Count Register
7
6
5
4
3
2
1
0
PPULSE
Field
Bits
PPULSE
7:0
Page 34
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Description
Proximity Pulse Count. Specifies the number of proximity pulses to be generated.
ams Datasheet
[v1-00] 2016-Mar-22
TSL2771 − Register Set
Control Register (0x0F)
The Control register provides eight bits of miscellaneous
control to the analog block. These bits typically control
functions such as gain settings and/or diode selection.
Figure 38:
Control Register
7
6
PDRIVE
5
4
3
PDIODE
Field
Bits
PDRIVE
7:6
5:4
0
AGAIN
Description
LED Drive Strength.
LED STRENGTH
00
100 mA
01
50 mA
10
25 mA
11
12.5 mA
Proximity Diode Select.
FIELD VALUE
DIODE SELECTION
00
Reserved
01
Proximity uses the CH0 diode
10
Proximity uses the CH1 diode
11
Proximity uses both diodes
Reserved
3:2
Reserved. Write bits as zero (0:0)
AGAIN
1:0
ALS Gain Control.
FIELD VALUE
ams Datasheet
[v1-00] 2016-Mar-22
1
Reserved
FIELD VALUE
PDIODE
2
ALS GAIN VALUE
00
1x gain
01
8x gain
10
16x gain
11
120x gain
Page 35
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TSL2771 − Register Set
ID Register (0x12)
The ID Register provides the value for the part number. The ID
register is a read-only register.
Figure 39:
ID Register
7
6
5
4
3
2
1
0
ID
Field
Bits
ID
7:0
Description
0x00 = TSL27711 & TSL27715
Part number identification
0x09 = TSL27713 & TSL27717
Status Register (0x13)
The Status Register provides the internal status of the device.
This register is read only.
Figure 40:
Status Register
7
6
Reserved
5
4
PINT
AINT
3
2
Reserved
1
0
AVALID
Field
Bit
Reserved
7:6
PINT
5
Proximity Interrupt. Indicates that the device is asserting a proximity
interrupt.
AINT
4
ALS Interrupt. Indicates that the device is asserting an ALS interrupt.
Reserved
3:1
AVALID
0
Page 36
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Description
Reserved.
Reserved.
ALS Valid. Indicates that the ALS channel has completed an
integration cycle.
ams Datasheet
[v1-00] 2016-Mar-22
TSL2771 − Register Set
ADC Channel Data Registers (0x14 - 0x17)
ALS data is stored as two 16-bit values. To ensure the data is
read correctly, a two-byte read I²C transaction should be used
with auto increment protocol bits set in the command register.
With this operation, when the lower byte register is read, the
upper eight bits are stored in a shadow register, which is read
by a subsequent read to the upper byte. The upper register will
read the correct value even if additional ADC integration cycles
end between the reading of the lower and upper registers.
Figure 41:
ADC Channel Data Registers
Register
Address
Bits
Description
C0DATA
0x14
7:0
ALS CH0 data low byte
C0DATAH
0x15
7:0
ALS CH0 data high byte
C1DATA
0x16
7:0
ALS CH1 data low byte
C1DATAH
0x17
7:0
ALS CH1 data high byte
Proximity Data Registers (0x18 - 0x19)
Proximity data is stored as a 16-bit value. To ensure the data is
read correctly, a two-byte read I²C transaction should be
utilized with auto increment protocol bits set in the command
register. With this operation, when the lower byte register is
read, the upper eight bits are stored into a shadow register,
which is read by a subsequent read to the upper byte. The upper
register will read the correct value even if the next ADC cycle
ends between the reading of the lower and upper registers.
Figure 42:
PDATA Registers
Register
Address
Bits
Description
PDATAL
0x18
7:0
Proximity data low byte
PDATAH
0x19
7:0
Proximity data high byte
ams Datasheet
[v1-00] 2016-Mar-22
Page 37
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TSL2771 − Application Information Hardware
Application Information
Hardware
LED Driver Pin with Proximity Detection
In a proximity sensing system, the IR LED can be pulsed by the
TSL2771 with more than 100 mA of rapidly switching current,
therefore, a few design considerations must be kept in mind to
get the best performance. The key goal is to reduce the power
supply noise coupled back into the device during the LED
pulses.
The first recommendation is to use two power supplies; one for
the device V DD and the other for the IR LED. In many systems,
there is a quiet analog supply and a noisy digital supply. By
connecting the quiet supply to the V DD pin and the noisy supply
to the LED, the key goal can be meet. Place a 1-μF low-ESR
decoupling capacitor as close as possible to the V DD pin and
another at the LED anode, and a 22-μF capacitor at the output
of the LED voltage regulator to supply the 100-mA current
surge.
