APL3518G

APL3518G
USB Power-Distribution Switches
General Description
Features
•
•
•
•
•
•
•
•
The APL3518G of power switches are designed for USB
applications. The 62mΩ N-channel MOSFET power switch
62mΩ High Side MOSFET
Wide Supply Voltage Range: 2.7V to 5.5V
satisfies the voltage drop requirements of USB
specification.
Current-Limit and Short-Circuit Protections
Over-Temperature Protection
The protection features include current-limit protection,
short-circuit protection, and over-temperature protection.
Fault Indication Output
Enable Input
The device limits the output current at current limit threshold level. When VOUT drops below 1.5V, the devices limit
UL Approved-File No. E328191
Nemko IEC 60950 and EN 60950-1 CB Scheme
the current to a lower and safe level. The over-temperature protection limits the junction temperature below
Certified, No.76812
•
•
TUV IEC 60950-1 and EN 60950-1 Certified, No.44
140oC in case of short circuit or over load conditions.
Other features include a deglitched OCB output to indi-
780 13 406748-012
Lead Free and Green Devices Available
cate the fault condition and an enable input to enable or
disable the device.
(RoHS Compliant)
Simplified Application Circuit
5V
Applications
•
•
•
USB Port
VIN
VOUT
Notebook and Desktop Computers
USB Ports
High-Side Power Protection Switches
APL3518G
USB
Controller
OCB
EN/ENB
GND
ANPEC reserves the right to make changes to improve reliability or manufacturability without notice, and
advise customers to obtain the latest version of relevant information to verify before placing orders.
Copyright  ANPEC Electronics Corp.
Rev. A.2 - Nov., 2013
1
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APL3518G
Pin Configurations
GND 1
8 VOUT
GND 1
8 VOUT
VIN 2
7 VOUT
VIN 2
7 VOUT
VIN 3
6 VOUT
5 OCB
VIN 3
6 VOUT
5 OCB
EN 4
ENB 4
MSOP-8
APL3518GB
(Top View)
MSOP-8
APL3518GA
(Top View)
Ordering and Marking Information
Package Code
X : MSOP-8
Assembly Material
Operating Ambient Temperature Range
I : -40 to 85 oC
Handling Code
Handling Code
Temperature Range
TR : Tape & Reel
Output Current/EN Function
Package Code
A : Active High B : Active Low
Output Current/EN Function
Assembly Material
G : Halogen and Lead Free Device
APL3518G
APL3518GA X:
L518A
XXX
XX
XXX
- Date Code
XX
APL3518GB X:
L518B
XXX
XX
XXX
- Date Code
XX
Note : ANPEC lead-free products contain molding compounds/die attach materials and 100% matte tin plate termination finish; which
are fully compliant with RoHS. ANPEC lead-free products meet or exceed the lead-free requirements of IPC/JEDEC J-STD-020D for
MSL classification at lead-free peak reflow temperature. ANPEC defines “Green” to mean lead-free (RoHS compliant)and halogen
free (Br or Cl does not exceed 900ppm by weight in homogeneous material and total of Br and Cl does not exceed 1500ppm by
weight).
Absolute Maximum Ratings
Symbol
VIN
VOUT
VEN ,VENB
VOCB
TJ
TSTG
TSDR
(Note 1)
Rating
Unit
VIN Input Voltage (VIN to GND)
Parameter
-0.3 ~ 7
V
VOUT to GND Voltage
-0.3 ~ 7
V
EN, ENB to GND Voltage
-0.3 ~ 7
V
OCB to GND Voltage
-0.3 ~ 7
Maximum Junction Temperature
Storage Temperature
Maximum Lead Soldering Temperature, 10 Seconds
V
150
o
-65 ~ 150
o
260
o
C
C
C
Note1: Stresses beyond those listed under "absolute maximum ratings" may cause permanent damage to the device. These are
stress ratings only and functional operation of the device at these or any other conditions beyond those indicated under "recommended operating conditions" is not implied. Exposure to absolute maximum rating conditions for extended periods may affect device
reliability.
