Datasheet

AOZ1312
Single Channel USB Switch
General Description
Features
The AOZ1312 is a member of Alpha and Omega
Semiconductor’s single-channel power-distribution
switch family intended for applications where heavy
capacitive loads and short-circuits are likely to be
encountered. This device incorporates a 70 mΩ
N-channel MOSFET power switch for power-distribution
systems. The switch is controlled by a logic enable input.
Gate drive is provided by an internal charge pump
designed to control the power-switch rise time and fall
time to minimize current surges during switching. The
charge pump requires no external components and
allows operation from supplies as low as 2.7 V.
z Typical 70 mΩ (NFET)
The AOZ1312 is available in an SO-8 or eMSOP-8
package and is rated over the -40 °C to +85 °C ambient
temperature range.
z 1.5A maximum continuous current
z Vin range of 2.7 V to 5.5 V
z Open Drain Fault Flag
z Fault Flag deglitched (blanking time)
z Thermal shutdown
z Reverse current blocking
z Packages: SO-8 and eMSOP-8
Applications
z Notebook Computers
z Desktop Computers
Typical Application
VIN
OUT
IN
R1
10kΩ
AOZ1312
Cin
LOAD
C2
0.1μF
C1
22μF
OC
EN
GND
Rev. 1.1 July 2011
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Page 1 of 13
AOZ1312
Ordering Information
Maximum
Continuous Current
Part Number
Typical Short-circuit
Current Limit
Enable
Setting
Channel 1 Channel 2 Channel 1 Channel 2
AOZ1341AI
AOZ1341EI
AOZ1341AI-1
Active Low
1A
1A
1.5 A
1.5 A
Active High
AOZ1341EI-1
AOZ1342PI
AOZ1342PI-1
1.5 A
1.5A
2A
2A
AOZ1343EI*
1.5 A
0.5A
2A
AOZ1312AI-1
AOZ1312EI-1
AOZ1310CI-1
EPAD MSOP-8
EPAD SO-8
Active High
AOZ1343EI-1*
SO-8
EPAD SO-8
0.75 A
1.5 A
None
2A
None
Active High
0.5 A
None
0.75 A
None
Active High
Environmental
EPAD MSOP-8
Active Low
Active Low
Output
Discharge
SO-8
Active High
AOZ1343AI*
AOZ1343AI-1*
Package
SO-8
No
Green Product
RoHS Compliant
EPAD MSOP-8
SO-8
EPAD MSOP-8
SO-8
EPAD MSOP-8
SOT23-5
*Contact factory for availability
AOS Green Products use reduced levels of Halogens, and are also RoHS compliant.
Please visit www.aosmd.com/web/quality/rohs_compliant.jsp for additional information.
Pin Configuration
AOZ1312
GND
1
8
NC
IN
2
7
OUT
IN
3
6
OUT
EN
4
5
OC
eMSOP-8 / SO-8
(Top View)
Pin Description
Pin Name
Pin Number
GND
1
Pin Function
Ground
IN
2, 3
EN
4
Enable input, logic high turns on power switch, IN-OUT
OC
5
Overcurrent, open-drain output, active low, IN-OUT
OUT
6, 7
NC
8
Rev. 1.1 July 2011
Input voltage
Power-switch output, IN-OUT
No connection
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Page 2 of 13
AOZ1312
Absolute Maximum Ratings
Recommended Operating Conditions
Exceeding the Absolute Maximum Ratings may damage the
device.
The device is not guaranteed to operate beyond the
Recommended Operating Conditions.
Parameter
Rating
Parameter
Rating
Input Voltage (VIN)
6V
Input Voltage (VIN)
Enable Voltage (VEN)
6V
Junction Temperature (TJ)
Storage Temperature (TS)
-55 °C to +150 °C
ESD Rating(1)
+2.7 V to +5.5 V
-40 °C to +125 °C
Package Thermal Resistance (ΘJA)
2 kV
eMSOP-8
60 °C/W
SO-8
Note:
115 °C/W
1. Devices are inherently ESD sensitive, handling precautions are
required. Human body model is a 100 pF capacitor discharging
through a 1.5 kΩ resistor.
Electrical Characteristics
TA = 25 °C, VIN = VEN =5.5 V, unless otherwise specified.
Symbol
Conditions(3)
Parameter
Min.
Typ.
