Transient Voltage Suppression Diodes Surface Mount – 200W > SMF Series SMF Series RoHS Pb e3 Description Uni-directional The SMF series is designed specifically to protect sensitive electronic equipment from voltage transients induced by lightning and other transient voltage events. SMF package is 50% smaller in footprint when compare to SMA package and delivers one of the low height profiles (1.1mm) in the industry. Features Agency Approvals AGENCY AGENCY FILE NUMBER E230531 Maximum Ratings and Thermal Characteristics (TA=25OC unless otherwise noted) Parameter Symbol Value Unit Peak Pulse Power Dissipation at TA=25ºC by 10/1000µs (Note 1) PPPM 200 W Thermal Resistance Junction- toAmbient RθJA 220 °C/W Thermal Resistance Junction- toLead RθJL 100 °C/W Operating Temperature Range TJ -65 to 150 °C TSTG -65 to 175 °C Storage Temperature Range Notes: 1. Non-repetitive current pulse, per Fig. 4 and derated above TJ (initial) =25ºC per Fig. 3. Functional Diagram Anode Uni-directional • ESD protection of data lines in accordance with IEC 61000-4-2 • EFT protection of data lines in accordance with IEC 61000-4-4 • Fast response time: typically less than 1.0ns from 0 Volts to VBR min • Glass passivated junction • Built-in strain relief • Plastic package is flammability rated V-0 per Underwriters Laboratories • Meet MSL level1, per J-STD-020, LF maximun peak of 260°C • Matte tin lead–free plated • Halogen-free and RoHS compliant • Pb-free E3: 2nd level interconnect is Pb-free and the terminal finish material is tin(Sn)(IPC/ JEDEC J-STD-609A.01) Applications Bi-directional Cathode • 200W peak pulsepower capability at 10/1000µs waveform, repetition rate (duty cycle): 0.01% •Compatible with industrial standard package SOD-123FL • Low profile: maximum height of 1.1mm. • Low inductance, excellent clamping capability • For surface mounted applications to optimize board space • High temperature to reflow soldering guaranteed: 260°C/40sec • Typical failure mode is short from over-specified voltage or current • Whisker test is conducted based on JEDEC JESD201A per its table 4a and 4c • IEC-61000-4-2 ESD 30kV(Air), 30kV (Contact) SMF devices are ideal for the protection of I/O interfaces, VCC bus and other vulnerable circuit used in cellular phones, portable devices, business machines, power supplies and other consumer applications. Additional Infomarion Datasheet Resources Samples © 2016 Littelfuse, Inc. Specifications are subject to change without notice. Revised: 03/15/16 Transient Voltage Suppression Diodes Surface Mount – 200W > SMF Series Electrical Characteristics (T =25°C unless otherwise noted) A Part Number SMF5.0A SMF6.0A SMF6.5A SMF7.0A SMF7.5A SMF8.0A SMF8.5A SMF9.0A SMF10A SMF11A SMF12A SMF13A SMF14A SMF15A SMF16A SMF17A SMF18A SMF20A SMF22A SMF24A SMF26A SMF28A SMF30A SMF33A SMF36A SMF40A SMF43A SMF45A SMF48A SMF51A SMF54A SMF58A SMF60A SMF64A SMF70A SMF75A SMF78A SMF85A Breakdown Voltage VBR (Volts) @ IT MIN MAX Test Current IT (mA) 6.40 6.67 7.22 7.78 8.33 8.89 9.44 10.00 11.10 12.20 13.30 14.40 15.60 16.70 17.80 18.90 20.0 0 22.20 24.40 26.70 28.90 31.10 33.30 36.70 40.00 44.40 47.80 50.00 53.30 56.70 60.00 64.40 66.70 71.10 