SKY66185_11_203354D.pdf

DATA SHEET
SKY66185-11: 851 to 894 MHz Linear Power Amplifier
Applications
 3G/4G LTE Bands 5, 6, 18, 19, 26, and 27 small cell
VCC1
VBIAS
VEN
VCC3
 Active distributed antenna system
 Cellular repeaters
Active Bias
RFOUT
Coupling Port
 Driver amplifier
RFIN
Output
Match
Input
Match
Features
Input Stage
 High gain: 36.5 dB (unconditionally stable)
 High linearity: +23 dBm with –50 dBc ACLR @ 85°C
(WCDMA Test Model 1 with 64 DPCH)
 RF input and output internally matched to 50 Ω
 Excellent output return loss: <–15 dB
 Integrated active bias: performance compensated over temp
 PA On/Off function: 6.5 μs switching time
 Integrated coupler for output power monitoring
 Single supply voltage: 3.3 V
 Minimal external components
 Pin-to-pin compatible PA family supporting all 3GPP bands
 Small 5 x 5 mm, 28-pin package
(MSL3, 260 C per JEDEC J-STD-020)
Skyworks GreenTM products are compliant with
all applicable legislation and are halogen-free.
For additional information, refer to Skyworks
Definition of GreenTM, document number
SQ04–0074.
RFOUT
Output Stage
203345-001
Figure 1. SKY66185-11 Linear PA Block Diagram
Description
The SKY66185-11 is a high-linearity power amplifier (PA) with
fully matched input/output and high gain. The compact 5 x 5 mm
PA is designed for FDD 3G/4G LTE small cell base stations
operating from 851 to 894 MHz. The active biasing circuitry is
integrated to compensate PA performance over temperature,
voltage, and process variation as well as an internal coupler for
power monitoring.
The SKY66185-11 requires minimal external components and is
part of a high-linearity, pin-to-pin compatible PA family
supporting all 3GPP bands.
A block diagram of the SKY66185-11 is shown in Figure 1. The
device package and pinout for the 28-pin device are shown in
Figure 2. Table 1 lists the pin-to-pin compatible parts in the PA
family.
Table 1. Pin-to-Pin Compatible PA Family
Part Number
Frequency (MHz)
LTE Band
SKY66180-11
790 to 821
20
SKY66181-11
1805 to 1880
3
SKY66182-11
2300 to 2400
30, 40
SKY66183-11
3400 to 3600
22, 42
SKY66184-11
2110 to 2170
1, 4, 10, and 23
SKY66185-11
851 to 894
5, 6, 18, 19, 26, and 27
SKY66186-11
728 to 768
12, 13, 14, and 17
SKY66187-11
2620 to 2690
7
SKY66188-11
758 to 803
28
SKY66189-11
1930 to 1995
2 and 25
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203354D • Skyworks Proprietary Information • Products and Product Information are Subject to Change Without Notice • May 11, 2016
1
GND
N/C
GND
N/C
VCC3
28
27
26
25
24
23
N/C
VCC1
DATA SHEET • SKY66185-11: 851 TO 894 MHz LINEAR POWER AMPLIFIER
GND
1
22
21
GND
GND
2
20
GND
N/C
3
19
RFOUT
RFIN
4
18
N/C
N/C
5
17
N/C
GND
6
16
GND
VEN
7
15
GND
14
RFOUT_COUP
13
GND
12
N/C
11
GND
10
VBIAS
9
N/C
N/C
8
203354C-002
Figure 2. SKY66185-11 Pinout
(Top View)
Table 2. SKY66185-11 Signal Descriptions
Pin
Name
Description
Pin
Name
Description
1
GND
Ground
15
GND
Ground
2
GND
Ground
16
GND
Ground
3
N/C
No internal connection
17
N/C
No internal connection
4
RFIN
RF input
18
N/C
No internal connection
5
N/C
No internal connection
19
RFOUT
RF output
6
GND
Ground
20
GND
Ground
7
VEN
Enable (active low)
21
GND
Ground
8
N/C
No internal connection
22
N/C
No internal connection
9
N/C
No internal connection
23
VCC3
Output stage supply voltage
10
VBIAS
Bias voltage
24
N/C
No internal connection
11
GND
Ground
25
GND
Ground
12
N/C
No internal connection
26
N/C
No internal connection
13
GND
Ground
27
GND
Ground
14
RFOUT_COUP
RF output coupling port
28
VCC1
Input stage supply voltage
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DATA SHEET • SKY66185-11: 851 TO 894 MHz LINEAR POWER AMPLIFIER
Technical Description
Electrical and Mechanical Specifications
The SKY66185-11 PA contains all of the needed RF matching and
DC biasing circuits. This two-stage device is optimized for high
linearity and power efficiency. These features make the device
suitable for wideband applications where PA linearity and power
consumption are of critical importance (e.g., small cell and
infrastructure applications).