Figure 43:
Proximity Sensing Using Separate Power Supplies
VBUS
Voltage
Regulator
VDD
1 mF
C*
RP
GND
TSL2771
RP
RPI
INT
SCL
Voltage
Regulator
LDR
22 mF
1 mF
SDA
IR LED
* Cap Value Per Regulator Manufacturer Recommendation
Page 38
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ams Datasheet
[v1-00] 2016-Mar-22
TSL2771 − Application Information Hardware
If it is not possible to provide two separate power supplies, the
device can be operated from a single supply. A 22-Ω resistor in
series with the V DD supply line and a 1-μF low ESR capacitor
effectively filter any power supply noise. The previous capacitor
placement considerations apply.
Figure 44:
Proximity Sensing Using Single Power Supply
VBUS
22 W
Voltage
Regulator
VDD
22 mF
1 mF
RP
GND
TSL2771
RP
RPI
INT
SCL
LDR
1 mF
SDA
IR LED
* Cap Value Per Regulator Manufacturer Recommendation
V BUS in the above figures refers to the I²C bus voltage which is
either V DD or 1.8 V. Be sure to apply the specified I²C bus voltage
shown in the Ordering Information for the specific device being
used.
The I²C signals and the Interrupt are open-drain outputs and
require pull-up resistors. The pull-up resistor (R P) value is a
function of the I²C bus speed, the I²C bus voltage, and the
capacitive load. The ams EVM running at 400 kbps, uses 1.5-kΩ
resistors. A 10-kΩ pull-up resistor (RPI) can be used for the
interrupt line.
ams Datasheet
[v1-00] 2016-Mar-22
Page 39
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TSL2771 − Application Information Hardware
PCB Pad Layouts
Suggested PCB pad layout guidelines for the Dual Flat No-Lead
(FN) surface mount package are shown in Figure 45.
Note(s): Pads can be extended further if hand soldering is
needed.
Figure 45:
Suggested FN Package PCB Layout
2500
1000
1000
400
650
1700
650
400
Note(s):
1. All linear dimensions are in micrometers.
2. This drawing is subject to change without notice.
Page 40
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ams Datasheet
[v1-00] 2016-Mar-22
TSL2771 − Mechanical Data
Mechanical Data
Figure 46:
Package FN — Dual Flat No-Lead Packaging Configuration
PACKAGE FN
Dual Flat No-Lead
TOP VIEW
466 10
PIN OUT
TOP VIEW
PIN 1
466
10
2000 100
2000
100
VDD 1
6 SDA
SCL 2
5 INT
GND 3
4 LDR
Photodiode Array Area
END VIEW
SIDE VIEW
295
Nominal
650 50
203 8
650
300
50
BOTTOM VIEW
CL of Photodiode
Array Area
2 2
(Note B)
CL of Solder Contacts
20 Nominal
140 Nominal
CL of Solder Contacts
2
2
CL of Photodiode Array Area (Note B)
RoHS
PIN 1
750 150
Pb
Green
Lead Free
Note(s):
1. All linear dimensions are in micrometers. Dimension tolerance is ± 20μm unless otherwise noted.
2. The die is centered within the package within a tolerance of ±3 mils.
3. Package top surface is molded with an electrically nonconductive clear plastic compound having an index of refraction of 1.55.
4. Contact finish is copper alloy A194 with pre-plated NiPdAu lead finish.
5. This package contains no lead (Pb).
6. This drawing is subject to change without notice.
ams Datasheet
[v1-00] 2016-Mar-22
Page 41
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TSL2771 − Mechanical Data
Figure 47:
Package FN Carrier Tape
TOP VIEW
2.00 0.05
1.75
4.00
8.00
1.50
4.00
B
+ 0.30
− 0.10
3.50 0.05
1.00
0.25
A
B
A
DETAIL A
DETAIL B
5 Max
5 Max
2.18 0.05
0.254
0.02
Ao
0.83 0.05
Ko
2.18 0.05
Bo
Note(s):
1. All linear dimensions are in millimeters. Dimension tolerance is ±0.10 mm unless otherwise noted.
2. The dimensions on this drawing are for illustrative purposes only. Dimensions of an actual carrier may vary slightly.
3. Symbols on drawing Ao, Bo, and Ko are defined in ANSI EIA Standard 481-B 2001.
4. Each reel is 178 millimeters in diameter and contains 3500 parts.
5. ams packaging tape and reel conform to the requirements of EIA Standard 481-B.
