datasheet

Board 3S SKYPER 32 PRO R Gold
Absolute Maximum Ratings
SKYPER®
Symbol
Conditions
Vs
Supply voltage primary
16
V
IoutPEAK
Output peak current
15
A
Output average current
50
mA
fmax
Max. switching frequency
50
kHz
VCE
Collector emitter voltage sense across
the IGBT
1700
V
4000
V
1100
V
1500
V
Visol IO
VisolPD
Visol12
Target Data
Unit
IoutAVmax
Adaptor board
Board 3S SKYPER 32 PRO R
Gold
Values
Insulation test voltage input - output
(AC, rms, 2s)
Partial discharge extinction voltage,
rms, QPD ̞ 10pC
Insulation test voltage output 1 - output
2 (AC, rms, 2s)
RGon min
Minimum rating for external RGon
1.5
Ω
RGoff min
Minimum rating for external RGoff
1.5
Ω
Top
Operating temperature
-40 ... 85
°C
Tstg
Storage temperature
-40 ... 85
°C
Features
• Two output channels
• Gold nickel finish
• Failure management
Characteristics
Symbol
Conditions
min.
typ.
max.
Unit
Vs
Supply voltage primary side
14.4
15
15.6
V
12.3
V
Typical Applications*
Vi
Input signal voltage on / off
• Adaptor board for SKYPER 32 IGBT
drivers in bridge circuits for industrial
applications
• PCB with gold plating
• DC bus up to 900V
VIT+
Input treshold voltage HIGH
Footnote
VIT-
Input threshold voltage (LOW)
VG(on)
Turn on output voltage
15 / 0
4.6
V
V
15
V
VG(off)
Turn off output voltage
-7
V
td(on)IO
Input-output turn-on propagation time
1.2
µs
td(off)IO
Input-output turn-off propagation time
1.2
µs
With external high voltage diode
Please note: the insulation test is not
performed as a series test at SEMIKRON
and must be performed by the user
according to VDE 0110-20
Insulation coordination in compliance with
EN50178 PD2
Operating temperature is real ambient
temperature around the driver core
Degree of protection: IP00
Adaptor board
© by SEMIKRON
Rev. 0.1 – 09.07.2015
1
Board 3S SKYPER 32 PRO R Gold
This is an electrostatic discharge sensitive device (ESDS), international standard IEC 60747-1, Chapter IX
* The specifications of our components may not be considered as an assurance of component characteristics. Components have to be tested
for the respective application. Adjustments may be necessary. The use of SEMIKRON products in life support appliances and systems is
subject to prior specification and written approval by SEMIKRON. We therefore strongly recommend prior consultation of our staff.
2
Rev. 0.1 – 09.07.2015
© by SEMIKRON
Technical Explanation
®
Board 3s SKYPER
32PRO R
Revision:
03
Issue date:
2015-05-05
Prepared by:
H.Flohrer
Approved by:
J.Krapp
Keyword: IGBT Driver, Adapter Board SKYPER
1. Application and Handling Instructions............................................................................................2
2. Further application support ..........................................................................................................2
3. General Description ....................................................................................................................2
4. Quality ......................................................................................................................................3
5. Dimensions ................................................................................................................................4
6. Component Placement Layout ......................................................................................................5
7. PIN Array ..................................................................................................................................6
8. Signal IF_CMN_nHALT.................................................................................................................8
9. Setting Dead Time ......................................................................................................................8
10. Setting Dynamic Short Circuit Protection .......................................................................................9
11. Collector Series Resistance ..........................................................................................................9
12. Adaptation Gate Resistors............................................................................................................9
13. Adaptation Decoupling Gate Resistors ......................................................................................... 10
14. Setting Soft Turn-Off ................................................................................................................ 10
15. Temperature Signal .................................................................................................................. 10
16. Over Temperature Protection Circuit (OTP) .................................................................................. 11
17. Mounting Notes ........................................................................................................................ 12
18. Schematics .............................................................................................................................. 13
19. Parts List ................................................................................................................................. 16
Please note:
All values in this technical explanation are typical values. Typical values are the average values
expected in large quantities and are provided for information purposes only. These values can and do
vary in different applications. All operating parameters should be validated by user’s technical experts
for each application.