The absolute maximum ratings of the SKY66185-11 are provided
in Table 3. The recommended operating conditions are specified
in Table 4, and electrical specifications are provided in Table 5.
Typical performance characteristics are shown in Figures 3
through 7.
The device is designed for standard WCDMA and LTE modulated
signals. Under these stringent test conditions, the device exhibits
excellent spectral purity and power efficiency.
Table 3. SKY66185-11 Absolute Maximum Ratings1
Parameter
Symbol
Minimum
Maximum
Units
0
+4.0
V
700
mA
Supply voltage (VCC)
VCC
Total supply current
ICC
Logic control input voltage (VEN)
VEN
–0.5
3.6
V
Case operating temperature2
TC
–40
+105
C
Storage temperature
TSTG
–55
+150
C
Junction temperature
TJ
+150
C
Thermal resistance
θJC
21
C/W
Power dissipation
PDISS
2.3
W
Electrostatic discharge:
ESD
500
150
V
V
Charged Device Model (CDM)
Human Body Model (HBM)
1 Exposure to maximum rating conditions for extended periods may reduce device reliability. There is no damage to device with only one parameter set at the limit and all other parameters set
at or below their nominal value. Exceeding any of the limits listed here may result in permanent damage to the device.
2 Case operating temperature (Tc) refers to the temperature of the bottom ground pad.
ESD HANDLING: Although this device is designed to be as robust as possible, electrostatic discharge (ESD) can damage this device. This
device must be protected at all times from ESD when handling or transporting. Static charges may easily produce
potentials of several kilovolts on the human body or equipment, which can discharge without detection. Industrystandard ESD handling precautions should be used at all times.
Table 4. SKY66185-11 Recommended Operating Conditions
Parameter
Symbol
Minimum
Frequency range
f
851
Supply voltage (VCC1, VCC2, VCC3)1
VCC
3.0
VENH
VENL
2.5
0
Typical
3.3
Maximum
Units
894
MHz
3.6
V
3.6
0.6
V
V
<1
mA
+85
C
PA enable control voltage (active low):
Disable
Enable
PA enable current (@ PAEN = 3.6 V)
