Board 3S SKYPER 32 PRO R Gold Absolute Maximum Ratings SKYPER® Symbol Conditions Vs Supply voltage primary 16 V IoutPEAK Output peak current 15 A Output average current 50 mA fmax Max. switching frequency 50 kHz VCE Collector emitter voltage sense across the IGBT 1700 V 4000 V 1100 V 1500 V Visol IO VisolPD Visol12 Target Data Unit IoutAVmax Adaptor board Board 3S SKYPER 32 PRO R Gold Values Insulation test voltage input - output (AC, rms, 2s) Partial discharge extinction voltage, rms, QPD ̞ 10pC Insulation test voltage output 1 - output 2 (AC, rms, 2s) RGon min Minimum rating for external RGon 1.5 Ω RGoff min Minimum rating for external RGoff 1.5 Ω Top Operating temperature -40 ... 85 °C Tstg Storage temperature -40 ... 85 °C Features • Two output channels • Gold nickel finish • Failure management Characteristics Symbol Conditions min. typ. max. Unit Vs Supply voltage primary side 14.4 15 15.6 V 12.3 V Typical Applications* Vi Input signal voltage on / off • Adaptor board for SKYPER 32 IGBT drivers in bridge circuits for industrial applications • PCB with gold plating • DC bus up to 900V VIT+ Input treshold voltage HIGH Footnote VIT- Input threshold voltage (LOW) VG(on) Turn on output voltage 15 / 0 4.6 V V 15 V VG(off) Turn off output voltage -7 V td(on)IO Input-output turn-on propagation time 1.2 µs td(off)IO Input-output turn-off propagation time 1.2 µs With external high voltage diode Please note: the insulation test is not performed as a series test at SEMIKRON and must be performed by the user according to VDE 0110-20 Insulation coordination in compliance with EN50178 PD2 Operating temperature is real ambient temperature around the driver core Degree of protection: IP00 Adaptor board © by SEMIKRON Rev. 0.1 – 09.07.2015 1 Board 3S SKYPER 32 PRO R Gold This is an electrostatic discharge sensitive device (ESDS), international standard IEC 60747-1, Chapter IX * The specifications of our components may not be considered as an assurance of component characteristics. Components have to be tested for the respective application. Adjustments may be necessary. The use of SEMIKRON products in life support appliances and systems is subject to prior specification and written approval by SEMIKRON. We therefore strongly recommend prior consultation of our staff. 2 Rev. 0.1 – 09.07.2015 © by SEMIKRON Technical Explanation ® Board 3s SKYPER 32PRO R Revision: 03 Issue date: 2015-05-05 Prepared by: H.Flohrer Approved by: J.Krapp Keyword: IGBT Driver, Adapter Board SKYPER 1. Application and Handling Instructions............................................................................................2 2. Further application support ..........................................................................................................2 3. General Description ....................................................................................................................2 4. Quality ......................................................................................................................................3 5. Dimensions ................................................................................................................................4 6. Component Placement Layout ......................................................................................................5 7. PIN Array ..................................................................................................................................6 8. Signal IF_CMN_nHALT.................................................................................................................8 9. Setting Dead Time ......................................................................................................................8 10. Setting Dynamic Short Circuit Protection .......................................................................................9 11. Collector Series Resistance ..........................................................................................................9 12. Adaptation Gate Resistors............................................................................................................9 13. Adaptation Decoupling Gate Resistors ......................................................................................... 10 14. Setting Soft Turn-Off ................................................................................................................ 10 15. Temperature Signal .................................................................................................................. 10 16. Over Temperature Protection Circuit (OTP) .................................................................................. 