© by SEMIKRON / 2015-05-05 / Technical Explanation / Board 3s SKYPER® 32PRO R
PROMGT.1023/ Rev.4/ Template Technical Explanation
Page 1/17
1.
•
Application and Handling Instructions
Please provide for static discharge protection during handling. As long as the hybrid driver is not
completely assembled, the input terminals have to be short-circuited. Persons working with devices
have to wear a grounded bracelet. Any synthetic floor coverings must not be statically chargeable. Even
during transportation the input terminals have to be short-circuited using, for example, conductive
rubber. Worktables have to be grounded. The same safety requirements apply to MOSFET- and IGBTmodules.
Any parasitic inductances within the DC-link have to be minimised. Over-voltages may be absorbed by
C- or RCD-snubber networks between main terminals for PLUS and MINUS of the power module.
When first operating a newly developed circuit, SEMIKRON recommends to apply low collector voltage
and load current in the beginning and to increase these values gradually, observing the turn-off
behaviour of the free-wheeling diode and the turn-off voltage spikes generated across the IGBT. An
oscillographic control will be necessary. Additionally, the case temperature of the module has to be
monitored. When the circuit works correctly under rated operation conditions, short-circuit testing may
be done, starting again with low collector voltage.
It is important to feed any errors back to the control circuit and to switch off the device immediately in
failure events. Repeated turn-on of the IGBT into a short circuit with a high frequency may destroy the
device.
The inputs of the hybrid driver are sensitive to over-voltage. Voltages higher than VS +0,3V or below 0,3V may destroy these inputs. Therefore, control signal over-voltages exceeding the above values have
to be avoided.
The connecting leads between hybrid driver and the power module should be as short as possible (max.
20cm), the driver leads should be twisted.
•
•
•
•
•
2.
Further application support
Latest information is available at http://www.semikron.com. For design support please read the SEMIKRON
Application Manual Power Modules available at http://www.semikron.com.
3.
General Description
The Board 3s SKYPER® 32PRO R is an adaptor board for the IGBT module SEMiX® 3s (spring contact
version). The board can be customized allowing adaptation and optimization to the used SEMiX ® Module.
The switching characteristic of the IGBT can be influenced through user settings, e.g. changing turn-on and
turn-off speed by variation of RGon and RGoff. Furthermore, it is possible to adjust the monitoring level and
blanking time for the DSCP (see Technical Explanations SKYPER® 32PRO R).
Please note:
This technical explanation is based on the Technical Explanations for SKYPER ® 32PRO R. Please read the
Technical Explanations SKYPER® 32 PRO R before using the Adaptor Board.
Figure 1: Board 3s SKYPER® 32PRO R
© by SEMIKRON / 2015-05-05 / Technical Explanation / Board 3s SKYPER® 32PRO R
Page 2/17
4.
Quality
Table 1: Quality
End
test
test category
test describtion
standard
AOI
Automated Optical
Inspection
Control of accurate placement of components/
of solder joints
SEMIKRON
ICT
In-Circuit Test
Test of the populated PCB, checking the
correctly fabrication
SEMIKRON
Type
test
test category
test conditions
standard
EP
Electrical
Parameters
Jamb = -40°C / +85°C
SEMIKRON
SP
STEP Test,
Interrupted PS
20x 10µs to 2s
EN61000-4-29
Iso
Isolation Test
High voltage test 4kV, 60s
EN 61800-5-1
TC
Thermal Cycling
200 cycles, Tstgmax – Tstgmin
IEC60068-2-14
PD
Partial discharge
test
>1,2 kV; suitable for 1000V DC Link
VDE 0110-20
TH
Temperature
Humidity
85°C, 85% RH, 96h
IEC 60068-2-67
VB
Vibration
Sinus 20/2000Hz Random 10/2000Hz, 5g, 26
per x,y,z
IEC 60068-2-6
SH
Shock
Half-sinus pulse, 30g, 6000 shocks, 6ms, ±x,
± y, ± z
IEC 60068-2-29
© by SEMIKRON / 2015-05-05 / Technical Explanation / Board 3s SKYPER® 32PRO R
Page 3/17
5.