IEN
Case operating temperature
TC
+25
+40
1 Voltage levels measured at the pads of the package. The Evaluation Board supply voltage levels may be different.
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DATA SHEET • SKY66185-11: 851 TO 894 MHz LINEAR POWER AMPLIFIER
Table 5. SKY66185-11 Electrical Specifications1
(VCC = +3.3 V, TC = +25 C, f = 872.5 MHz, Characteristic Impedance [ZO] = 50 Ω, VEN = 0 V, Unless Otherwise Noted)
Parameter
Symbol
Gain
[email protected]
Test Condition
Typical
Max
Input return loss
|S11|
CW, PIN = –30 dBm
Output return loss:
|S22|
CW, PIN = –30 dBm:
In-band frequency: 851 and 894 MHz
Out-of-band frequency: 831 and 914 MHz
36.0
36.0
35.5
36.5
36.3
36.0
dB
dB
dB
8.0
10.0
dB
11.0
10.0
15.0
13.0
dB
dB
Quiescent current
ICQ
No RF
130
160
mA
Operating current
ICC
CW, POUT = +23 dBm
420
480
mA
Power-down current
IPD
VEN = 2.5 V
0.1
1.5
mA
Adjacent channel leakage ratio
ACLR
@ 5 MHz offset, WCDMA test model 1, with
64 DPCH, 8.5 dB PAR,
POUT = +23 dBm
–50
–46.5
dBc
Output 1 dB compression point
OP1dB
CW (Gain compression less than 1dB
reference to [email protected])
+30.3
+30.8
Power-added efficiency
PAE
CW @ POUT = +23 dBm
12
14
Output coupling factor
CPLOUT
POUT = +23 dBm, CW
16
18
dBm
%
20
1 Performance is guaranteed only under the conditions listed in this table.
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4
Units
CW, POUT = +23 dBm:
851 MHz
872.5 MHz
894 MHz
In-band
Out-of-band
Min
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dB
DATA SHEET • SKY66185-11: 851 TO 894 MHz LINEAR POWER AMPLIFIER
Typical Performance Characteristics
(VCC = +3.3 V, TC = +25 C, f = 872.5 MHz, Characteristic Impedance [ZO] = 50 Ω, VEN = 0 V, Unless Otherwise Noted)
44
35
25 °C
40 °C
85 °C
42
25
38
PAE (%)
36
34
15
203354C-003
10
32
30
20
9
11
13
15
17
19
21
23
25
27
29
31
203354C-004
Gain (dB)
40
25 °C
40 °C
85 °C
30
5
0
33
9
11
13
15
17
19
–30
32.0
–35
203354C-005
31.0
30.5
30.0
35
40
45
50
55
25
27
29
31
33
60
65
70
75
80
25 ˚C
40 ˚C
85 ˚C
–40
–45
–50
203354C-006
ACLR (dBc)
31.5
–55
–60
85
21
22
23
Temperature (°C)
24
POUT (dBm)
Figure 5. OP1dB vs Temperature
Figure 6. ACLR vs Output Power
–12
–13
25 ˚C
40 ˚C
85 ˚C
–14
–15
S22 (dB)
–16
–17
–18
–19
203354C-007
OP1dB (dBm)
32.5
30
23
Figure 4. PAE vs Output Power
Figure 3. Gain vs Output Power
25
21
POUT (dBm)
POUT (dBm)
–20
–21
828
838
848
858
868
878
888
898
908
918
Frequency (MHz)
Figure 7. S22 vs Frequency across Temperature
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DATA SHEET • SKY66185-11: 851 TO 894 MHz LINEAR POWER AMPLIFIER
Evaluation Board Description
Application Circuit Notes
The SKY66185-11 Evaluation Board is used to test the
performance of the SKY66185-11 PA. A typical application
schematic diagram is shown in Figure 8. A Bill of Materials for the
SKY66185-11 Evaluation Board is listed in Table 6. An assembly
drawing for the Evaluation Board is shown in Figure 9. The board
layer detail is shown in Figurer 10. The layer detail physical
characteristics are shown in Figure 11.
Center Ground. It is extremely important to sufficiently ground
the bottom ground pad of the device for both thermal and stability
reasons. Multiple small vias are acceptable and work well under
the device if solder migration is an issue.
GND (pins 1, 2, 6, 11, 13, 15, 16, 20, 21, 25, and 27). Attach all
ground pins to the RF ground plane with the largest diameter and
lowest inductance via that the layout allows. Multiple small vias
are acceptable and work well under the device if solder migration
is an issue.
VBIAS (pin 10). The bias supply voltage for each stage, nominally
set to +3.3 V.