Max. Units
POWER SWITCH
RDS(ON)
tr
tf
Switch On-Resistance
VIN = 5.5 V, IOUT = 1.5 A
70
135
mΩ
Rise Time, Output
VIN = 5.5 V, CL = 1 μF, RL = 5 Ω
0.6
1.5
ms
VIN = 2.7 V, CL = 1 μF, RL = 5 Ω
0.4
1
Fall Time, Output
VIN = 5.5 V
VIN = 2.7 V
FET Leakage Current
Out connect to ground,
VI(ENx) = 5.5 V,
or VI(ENx) = 0 V
-40 °C ≤ TJ ≤ 125
0.05
0.5
0.05
0.5
°C(2)
ms
μA
1
ENABLE INPUT EN
VIH
High-level Input Voltage
2.7V ≤ VIN ≤ 5.5V
VIL
Low-level Input Voltage
2.7V ≤ VIN ≤ 5.5V
2.0
V
-0.5
0.8
V
-0.5
μA
ms
II
Input Current
ton
Turn-on Time
CL = 100 μF, RL = 5 Ω
3
toff
Turn-off Time
CL = 100 μF, RL = 5 Ω
10
CURRENT LIMIT
IOS
Short-circuit Output Current
1.5
2.0
2.5
A
IOC_TRIP
Overcurrent Trip Threshold
1.6
2.3
2.7
A
0.5
1
μA
0.5
5
50
70
50
90
SUPPLY CURRENT
Supply Current, Low-level
Output
No load on OUT,
VI(ENx) = 5.5 V,
or VI(ENx) = 0 V
TJ = 25°C
Supply Current, High-level
Output
No load on OUT,
VI(ENx) = 0 V,
or VI(ENx) = 5.5 V
TJ = 25°C
Reverse Leakage Current
VI(OUTx) = 5.5V, IN = ground TJ = 25 °C
Rev. 1.1 July 2011
-40 °C ≤ TJ ≤ 125 °C
-40 °C ≤ TJ ≤ 125
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(2)
°C(2)
0.2
μA
μA
Page 3 of 13
AOZ1312
Electrical Characteristics (Continued)
TA = 25 °C, VIN = VEN =5.5 V, unless otherwise specified.
Symbol
Conditions(3)
Parameter
Min.
Typ.
Max. Units
UNDERVOLTAGE LOCKOUT
Low-level Voltage, IN
2
TJ = 25°C
Hysteresis, IN
2.5
200
V
mV
OVERCURRENT OC
Output low Voltage VOL(OCx)
IO(OCx) = 5mA
Off-state Current
VO(OCx) = 5V or 3.3V
OC_L Deglitch
OCx assertion or deassertion
4
8
0.4
V
1
μA
15
ms
THERMAL SHUTDOWN
Thermal Shutdown
Threshold
135
°C
Recovery from Thermal
Shutdown
105
°C
Hysteresis
30
°C
Note:
2. Parameters are guaranteed by design only and not production tested.
3. Pulse testing techniques maintain junction temperature close to ambient temperature; thermal effects must be taken into account separately.
Functional Block Diagram
IN
OUT
Gate Driver
UVLO
Comparator
Current
Limit
2.5V
Thermal
Shutdown
EN
OC
Deglitch
AOZ1312
Rev. 1.1 July 2011
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Page 4 of 13
AOZ1312
Functional Characteristics
Figure 2. Turn-Off Delay and Fall Time
with 1μF Load (Active High)
Figure 1. Turn-On Delay and Rise Time
with 1μF Load (Active High)
RL = 5Ω
CL = 1μF
TA = 25°C
EN
5V/div
RL = 5Ω
CL = 1μF
TA = 25°C
EN
5V/div
VOUT
2V/div
VOUT
2V/div
200μs/div
200μs/div
Figure 4. Turn-Off Delay and Fall Time
with 100μF Load (Active High)
Figure 3. Turn-On Delay and Rise Time
with 100μF Load (Active High)
RL = 5Ω
CL = 100μF
TA = 25°C
EN
5V/div
RL = 5Ω
CL = 100μF
TA = 25°C
EN
5V/div
VOUT
2V/div
VOUT
2V/div
200μs/div
500μs/div
Figure 5. Short-circuit Current, Device Enable
to Short (Active High)
EN
2V/div
Figure 6. 0.6Ω Load Connected to Enable to
Device (Active High)
OC
2V/div
IOUT
1A/div
IOUT
1A/div
200μs/div
Rev. 1.1 July 2011
2ms/div
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Page 5 of 13
AOZ1312
Functional Characteristics (Continued)
Figure 8. Short Circuit Current Limit
Figure 7. Inrush Current with Different Load Capacitance
EN
5V/div
VIN = 5V
RL = 5Ω
TA = 25°C
EN
2V/div
220μF
470μF
IOUT
500mA/div
IOUT
500mA/div
100μF
1ms/div
20ms/div
Typical Characteristics
Figure 9. Supply Current, Output Enabled
vs. Junction Temperature
Figure 10. Supply Current, Output Disabled
vs. Junction Temperature
0.50
70
Supply Current (μA)
Supply Current (μA)
50
40
30
Vin=5.5V
Vin=5V
Vin=3.3V
Vin=2.7V
20
10
0
-50
0
50
100
Junction Temperature (°C)
0.40
0.35
0.30
0.25
0.20
0.15
0.10
0.05
0
-50
150
200
2.22
180
2.21
160
2.20
Threshold (V)
120
100
80
60
Vin=2.7V
Vin=3.3V
Vin=5V
Vin=5.5V
40
20
Rev. 1.1 July 2011
50