Copyright  ANPEC Electronics Corp.
Rev. A.2 - Nov., 2013
2
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APL3518G
Thermal Characteristics
Symbol
θJA
Parameter
Typical Value
Unit
Junction-to-Ambient Resistance in Free Air (Note 2)
o
MSOP-8
C/W
160
Note 2 : θJA is measured with the component mounted on a high effective thermal conductivity test board in free air.
Recommended Operating Conditions (Note 3)
Symbol
VIN
Parameter
Range
VIN Input Voltage
Unit
2.7 ~ 5.5
V
TA
Ambient Temperature
-40 ~ 85
o
TJ
Junction Temperature
-40 ~ 125
o
C
C
Note 3 : Refer to the typical application circuit
Electrical Characteristics
Unless otherwise specified, these specifications apply over VIN=5V, VENB=0V and TA= -40 ~ 85 oC. Typical values are at TA=25oC.
Symbol
Parameter
APL3518G
Test Conditions
Min.
Typ.
Unit
Max.
SUPPLY CURRENT
No load, VEN=0V, VENB=5V
-
-
1
µA
No load, VEN=5V, VENB=0V
-
60
100
µA
Leakage Current
VOUT=GND, VEN=0V, VENB=5V
-
-
1
µA
Reverse Leakage Current
VIN=GND, VEN=0V, VENB=5V
-
-
1
µA
IOUT=1A, TA= 25 oC
-
62
78
mΩ
1.7
-
2.65
V
-
0.2
-
V
2.7
-
3.6
A
VIN Supply Current
POWER SWITCH
RDS(ON)
Power Switch On Resistance
UNDER-VOLTAGE LOCKOUT (UVLO)
VIN UVLO Threshold Voltage
VIN rising, TA= -40 ~ 85 oC
VIN UVLO Hysteresis
CURRENT-LIMIT AND SHORT-CIRCUIT PROTECTIONS
ILIM
ISHORT
Current Limit Threshold
VIN=2.7V to 5.5V, TA= -40 ~ 85 oC
Short Circuit Output Current
VIN=2.7V to 5.5V
-
1.5
-
A
OCB Output Low Voltage
IOCB=5mA
-
0.2
0.4
V
OCB Leakage Current
VOCB=5V
-
-
1
µA
5
12
20
ms
OCB OUTPUT PIN
tD(OCB)
OCB Deglitch Time
Copyright  ANPEC Electronics Corp.
Rev. A.2 - Nov., 2013
o
OCB assertion, TA= -40 ~ 85 C
3
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APL3518G
Electrical Characteristics (Cont.)
Unless otherwise specified, these specifications apply over VIN=5V, VENB=0V and TA= -40 ~ 85 oC. Typical values are at TA=25oC.
Symbol
Parameter
APL3518G
Test Conditions
Unit
Min.
Typ.
Max.
ENB INPUT PIN
VIH
Input Logic HIGH
VIN=2.7V to 5V
2
-
-
VIL
Input Logic LOW
VIN=2.7V to 5V
-
-
0.8
V
-
-
1
µA
-
40
-
Ω
µs
Input Current
VOUT Discharge Resistance
VEN=0V, VENB=5V, VOUT=1V
V
tD(ON)
Turn On Delay Time
-
30
-
tD(OFF)
Turn Off Delay Time
-
30
-
µs
No load, COUT=1µF, VIN=5V
-
400
-
µs
TJ rising
-
140
-
°C
-
20
-
°C
tSS
Soft-Start Time
OVER-TEMPERATURE PROTECTION (OTP)
TOTP
Over-Temperature Threshold
Over-Temperature Hysteresis
Copyright  ANPEC Electronics Corp.
Rev. A.2 - Nov., 2013
4
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APL3518G
Typical Operating Characteristics
Switch On Resistance vs.
