CL-L103 Th P789 0710 E

Heat dissipation design is a precondition in order to maximize the performance
of the LED. In this document, the data that is deemed necessary in the detailed
heat dissipation structure of the products and the heat dissipation design of the
lighting apparatus is provided as a reference for the appropriate thermal design.
CONTENTS
1.
Introduction
P.2
2.
Package structure and thermal resistance
P.2
3.
Thermal design outside the package
P.3
4-1. Simulation ( CL-L103-C3 )
P.4
4-2. Simulation ( CL-L103-C6 )
P.5
Heat dissipation structure that can conduct heat
radiated from LEDs efficiently
1.
Introduction
Significance of the heat dissipation structure
The light-emitting diode of an LED package radiates light
and heat according to the input power. However, the surface
area of an LED package is quite small, and the package
itself is expected to release little heat into the atmosphere.
An external radiator such as a heat sink is thus required.
The heat dissipation structure up to the connection portion
of the external radiator uses mainly heat conduction.
Regarding LED packages, to control the junction temperature of the light-emitting diode Tj is important. The Tj must
be kept from exceeding the absolute maximum rating in the
specifications under any conditions. As direct measurement
of the junction temperature of a light-emitting diode inside a
package is difficult, the temperature of a particular part on
2.
the external package ( the case temperature ) Tc [°C] is
normally measured. Tj [°C] is calculated using the thermal
resistance between the junction and the case Rj-c [°C/W],
and the emitted heat amount that is nearly equal to the input
power Pd [W]. The heat generated at the light-emitting
diode can be conducted to the external radiator efficiently
because the package structure for the CL-L103 series
minimizes the thermal resistance Rj-c.
This document describes the detailed heat dissipation
structure of the CL-L103 series and provides data necessary
for thermal design of the lighting apparatus to maximize LED
performance.
Package structure and thermal resistance
Understanding the junction temperature
The cross-sectional structure example, where the package of
the CL-L103 series is connected to an external heat sink, is
shown in Figure-1 ( a ). The package has a laminated structure
of an aluminum substrate, insulating layers and conductive
copper foil patterns.
A distinctive point is that the light-emitting diode is mounted
directly on the well conductive aluminum substrate not on the
insulating layer, which has low thermal conductivity. Thus, the
heat generated at the light-emitting diode can be efficiently
conducted to the outside of the package.
The aluminum substrate side of the package outer shell is
thermally connected to the heat sink via heat-dissipation grease
( or adhesive ). As described above, the heat generated in the
junction section of the light-emitting diode is transferred mainly to
the heat sink using heat conduction, through the light-emitting
diode to the adhesive for die-mounting to the aluminum
■Figure-1 ( a ) Cross Section
Cross-section diagram
Aluminum
Bond
Heat Sink
LED die
Tj
Rj-c
Tc
Rb
substrate to the grease ( adhesive ). The thermal resistance
between the junction section of the light-emitting diode and the
aluminum substrate side of the package outer shell is Rj-c, and
the specific thermal resistance value of the package.
Therefore, the following formula is used
Tj = Rj-c・Pd + Tc
In addition, the thermal resistance of the grease ( adhesive )
outside the package is Rb [°C/W], the thermal resistance with the
heat sink is Rh [°C/W], and the ambient temperature is Ta [°C].
Figure-2 ( b ) indicates the equivalent thermal resistance along
the cross-sectional diagram in Figure-2 ( a ). As indicated, the
thermal resistances Rj-c, Rb, and Rh ■Figure-2 ( a )
Thermal Resistance
are connected in series between the
Connection
junction temperature Tj and the
ambient temperature Ta. The thermal
Tj
Tj
resistances outside the package Rb
and Rh can be integrated into the
Rj-c
Rj-c
Tc
thermal resistance Rc-a at this point.
Tc
Thus, the following formula is also
Rb
Rc-a
used:
Tj = ( Rj-c + Rc-a )・Pd + Ta
Rh
Ta
Rh
Ta
Ta
Use the correlation between the thermal resistance
and the ambient temperature for design
of the external heat dissipation mechanism
3.
Thermal design of the outside the package
Point of the external heat dissipation mechanism
The thermal resistance outside the package Rc-a
[°C/W], which is the combination of the heatdissipation grease ( adhesive ) and the heat sink, is
limited by the input power Pd [W], the ambient
temperature Ta [°C], and the thermal resistance of the
package Rj-c [°C/W], i.e.,
maximum rating value in the specifications for the
CL-L103-C3 package.
The higher the ambient temperature Ta and the larger
the driving current, the smaller the allowable thermal
resistance outside the package Rc-a = Rb + Rh.
