Technical Brief: TB-200 INTEGRATED CIRCUITS DIVISION Pb-Free Solder Reflow Profile for Select Devices TB-200-R01 www.ixysic.com 1 Technical Brief: TB-200 INTEGRATED CIRCUITS DIVISION IXYS Integrated Circuits Division is providing the following lead-free solder reflow temperature profile for a small number of optically coupled devices whose data sheet specifies the solder reflow profile given in Technical Brief TB-200 "Pb-Free Solder Reflow Profile for Select Devices" must be followed. This profile is similar to that provided in J-STD-020 with a few subtle differences to minimize damage during the reflow process caused by moisture retention of the package. One modification splits the Preheat stage into two sections, Preheat 1 and Preheat 2. Preheat 1 is used to improve water vapor removal from the package while Preheat 2 rounds out the preheat temperature increase specified in J-STD-020. The other modification to the JEDEC profile is the reduction of the maximum time the body temperature of the device is within 5°C of the classification temperature. This dwell time, identified as tp in the profile below, is limited to 15 seconds. In addition to these modifications the maximum ramp rate over any time range during "Time 25°C to Peak" is restricted to 3°C/s. Solder Reflow Profile Tc Tp Ramp-Up Max. Rate = 3ºC/s Temperature TL Tsmax tp 15s max Tc - 5ºC Ramp-Down Max. Rate = 6ºC/s tL 60s - 150s Tsmid Preheat 2 Tsmin ts2 Preheat 1 ts1 (180ºC - 200ºC) 30s - 60s (150ºC - 180ºC) 60s - 120s 25ºC Time 25ºC to Peak TIME 1. 2. 3. 4. 5. 6. 7. 8. (Note: Drawing is not to scale) Tc - Classification temperature: maximum body temperature rating of the device as given in the data sheet. Tp = Peak package body temperature during the soldering reflow process, Tp < Tc. TL = 217°C = Liquidus temperature of Pb-free solder. Preheat / Soak period: • Tsmin = 150°C = Body temperature at the beginning of the preheat step. • Tsmid = 180°C = Temperature marking end of Preheat 1 and the beginning of Preheat 2. • Tsmax = 200°C = Body temperature attained at the end of the preheat period. tL = Time maintained above TL. Time 25°C to Peak < 8 minutes. tp = time within 5°C of classification temperature. Maximum ramp rates are true maximums over any time range (not average). Note: Body temperature is based on temperature sensor positioned at the center of the package surface facing upward during the solder reflow procedure. 2 www.ixysic.com R01 Technical Brief: TB-200 INTEGRATED CIRCUITS DIVISION For additional information please visit our website at: www.ixysic.com IXYS Integrated Circuits Division makes no representations or warranties with respect to the accuracy or completeness of the contents of this publication and reserves the right to make changes to specifications and product descriptions at any time without notice. Neither circuit patent licenses nor indemnity are expressed or implied. Except as set forth in IXYS Integrated Circuits Division’s Standard Terms and Conditions of Sale, IXYS Integrated Circuits Division assumes no liability whatsoever, and disclaims any express or implied warranty, relating to its products including, but not limited to, the implied warranty of merchantability, fitness for a particular purpose, or infringement of any intellectual property right. The products described in this document are not designed, intended, authorized or warranted for use as components in systems intended for surgical implant into the body, or in other applications intended to support or sustain life, or where malfunction of IXYS Integrated Circuits Division’s product may result in direct physical harm, injury, or death to a person or severe property or environmental damage. IXYS Integrated Circuits Division reserves the right to discontinue or make changes to its products at any time without notice. Specification: TB-200-R01 ©Copyright 2015, IXYS Integrated Circuits Division All rights reserved. Printed in USA. 11/10/2015 R01 www.ixysic.com 3