Ambient Temperature
120
Switch On Resistance , RDS(on) (mΩ)
Switch On Resistance , RDS(on) (mΩ)
120
110
100
90
80
70
60
50
40
VIN =5V, IOUT =1A
0
50
Ambient Temperature
80
70
60
50
40
2.5
3.0
4.0
4.5
5.0
5.5
Supply Current vs. Input Voltage
60
55
Supply Current, ICC (µA)
40
0
50
45
40
35
30
25
VIN =5V, RLOAD = Open,
CIN =COUT =33µF/Electrolytic
-50
50
100
20
150
RLOAD = Open,
CIN =COUT =33µF/Electrolytic, TA=25oC
2.5
3.0
Junction Temperature (oC)
Current Limit Threshold, ILIM (A)
3
2
1
VIN =5V
100
150
5.5
3.4
3.2
3.0
2.8
2.6
2.4
2.2
TA =25oC
3.0
3.5
4.0
4.5
5.0
5.5
Input Voltage (V)
Junction Temperature (oC)
Copyright  ANPEC Electronics Corp.
Rev. A.2 - Nov., 2013
5.0
3.6
2.0
2.5
0
50
4.5
Input Voltage
3.8
4
0
4.0
Current Limit Threshold vs.
5
-50
3.5
Input Voltage (V)
Current Limit Threshold vs.
Junction Temperature
6
Current Limit Threshold, ILIM (A)
3.5
Input Voltage (V)
60
0
90
( oC)
80
20
100
150
Supply Current vs.
Junction Temperature
100
Supply Current, ICC (µA)
100
IOUT =1A, TA=25oC
110
30
30
-50
Switch On Resistance vs.
Input Voltage
5
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APL3518G
Typical Operating Characteristics (Cont.)
Short-Circuit Output Current vs.
Current-Limit Response vs.
Output Peak Current
VIN = 5V, TA=25oC
450
Current-Limit Response (µs)
Short-Circuit Output Current, ISHORT (A)
500
400
350
300
250
200
150
100
50
0
0
1
2
3
4
5
6
7
8
9
10
Input Voltage
2.6
2.4
2.2
2.0
1.8
1.6
1.4
1.2
1.0
V IN = 5V,RLOAD =0.5Ω, TA=25℃
0.8
2.5
3.0
3.5 4.0
4.5
EN pin Threshold Voltage vs.
EN pin Threshold Voltage, VEN (V)
EN pin Threshold Voltage, VEN (V)
3.0
2.5
EN Rising
1.5
EN Falling
1.0
0.5
RLOAD =50Ω,
CIN = COUT =33µF/Elctrolytic
-50
0
50
100
150
2.1
2.0
1.9
1.8
1.7
1.6
1.5
1.4
1.3
1.2
1.1
1.0
0.9
0.8
Input Voltage
EN Rising
EN Falling
VIN =5V, RLOAD =50Ω,
CIN = COUT =33µF/Elctrolytic, TA=25oC
2.5
3.0
3.5
2.5
2.0
1.5
1.0
0.5
50
100
17
16
15
14
13
12
11
10
RLOAD =1Ω,
CIN = COUT =33µF/Elctrolytic
9
150
-50
Junction Temperature (oC)
Copyright  ANPEC Electronics Corp.
Rev. A.2 - Nov., 2013
5.5
Junction Temperature
VIN =5V, Shutdown mode, RLOAD =0Ω,
CIN = COUT =33µF/Elctrolytic
0
5.0
18
3.0
0.0
-50
4.5
OCB Deglitch Time vs.
Turn-Off Leakage Current vs.
Junction Temperature
OCB Deglitch Time , TD(OCB) (ms)
Turn-Off Leakage Current, ILEAK (µA)
3.5
4.0
Input Voltage (V)
Junction Temperature (oC)
4.0
5.5
Input Voltage (V)
Output Peak Current (A)
EN pin Threshold Voltage vs.
Junction Temperature
2.0
5.0
0
50
100
Junction Temperature
6
150
( oC)
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APL3518G
Typical Operating Characteristics (Cont.)
