CPC1333 Single-Pole Normally Closed OptoMOS® Relay INTEGRATED CIRCUITS DIVISION Parameters Peak Blocking Voltage Load Current On-Resistance (max) Isolation Voltage, Input to Output Ratings 350 Units VP 130 30 5000 mArms / mADC Vrms Features • • • • • • 5000Vrms Input/Output Isolation 350VP Blocking Voltage Low Drive Power Requirements Arc-Free With No Snubbing Circuits No EMI/RFI Generation Small 4-Pin Package Description The CPC1333G is a single-pole, normally closed (1-Form-B) Solid State Relay with an enhanced input to output isolation barrier of 5000Vrms. The relay output is constructed with efficient MOSFET switches that use IXYS Integrated Circuits Division's patented OptoMOS architecture. The input, a highly efficient infrared LED, controls the optically coupled output. Approvals • UL Recognized Component: File E76270 • EN/IEC 60950-1 Certified Component: TUV Certificate B 13 12 82667 003 Ordering Information Applications • Telephony Switching • Instrumentation • Multiplexers • Data Acquisition • Electronic Switching • I/O Subsystems • Meters (Watt-Hour, Water, Gas) • Medical Equipment—Patient/Equipment Isolation • Security • Aerospace • Industrial Controls Part Number CPC1333G CPC1333GR CPC1333GRTR Description 4-Pin DIP (100/Tube) 4-Pin Surface Mount (100/Tube) 4-Pin Surface Mount (1000/Reel) Pin Configuration + Control – Control 1 4 2 3 Load Load Switching Characteristics of Normally Closed Devices Form-B IF ILOAD 10% ton DS-CPC1333-R03 www.ixysic.com 90% toff 1 INTEGRATED CIRCUITS DIVISION CPC1333 Absolute Maximum Ratings @ 25ºC Parameter Peak Blocking Voltage Reverse Input Voltage Input Control Current Peak (10ms) Input Power Dissipation 1 Total Package Dissipation 2 Isolation Voltage, Input to Output ESD Rating, Human Body Model Operational Temperature Storage Temperature 1 Derate linearly 1.33mW / ºC 2 Derate linearly 3mW / ºC Ratings 350 5 50 1 100 550 5000 8 -40 to +85 -40 to +125 Units VP V mA A mW mW Vrms kV ºC ºC Absolute Maximum Ratings are stress ratings. Stresses in excess of these ratings can cause permanent damage to the device. Functional operation of the device at conditions beyond those indicated in the operational sections of this data sheet is not implied. Typical values are characteristic of the device at +25°C, and are the result of engineering evaluations. They are provided for information purposes only, and are not part of the manufacturing testing requirements. Electrical Characteristics @ 25ºC Parameters Output Characteristics Load Current Continuous Peak On-Resistance 1 Off-State Leakage Current Switching Speeds Turn-On Turn-Off Output Capacitance Input Characteristics Input Control Current to Activate 2 Input Control Current to Deactivate Input Voltage Drop Reverse Input Current Common Characteristics Capacitance, Input to Output 1 2 Conditions Symbol Min Typ Max Units - IL - - 130 t=10ms IL=130mA IF=2mA, VL=350V ILPK RON ILEAK - 25 - ±350 30 1 mArms / mADC mAP IF=2mA, VL=50V, f=1MHz ton toff COUT - 6 2 3 - IL=130mA IF=5mA VR=5V IF IF VF IR 0.1 0.9 - 0.18 1.26 - 2 1.4 10 mA mA V A VIO=0V, f=1MHz CI/O - 3 - pF IF=5mA, VL=10V ms pF Measurement taken within one second of on-time. For high temperature operation (> 60ºC), IXYS Integrated Circuits Division recommends a minimum LED drive current of 5mA. Timing Diagram CPC1333G Isolation Test Circuit 1 IF 4 0 mA 2 IL 2 A 90% 10% 0 mA ton 3 Test Conditions: Voltage Ramp: Test Time: ILEAK Threshold: Test Voltage: 2V/s 2 Seconds 50A 6kVrms 6kVrms toff www.ixysic.com R03 INTEGRATED CIRCUITS DIVISION CPC1333 PERFORMANCE DATA @25ºC (Unless Otherwise Noted)* 15 10 5 0 15 10 5 0.24 Device Count (N) 15 10 5 0 0.28 0.30 0.32 0.34 Turn-On Time (ms) 0.14 0.16 0.18 0.20 LED Current (mA) 10 5 25 1.3 2.0 IF=50mA IF=20mA IF=10mA IF=5mA IF=2mA Turn-Off Time (Ps) Turn-On Time (Ps) 1.4 336 334 332 330 328 324 80 Typical IF for Switch Operation vs. Temperature (IL=60mA) 10 20 30 LED Current (mA) 40 0.5 0 20 40 60 Temperature (ºC) 80 100 1000 750 500 400 IF=10mA IF=5mA IF=2mA 300 200 0 -40 -20 0 20 40 60 Temperature (ºC) 10 80 100 20 30 LED Current (mA) 40 50 Typical Turn-Off Time vs. Temperature (IL=60mA) 2500 100 -20 Typical Turn-Off Time vs. LED Forward