Dimensions
Figure 2: Dimensions in mm
40,37
16,73
Ø3
33,01
Ø3
X10
9
10
9
10
Ø
3
1
2
9
10
58,01
Ø 3,5
Ø 3,2
Ø3
1
2
1
2
Ø3
Ø3
20
19
9
10
Ø3
Ø
X20
3,5
Ø 3,2
1
2
2
1
Ø 3,2
66
20,3
23,01
24,11
8,01
2,77
Ø 1,3
2,54
97,27
10,1
13,2
100
© by SEMIKRON / 2015-05-05 / Technical Explanation / Board 3s SKYPER® 32PRO R
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6.
Component Placement Layout
Figure 3: Adaptor Board
© by SEMIKRON / 2015-05-05 / Technical Explanation / Board 3s SKYPER® 32PRO R
Page 5/17
7.
PIN Array
Figure 4: Connector X20 (Assmann AWHW 20G SMD)
Product information of suitable female connectors and distributor contact information is available at e.g.
http://www.harting.com (part number 09 18 520 6 813).
© by SEMIKRON / 2015-05-05 / Technical Explanation / Board 3s SKYPER® 32PRO R
Page 6/17
Table 2: PIN Array
PIN
Signal
Function
Specification
X20:01
IF_PWR_15P
Drive power supply
Stabilised +15V ±4%
X20:02
IF_PWR_GND
GND for power supply
X20:03
IF_PWR_15P
Drive power supply
X20:04
IF_PWR_GND
GND for power supply
X20:05
IF_PWR_15P
Drive power supply
X20:06
IF_PWR_GND
GND for power supply
X20:07
reserved
X20:08
IF_PWR_GND
GND for power supply
X20:09
IF_CMN_nHALT
Driver core status signal
(bidirectional signal with
dominant recessive behaviour)
X20:10
reserved
X20:11
reserved
X20:12
IF_CMN_GND
X20:13
reserved
X20:14
reserved
X20:15
IF_HB_TOP
Switching signal input (TOP
switch)
Digital 15 V logic; 10 kOhm
impedance;
LOW = TOP switch off;
HIGH = TOP switch on
X20:16
IF_HB_BOT
Switching signal input
(BOTTOM switch)
Digital 15 V logic; 10 kOhm
impedance;
LOW = BOT switch off;
HIGH = BOT switch on
X20:17
reserved
X20:18
IF_HB_GND
X20:19
reserved
X20:20
reserved
Stabilised +15V ±4%
Stabilised +15V ±4%
Digital 15V logic;
LOW (dominant) = driver disabled;
HIGH (recessive) = ready to operate
GND for signal IF_CMN_nHALT
GND for signals IF_HB_TOP &
F_HB_BOT
© by SEMIKRON / 2015-05-05 / Technical Explanation / Board 3s SKYPER® 32PRO R
Page 7/17
8.
Signal IF_CMN_nHALT
The Halt Logic Signals PRIM_HALT_IN and PRIM_HALT_OUT of the driver core are coupled to one
bidirectional signal (IF_CMN_nHALT) with dominant recessive behaviour. IF_CMN_nHALT shows the driver
core status. When IF_CMN_nHALT is HIGH (recessive), the driver core is ready to operate. When
IF_CMN_nHALT is LOW (dominant), the driver core is disabled / not ready to operate because of e. g.
detected failure or driver core system start.
A controller can hold with the IF_CMN_nHALT signal the driver core in a safe state (e.g. during a start up of
a system or gathered failure signal of other hardware) or generate a coeval release of paralleled driver.
Furthermore, paralleled drivers can send and receive IF_CMN_nHALT signals among each other by using a
single-wire bus.
Figure 5: Connection IF_CMN_nHALT
User Side
+15V
Rpull_up_int
5,1K
STATUS SIGNAL
GND
9.