OCB Deglitch Time vs.
UVLO Threshold Voltage, VUVLO (V)
18
OCB Deglitch Time , TD(OCB) (ms)
UVLO Threshold Voltage vs.
Input Voltage
17
16
15
14
13
12
11
RLOAD =1Ω,
CIN = COUT =33µF/Elctrolytic
10
9
2.5
3.0
3.5
4.0
4.5
5.0
Junction Temperature
3.2
2.8
UVLO Rising
2.4
UVLO Falling
2.0
1.6
ILOAD =15mA,
CIN = COUT =33µF/Elctrolytic
1.2
0.8
5.5
-50
0
Input Voltage (V)
Turn-On Rising Time, tR (µs)
Turn-Off Falling Time, tF (µs)
150
100
50
0
-50
0
50
100
VIN = 5V, RLOAD =30Ω,
CIN = 33µF/Elctrolytic, COUT =1µF/X7R
600
500
400
300
200
100
0
150
-50
0
Switch Off Supply Current vs.
VIN = 5V, RLOAD = Open,
CIN = COUT =33µF/Elctrolytic
Output Voltage, VOUT (V)
Switch Off Supply Current, ICC(off)(µA)
6
3.0
2.5
2.0
1.5
1.0
5
4
3
VIN = 5V, TA=25℃
2
1
0.5
0.0
150
100
Output Voltage vs. Output Current
Junction Temperature
3.5
50
Junction Temperature (oC)
Junction Temperature (oC)
4.0
( oC)
Turn-On Rising Time vs.
Junction Temperature
700
VIN = 5V, RLOAD =30Ω,
CIN = 33µF/Elctrolytic, COUT =1µF/X7R
150
100
Junction Temperature
Turn-Off Falling Time vs.
Junction Temperature
200
50
-50
0
50
Junction Temperature
Copyright  ANPEC Electronics Corp.
Rev. A.2 - Nov., 2013
100
0
150
0
( oC)
0.5
1
1.5
2
2.5
3
3.5
Output Current ( A)
7
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APL3518G
Operating Waveforms
The test condition is VIN=5V, TA= 25oC unless otherwise specified.
Turn On Response
Turn Off Response
VENB
1
1
V ENB
V OUT
VOUT
2
2
VIN =5V, RLOAD =30Ω, CIN =33µF/Electrolytic,
COUT =1µF/Electrolytic
VIN =5V, RLOAD =30Ω, CIN =33µF/Electrolytic,
COUT =1µF/Electrolytic
CH1: VENB, 5V/Div, DC
CH2: VOUT, 2V/Div, DC
TIME: 200µs/Div
CH1: VENB, 5V/Div, DC
CH2: VOUT, 2V/Div, DC
TIME: 100µs/Div
UVLO at Rising
UVLO at Falling
VIN
V OUT
VIN
1
1
VOUT
2
2
VIN =5V, RLOAD =30Ω, CIN =33µF/Electrolytic,
COUT =1µF/Electrolytic
VIN =5V, RLOAD =30Ω, CIN =33µF/Electrolytic,
COUT =1µF/Electrolytic
CH1: VIN, 1V/Div, DC
CH2: VOUT, 1V/Div, DC
TIME:2ms/Div
CH1: VIN, 1V/Div, DC
CH2: VOUT, 1V/Div, DC
TIME:5ms/Div
Copyright  ANPEC Electronics Corp.
Rev. A.2 - Nov., 2013
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APL3518G
Operating Waveforms (Cont.)
The test condition is VIN=5V, TA= 25oC unless otherwise specified.