RFOUT (pin 19). Amplifier RF output pin (ZO = 50 Ω). The module
includes an onboard internal DC blocking capacitor. All
impedance matching is provided internal to the module.
VCC1 and VCC3 (pins 28 and 23, respectively). Supply voltage
for each stage collector bias is nominally set to 3.3 V. Bypass and
decoupling capacitors C1, C2, C5, and C6 should be placed in the
approximate location shown on the evaluation board assembly
drawing, although exact placement is not critical.
RFIN (pin 4). Amplifier RF input pin (Zo = 50 Ω). The module
includes an onboard internal DC blocking capacitor. All
impedance matching is provided internal to the module.
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DATA SHEET • SKY66185-11: 851 TO 894 MHz LINEAR POWER AMPLIFIER
J1
1
2
PAEN
VBIAS
3
4
L1
0Ω
N/C
8
X
X
VCC3
29
GND
8 Header
X
RFIN
N/C
R2
5100 Ω
SKY66185-11
RFOUT_COUP
C8
DNI
GND
2 GND
3 N/C
4 RFIIN
5 N/C
6 GND
7 VEN
GND
N/C
GND
J3
X
C5
0.1 μF
C6
10 μF
28 27 26 25 24 23 22
1
C7
33 pF
VCC3
C12
DNI
X
VCC1
GND
N/C
GND
N/C
VCC3
N/C
7
C2
0.1 μF
C1
10 μF
VCC1
N/C
VBIAS
5
6
VCC1
GND
GND
RFOUT
N/C
N/C
GND
GND
21
20
19
18
17
RFOUT
J2
X
X
16
15
8 9 10 11 12 13 14
X
PAEN
X
R5
0Ω
X
RF Output
Coupling Port
J4
C10
0.1 μF
C11
0.1 μF
203354C-008
VBIAS
Figure 8. SKY66185-11 Application Schematic
Table 6. SKY66185-11 Evaluation Board Bill of Materials (BOM)
Quantity
Component
Size
Part Number
Description
2
C1, C6
1206
C1206X7R160-106KNE
Capacitor, 10 μF, 16 V, ±10%, X7R
3
C2, C5, C10, C11
0402
GRM155R71C104KA88
Ceramic capacitor, 0.1 μF, 10%, X7R, 16 V
1
C7
0402
GRM1555C1H330JZ01
Capacitor, 33 pF, 50 V, ±5%, X7R
3
C8, C12
DNI
DNI
1
L1
0603
RM73ZIJ000
Resistor, 0 Ω, 5%
1
R5
0402
ERJ2GE0R00
Resistor, 0 Ω, jumper, 0.063 W
1
1
R2
PCB
TW22-D115-002
SKY66185
0402
ERJ2GEJ512
Resistor, 5100 Ω, 5%, 0.063 W
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7
DATA SHEET • SKY66185-11: 851 TO 894 MHz LINEAR POWER AMPLIFIER
J1
C6
C4
C1
C5
L1
C12
C3
C2
RF In
C8
RF Out
U1
C7
C10
R2
R5
C11
RF Out Coupling Port
Notes:
203354C-009
The C3 and C4 components are not required.
Some of the other components shown are optional.
Figure 9. SKY66185-10 Evaluation Board Assembly Diagram
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203354C-010
DATA SHEET • SKY66185-11: 851 TO 894 MHz LINEAR POWER AMPLIFIER
Figure 10. SKY66185-11 Board Layer Detail
Cross Section
Name
Thickness (mm)
Material
Top Solder Mask
0.010
Solder Resist
L1
0.035
Cu – 1 oz
Dielectric
0.250
Rogers RO4350B
L2
0.035
Cu – 1 oz
Dielectric
0.500
FR4
L3
0.035
Cu – 1 oz
Dielectric
0.250
FR4
L4
0.035
Cu – 1 oz
Bottom Solder Mask
0.010
Solder Resist
203354C-011
Figure 11. SKY66185-11 Layer Detail Physical Characteristics
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DATA SHEET • SKY66185-11: 851 TO 894 MHz LINEAR POWER AMPLIFIER
Package Dimensions
The SKY66185-11 is rated to Moisture Sensitivity Level 3
(MSL3) at 260 C. It can be used for lead or lead-free soldering.