11 17. Mounting Notes ........................................................................................................................ 12 18. Schematics .............................................................................................................................. 13 19. Parts List ................................................................................................................................. 16 Please note: All values in this technical explanation are typical values. Typical values are the average values expected in large quantities and are provided for information purposes only. These values can and do vary in different applications. All operating parameters should be validated by user’s technical experts for each application. © by SEMIKRON / 2015-05-05 / Technical Explanation / Board 3s SKYPER® 32PRO R PROMGT.1023/ Rev.4/ Template Technical Explanation Page 1/17 1. • Application and Handling Instructions Please provide for static discharge protection during handling. As long as the hybrid driver is not completely assembled, the input terminals have to be short-circuited. Persons working with devices have to wear a grounded bracelet. Any synthetic floor coverings must not be statically chargeable. Even during transportation the input terminals have to be short-circuited using, for example, conductive rubber. Worktables have to be grounded. The same safety requirements apply to MOSFET- and IGBTmodules. Any parasitic inductances within the DC-link have to be minimised. Over-voltages may be absorbed by C- or RCD-snubber networks between main terminals for PLUS and MINUS of the power module. When first operating a newly developed circuit, SEMIKRON recommends to apply low collector voltage and load current in the beginning and to increase these values gradually, observing the turn-off behaviour of the free-wheeling diode and the turn-off voltage spikes generated across the IGBT. An oscillographic control will be necessary. Additionally, the case temperature of the module has to be monitored. When the circuit works correctly under rated operation conditions, short-circuit testing may be done, starting again with low collector voltage. It is important to feed any errors back to the control circuit and to switch off the device immediately in failure events. Repeated turn-on of the IGBT into a short circuit with a high frequency may destroy the device. The inputs of the hybrid driver are sensitive to over-voltage. Voltages higher than VS +0,3V or below 0,3V may destroy these inputs. Therefore, control signal over-voltages exceeding the above values have to be avoided. The connecting leads between hybrid driver and the power module should be as short as possible (max. 20cm), the driver leads should be twisted. • • • • • 2. Further application support Latest information is available at http://www.semikron.com. For design support please read the SEMIKRON Application Manual Power Modules available at http://www.semikron.com. 3. General Description The Board 3s SKYPER® 32PRO R is an adaptor board for the IGBT module SEMiX® 3s (spring contact version). The board can be customized allowing adaptation and optimization to the used SEMiX ® Module. The switching characteristic of the IGBT can be influenced through user settings, e.g. changing turn-on and turn-off speed by variation of RGon and RGoff. Furthermore, it is possible to adjust the monitoring level and blanking time for the DSCP (see Technical Explanations SKYPER® 32PRO R). Please note: This technical explanation is based on the Technical Explanations for SKYPER ® 32PRO R. Please read the Technical Explanations SKYPER® 32 PRO R before using the Adaptor Board. Figure 1: Board 3s SKYPER® 32PRO R © by SEMIKRON / 2015-05-05 / Technical Explanation / Board 3s SKYPER® 32PRO R Page 2/17 4. Quality Table 1: Quality End test test category test describtion standard AOI Automated Optical Inspection Control of accurate placement of components/ of solder joints SEMIKRON ICT In-Circuit Test Test of the populated PCB, checking the correctly fabrication SEMIKRON Type test test category test conditions standard EP Electrical Parameters Jamb = -40°C / +85°C SEMIKRON SP STEP Test, Interrupted PS 20x 10µs to 2s EN61000-4-29 Iso Isolation Test High voltage test 4kV, 60s EN 61800-5-1 TC Thermal Cycling 200 cycles, Tstgmax – Tstgmin IEC60068-2-14 PD Partial discharge test >1,2 kV; suitable for 1000V DC Link VDE 0110-20 TH Temperature Humidity 85°C, 85% RH, 96h IEC 60068-2-67 VB Vibration Sinus 20/2000Hz Random 10/2000Hz, 5g, 26 per x,y,z IEC 60068-2-6 SH Shock Half-sinus pulse, 30g, 6000 shocks, 6ms, ±x, ± y, ± z IEC 60068-2-29 © by