OCB Response during Short Circuit
OCB Response with Ramped Load
VOCB
1
VEN B
VOUT
1
VOCB
2
2
IOUT
3
I OUT
3
VIN =5V, OUT short to GND,
CIN =COUT=33µF/Electrolytic
CH1: VENB, 5V/Div, DC
CH2: VOCB, 5V/Div, DC
CH3: IOUT, 2A/Div, DC
TIME: 5ms/Div
VIN =5V, CIN =COUT=33µF/Electrolytic
CH1: VOCB, 5V/Div, DC
CH2: V OUT, 2V/Div, DC
CH3: IOUT, 2A/Div, DC
TIME: 5ms/Div
Short Circuit Response
Load Transient Response
VOUT
VIN
VOUT
1
2
1
I OUT
3
IOUT
2
VIN =5V, RLOAD =1kΩ to 2.2Ω,
CIN =COUT=33µF/Electrolytic
CH1: VOUT, 1V/Div, DC
CH2: IOUT, 1A/Div, DC
TIME: 1ms/Div
VIN =5V, OUT Short to GND,
CIN =33µF/Electrolytic, No COUT
CH1: VIN, 2V/Div, DC
CH2: VOUT, 2V/Div, DC
CH3: IOUT, 5A/Div, DC
TIME: 50µs/Div
Copyright  ANPEC Electronics Corp.
Rev. A.2 - Nov., 2013
9
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APL3518G
Pin Description
PIN
FUNCTION
NO.
NAME
1
GND
Ground.
VIN
Power Supply Input. Connect this pin to external DC supply.
2
3
4
5
EN
(APL3518GA)
Enable Input. Pulling this pin to high will enable the device and pulling this pin to low will disable
device. The EN pin cannot be left floating.
ENB
(APL3518GB)
Enable Input. Pulling this pin to high will disable the device and pulling this pin to low will enable
device. The ENB pin cannot be left floating.
OCB
Fault Indication Pin. This pin goes low when a current limit or an over-temperature condition is
detected after a 12ms deglitch time.
VOUT
Output Voltage Pin. The output voltage follows the input voltage. When ENB is high or EN is low, the
output voltage is discharged by an internal resistor.
6
7
8
Block Diagram
VIN
VOUT
UVLO
Charge
Pump
Short-Circuit
Protection
Current
Limit
Gate Driver and
Control Logic
OCB
ENB
GND
OTP
Copyright  ANPEC Electronics Corp.
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APL3518G
Typical Application Circuit
3.3V
USB Port
5V
CIN
50kΩ
VIN
1µF
USB
Controller
VOUT
APL3518G
CBYP
COUT
0.1µF
150µF
VBUS
D+
D-
OCB
GND
EN/ENB
GND
Copyright  ANPEC Electronics Corp.
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APL3518G
Function Description
VIN Under-Voltage Lockout (UVLO)
Enable/Disable
The APL3518G of power switches have a built-in under-
Pull the ENB above 2V or EN below 0.8V will disable the
device, and pull ENB pin below 0.8V or EN above 2V will
voltage lockout circuit to keep the output shutting off until
internal circuitry is operating properly. The UVLO circuit
enable the device. When the IC is disabled, the supply
current is reduced to less than 1µA. The enable input is
has hysteresis and a de-glitch feature so that it will typically ignore undershoot transients on the input. When
compatible with both TTL and CMOS logic levels. The
EN/ENB pin cannot be left floating.
input voltage exceeds the UVLO threshold, the output
voltage starts a soft-start to reduce the inrush current.
Power Switch
Over-Temperature Protection
The power switch is an N-channel MOSFET with a low
When the junction temperature exceeds 140oC, the inter-
RDS(ON). The internal power MOSFET does not have the
body diode. When IC is off, the MOSFET prevents a cur-
nal thermal sense circuit turns off the power FET and
allows the device to cool down. When the device’s junc-
rent flowing from the VOUT back to VIN and VIN to VOUT.
tion temperature cools by 20 oC, the internal thermal
sense circuit will enable the device, resulting in a pulsed
Current-Limit Protection
output during continuous thermal protection. Thermal
protection is designed to protect the IC in the event of
The APL3518G of power switches provide the currentlimit protection function. During current-limit, the devices
over temperature conditions. For normal operation, the
junction temperature cannot exceed TJ=+125oC.
limit output current at current limit threshold. For reliable
operation, the device should not be operated in currentlimit for extended period.