In brief, the grease ( adhesive ) and the heat sink, with
smaller thermal resistance ( this means better heat
dissipation ) , are required in order to keep Tj from
exceeding 120°C, the absolute maximum rating in the
specifications, if the ambient temperature becomes
higher and/or the driving current is larger. Therefore,
use Figure-2 as a guide when selecting the external
heat dissipation parts, and ultimately conduct thermal
verification on actual devices.
In addition, the equivalent chart in the case of the
CL-L103-C6 package is indicated in Figure-3 for
reference.
Tj = ( Rj-c + Rc-a )・Pd + Ta Rc-a = ( Tj - Ta ) / Pd - Rj-c
Tj function converted from the above formula is
Rc-a = -Ta / Pd + Tj / Pd - Rj-c
and it is a straight line with the slope of -1 / Pd and the
intercept of Tj / Pd - Rj-c.
Figure-2 is the chart showing the relationship between
the ambient temperature Ta and the thermal resistance
outside the package Rc-a indicated by driving current,
where Tj is assumed to be 120°C - the absolute
■Figure-2 Ta-Rc-a ( CL-103-C3 )
■Figure-3 Ta-Rc-a ( CL-103-C6 )
( ℃/W )
Rj-c=6.4( ℃/W )
100
80
150mA
30
350mA
240mA
25
480mA
700mA
20
420mA
Rc-a
Rc-a
Rj-c=5.0( ℃/W )
35
350mA
60
40
840mA
15
10
20
0
( ℃/W )
5
0
20
40
60
Ta
80
100
(℃)
0
0
20
40
60
Ta
80
100
(℃)
4-1. Simulation ( CL-L103-C3 Series )
For efficient thermal design
A simulation is an effective procedure with regard to
Structure figure of analytical model
the thermal design. Simulation results from when the
package of CL-L103-C3 was connected to the heat sink
Thermal conductive grease
with a heat conductive sheet are shown in Fig.4 ( a ), ( b ).
CL-L103-C3
Boundary conditions
Ambient temperature : Ta = 25°C
Heat conductivity : 5W/m.K
Heat dissipation coefficient of the heat sink : 0.2
Contact resistance : Not taken into consideration
L
W
( Variable )
Model conditions
H
Heat conductivity of the heat conductive sheet : 4.5W/m.K
Thickness of the heat conductive sheet : t=0.12mm
Heat sink material : Aluminum ( Number of the fin=6 )
Dimensions : W : 64mm x H : 40mm x L : ( variable )
■図4(b) Characteristic of input power - junction temperature Tj
( Ŋ)70
80
( Ŋ)
Input Power : 3.255W ( Rated input )
65
Junction temperature Tj
Junction temperature Tj
■図4(a)Characteristic of heat sink surface area - junction temperature Tj
60
55
50
45
0
50000
100000
150000
Surface area of the heatsink
200000
250000
70
S=26,613m m 2
60
50
40
30
20
0
( mm )
2
* Above data represents simulation values and is not guaranteed to represent actual measurement values.
Evaluation and verification shall be conducted under the conditions of actual use.
1
2
Pd
3
4
( W)
4-2. Simulation ( CL-L103-C6 Series )
Structure figure of analytical model
In addition, results from a simulation where the package of CL-L103-C6 is connected to the heat sink with
Thermal conductive grease
the heat conductive sheet are indicated in Fig.5 ( a ),( b ).
CL-L103-C6
Boundary conditions
Ambient temperature : Ta = 25°C
Heat conductivity : 5W/m.K
Heat dissipation coefficient of the heat sink : 0.2
Contact resistance : Not taken into consideration
L
W
( Variable )
Model conditions
Heat conductivity of the heat conductive sheet : 4.5W/m.K
H
Thickness of the heat conductive sheet : t=0.12mm
Heat sink material : Aluminum ( Number of the fin=6 )
Dimensions : W : 64mm x H : 40mm x L : ( variable )
■図5(a)Characteristic of heat sink surface area - junction temperature Tj
( Ŋ)95
( Ŋ)130
120
85
Junction Temperature Tj
Junction temperature Tj
90
Input Power : 6.51W ( Rated input )
80
75
70
65
60
■図5(b)Characteristic of input power - junction temperature Tj
110
100
90
80
70
S = 26,613mm2
60
50
40
30
0
50000
100000
150000
Surface area of the heatsink.
200000
250000
20
0
( mm2 )
* Above data represents simulation values and is not guaranteed to represent actual measurement values.
Evaluation and verification shall be conducted under the conditions of actual use.
2
4
6
Pd
8
10
12
(W)
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