SEMIKRON / 2015-05-05 / Technical Explanation / Board 3s SKYPER® 32PRO R Page 3/17 5. Dimensions Figure 2: Dimensions in mm 40,37 16,73 Ø3 33,01 Ø3 X10 9 10 9 10 Ø 3 1 2 9 10 58,01 Ø 3,5 Ø 3,2 Ø3 1 2 1 2 Ø3 Ø3 20 19 9 10 Ø3 Ø X20 3,5 Ø 3,2 1 2 2 1 Ø 3,2 66 20,3 23,01 24,11 8,01 2,77 Ø 1,3 2,54 97,27 10,1 13,2 100 © by SEMIKRON / 2015-05-05 / Technical Explanation / Board 3s SKYPER® 32PRO R Page 4/17 6. Component Placement Layout Figure 3: Adaptor Board © by SEMIKRON / 2015-05-05 / Technical Explanation / Board 3s SKYPER® 32PRO R Page 5/17 7. PIN Array Figure 4: Connector X20 (Assmann AWHW 20G SMD) Product information of suitable female connectors and distributor contact information is available at e.g. http://www.harting.com (part number 09 18 520 6 813). © by SEMIKRON / 2015-05-05 / Technical Explanation / Board 3s SKYPER® 32PRO R Page 6/17 Table 2: PIN Array PIN Signal Function Specification X20:01 IF_PWR_15P Drive power supply Stabilised +15V ±4% X20:02 IF_PWR_GND GND for power supply X20:03 IF_PWR_15P Drive power supply X20:04 IF_PWR_GND GND for power supply X20:05 IF_PWR_15P Drive power supply X20:06 IF_PWR_GND GND for power supply X20:07 reserved X20:08 IF_PWR_GND GND for power supply X20:09 IF_CMN_nHALT Driver core status signal (bidirectional signal with dominant recessive behaviour) X20:10 reserved X20:11 reserved X20:12 IF_CMN_GND X20:13 reserved X20:14 reserved X20:15 IF_HB_TOP Switching signal input (TOP switch) Digital 15 V logic; 10 kOhm impedance; LOW = TOP switch off; HIGH = TOP switch on X20:16 IF_HB_BOT Switching signal input (BOTTOM switch) Digital 15 V logic; 10 kOhm impedance; LOW = BOT switch off; HIGH = BOT switch on X20:17 reserved X20:18 IF_HB_GND X20:19 reserved X20:20 reserved Stabilised +15V ±4% Stabilised +15V ±4% Digital 15V logic; LOW (dominant) = driver disabled; HIGH (recessive) = ready to operate GND for signal IF_CMN_nHALT GND for signals IF_HB_TOP & F_HB_BOT © by SEMIKRON / 2015-05-05 / Technical Explanation / Board 3s SKYPER® 32PRO R Page 7/17 8. Signal IF_CMN_nHALT The Halt Logic Signals PRIM_HALT_IN and PRIM_HALT_OUT of the driver core are coupled to one bidirectional signal (IF_CMN_nHALT) with dominant recessive behaviour. IF_CMN_nHALT shows the driver core status. When IF_CMN_nHALT is HIGH (recessive), the driver core is ready to operate. When IF_CMN_nHALT is LOW (dominant), the driver core is disabled / not ready to operate because of e. g. detected failure or driver core system start. A controller can hold with the IF_CMN_nHALT signal the driver core in a safe state (e.g. during a start up of a system or gathered failure signal of other hardware) or generate a coeval release of paralleled driver. Furthermore, paralleled drivers can send and receive IF_CMN_nHALT signals among each other by using a single-wire bus. Figure 5: Connection IF_CMN_nHALT User Side +15V Rpull_up_int 5,1K STATUS SIGNAL GND 9. Setting Dead Time Table 3: DT adjustment Designation Pattern Name Setting R43 (connected to GND) 0603 PRIM_CFG_TDT2_IN Factory setting: 0Ω R44 (connected to GND) 0603 PRIM_CFG_SELECT_IN Factory setting: not equipped R45 (connected to GND) 0603 PRIM_CFG_TDT3_IN Factory setting: 0Ω R46 (connected to GND) 0603 PRIM_CFG_TDT1_IN Factory setting: not equipped Factory setting: 3,3µs © by SEMIKRON / 2015-05-05 / Technical Explanation / Board 3s SKYPER® 32PRO R Page 8/17 10. Setting Dynamic Short Circuit Protection Table 4: RCE & CCE Designation Pattern Name Setting R162 1206 RCE Factory setting: not equipped TOP C150 1206 CCE Factory setting: not equipped TOP R262 1206 RCE Factory setting: not equipped BOT C250 1206 CCE Factory setting: not equipped BOT 11. Collector Series Resistance Table 5: RVCE Designation Pattern Name Setting R150 MiniMELF RVCE * Factory setting: not equipped TOP R250 MiniMELF RVCE * Factory setting: not equipped BOT * 1200V IGBT operation: 0Ω 1700V IGBT operation: 1kΩ / 0,4W 12. Adaptation Gate Resistors Table 6: RGon & RGoff Designation Pattern Name Setting R151, R152, R153 (parallel connected) MiniMELF RGon Factory setting: not equipped TOP R154, R155, R156 (parallel connected) MiniMELF RGoff Factory setting: not equipped TOP R251, R252, R253 (parallel connected) MiniMELF RGon Factory setting: not equipped BOT R254, R255, R256 (parallel connected) MiniMELF RGoff Factory setting: not equipped BOT © by SEMIKRON / 2015-05-05 / Technical Explanation / Board 3s SKYPER® 32PRO R Page 9/17 13. Adaptation Decoupling Gate Resistors For details to the decoupling gate resistors and recommended values, see Modules Explanations and Data Sheets SEMiX®. Table 7: RG1, RG2, RG3 Designation Pattern Name Setting R101 MELF RG1 Factory setting: not equipped TOP R102 MELF RG2 Factory setting: not equipped TOP R103 MELF RG3 Factory setting: not equipped TOP R201 MELF RG1 Factory setting: not equipped BOT R202 MELF RG2 Factory setting: not equipped BOT R203 MELF RG3 Factory setting: not equipped BOT Designation Pattern Name Setting R160, R161 (parallel connected) MiniMELF RGoff_SC Factory setting: not equipped TOP R260, R261 (parallel connected) MiniMELF RGoff_SC Factory setting: not equipped BOT 14. Setting Soft Turn-Off Table 8: RGoff_SC 15. Temperature Signal The temperature sensor inside the SEMiX® module is directly connected to contacting points T1 and T2. For details to the temperature sensor, see Modules Explanations SEMiX®. Safety Warnings: The contacting points T1 and T2 are not electrical isolated. Due to high voltage that may be present at the contacting points T1 and T2, some care must be taken in order to avoid accident. There is no cover or potential isolation that protect the high voltage sections / wires from accidental human contact. Please note: If the contacting points T1 and T2 are used for adaptor of the temperature sensor, the Over Temperature Protection Ciruit must be disabled by taking out the resistors R175, R178 and R179. © by SEMIKRON / 2015-05-05 / Technical Explanation / Board 3s SKYPER® 32PRO R Page 10/17 16. Over Temperature Protection Circuit (OTP) The external error input SEC_TOP_ERR_IN on the secondary side (high potential) of the driver core is used for an over temperature protection circuit to place the gate driver into halt mode. Dimensioning OTP [1] Define an over temperature trip level according to the application. [2] Calculate the nominal ohmic resistance value of the temperature sensor at the defined trip level (see "Modules – Explanations - SEMiX®" on SEMiX® product overview page at http://www.semikron.com). [3] The trip level on the adapter board is set with R172 by using the calculated resistance value. • Factory setting R172: not equipped • If no resistor is used, a failure signal is generated. © by SEMIKRON / 2015-05-05 / Technical Explanation / Board 3s SKYPER® 32PRO R Page 11/17 17. Mounting Notes The electrical connections between adaptor board and SEMiX ® are realised via spring contacts integrated in SEMiX® power modules and via landing pads on the bottom side of the adaptor board. Figure 6: Adaptor Board & Driver Core Mounting [1] Soldering of components (e.g. RGon, RGoff, etc.) on adapter board. [2] Adaptor Board has to be fixed to the SEMiX® module (see "Mounting Instruction and Application Notes for SEMiX® IGBT modules" on SEMiX® product overview page at http://www.semikron.com). [3] Insert driver core into the box connector on adaptor board. SKYPER™ 32PRO Support post Printed Ciruit Board The connection between driver core and adaptor board should be mechanical reinforced by using support posts. The posts have to be spaced between driver core and adaptor board. Product information of suitable support posts and distributor contact information is available at e.g. http://www.richco-inc.com (e.g. part number DLMSPM-8-01, LCBST-8-01). © by SEMIKRON / 2015-05-05 / Technical Explanation / Board 3s SKYPER® 32PRO R Page 12/17 18. Schematics Figure 7: Schematic I Adaptor Board © by SEMIKRON / 2015-05-05 / Technical Explanation / Board 3s SKYPER® 32PRO R Page 13/17 Figure 8: Schematic II Adaptor Board © by SEMIKRON / 2015-05-05 / Technical Explanation / Board 3s SKYPER® 32PRO R Page 14/17 Figure 9: Schematic III Adaptor Board © by SEMIKRON / 2015-05-05 / Technical Explanation / Board 3s SKYPER® 32PRO R Page 15/17 19. Parts List Figure 10: Parts List Adaptor Board Count Ref. Designator Value Pattern Name Description 7 C170, C171, C173, C174, C175, C176, CN170 100nF 0805 (SMD) Capacitor X7R 6 1 1 1 2 1 1 1 2 1 C20, C21, C22, C23, C24, C25 C26 C27 C31 C35, C151 C36 CD20 D20 L150, L151 N170 1nF 2,2µF 220uF/35V 68pF 1uF 100pF 100nF 74C14 100uH LM2904 0805 (SMD) 1210 (SMD) SMD 0603 (SMD) 1206 (SMD) 0603 (SMD) 1206 (SMD) SOIC 14 (SMD) 1210 (SMD) SOIC 8 (SMD) Capacitor X7R Capacitor X7R Longlife-Elko Capacitor NP0 Capacitor X7R Capacitor NP0 Capacitor X7R Logic-IC 74C... Inductor Operational Amplifier 6 R111, R112, R113, R201, R211, R212, R 213 0,51Ohm Melf (SMD) 2% 2 1 2 3 1 1 3 3 6 1 2 3 1 1 1 1 2 1 R157, R171 R158 R163, R263 R170, R174, R176 R175 R177 R27, R178, R179 R28, R50, R52 R30, R31, R32, R33, R34, R37 R36 R43, R45 R47, R54, R56 R51 R53 R57 R58 R60, R61 R62 15,0KOhm 10,0Ohm 10,0KOhm 30,1KOhm 5,62KOhm 3,01KOhm 0,00Ohm 10,0KOhm 5,11KOhm 3,32KOhm 0,00Ohm 10,0KOhm 121KOhm 100Ohm 1,50KOhm 1,00KOhm 2,00KOhm 3,92KOhm 0603 (SMD) 0603 (SMD) MiniMelf (SMD) 0603 (SMD) MiniMelf (SMD) 1206 (SMD) MiniMelf (SMD) MicroMelf (SMD) MicroMelf (SMD) 0603 (SMD) 0603 (SMD) 