Short-Circuit Protection
When the output voltage drops below 1.5V, which is
caused by an over-load or a short-circuit, the devices limit
the output current down to a safe level. The short-circuit
current limit is used to reduce the power dissipation during short-circuit conditions. If the junction temperature
reaches over-temperature threshold, the device will enter the thermal shutdown.
OCB Output
The APL3518G of power switches provide an open-drain
output to indicate that a fault has occurred. When any of
current-limit or over-temperature protection occurs for a
deglitch time of tD(OCB), the OCB goes low. Since the OCB
pin is an open-drain output, connecting a resistor to a
pull high voltage is necessary.
Copyright  ANPEC Electronics Corp.
Rev. A.2 - Nov., 2013
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APL3518G
Application Information
Input Capacitor
A 1µF ceramic bypass capacitor from VIN to GND, located
near the APL3518G, is strongly recommended to suppress the ringing during short circuit fault event. Without
the bypass capacitor, the output short may cause sufficient ringing on the input (from supply lead inductance) to
damage internal control circuitry.
Output Capacitor
A low-ESR 150µF aluminum electrolytic or tantalum between VOUT and GND is strongly recommended to reduce
the voltage drop during hot-attachment of downstream
peripheral. (Per USB 2.0, output ports must have a minimum 120µF of low-ESR bulk capacitance per hub).
Higher-value output capacitor is better when the output
load is heavy. Additionally, bypassing the output with a
0.1µF ceramic capacitor improves the immunity of the device to short-circuit transients.
Layout Consideration
The PCB layout should be carefully performed to maximize thermal dissipation and to minimize voltage drop,
droop and EMI. The following guidelines must be
considered:
1. Please place the input capacitors near the VIN pin as
close as possible.
2. Output decoupling capacitors for load must be placed
near the load as close as possible for decoupling highfrequency ripples.
3. Locate APL3518G and output capacitors near the load
to reduce parasitic resistance and inductance for excellent load transient performance.
4. The negative pins of the input and output capacitors
and the GND pin must be connected to the ground plane
of the load.
5. Keep VIN and VOUT traces as wide and short as possible.
Copyright  ANPEC Electronics Corp.
Rev. A.2 - Nov., 2013
13
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APL3518G
Package Information
MSOP-8
D
b
0.25
A
A1
A2
c
L
GAUGE PLANE
SEATING PLANE
0
e
E
E1
SEE VIEW A
VIEW A
S
Y
M
B
O
L
MSOP-8
MILLIMETERS
MIN.
INCHES
MIN.
MAX.
A
MAX.
0.043
1.10
0.00
0.15
0.000
0.006
A2
0.75
0.95
0.030
0.037
b
0.22
0.38
0.009
0.015
c
0.08
0.23
0.003
0.009
A1
D
2.90
3.10
0.114
0.122
E
4.70
5.10
0.185
0.201
E1
2.90
3.10
0.114
e
0.65 BSC
0.122
0.026 BSC
L
0.40
0.80
0.016
0.031
0
0°
8°
0°
8°
Note: 1. Follow JEDEC MO-187 AA.
2. Dimension “D”does not include mold flash, protrusions or gate
burrs. Mold flash, protrusion or gate burrs shall not exceed 6 mil
per side.
3. Dimension “E1”does not include inter-lead flash or protrusions.
Inter-lead flash and protrusions shall not exceed 5 mil per side.
Copyright  ANPEC Electronics Corp.