Current (IL=60mA) 0 Turn-Off Time (Ps) Turn-On Time (Ps) LED Current (mA) 1.0 460 470 1250 50 Typical Turn-On Time vs. Temperature (IL=60mA) 600 1.5 410 420 430 440 450 Blocking Voltage (VP) 0 0 100 500 0.0 -40 5 250 326 20 40 60 Temperature (ºC) 10 1500 338 0 15 400 Typical Turn-On Time vs. LED Forward Current (IL=60mA) 340 -20 20 23.75 24.50 25.25 26.00 26.75 27.50 28.25 On-Resistance (:) 1.5 1.0 -40 Typical Blocking Voltage Distribution (N=50, IF=2mA) 0 0.22 1.6 1.1 5 0.295 0.305 0.315 0.325 0.335 0.345 0.355 Turn-Off Time (ms) 15 Typical LED Forward Voltage Drop vs. Temperature 1.2 10 0.36 0 0.12 LED Forward Voltage (V) 0.26 Typical On-Resistance Distribution (N=50, IF=0mA, IL=130mA) 20 20 15 0 1.275 Device Count (N) 1.255 1.260 1.265 1.270 LED Forward Voltage (V) Typical IF for Switch Operation (N=50, IL=130mA) 25 Device Count (N) 20 0 1.250 Typical Turn-Off Time (N=50, IF=5mA, IL=60mA) 20 Device Count (N) 20 Typical Turn-On Time (N=50, IF=5mA, IL=60mA) 25 Device Count (N) Device Count (N) 25 Typical LED Forward Voltage Drop (N=50, IF=5mA) 2000 IF=2mA IF=5mA IF=10mA 1500 1000 500 0 -40 -20 0 20 40 60 Temperature (ºC) 80 100 * The Performance data shown in the graphs above is typical of device performance. For guaranteed parameters not indicated in the written specifications, please contact our application department. R03 www.ixysic.com 3 INTEGRATED CIRCUITS DIVISION CPC1333 PERFORMANCE DATA @25ºC (Unless Otherwise Noted)* Typical On-Resistance vs. Temperature (IF=0mA, IL=60mA) 0.15 35 30 25 0.05 0.00 -0.05 -0.10 -20 0 20 40 60 Temperature (ºC) 80 500 460 400 Leakage (nA) Blocking Voltage (VP) Typical Blocking Voltage vs. Temperature 465 455 450 440 -40 -3 -2 -1 0 1 Load Voltage (V) 2 3 -20 0 20 40 60 Temperature (ºC) 80 50 -40 Typical Leakage vs. Temperature Measured Between Pins 3 & 4 (IF=2mA, VL=350V) 70 300 200 0 -40 100 75 4 100 445 100 0 -4 100 125 25 -0.15 Output Capacitance (pF) 20 -40 Load Current (mA) 40 Maximum Load Current vs. Temperature (IF=0mA) 150 0.10 Load Current (A) On-Resistance (:) 45 Typical Load Current vs. Load Voltage (IF=0mA) -20 0 20 40 60 Temperature (ºC) 80 100 Output Capacitance vs. Load Voltage (IF=2mA, f=1MHz) 60 50 40 30 20 10 0 -20 0 20 40 60 Temperature (ºC) 80 100 10s 100s 0.1 1 10 100 Load Voltage (V) 1000 Energy Rating Curve Load Current (A) 1.0 0.8 0.6 0.4 0.2 0.0 10Ps 100Ps 1ms 10ms 100ms Time 1s * The Performance data shown in the graphs above is typical of device performance. For guaranteed parameters not indicated in the written specifications, please contact our application department. 4 www.ixysic.com R03 INTEGRATED CIRCUITS DIVISION CPC1333 Manufacturing Information Moisture Sensitivity All plastic encapsulated semiconductor packages are susceptible to moisture ingression. IXYS Integrated Circuits Division classified all of its plastic encapsulated devices for moisture sensitivity according to the latest version of the joint industry standard, IPC/JEDEC J-STD-020, in force at the time of product evaluation. We test all of our products to the maximum conditions set forth in the standard, and guarantee proper operation of our devices when handled according to the limitations and information in that standard as well as to any limitations set forth in the information or standards referenced below. Failure to adhere to the warnings or limitations as established by the listed specifications could result in reduced product performance, reduction of operable life, and/or reduction of overall reliability. This product carries a Moisture Sensitivity Level (MSL) rating as shown below, and should be handled according to the requirements of the latest version of the joint industry standard IPC/JEDEC J-STD-033. Device Moisture Sensitivity Level (MSL) Rating CPC1333G CPC1333GR MSL 1 MSL 3 ESD Sensitivity This product is ESD Sensitive, and should be handled according to the industry standard JESD-625. Soldering Profile Provided in the table below is the Classification Temperature (TC) of this product and the maximum dwell time the body temperature of this device may be above (TC - 5)ºC. The classification temperature sets the Maximum Body Temperature allowed for this device during