0603 (SMD) 0603 (SMD) MicroMelf (SMD) MicroMelf (SMD) 0603 (SMD) 0603 (SMD) 0603 (SMD) 1% 1% 1% 1% 1% 1% 1% 1% 1% 1% 1% 1% 1% 6 V111, V112, V113, V211, V212, V213 10BQ100 SMB (SMD) Diode Schottky 2 2 1 5 1 1 4 V150, V250 V170, V171 V20 V23, V25, V26, V27, V29 V28 X20 X6, X7, X10, X11 BY203/20S BAV70W SMCJ15 BC847B BZX284-C7V5 20p. RM2,54 10p. SMD SOT323 (SMD) DO214AB (SMD) SOT23 (SMD) SOD110 (SMD) SMD SMD High Voltage Diode Double Diode Suppressor Diode NPN-Transistor Zener-Diode Connector Box Connector 1% 1% 1% TP: Test Point Box Connector: SUYIN 254100FA010G200ZU © by SEMIKRON / 2015-05-05 / Technical Explanation / Board 3s SKYPER® 32PRO R Page 16/17 Figure Figure Figure Figure Figure Figure Figure Figure Figure Figure Table Table Table Table Table Table Table Table 1: Board 3s SKYPER® 32PRO R ................................................................................................2 2: Dimensions in mm .............................................................................................................4 3: Adaptor Board ...................................................................................................................5 4: Connector X20 (Assmann AWHW 20G SMD) ..........................................................................6 5: Connection IF_CMN_nHALT .................................................................................................8 6: Adaptor Board & Driver Core Mounting ............................................................................... 12 7: Schematic I Adaptor Board ................................................................................................ 13 8: Schematic II Adaptor Board .............................................................................................. 14 9: Schematic III Adaptor Board ............................................................................................. 15 10: Parts List Adaptor Board.................................................................................................. 16 1: 1: 2: 3: 4: 5: 6: 7: Quality ...............................................................................................................................3 PIN Array ...........................................................................................................................7 DT adjustment ....................................................................................................................8 RCE & CCE ............................................................................................................................9 RVCE ...................................................................................................................................9 RGon & RGoff .........................................................................................................................9 RG1, RG2, RG3 ..................................................................................................................... 10 RGoff_SC ............................................................................................................................. 10 References [1] www.SEMIKRON.com [2] A. Wintrich, U. Nicolai, W. Tursky, T. Reimann, “Application Manual Power Semiconductors”, ISLE Verlag 2011, ISBN 978-3-938843-666 HISTORY SEMIKRON reserves the right to make changes without further notice herein DISCLAIMER SEMIKRON reserves the right to make changes without further notice herein to improve reliability, function or design. Information furnished in this document is believed to be accurate and reliable. However, no representation or warranty is given and no liability is assumed with respect to the accuracy or use of such information, including without limitation, warranties of non-infringement of intellectual property rights of any third party. SEMIKRON does not assume any liability arising out of the application or use of any product or circuit described herein. Furthermore, this technical information may not be considered as an assurance of component characteristics. No warranty or guarantee expressed or implied is made regarding delivery, performance or suitability. This document supersedes and replaces all information previously supplied and may be superseded by updates without further notice. SEMIKRON products are not authorized for use in life support appliances and systems without the express written approval by SEMIKRON. SEMIKRON INTERNATIONAL GmbH P.O. Box 820251 • 90253 Nuremberg • Germany Tel: +49 911-65 59-234 • Fax: +49 911-65 59-262 [email protected] • www.semikron.com © by SEMIKRON / 2015-05-05 / Technical Explanation / Board 3s SKYPER® 32PRO R Page 17/17