100
Junction Temperature (°C)
0
50
100
Junction Temperature (°C)
150
Rising
Falling
2.19
140
0
-50
0
Figure 12. UVLO Threshold vs. Junction Temperature
Figure 11. Rds(on) vs. Ambient Temperature
Rdson (mΩ)
Vin=5.5V
Vin=5V
Vin=3.3V
Vin=2.7V
0.45
60
150
2.18
2.17
2.16
2.15
2.14
2.13
2.12
2.11
-50
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0
50
100
Junction Temperature (°C)
150
Page 6 of 13
AOZ1312
Detailed Description
The AOZ1312 is a member of Alpha and Omega
Semiconductor’s single-channel power-distribution
switches family. The AOZ1312 is intended for
applications where heavy capacitive loads and
short-circuits are likely to be encountered. Gate drive is
provided by an internal charge pump designed to control
the power-switch rise times and fall times to minimize
current surges during switching. The charge pump
requires no external components and allows operation
from supplies as low as 2.7 V.
Power Switch
The power switch is a N-channel MOSFET with a low
on-state resistance capable of delivering 1 A of
continuous current. Configured as a high-side switch,
the MOSFET will go into high impedance when disabled.
Thus, preventing current flow from OUT to IN and IN to
OUT.
Charge Pump
An internal charge pump supplies power to the circuits
and provides the necessary voltage to drive the gate of
the MOSFET beyond the source. The charge pump is
capable of operating down to a low voltage of 2.7 Volts.
Driver
The driver controls the voltage on the gate to the power
MOSFET switch. This is used to limit the large current
surges when the switch is being turned On and Off.
Proprietary circuitry controls the rise and fall time of the
output voltages.
Rev. 1.1 July 2011
Enable
The logic enable disables the power switch, charge
pump, gate driver, logic device, and other circuitry to
reduce the supply current. When the enable receives a
logic high the supply current is reduced to approximately
1 μA. The enable input is compatible with both TTL and
CMOS logic levels.
Over-current
The over-current open drain output is asserted
(active low) when an over-current condition occurs.
The output will remain asserted until the over-current
condition is removed. A 15 ms deglitch circuit prevents
the over-current from false triggering.
Thermal Shut-down Protection
When the output load exceeds the current-limit threshold
or a short is present, the device limits the output current
to a safe level by switching into a constant-current mode,
pulling the overcurrent (OC) logic output low.
During current limit or short circuit conditions, the
increasing power dissipation in the chip causing the die
temperature to rise. When the die temperature reaches a
certain level, the thermal shutdown circuitry will shutdown
the device. The thermal shutdown will cycle repeatedly
until the short circuit condition is resolved.
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Page 7 of 13
AOZ1312
Applications Information
Input Capacitor Selection
Power Dissipation Calculation
The input capacitor prevents large voltage transients
from appearing at the input, and provides the
instantaneous current needed each time the switch turns
on and to limit input voltage drop. The input capacitor
also prevents high-frequency noise on the power line
from passing through the output of the power side. The
choice of the input capacitor is based on its ripple current
and voltage ratings rather than its capacitor value. The
input capacitor should be located as close to the VIN pin
as possible. A 1 μF and above ceramic cap is
recommended. However, higher capacitor values further
reduce the voltage drop at the input.