For additional information, refer to the Skyworks Application
Note, PCB Design and SMT Assembly/Rework Guidelines for
MCM-L Packages, document number 101752.
The typical part marking is shown in Figure 12. Figure 13 shows
the PCB layout footprint. Figure 14 shows the package
dimensions, and Figure 15 provides the tape and reel
dimensions.
Care must be taken when attaching this product, whether it is
done manually or in a production solder reflow environment.
Production quantities of this product are shipped in a standard
tape and reel format.
Package and Handling Information
Since the device package is sensitive to moisture absorption, it
is baked and vacuum packed before shipping. Instructions on
the shipping container label regarding exposure to moisture
after the container seal is broken must be followed. Otherwise,
problems related to moisture absorption may occur when the
part is subjected to high temperature during solder assembly.
Pin 1
Indicator
66185-11
XXXXXXXXX
YYWW CC
203354C-012
Skyworks
Part Number
Lot Code
Date Code:
YY = Calendar Year
WW = Work Week
CC = Country Code
Figure 12. Typical Part Marking
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DATA SHEET • SKY66185-11: 851 TO 894 MHz LINEAR POWER AMPLIFIER
5.3 mm
Pin 28
Package Outline
6X 1.25 mm
Pin 1 Indicator
0.43 X 0.43
Pin 1
0.5 mm Pitch
5.3 mm
6X 1.25 mm
9X 1.1 mm
28X 0.55 mm
Exposed Center Pad
Stencil aperture size of
80% to 100% of the module/package
solder mask openings
28X 0.25 mm
9X 1.1 mm
Stencil Aperture
Top View
5.4 mm
5.3 mm
Package Outline
Pin 28
0.25 mm Typ
Pin 28
Package Outline
Pin 1 Indicator
0.43 x 0.43
Pin 1
Pin 1
0.5 mm Pitch
0.5 mm Pitch
5.3 mm
5.4 mm
2X 1.8 mm
0.6 mm Pitch
17X 0.55 mm
Thermal via array Ø0.3 mm
on 0.6 mm pitch
improves thermal performance
17X 0.25 mm
28X 0.65 mm
Exposed Center Pad
Opening size of 60%
to 100% of exposed
center opening shown
2X 1.8 mm
28X 0.35 mm
0.6 mm Pitch
Notes:
Metallization
Top View
Solder Mask Opening
Top View
1. Thermal vias should be resin filled and capped in accordance with IPC–4761 type VII vias.
2. Recommended Cu thickness is 30 to 35 μm.
203354C-013
Figure 13. SKY66185-11 PCB Layout Footprint
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11
28X SMT Pad
0.1
A B C
Top
4X 1
B
4X 1.5
5
Pin 1
Indicator
4X 0.5
DATA SHEET • SKY66185-11: 851 TO 894 MHz LINEAR POWER AMPLIFIER
Pin 28
0
C
See Detail B
Pin 1 Indicator
See Detail C
Pin 1
4X 1.5
4X 0.5
5
0
4X 1
6X 1.25
14X 2.4
0.2 A B C
0.1
Side View
14X 2.4
Solder Mask Opening
1.25 ± 0.1
0.075 A B C
Top View
6X 1.25
A
A
Bottom View
0.35 ± 0.05
2X (0.05)
1.1
0.43 X 0.43
0.3 ± 0.1
1.1
(0.1)
Detail A
Pad
Notes:
1. Dimensions are in millimeters.
2. Dimensions and tolerances according to ASME Y14.5M-1994.
1.1
Metal Pad Edge
0.25 ± 0.05
Scale: 2X
7X This Rotation
7X Rotated 180°
7X Rotated 90° CW
7X Rotated 90° CCW
5X R0.05 Max
4X R0.05 Max
1.1
Detail B
Pad
Scale: 2X
8X This Rotation
Detail C
Pad
Scale: 2X
1X This Rotation
Figure 14. SKY66185-11 Package Dimensions
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203354C-014
DATA SHEET • SKY66185-11: 851 TO 894 MHz LINEAR POWER AMPLIFIER
0.25 ± 0.20
Ø1.