6. In accordance with EIA standard, device pin 1 is located next to the sprocket holes in the tape.
7. This drawing is subject to change without notice.
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ams Datasheet
[v1-00] 2016-Mar-22
TSL2771 − Manufacturing Information
The FN package has been tested and has demonstrated an
ability to be reflow soldered to a PCB substrate.
Manufacturing Information
The solder reflow profile describes the expected maximum heat
exposure of components during the solder reflow process of
product on a PCB. Temperature is measured on top of
component. The components should be limited to a maximum
of three passes through this solder reflow profile.
Figure 48:
Soldier Reflow Profile
Parameter
Reference
Device
Average temperature gradient in preheating
2.5°C/s
tsoak
2 to 3 minutes
Time above 217°C (T1)
t1
Max 60 s
Time above 230°C (T2)
t2
Max 50 s
Time above Tpeak −10°C (T3)
t3
Max 10 s
Peak temperature in reflow
Tpeak
260°C
Soak time
Temperature gradient in cooling
Max −5°C/s
Figure 49:
Solder Reflow Profile Graph
Tpeak
Not to scale — for reference o
T3
T2
Temperature (C)
T1
Time (s)
t3
t2
tsoak
t1
Note(s):
1. Note to scale – for reference only.
ams Datasheet
[v1-00] 2016-Mar-22
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TSL2771 − Manufacturing Information
Moisture Sensitivity
Optical characteristics of the device can be adversely affected
during the soldering process by the release and vaporization of
moisture that has been previously absorbed into the package.
To ensure the package contains the smallest amount of
absorbed moisture possible, each device is dry-baked prior to
being packed for shipping. Devices are packed in a sealed
aluminized envelope called a moisture barrier bag with silica
gel to protect them from ambient moisture during shipping,
handling, and storage before use.
The FN package has been assigned a moisture sensitivity level
of MSL 3 and the devices should be stored under the following
conditions:
• Temperature Range: 5ºC to 50ºC
• Relative Humidity: 60% maximum
• Total Time: 12 months from the date code on the
aluminized envelope — if unopened
• Opened Time: 168 hours or fewer
Rebaking will be required if the devices have been stored
unopened for more than 12 months or if the aluminized
envelope has been open for more than 168 hours. If rebaking
is required, it should be done at 50ºC for 12 hours.
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ams Datasheet
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TSL2771 − Ordering & Contact Information
Ordering & Contact Information
Figure 50:
Ordering Information
Ordering Code
Device
Address
Package - Leads
Interface Description
TSL27711FN
TSL27711
0x39
FN−6
I²C Vbus = VDD Interface
TSL27713FN
TSL27713
0x39
FN−6
I²C Vbus = 1.8 V Interface
TSL27715FN
TSL27715 (1)
0x29
FN−6
I²C Vbus = VDD Interface
TSL27717FN
TSL27717 (1)
0x29
FN−6
I²C Vbus = 1.8 V Interface
Note(s):
1. Contact ams for availability.
Buy our products or get free samples online at:
www.ams.com/ICdirect
Technical Support is available at:
www.ams.com/Technical-Support
Provide feedback about this document at:
www.ams.com/Document-Feedback
For further information and requests, e-mail us at:
[email protected]
For sales offices, distributors and representatives, please visit:
www.ams.com/contact
Headquarters
ams AG
Tobelbaderstrasse 30
8141 Premstaetten
Austria, Europe
Tel: +43 (0) 3136 500 0
Website: www.ams.com
ams Datasheet
[v1-00] 2016-Mar-22
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TSL2771 − RoHS Compliant & ams Green Statement
RoHS Compliant & ams Green
Statement
RoHS: The term RoHS compliant means that ams AG products
fully comply with current RoHS directives. Our semiconductor
products do not contain any chemicals for all 6 substance
categories, including the requirement that lead not exceed
0.1% by weight in homogeneous materials. Where designed to
be soldered at high temperatures, RoHS compliant products are
suitable for use in specified lead-free processes.
ams Green (RoHS compliant and no Sb/Br): ams Green
defines that in addition to RoHS compliance, our products are
free of Bromine (Br) and Antimony (Sb) based flame retardants
(Br or Sb do not exceed 0.1% by weight in homogeneous
material).
Important Information: The information provided in this
statement represents ams AG knowledge and belief as of the
date that it is provided. ams AG bases its knowledge and belief
on information provided by third parties, and makes no
representation or warranty as to the accuracy of such
information. Efforts are underway to better integrate
information from third parties. ams AG has taken and continues
to take reasonable steps to provide representative and accurate
information but may not have conducted destructive testing or
chemical analysis on incoming materials and chemicals. ams AG
and ams AG suppliers consider certain information to be
proprietary, and thus CAS numbers and other limited
information may not be available for release.