Calculate the power dissipation for normal load condition
using the following equation:
The worst case power dissipation occurs when the load
current hits the current limit due to over-current or short
circuit faults. The power dissipation under these
conditions can be calculated using the following
equation:
PD = (VIN – VOUT) x ILIMIT
Layout Guidelines
Output Capacitor Selection
The output capacitor acts in a similar way. A small 0.1 μF
capacitor prevents high-frequency noise from going into
the system. Also, the output capacitor has to supply
enough current for a large load that it may encounter
during system transients. This bulk capacitor must be
large enough to supply fast transient load in order to
prevent the output from dropping.
Rev. 1.1 July 2011
PD = RON x (IOUT)2
Good PCB layout is important for improving the thermal
and overall performance of the AOZ1312. To optimize the
switch response time to output short-circuit conditions
keep all traces as short as possible to reduce the effect of
unwanted parasitic inductance. Place the input and
output bypass capacitors as close as possible to the IN
and OUT pins. The input and output PCB traces should
be as wide as possible for the given PCB space. Use a
ground plane to enhance the power dissipation capability
of the device.
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Page 8 of 13
AOZ1312
Package Dimensions, SO-8L
D
Gauge Plane
Seating Plane
e
0.25
8
L
E1
E
h x 45
1
C
θ
7 (4x)
A2 A
0.1
b
RECOMMENDED LAND PATTERN
2.20
5.74
2.87
1.27
A1
Dimensions in millimeters
Symbols
A
A1
A2
b
c
D
E
e
E1
h
L
θ
Nom.
1.65
—
1.50
—
—
4.90
3.90
1.27 BSC
6.00
5.80
—
0.25
—
0.40
—
0°
Min.
1.35
0.10
1.25
0.31
0.17
4.80
3.80
Max.
1.75
0.25
1.65
0.51
0.25
5.00
4.00
6.20
0.50
1.27
8°
Dimensions in inches
Symbols
A
A1
A2
b
c
D
E
e
E1
h
L
θ
Min.
0.053
0.004
0.049
0.012
0.007
0.189
0.150
Nom. Max.
0.065 0.069
—
0.010
0.059 0.065
—
0.020
—
0.010
0.193 0.197
0.154 0.157
0.050 BSC
0.228 0.236 0.244
0.010
—
0.020
0.016
—
0.050
—
0°
8°
0.80
0.635
UNIT: mm
Notes:
1. All dimensions are in millimeters.
2. Dimensions are inclusive of plating
3. Package body sizes exclude mold flash and gate burrs. Mold flash at the non-lead sides should be less than 6 mils.
4. Dimension L is measured in gauge plane.
5. Controlling dimension is millimeter, converted inch dimensions are not necessarily exact.
Rev. 1.1 July 2011
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Page 9 of 13
AOZ1312
Tape and Reel Dimensions, SO-8
Carrier Tape
P1
D1
P2
T
E1
E2
E
B0
K0
A0
D0
P0
Feeding Direction
UNIT: mm
Package
SO-8
(12mm)
A0
6.40
±0.10
B0
5.20
±0.10
K0
2.10
±0.10
D0
1.60
±0.10
D1
1.50
±0.10
E
12.00
±0.10
Reel
E1
1.75
±0.10
E2
5.50
±0.10
P0
8.00
±0.10
P1
4.00
±0.10
P2
2.00
±0.10
T
0.25
±0.10
W1
S
G
N
M
K
V
R
H
W
UNIT: mm
W
N
Tape Size Reel Size
M
12mm
ø330
ø330.00 ø97.00 13.00
±0.10 ±0.30
±0.50
W1
17.40
±1.00
H
K
ø13.00
10.60
+0.50/-0.20
S
2.00
±0.50
G
—
R
—
V
—
Leader/Trailer and Orientation
Trailer Tape
300mm min. or
75 empty pockets
Rev. 1.1 July 2011
Components Tape
Orientation in Pocket
www.aosmd.com
Leader Tape
500mm min. or
125 empty pockets
Page 10 of 13
AOZ1312
Package Dimensions, MSOP8_EP1
Gauge Plane
D
Seating Plane
L2
L
2
L1
E2
E
E1
D1
c
1
A
A1
A2
b
e
0.10mm
Dimensions in millimeters
RECOMMENDED LAND PATTERN
0.75
1.9
1.9
0.65
4.35
0.35
Dimensions in inches
Symbols
A
Min.
0.81
Nom.
1.02
Max.
1.12
Symbols
A
Min.
0.032
Nom.
0.040
Max.