Setting Dead Time
Table 3: DT adjustment
Designation
Pattern Name
Setting
R43
(connected to GND)
0603
PRIM_CFG_TDT2_IN
Factory setting: 0Ω
R44
(connected to GND)
0603
PRIM_CFG_SELECT_IN
Factory setting: not equipped
R45
(connected to GND)
0603
PRIM_CFG_TDT3_IN
Factory setting: 0Ω
R46
(connected to GND)
0603
PRIM_CFG_TDT1_IN
Factory setting: not equipped
Factory setting: 3,3µs
© by SEMIKRON / 2015-05-05 / Technical Explanation / Board 3s SKYPER® 32PRO R
Page 8/17
10. Setting Dynamic Short Circuit Protection
Table 4: RCE & CCE
Designation
Pattern Name
Setting
R162
1206
RCE
Factory setting: not equipped
TOP
C150
1206
CCE
Factory setting: not equipped
TOP
R262
1206
RCE
Factory setting: not equipped
BOT
C250
1206
CCE
Factory setting: not equipped
BOT
11. Collector Series Resistance
Table 5: RVCE
Designation
Pattern Name
Setting
R150
MiniMELF
RVCE *
Factory setting: not equipped
TOP
R250
MiniMELF
RVCE *
Factory setting: not equipped
BOT
* 1200V IGBT operation: 0Ω
1700V IGBT operation: 1kΩ / 0,4W
12. Adaptation Gate Resistors
Table 6: RGon & RGoff
Designation
Pattern Name
Setting
R151, R152, R153
(parallel connected)
MiniMELF
RGon
Factory setting: not equipped
TOP
R154, R155, R156
(parallel connected)
MiniMELF
RGoff
Factory setting: not equipped
TOP
R251, R252, R253
(parallel connected)
MiniMELF
RGon
Factory setting: not equipped
BOT
R254, R255, R256
(parallel connected)
MiniMELF
RGoff
Factory setting: not equipped
BOT
© by SEMIKRON / 2015-05-05 / Technical Explanation / Board 3s SKYPER® 32PRO R
Page 9/17
13. Adaptation Decoupling Gate Resistors
For details to the decoupling gate resistors and recommended values, see Modules Explanations and Data
Sheets SEMiX®.
Table 7: RG1, RG2, RG3
Designation
Pattern Name
Setting
R101
MELF
RG1
Factory setting: not equipped
TOP
R102
MELF
RG2
Factory setting: not equipped
TOP
R103
MELF
RG3
Factory setting: not equipped
TOP
R201
MELF
RG1
Factory setting: not equipped
BOT
R202
MELF
RG2
Factory setting: not equipped
BOT
R203
MELF
RG3
Factory setting: not equipped
BOT
Designation
Pattern Name
Setting
R160, R161
(parallel connected)
MiniMELF
RGoff_SC
Factory setting: not equipped
TOP
R260, R261
(parallel connected)
MiniMELF
RGoff_SC
Factory setting: not equipped
BOT
14. Setting Soft Turn-Off
Table 8: RGoff_SC
15. Temperature Signal
The temperature sensor inside the SEMiX® module is directly connected to contacting points T1 and T2. For
details to the temperature sensor, see Modules Explanations SEMiX®.
Safety Warnings:
The contacting points T1 and T2 are not electrical isolated. Due to high voltage that may be
present at the contacting points T1 and T2, some care must be taken in order to avoid accident.
There is no cover or potential isolation that protect the high voltage sections / wires from
accidental human contact.
Please note:
If the contacting points T1 and T2 are used for adaptor of the temperature sensor, the Over
Temperature Protection Ciruit must be disabled by taking out the resistors R175, R178 and R179.
© by SEMIKRON / 2015-05-05 / Technical Explanation / Board 3s SKYPER® 32PRO R
Page
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16. Over Temperature Protection Circuit (OTP)
The external error input SEC_TOP_ERR_IN on the secondary side (high potential) of the driver core is used
for an over temperature protection circuit to place the gate driver into halt mode.