77.80 83.30 86.70 94.40 7.00 7.37 7.98 8.60 9.21 9.83 10.40 11.10 12.30 13.50 14.70 15.90 17.20 18.50 19.70 20.90 22.10 24.50 26.90 29.50 31.90 34.40 36.80 40.60 44.20 49.10 52.80 55.30 58.90 62.70 66.30 71.20 73.70 78.60 86.00 92.10 95.80 104.00 10 10 10 10 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 Marking Code AE AG AK AM AP AR AT AV AX AZ BE BG BK BM BP BR BT BV BX BZ CE CG CK CM CP CR CT CV CX CZ DE RG RK RM RP RR RT RV Notes: 1. VBR measured after IT applied for 300µs, IT = square wave pulse or equivalent. 2. Surge current waveform per 10/1000µs exponential wave and derated per Fig.2. 3. All terms and symbols are consistent with ANSI/IEEE C62.35. © 2016 Littelfuse, Inc. Specifications are subject to change without notice. Revised: 03/15/16 Maximum Reverse Stand Reverse off Voltage Leakage @ VR VR (V) IR (µA) 5.0 6.0 6.5 7.0 7.5 8.0 8.5 9.0 10 11 12 13 14 15 16 17 18 20 22 24 26 28 30 33 36 40 43 45 48 51 54 58 60 64 70 75 78 85 400 400 250 100 50 25 10 5 2.5 2.5 2.5 1.0 1.0 1.0 1.0 1.0 1.0 1.0 1.0 1.0 1.0 1.0 1.0 1.0 1.0 1.0 1.0 1.0 1.0 1.0 1.0 1.0 1.0 1.0 1.0 1.0 1.0 1.0 Maximum Peak Pulse Current Ipp (A) 21.7 19.4 17.9 16.7 15.5 14.7 13.9 13.0 11.8 11.0 10.1 9.3 8.6 8.2 7.7 7.2 6.8 6.2 5.6 5.1 4.8 4.4 4.1 3.8 3.4 3.1 2.9 2.8 2.6 2.4 2.3 2.1 1.8 1.7 1.5 1.4 1.4 1.3 Maximum Clamping Voltage @Ipp VC (V) 9.2 10.3 11.2 12.0 12.9 13.6 14.4 15.4 17.0 18.2 19.9 21.5 23.2 24.4 26.0 27.6 29.2 32.4 35.5 38.9 42.1 45.4 48.4 53.3 58.1 64.5 69.4 72.7 77.4 82.4 87.1 93.6 96.8 103.0 113.0 121.0 126.0 137.0 Agency Approval X X X X X X X X X X X X X X X X X X X X X X X X X X X X Transient Voltage Suppression Diodes Surface Mount – 200W > SMF Series I-V Curve Characteristics Uni-directional Vc VBR VR V IR VF IT Ipp PPPM VR VBR VC IR VF Peak Pulse Power Dissipation -- Max power dissipation Stand-off Voltage -- Maximum voltage that can be applied to the TVS without operation Breakdown Voltage -- Maximum voltage that flows though the TVS at a specified test current (IT) Clamping Voltage -- Peak voltage measured across the TVS at a specified Ippm (peak impulse current) Reverse Leakage Current -- Current measured at VR Forward Voltage Drop for Uni-directional Ratings and Characteristic Curves (T =25°C unless otherwise noted) A Figure 1 - TVS Transients Clamping Waveform Figure 2 - Peak Pulse Power Rating Curve Voltage Transients 10 PPPM-Peak Pulse Power (kW) TJ initial = Tamb Voltage or Current Voltage Across TVS Current Through TVS 1 0.1 0.001 Time 0.01 0.1 1 td-Pulse Width (ms) continues on next page. © 2016 Littelfuse, Inc. Specifications are subject to change without notice. Revised: 03/15/16 Transient Voltage Suppression Diodes Surface Mount – 200W > SMF Series Ratings and Characteristic Curves (T =25°C unless otherwise noted) (Continued) A Figure 3 - Peak Pulse Power Derating Curve Figure 4 - Pulse Waveform - 10/1000µS 150 IPPM- Peak Pulse Current, % IRSM Peak Pulse Power (PPP) or Current (IPP) Derating in Percentage % 100 80 60 40 20 0 0 25 50 75 100 125 150 TJ - Initial Junction Temperature (ºC) tr=10µsec Peak Value IPPM 100 Half Value IPPM IPPM ( ) 2 50 0 175 TJ=25°C Pulse Width(td) is defined as the point where the peak