Package

ALPHA & OMEGA
SEMICONDUCTOR, LTD.
S
Y
M
B
O
L
RECOMMENDED LAND PATTERN
6.25 MIN.
6.80 MIN.
6.60
1.50 MIN.
3.00 MIN.
2.286
4.572 BSC
UNIT: mm
DIMENSION IN MILLIMETERS
MIN.
NOM.
MAX.
MIN.
NOM.
MAX.
A
2.184
2.286
2.388
0.086
0.090
0.094
A1
0.000
-----
0.127
0.000
-----
0.005
A2
0.889
1.041
1.143
0.035
0.041
0.045
b
0.635
0.762
0.889
0.025
0.030
0.035
b1
0.762
0.840
1.143
0.030
0.033
0.045
b2
4.953
5.340
5.461
0.195
0.210
0.215
c
0.450
0.508
0.610
0.018
0.020
0.024
c1
0.450
0.508
0.610
0.018
0.020
0.024
D
5.969
6.096
6.223
0.235
0.240
0.245
D1
5.210
5.249
D2
0.662
0.762
E
6.350
E1
4.318
6.604
4.826
E2
1.678
1.778
1.878
e
2.286 BSC
e1
4.572 BSC
0.205
0.207
0.212
0.862
0.026
0.030
0.034
6.731
0.250
0.260
0.265
4.901
0.170
0.190
0.193
0.066
0.070
0.074
5.380
0.090 BSC
0.180 BSC
H
9.398
10.033
10.414
0.370
0.395
0.410
L
1.270
1.520
2.032
0.050
0.060
0.080
L1
NOTE
1. PACKAGE BODY SIZES EXCLUDE MOLD FLASH AND
GATE BURRS. MOLD FLASH SHOULD BE LESS THAN
6 MILS.
2. DIMENSION L IS MEASURED IN GAUGE PLANE
3. TOLERANCE 0.10 mm UNLESS OTHERWISE SPECIFIED
4. CONTROLLING DIMENSION IS MILLIMETER. CONVERTED
INCH DIMENSIONS ARE NOT NECESSARILY EXACT.
5. REFER TO JEDEC TO-252 (AA)
DIMENSIONS IN INCHES
2.921 REF.
0.115REF.
L2
0.408
0.508
0.608
0.016
0.020
0.024
L3
0.889
1.016
1.270
0.035
0.040
0.050
L4
0.635
-----
1.016
0.025
-----
0.040