Dimensioning OTP
[1] Define an over temperature trip level according to the application.
[2] Calculate the nominal ohmic resistance value of the temperature sensor at the defined trip level (see
"Modules – Explanations - SEMiX®" on SEMiX® product overview page at
http://www.semikron.com).
[3] The trip level on the adapter board is set with R172 by using the calculated resistance value.
•
Factory setting R172: not equipped
•
If no resistor is used, a failure signal is generated.
© by SEMIKRON / 2015-05-05 / Technical Explanation / Board 3s SKYPER® 32PRO R
Page
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17. Mounting Notes
The electrical connections between adaptor board and SEMiX ® are realised via spring contacts integrated in
SEMiX® power modules and via landing pads on the bottom side of the adaptor board.
Figure 6: Adaptor Board & Driver Core Mounting
[1] Soldering of components (e.g.
RGon, RGoff, etc.) on adapter board.
[2] Adaptor Board has to be fixed to
the SEMiX® module (see
"Mounting Instruction and
Application Notes
for SEMiX®
IGBT modules" on SEMiX® product
overview page at
http://www.semikron.com).
[3] Insert driver core into the box
connector on adaptor board.
SKYPER™ 32PRO
Support post
Printed Ciruit Board
The connection between driver core
and
adaptor
board
should
be
mechanical reinforced by using support
posts. The posts have to be spaced
between driver core and adaptor
board.
Product information of suitable support
posts and distributor contact
information is available at e.g.
http://www.richco-inc.com (e.g. part
number DLMSPM-8-01, LCBST-8-01).
© by SEMIKRON / 2015-05-05 / Technical Explanation / Board 3s SKYPER® 32PRO R
Page
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18. Schematics
Figure 7: Schematic I Adaptor Board
© by SEMIKRON / 2015-05-05 / Technical Explanation / Board 3s SKYPER® 32PRO R
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Figure 8: Schematic II Adaptor Board
© by SEMIKRON / 2015-05-05 / Technical Explanation / Board 3s SKYPER® 32PRO R
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Figure 9: Schematic III Adaptor Board
© by SEMIKRON / 2015-05-05 / Technical Explanation / Board 3s SKYPER® 32PRO R
Page
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19. Parts List
Figure 10: Parts List Adaptor Board
Count
Ref. Designator
Value
Pattern Name
Description
7
C170, C171, C173, C174, C175,
C176, CN170
100nF
0805 (SMD)
Capacitor X7R
6
1
1
1
2
1
1
1
2
1
C20, C21, C22, C23, C24, C25
C26
C27
C31
C35, C151
C36
CD20
D20
L150, L151
N170
1nF
2,2µF
220uF/35V
68pF
1uF
100pF
100nF
74C14
100uH
LM2904
0805 (SMD)
1210 (SMD)
SMD
0603 (SMD)
1206 (SMD)
0603 (SMD)
1206 (SMD)
SOIC 14 (SMD)
1210 (SMD)
SOIC 8 (SMD)
Capacitor X7R
Capacitor X7R
Longlife-Elko
Capacitor NP0
Capacitor X7R
Capacitor NP0
Capacitor X7R
Logic-IC 74C...
Inductor
Operational Amplifier
6
R111, R112, R113, R201, R211,
R212, R 213
0,51Ohm
Melf (SMD)
2%
2
1
2
3
1
1
3
3
6
1
2
3
1
1
1
1
2
1
R157, R171
R158
R163, R263
R170, R174, R176
R175
R177
R27, R178, R179
R28, R50, R52
R30, R31, R32, R33, R34, R37
R36
R43, R45
R47, R54, R56
R51
R53
R57
R58
R60, R61
R62
15,0KOhm
10,0Ohm
10,0KOhm
30,1KOhm
5,62KOhm
3,01KOhm
0,00Ohm
10,0KOhm
5,11KOhm
3,32KOhm
0,00Ohm
10,0KOhm
121KOhm
100Ohm
1,50KOhm
1,00KOhm
2,00KOhm
3,92KOhm
0603 (SMD)
0603 (SMD)
MiniMelf (SMD)
0603 (SMD)
MiniMelf (SMD)
1206 (SMD)
MiniMelf (SMD)
MicroMelf (SMD)
MicroMelf (SMD)
0603 (SMD)
0603 (SMD)
0603 (SMD)
0603 (SMD)
MicroMelf (SMD)
MicroMelf (SMD)
0603 (SMD)
0603 (SMD)
0603 (SMD)
1%
1%
1%
1%
1%
1%
1%
1%
1%
1%
1%
1%
1%
6
V111, V112, V113, V211, V212,
V213
10BQ100
SMB (SMD)
Diode Schottky
2
2
1
5
1
1
4
V150, V250
V170, V171
V20
V23, V25, V26, V27, V29
V28
X20
X6, X7, X10, X11
BY203/20S
BAV70W
SMCJ15
BC847B
BZX284-C7V5
20p.