0.044
A1
A2
0.05
0.76
—
0.86
0.15
0.97
A1
A2
0.002
0.030
—
0.034
0.006
0.038
b
c
D
0.25
0.13
2.90
0.30
0.15
3.00
0.40
0.23
3.10
b
c
D
0.010
0.005
0.116
0.012
0.006
0.118
0.016
0.010
0.120
D1
e
E
E1
E2
L
1.55
—
0.65 TYP.
3.00
4.90
—
0.55
1.8
0.06
3.10
5.10
1.8
0.70
D1
e
E
E1
E2
L
—
0.07
0.026 TYP.
0.116 0.118 0.120
0.185 0.192
0.20
0.05
—
0.07
0.016 0.022 0.028
L1
L2
θ1
0.90
0.95
1.00
0.25 BSC
—
6°
L1
L2
θ1
0.035
θ2
—
θ2
—
2.90
4.70
1.3
0.40
0°
12°
—
0.037 0.039
0.010 BSC
0°
—
6°
12°
—
Notes:
1. All dimensions are in millimeters.
2. Dimensions are inclusive of plating.
3. Package body sizes exclude mold flash and gate burrs. Mold flash at the non-lead sides should be less than 6 mils each.
4. Dimension L is measured in gauge plane.
5. Controlling dimension is millimeter, converted inch dimensions are not necessarily exact.
Rev. 1.1 July 2011
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Page 11 of 13
AOZ1312
Tape and Reel Dimensions, MSO8P_EP1
Carrier Tape
P1
Section B-B'
P2
D1
D0
K1
E1
E2
R0.3
Max
E
B0
A0
4.2
3.4
K1
T
K0
R0.3 Typ.
Feeding Direction
Section B-B'
UNIT: mm
Package
MSOP-8
P0
T
0.30
±0.05
B0
3.30
±0.10
A0
5.20
±0.10
K1
1.20
±0.10
K0
1.60
±0.10
D0
D1
ø1.50
ø1.50
+0.1/-0.0 Min.
E
12.0
±0.3
E1
1.75
±0.10
E2
5.50
±0.05
P0
8.00
±0.10
P1
4.00
±0.05
P2
2.00
±0.05
Reel
W1
S
G
N
M
K
V
R
H
W
UNIT: mm
Tape Size Reel Size
M
N
W
12mm
ø330
ø330.00 ø97.00 13.00
±0.50
±0.10 ±0.30
W1
17.40
±1.00
H
K
ø13.00
10.60
+0.50/-0.20
S
2.00
±0.50
G
—
R
—
V
—
Leader/Trailer and Orientation
Trailer Tape
300mm min.
Components Tape
Orientation in Pocket
Leader Tape
500mm min.
Notes:
1. 10 sprocket hole pich cumulative tolerance 0.2.
2. Camber not to exceed 1mm in 100mm.
3. A0 and B0 measured on a plane 0.3mm above the bottom of the pocket.
4. K0 measured from a plane on the inside bottom of the pocket to the top surface of the carrier.
5. Pocket position relative to sprocket hole measured as tue position of pocket, not pocket hole.
6. All dimensions in mm.
Rev. 1.1 July 2011
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Page 12 of 13
AOZ1312
Part Marking
AOZ1312AI-1
(SO-8)
Part Number Code
Assembly Lot Code
Fab Code & Assembly Location Code
Year Code and Week Code
AOZ1312EI-1
(MSOP8_EP1)
Part Number Code
Year Code and Week Code
Fab Code & Assembly
Location Code
Assembly Lot Code
This datasheet contains preliminary data; supplementary data may be published at a later date.
Alpha & Omega Semiconductor reserves the right to make changes at any time without notice.
LIFE SUPPORT POLICY
ALPHA & OMEGA SEMICONDUCTOR PRODUCTS ARE NOT AUTHORIZED FOR USE AS CRITICAL
COMPONENTS IN LIFE SUPPORT DEVICES OR SYSTEMS.
As used herein:
1. Life support devices or systems are devices or
systems which, (a) are intended for surgical implant into
the body or (b) support or sustain life, and (c) whose
failure to perform when properly used in accordance
with instructions for use provided in the labeling, can be
reasonably expected to result in a significant injury of
the user.
Rev. 1.1 July 2011
2. A critical component in any component of a life
support, device, or system whose failure to perform can
be reasonably expected to cause the failure of the life
support device or system, or to affect its safety or
effectiveness.
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Page 13 of 13