Datasheet

Transient Voltage Suppression Diodes
Surface Mount – 200W > SMF Series
SMF Series
RoHS
Pb e3
Description
Uni-directional
The SMF series is designed specifically to protect
sensitive electronic equipment from voltage transients
induced by lightning and other transient voltage events.
SMF package is 50% smaller in footprint when
compare to SMA package and delivers one of the low
height profiles (1.1mm) in the industry.
Features
Agency Approvals
AGENCY
AGENCY FILE NUMBER
E230531
Maximum Ratings and Thermal Characteristics
(TA=25OC unless otherwise noted)
Parameter
Symbol
Value
Unit
Peak Pulse Power Dissipation at
TA=25ºC by 10/1000µs (Note 1)
PPPM
200
W
Thermal Resistance Junction- toAmbient
RθJA
220
°C/W
Thermal Resistance Junction- toLead
RθJL
100
°C/W
Operating Temperature Range
TJ
-65 to 150
°C
TSTG
-65 to 175
°C
Storage Temperature Range
Notes:
1. Non-repetitive current pulse, per Fig. 4 and derated above TJ (initial) =25ºC per Fig. 3.
Functional Diagram
Anode
Uni-directional
• ESD protection of data
lines in accordance with
IEC 61000-4-2
• EFT protection of data
lines in accordance with
IEC 61000-4-4
• Fast response time:
typically less than 1.0ns
from 0 Volts to VBR min
• Glass passivated junction
• Built-in strain relief
• Plastic package is
flammability rated
V-0 per Underwriters
Laboratories
• Meet MSL level1, per
J-STD-020, LF maximun
peak of 260°C
• Matte tin lead–free plated
• Halogen-free and RoHS
compliant
• Pb-free E3: 2nd level
interconnect is Pb-free
and the terminal finish
material is tin(Sn)(IPC/
JEDEC J-STD-609A.01)
Applications
Bi-directional
Cathode
• 200W peak pulsepower
capability at 10/1000µs
waveform, repetition rate
(duty cycle): 0.01%
•Compatible with
industrial standard
package SOD-123FL
• Low profile: maximum
height of 1.1mm.
• Low inductance, excellent
clamping capability
• For surface mounted
applications to optimize
board space
• High temperature
to reflow soldering
guaranteed: 260°C/40sec
• Typical failure mode is
short from over-specified
voltage or current
• Whisker test is conducted
based on JEDEC
JESD201A per its table 4a
and 4c
• IEC-61000-4-2 ESD
30kV(Air), 30kV (Contact)
SMF devices are ideal for the protection of I/O interfaces,
VCC bus and other vulnerable circuit used in cellular
phones, portable devices, business machines, power
supplies and other consumer applications.
Additional Infomarion
Datasheet
Resources
Samples
© 2016 Littelfuse, Inc.
Specifications are subject to change without notice.
Revised: 03/15/16
Transient Voltage Suppression Diodes
Surface Mount – 200W > SMF Series
Electrical Characteristics (T =25°C unless otherwise noted)
A
Part
Number
SMF5.0A
SMF6.0A
SMF6.5A
SMF7.0A
SMF7.5A
SMF8.0A
SMF8.5A
SMF9.0A
SMF10A
SMF11A
SMF12A
SMF13A
SMF14A
SMF15A
SMF16A
SMF17A
SMF18A
SMF20A
SMF22A
SMF24A
SMF26A
SMF28A
SMF30A
SMF33A
SMF36A
SMF40A
SMF43A
SMF45A
SMF48A
SMF51A
SMF54A
SMF58A
SMF60A
SMF64A
SMF70A
SMF75A
SMF78A
SMF85A
Breakdown
Voltage VBR
(Volts) @ IT
MIN
MAX
Test
Current
IT
(mA)
6.40
6.67
7.22
7.78
8.33
8.89
9.44
10.00
11.10
12.20
13.30
14.40
15.60
16.70
17.80
18.90
20.0 0
22.20
24.40
26.70
28.90
31.10
33.30
36.70
40.00
44.40
47.80
50.00
53.30
56.70
60.00
64.40
66.70
71.10
77.80
83.30
86.70
94.40
7.00
7.37
7.98
8.60
9.21
9.83
10.40
11.10
12.30
13.50
14.70
15.90
17.20
18.50
19.70
20.90
22.10
24.50
26.90
29.50
31.90
34.40
36.80
40.60
44.20
49.10
52.80
55.30
58.90
62.70
66.30
71.20
73.70
78.60
86.00
92.10
95.80
104.00
10
10
10
10
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
Marking
Code
AE
AG
AK
AM
AP
AR
AT
AV
AX
AZ
BE
BG
BK
BM
BP
BR
BT
BV
BX
BZ
CE
CG
CK
CM
CP
CR
CT
CV
CX
CZ
DE
RG
RK
RM
RP
RR
RT
RV
Notes:
1. VBR measured after IT applied for 300µs, IT = square wave pulse or equivalent.
2. Surge current waveform per 10/1000µs exponential wave and derated per Fig.2.
3. All terms and symbols are consistent with ANSI/IEEE C62.35.
© 2016 Littelfuse, Inc.
Specifications are subject to change without notice.
Revised: 03/15/16
Maximum
Reverse Stand
Reverse
off Voltage
Leakage @ VR
VR (V)
IR (µA)
5.0
6.0
6.5
7.0
7.5
8.0
8.5
9.0
10
11
12
13
14
15
16
17
18
20
22
24
26
28
30
33
36
40
43
45
48
51
54
58
60
64
70
75
78
85
400
400
250
100
50
25
10
5
2.5
2.5
2.5
1.0
1.0
1.0
1.0
1.0
1.0
1.0
1.0
1.0
1.0
1.0
1.0
1.0
1.0
1.0
1.0
1.0
1.0
1.0
1.0
1.0
1.0
1.0
1.0
1.0
1.0
1.0
Maximum
Peak Pulse
Current Ipp
(A)
21.7
19.4
17.9
16.7
15.5
14.7
13.9
13.0
11.8
11.0
10.1
9.3
8.6
8.2
7.7
7.2
6.8
6.2
5.6
5.1
4.8
4.4
4.1
3.8
3.4
3.1
2.9
2.8
2.6
2.4
2.3
2.1
1.8
1.7
1.5
1.4
1.4
1.3
Maximum
Clamping
Voltage @Ipp
VC (V)
9.2
10.3
11.2
12.0
12.9
13.6
14.4
15.4
17.0
18.2
19.9
21.5
23.2
24.4
26.0
27.6
29.2
32.4
35.5
38.9
42.1
45.4
48.4
53.3
58.1
64.5
69.4
72.7
77.4
82.4
87.1
93.6
96.8
103.0
113.0
121.0
126.0
137.0
Agency
Approval
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
Transient Voltage Suppression Diodes
Surface Mount – 200W > SMF Series
I-V Curve Characteristics
Uni-directional
Vc VBR VR
V
IR VF
IT
Ipp
PPPM
VR
VBR
VC
IR
VF
Peak Pulse Power Dissipation -- Max power dissipation
Stand-off Voltage -- Maximum voltage that can be applied to the TVS without operation
Breakdown Voltage -- Maximum voltage that flows though the TVS at a specified test current (IT)
Clamping Voltage -- Peak voltage measured across the TVS at a specified Ippm (peak impulse current)
Reverse Leakage Current -- Current measured at VR
Forward Voltage Drop for Uni-directional
Ratings and Characteristic Curves (T =25°C unless otherwise noted)
A
Figure 1 - TVS Transients Clamping Waveform
Figure 2 - Peak Pulse Power Rating Curve
Voltage Transients
10
PPPM-Peak Pulse Power (kW)
TJ initial = Tamb
Voltage or Current
Voltage Across TVS
Current Through TVS
1
0.1
0.001
Time
0.01
0.1
1
td-Pulse Width (ms)
continues on next page.
© 2016 Littelfuse, Inc.
Specifications are subject to change without notice.
Revised: 03/15/16
Transient Voltage Suppression Diodes
Surface Mount – 200W > SMF Series
Ratings and Characteristic Curves (T =25°C unless otherwise noted) (Continued)
A
Figure 3 - Peak Pulse Power Derating Curve
Figure 4 - Pulse Waveform - 10/1000µS
150
IPPM- Peak Pulse Current, % IRSM
Peak Pulse Power (PPP) or Current (IPP)
Derating in Percentage %
100
80
60
40
20
0
0
25
50
75
100 125 150
TJ - Initial Junction Temperature (ºC)
tr=10µsec
Peak Value
IPPM
100
Half Value
IPPM IPPM
( )
2
50
0
175
TJ=25°C
Pulse Width(td) is defined
as the point where the peak
current decays to 50% of IPPM
10/1000µsec. Waveform
as defined by R.E.A
td
0
1.0
2.0
3.0
4.0
t-Time (ms)
Figure 6 - Typical Junction Capacitance
Figure 5 - Forward Voltage
0.8
Uni-directional V=0v
1000
0.7
Cj (pF)
Vf - Typical forward dropped [email protected]
10000
0.9
0.6
100
Uni-directional V=VR
0.5
10
0.4
0
-55
10
75
1
140
1
Temperature (ºC)
Figure 7 - Peak Forward Voltage Drop vs.