current decays to 50% of IPPM 10/1000µsec. Waveform as defined by R.E.A td 0 1.0 2.0 3.0 4.0 t-Time (ms) Figure 6 - Typical Junction Capacitance Figure 5 - Forward Voltage 0.8 Uni-directional V=0v 1000 0.7 Cj (pF) Vf - Typical forward dropped voltage@10mA 10000 0.9 0.6 100 Uni-directional V=VR 0.5 10 0.4 0 -55 10 75 1 140 1 Temperature (ºC) Figure 7 - Peak Forward Voltage Drop vs. Peak Forward Current 10 VBR - Reverse Breakdown Voltage (V) 100 Figure 8 - Maximum Non-Repetitive Forward Surge Current Uni-Directional Only IFSM - Peak Forward Surve Current(A) I F - Peak Forward Current(A) 35 10 1 0.1 0.01 0 0.5 1 1.5 2 2.5 3 V F - Peak Forward Voltage(V) © 2016 Littelfuse, Inc. Specifications are subject to change without notice. Revised: 03/15/16 3.5 4 30 25 20 15 10 5 0 1 10 Number of Cycles at 60 Hz 100 Transient Voltage Suppression Diodes Surface Mount – 200W > SMF Series Soldering Parameters Lead–free assembly Pre Heat - Temperature Min (Ts(min)) 150°C - Temperature Max (Ts(max)) 200°C - Time (min to max) (ts) 60 – 180 secs Average ramp up rate (Liquidus Temp (TA) to peak 3°C/second max TS(max) to TA - Ramp-up Rate 3°C/second max Reflow - Temperature (TA) (Liquidus) 217°C - Time (min to max) (ts) 60 – 150 seconds Peak Temperature (TP) 260+0/-5 °C Time within 5°C of actual peak Temperature (tp) 20 – 40 seconds Ramp-down Rate 6°C/second max Time 25°C to peak Temperature (TP) 8 minutes Max. Do not exceed 260°C tp TP Ramp-up TL Temperature (T) Reflow Condition Critical Zone TL to TP tL Ts(max) Ramp-down Ts(min) ts Preheat 25˚C t 25˚C to Peak Time (t) Environmental Specifications High Temp. Storage JESD22-A103 HTRB JESD22-A108 Temperature Cycling JESD22-A104 Physical Specifications Case SOD-123FL plastic over glass passivated junction MSL JEDEC-J-STD-020, Level 1 Polarity olor band denotes cathode except C bipolar H3TRB JESD22-A101 Terminal Matte tin-plated leads, solderable per JESD22-B102 RSH JESD22-A111 C Dimensions Millimeters Min Max Inches Min Max A 2.90 3.10 0.114 0.122 B 3.50 3.90 0.138 0.154 C 0.85 1.05 0.033 0.041 E B A E Dimensions - SOD-123FL Package D 1.70 2.00 0.067 0.079 F E 0.43 0.83 0.017 0.033 F 0.10 0.25 0.004 0.010 G 0.00 0.10 0.000 0.004 H 0.90 1.08 0.035 0.043 G H D Mounting Pad Layout 1.6 (0.062) 1.3 (0.051) 1.4 (0.055) © 2016 Littelfuse, Inc. Specifications are subject to change without notice. Revised: 03/15/16 Transient Voltage Suppression Diodes Surface Mount – 200W > SMF Series Part Numbering System Part Marking System SMF xx A LF 5% VBR VOLTAGE TOLERANCE XX YM Cathode Band Marking Code Trace Code Marking Y:Year Code M: Month Code VR VOLTAGE SERIES Packaging Options Part number Component Package Quantity Packaging Option Packaging Specification SMFXXX SOD-123FL 3000 Tape & Reel – 8mm tape/7” reel EIA RS-481 SMFXXX-T13 SOD-123FL 10000 Tape & Reel – 8mm tape/13” reel EIA RS-481 Tape and Reel Specification 0.157 (4.0) Cathode 0.31 (8.0) 0.157 (4.0) Optional 7” 7.0 (178) 13” 13.0 (330) 0.80 (20.2) Arbor Hole Dia. 0.33 (8.5) © 2016 Littelfuse, Inc. Specifications are subject to change without notice. Revised: 03/15/16 0.059 DIA (1.5) Cover tape Dimensions are in inches (and millimeters). Direction of Feed