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TSL2771 − Copyrights & Disclaimer
Copyrights & Disclaimer
Copyright ams AG, Tobelbader Strasse 30, 8141 Premstaetten,
Austria-Europe. Trademarks Registered. All rights reserved. The
material herein may not be reproduced, adapted, merged,
translated, stored, or used without the prior written consent of
the copyright owner.
Devices sold by ams AG are covered by the warranty and patent
indemnification provisions appearing in its General Terms of
Trade. ams AG makes no warranty, express, statutory, implied,
or by description regarding the information set forth herein.
ams AG reserves the right to change specifications and prices
at any time and without notice. Therefore, prior to designing
this product into a system, it is necessary to check with ams AG
for current information. This product is intended for use in
commercial applications. Applications requiring extended
temperature range, unusual environmental requirements, or
high reliability applications, such as military, medical
life-support or life-sustaining equipment are specifically not
recommended without additional processing by ams AG for
each application. This product is provided by ams AG “AS IS”
and any express or implied warranties, including, but not
limited to the implied warranties of merchantability and fitness
for a particular purpose are disclaimed.
ams AG shall not be liable to recipient or any third party for any
damages, including but not limited to personal injury, property
damage, loss of profits, loss of use, interruption of business or
indirect, special, incidental or consequential damages, of any
kind, in connection with or arising out of the furnishing,
performance or use of the technical data herein. No obligation
or liability to recipient or any third party shall arise or flow out
of ams AG rendering of technical or other services.
ams Datasheet
[v1-00] 2016-Mar-22
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TSL2771 − Document Status
Document Status
Document Status
Product Preview
Preliminary Datasheet
Datasheet
Datasheet (discontinued)
Page 48
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Product Status
Definition
Pre-Development
Information in this datasheet is based on product ideas in
the planning phase of development. All specifications are
design goals without any warranty and are subject to
change without notice
Pre-Production
Information in this datasheet is based on products in the
design, validation or qualification phase of development.
The performance and parameters shown in this document
are preliminary without any warranty and are subject to
change without notice
Production
Information in this datasheet is based on products in
ramp-up to full production or full production which
conform to specifications in accordance with the terms of
ams AG standard warranty as given in the General Terms of
Trade
Discontinued
Information in this datasheet is based on products which
conform to specifications in accordance with the terms of
ams AG standard warranty as given in the General Terms of
Trade, but these products have been superseded and
should not be used for new designs
ams Datasheet
[v1-00] 2016-Mar-22
TSL2771 − Revision Information
Revision Information
Changes from 100B (2011-Feb) to current revision 1-00 (2016-Mar-22)
Page
Content of TAOS datasheet was updated to latest ams design
Note(s):
1. Page and figure numbers for the previous version may differ from page and figure numbers in the current revision
2. Correction of typographical errors is not explicitly mentioned.
ams Datasheet
[v1-00] 2016-Mar-22
Page 49
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TSL2771 − Content Guide
Content Guide
Page 50
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1
2
2
3
General Description
Key Benefits & Features
Applications
Functional Block Diagram
4
5
Detailed Description
Pin Assignments
6
11
Absolute Maximum Ratings
Parameter Measurement Information
12
Typical Operating Characteristics
14
14
15
15
16
17
19
21
22
23
Principles Of Operation
System State Machine
Photodiodes
ALS Operation
Lux Equation
Proximity Detection
Interrupts
State Diagram
Power Management
I²C Protocol
25
27
28
29
29
30
30
31
32
34
34
35
36
36
37
37
Register Set
Command Register
Enable Register (0x00)
ALS Timing Register (0x01)
Proximity Time Control Register (0x02)
Wait Time Register (0x03)
ALS Interrupt Threshold Registers (0x04 - 0x07)
Proximity Interrupt Threshold Registers (0x08 - 0x0B)
Persistence Register (0x0C)
Configuration Register (0x0D)
Proximity Pulse Count Register (0x0E)
Control Register (0x0F)
ID Register (0x12)
Status Register (0x13)
ADC Channel Data Registers (0x14 - 0x17)
Proximity Data Registers (0x18 - 0x19)
38
38
40
Application Information Hardware
LED Driver Pin with Proximity Detection
PCB Pad Layouts
41
43
44
Mechanical Data
Manufacturing Information
Moisture Sensitivity
45
46
47
48
49
Ordering & Contact Information
RoHS Compliant & ams Green Statement
Copyrights & Disclaimer
Document Status
Revision Information
ams Datasheet
[v1-00] 2016-Mar-22