Rev. A.2 - Nov., 2013
14
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APL3518G
Carrier Tape & Reel Dimensions
P0
P2
P1
A
B0
W
F
E1
OD0
K0
A0
A
OD1 B
B
T
SECTION A-A
SECTION B-B
H
A
d
T1
Application
MSOP-8
A
H
330.0±2.00
50 MIN.
P0
P1
4.00±0.10
8.00±0.10
T1
C
12.4+2.00 13.0+0.50
-0.00
-0.20
P2
D0
2.00±0.05
1.5+0.10
-0.00
d
D
1.5 MIN.
20.2 MIN.
W
E1
12.0±0.30 1.75±0.10
F
5.5±0.05
D1
T
A0
B0
K0
1.5 MIN.
0.6+0.00
-0.40
5.30±0.20
3.30±0.20
1.40±0.20
(mm)
Copyright  ANPEC Electronics Corp.
Rev. A.2 - Nov., 2013
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APL3518G
Devices Per Unit
Package Type
Unit
Quantity
MSOP-8
Tape & Reel
3000
Taping Direction Information
MSOP-8
USER DIRECTION OF FEED
Copyright  ANPEC Electronics Corp.
Rev. A.2 - Nov., 2013
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APL3518G
Classification Profile
Classification Reflow Profiles
Profile Feature
Sn-Pb Eutectic Assembly
Pb-Free Assembly
100 °C
150 °C
60-120 seconds
150 °C
200 °C
60-120 seconds
3 °C/second max.
3 °C/second max.
183 °C
60-150 seconds
217 °C
60-150 seconds
See Classification Temp in table 1
See Classification Temp in table 2
Time (tP)** within 5°C of the specified
classification temperature (Tc)
20** seconds
30** seconds
Average ramp-down rate (Tp to Tsmax)
6 °C/second max.
6 °C/second max.
6 minutes max.
8 minutes max.
Preheat & Soak
Temperature min (Tsmin)
Temperature max (Tsmax)
Time (Tsmin to Tsmax) (ts)
Average ramp-up rate
(Tsmax to TP)
Liquidous temperature (TL)
Time at liquidous (tL)
Peak package body Temperature
(Tp)*
Time 25°C to peak temperature
* Tolerance for peak profile Temperature (Tp) is defined as a supplier minimum and a user maximum.
** Tolerance for time at peak profile temperature (tp) is defined as a supplier minimum and a user maximum.
Copyright  ANPEC Electronics Corp.
Rev. A.2 - Nov., 2013
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APL3518G
Classification Reflow Profiles (Cont.)
Table 1. SnPb Eutectic Process – Classification Temperatures (Tc)
Package
Thickness
<2.5 mm
≥2.5 mm
Volume mm
<350
235 °C
220 °C
3
Volume mm
≥350
220 °C
220 °C
3
Table 2. Pb-free Process – Classification Temperatures (Tc)
Package
Thickness
<1.6 mm
1.6 mm – 2.5 mm
≥2.5 mm
Volume mm
<350
260 °C
260 °C
250 °C
3
Volume mm
350-2000
260 °C
250 °C
245 °C
3
Volume mm
>2000
260 °C
245 °C
245 °C
3
Reliability Test Program
Test item
SOLDERABILITY
HOLT
PCT
TCT
HBM
MM
Latch-Up
Method
JESD-22, B102
JESD-22, A108
JESD-22, A102
JESD-22, A104
MIL-STD-883-3015.7
JESD-22, A115
JESD 78
Description
5 Sec, 245°C
1000 Hrs, Bias @ Tj=125°C
168 Hrs, 100%RH, 2atm, 121°C
500 Cycles, -65°C~150°C
VHBM≧2KV
VMM≧200V
10ms, 1tr≧100mA
Customer Service
Anpec Electronics Corp.
Head Office :
No.6, Dusing 1st Road, SBIP,
Hsin-Chu, Taiwan, R.O.C.
Tel : 886-3-5642000
Fax : 886-3-5642050
Taipei Branch :
2F, No. 11, Lane 218, Sec 2 Jhongsing Rd.,
Sindian City, Taipei County 23146, Taiwan
Tel : 886-2-2910-3838
Fax : 886-2-2917-3838
Copyright  ANPEC Electronics Corp.
Rev. A.2 - Nov., 2013
18
www.anpec.com.tw