lead-free reflow processes. Additionally, for the CPC1333GR, the solder reflow profile given in Technical Brief TB-200 "Pb-Free Solder Reflow Profile for Select Devices" must be followed. For the through-hole device, CPC1333G, and any other processes, the guidelines of J-STD-020 must be observed. Device Maximum Body Temperature (Tc) Time CPC1333GR 250ºC 15 seconds Board Wash IXYS Integrated Circuits Division recommends the use of no-clean flux formulations. Board washing to reduce or remove flux residue following the solder reflow process is acceptable provided proper precautions are taken to prevent damage to the device. These precautions include, but are not limited to: using a low pressure wash and providing a follow-up bake cycle sufficient to remove any moisture trapped within the device due to the washing process. Due to the variability of the wash parameters used to clean the board, determination of the bake temperature and duration necessary to remove the moisture trapped within the package is the responsibility of the user (assembler). Cleaning or drying methods that employ ultrasonic energy may damage the device, and should not be used. Additionally, the device must not be exposed to flux or solvents that are Chlorine- or Fluorine-based. R03 www.ixysic.com 5 INTEGRATED CIRCUITS DIVISION CPC1333 Mechanical Dimensions CPC1333G 0.991 (0.039) PC Board Pattern (Top View) 0.254 (0.010) 3.30 ± 0.050 (0.130 ± 0.002) 6 - 0.800 DIA. (6 - 0.031 DIA.) 6.350 ± 0.127 (0.250 ± 0.005) 4.572 ± 0.127 (0.180 ± 0.005) 2.540 ± 0.127 (0.100 ± 0.005) 7.620 ± 0.127 (0.300 ± 0.005) PIN 1 9º (ALL) 9º (ALL) 7.620 ± 0.250 (0.300 ± 0.010) 2.159 (0.085) 0.457 ± 0.076 (0.018 ± 0.003) 9.144 ± 0.508 (0.360 ± 0.020) 6.350 ± 0.127 (0.250 ± 0.005) 0.508 (0.020) 3.175 (0.125) 2.540 ± 0.127 (0.100 ± 0.005) Dimensions mm (inches) CPC1333GR 2.540 ± 0.127 (0.100 ± 0.005) PCB Land Pattern 3.300 ± 0.050 (0.130 ± 0.002) 0.635 ± 0.254 (0.025 ± 0.010) 6.350 ± 0.127 (0.250 ± 0.005) 9.525 (0.375) 7.620 ± 0.254 (0.300 ± 0.010) 8.80 (0.346) 1.60 (0.063) PIN #1 0.991 (0.039) 9º ± 1º (ALL) 2.287 (0.09) 3.480 ± 0.076 (0.137 ± 0.003) 4.572 ± 0.127 (0.180 ± 0.005) 0.254 (0.010) 0.95 (0.037) 2.540 ± 0.127 (0.100 ± 0.005) 2.287 ± 0.127 (0.090 ± 0.005) 6 0.102 min / 0.254 max (0.004 min / 0.010 max) www.ixysic.com Dimensions mm (inches) R03 INTEGRATED CIRCUITS DIVISION CPC1333 CPC1333GRTR Tape & Reel 330.2 Dia (13.00 Dia) Top Cover Tape Thickness 0.102 Max (0.004 Max) W=16.00±0.30 (0.630±0.012) B0=5.00 (0.197) K0=4.20 (0.165) K1=3.70 (0.146) A0=10.01 (0.394) P=12.00 (0.472) Dimensions mm (inches) Embossed Carrier Embossment NOTES: 1. All dimensions meet EIA-481-C requirements 2. Unless otherwise noted, tolerances = ±0.10 (0.004) For additional information please visit our website at: www.ixysic.com IXYS Integrated Circuits Division makes no representations or warranties with respect to the accuracy or completeness of the contents of this publication and reserves the right to make changes to specifications and product descriptions at any time without notice. Neither circuit patent licenses nor indemnity are expressed or implied. Except as set forth in IXYS Integrated Circuits Division’s Standard Terms and Conditions of Sale, IXYS Integrated Circuits Division assumes no liability whatsoever, and disclaims any express or implied warranty, relating to its products including, but not limited to, the implied warranty of merchantability, fitness for a particular purpose, or infringement of any intellectual property right. The products described in this document are not designed, intended, authorized or warranted for use as components in systems intended for surgical implant into the body, or in other applications intended to support or sustain life, or where malfunction of IXYS Integrated Circuits Division’s product may result in direct physical harm, injury, or death to a person or severe property or environmental damage. IXYS Integrated Circuits Division reserves the right to discontinue or make changes to its products at any time without notice. 7 Specification: DS-CPC1333-R03 ©Copyright 2016, IXYS Integrated Circuits Division All rights reserved. Printed in USA. 1/7/2016