Peak Forward Current
10
VBR - Reverse Breakdown Voltage (V)
100
Figure 8 - Maximum Non-Repetitive Forward Surge
Current Uni-Directional Only
IFSM - Peak Forward Surve Current(A)
I F - Peak Forward Current(A)
35
10
1
0.1
0.01
0
0.5
1
1.5
2
2.5
3
V F - Peak Forward Voltage(V)
© 2016 Littelfuse, Inc.
Specifications are subject to change without notice.
Revised: 03/15/16
3.5
4
30
25
20
15
10
5
0
1
10
Number of Cycles at 60 Hz
100
Transient Voltage Suppression Diodes
Surface Mount – 200W > SMF Series
Soldering Parameters
Lead–free
assembly
Pre Heat
- Temperature Min (Ts(min))
150°C
- Temperature Max (Ts(max))
200°C
- Time (min to max) (ts)
60 – 180 secs
Average ramp up rate (Liquidus Temp (TA)
to peak
3°C/second max
TS(max) to TA - Ramp-up Rate
3°C/second max
Reflow
- Temperature (TA) (Liquidus)
217°C
- Time (min to max) (ts)
60 – 150 seconds
Peak Temperature (TP)
260+0/-5 °C
Time within 5°C of actual peak
Temperature (tp)
20 – 40 seconds
Ramp-down Rate
6°C/second max
Time 25°C to peak Temperature (TP)
8 minutes Max.
Do not exceed
260°C
tp
TP
Ramp-up
TL
Temperature (T)
Reflow Condition
Critical Zone
TL to TP
tL
Ts(max)
Ramp-down
Ts(min)
ts
Preheat
25˚C
t 25˚C to Peak
Time (t)
Environmental Specifications
High Temp. Storage
JESD22-A103
HTRB
JESD22-A108
Temperature Cycling
JESD22-A104
Physical Specifications
Case
SOD-123FL plastic over glass passivated
junction
MSL
JEDEC-J-STD-020, Level 1
Polarity
olor band denotes cathode except
C
bipolar
H3TRB
JESD22-A101
Terminal
Matte tin-plated leads, solderable per
JESD22-B102
RSH
JESD22-A111
C
Dimensions
Millimeters
Min
Max
Inches
Min
Max
A
2.90
3.10
0.114
0.122
B
3.50
3.90
0.138
0.154
C
0.85
1.05
0.033
0.041
E
B
A
E
Dimensions - SOD-123FL Package
D
1.70
2.00
0.067
0.079
F
E
0.43
0.83
0.017
0.033
F
0.10
0.25
0.004
0.010
G
0.00
0.10
0.000
0.004
H
0.90
1.08
0.035
0.043
G
H
D
Mounting Pad Layout
1.6 (0.062)
1.3 (0.051)
1.4 (0.055)
© 2016 Littelfuse, Inc.
Specifications are subject to change without notice.
Revised: 03/15/16
Transient Voltage Suppression Diodes
Surface Mount – 200W > SMF Series
Part Numbering System
Part Marking System
SMF xx A
LF
5% VBR VOLTAGE TOLERANCE
XX
YM
Cathode Band
Marking Code
Trace Code Marking
Y:Year Code
M: Month Code
VR VOLTAGE
SERIES
Packaging Options
Part number
Component
Package
Quantity
Packaging Option
Packaging
Specification
SMFXXX
SOD-123FL
3000
Tape & Reel – 8mm tape/7” reel
EIA RS-481
SMFXXX-T13
SOD-123FL
10000
Tape & Reel – 8mm tape/13” reel
EIA RS-481
Tape and Reel Specification
0.157
(4.0)
Cathode
0.31
(8.0)
0.157
(4.0)
Optional
7” 7.0 (178)
13” 13.0 (330)
0.80 (20.2)
Arbor Hole Dia.
0.33
(8.5)
© 2016 Littelfuse, Inc.
Specifications are subject to change without notice.
Revised: 03/15/16
0.059 DIA
(1.5)
Cover tape
Dimensions are in inches
(and millimeters).
Direction of Feed