RM2,54 10p.
SMD
SOT323 (SMD)
DO214AB (SMD)
SOT23 (SMD)
SOD110 (SMD)
SMD
SMD
High Voltage Diode
Double Diode
Suppressor Diode
NPN-Transistor
Zener-Diode
Connector
Box Connector
1%
1%
1%
TP: Test Point
Box Connector: SUYIN 254100FA010G200ZU
© by SEMIKRON / 2015-05-05 / Technical Explanation / Board 3s SKYPER® 32PRO R
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Figure
Figure
Figure
Figure
Figure
Figure
Figure
Figure
Figure
Figure
Table
Table
Table
Table
Table
Table
Table
Table
1: Board 3s SKYPER® 32PRO R ................................................................................................2
2: Dimensions in mm .............................................................................................................4
3: Adaptor Board ...................................................................................................................5
4: Connector X20 (Assmann AWHW 20G SMD) ..........................................................................6
5: Connection IF_CMN_nHALT .................................................................................................8
6: Adaptor Board & Driver Core Mounting ............................................................................... 12
7: Schematic I Adaptor Board ................................................................................................ 13
8: Schematic II Adaptor Board .............................................................................................. 14
9: Schematic III Adaptor Board ............................................................................................. 15
10: Parts List Adaptor Board.................................................................................................. 16
1:
1:
2:
3:
4:
5:
6:
7:
Quality ...............................................................................................................................3
PIN Array ...........................................................................................................................7
DT adjustment ....................................................................................................................8
RCE & CCE ............................................................................................................................9
RVCE ...................................................................................................................................9
RGon & RGoff .........................................................................................................................9
RG1, RG2, RG3 ..................................................................................................................... 10
RGoff_SC ............................................................................................................................. 10
References
[1] www.SEMIKRON.com
[2] A. Wintrich, U. Nicolai, W. Tursky, T. Reimann, “Application Manual Power Semiconductors”, ISLE
Verlag 2011, ISBN 978-3-938843-666
HISTORY
SEMIKRON reserves the right to make changes without further notice herein
DISCLAIMER
SEMIKRON reserves the right to make changes without further notice herein to improve reliability, function
or design. Information furnished in this document is believed to be accurate and reliable. However, no
representation or warranty is given and no liability is assumed with respect to the accuracy or use of such
information, including without limitation, warranties of non-infringement of intellectual property rights of
any third party. SEMIKRON does not assume any liability arising out of the application or use of any
product or circuit described herein. Furthermore, this technical information may not be considered as an
assurance of component characteristics. No warranty or guarantee expressed or implied is made regarding
delivery, performance or suitability. This document supersedes and replaces all information previously
supplied and may be superseded by updates without further notice.
SEMIKRON products are not authorized for use in life support appliances and systems without the express
written approval by SEMIKRON.
SEMIKRON INTERNATIONAL GmbH
P.O. Box 820251 • 90253 Nuremberg • Germany
Tel: +49 911-65 59-234 • Fax: +49 911-65 59-262
sales.skd@semikron.com • www.semikron.com
© by SEMIKRON / 2015-05-05 / Technical Explanation / Board 3s SKYPER® 32PRO R
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