50
2.00 ± 0.10
±0
4.00 ± 0.10
1.75 ± 0.10
5.25 ± 0.10
5.50 ± 0.10
Pin 1
1.40 ± 0.10
8.00 ± 0.10
12.00 ± 0.20
.10
Ø1.50 ± 0.10
Notes:
1. Carrier tapes must meet all requirements of Skyworks GP01-D232 procurement spec for tape and reel shipping.
2. Carrier tape shall be black conductive polycarbonate.
3. Cover tape shall be transparent conductive material.
4. ESD-surface resistivity shall be ≤ 1 × 1010 Ω/square per EJA, JEDEC TNR specification.
5. All measurements are in millimeters.
5.25 ± 0.10
203354C-015
Figure 15. SKY66185-11 Tape and Reel Dimensions
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DATA SHEET • SKY66185-11: 851 TO 894 MHz LINEAR POWER AMPLIFIER
Ordering Information
Model Name
SKY66185-11: Linear PA
Manufacturing Part Number
SKY66185-11
Evaluation Board Part Number
TW22-D115-002
Copyright © 2015-2016 Skyworks Solutions, Inc. All Rights Reserved.
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THE MATERIALS, PRODUCTS AND INFORMATION ARE PROVIDED “AS IS” WITHOUT WARRANTY OF ANY KIND, WHETHER EXPRESS, IMPLIED, STATUTORY, OR OTHERWISE, INCLUDING FITNESS FOR A
PARTICULAR PURPOSE OR USE, MERCHANTABILITY, PERFORMANCE, QUALITY OR NON-INFRINGEMENT OF ANY INTELLECTUAL PROPERTY RIGHT; ALL SUCH WARRANTIES ARE HEREBY EXPRESSLY
DISCLAIMED. SKYWORKS DOES NOT WARRANT THE ACCURACY OR COMPLETENESS OF THE INFORMATION, TEXT, GRAPHICS OR OTHER ITEMS CONTAINED WITHIN THESE MATERIALS. SKYWORKS
SHALL NOT BE LIABLE FOR ANY DAMAGES, INCLUDING BUT NOT LIMITED TO ANY SPECIAL, INDIRECT, INCIDENTAL, STATUTORY, OR CONSEQUENTIAL DAMAGES, INCLUDING WITHOUT LIMITATION,
LOST REVENUES OR LOST PROFITS THAT MAY RESULT FROM THE USE OF THE MATERIALS OR INFORMATION, WHETHER OR NOT THE RECIPIENT OF MATERIALS HAS BEEN ADVISED OF THE
POSSIBILITY OF SUCH DAMAGE.
Skyworks products are not intended for use in medical, lifesaving or life-sustaining applications, or other equipment in which the failure of the Skyworks products could lead to personal injury,
death, physical or environmental damage. Skyworks customers using or selling Skyworks products for use in such applications do so at their own risk and agree to fully indemnify Skyworks for any
damages resulting from such improper use or sale.
Customers are responsible for their products and applications using Skyworks products, which may deviate from published specifications as a result of design defects, errors, or operation of
products outside of published parameters or design specifications. Customers should include design and operating safeguards to minimize these and other risks. Skyworks assumes no liability for
applications assistance, customer product design, or damage to any equipment resulting from the use of Skyworks products outside of stated published specifications or parameters.
Skyworks and the Skyworks symbol are trademarks or registered trademarks of Skyworks Solutions, Inc., in the United States and other countries. Third-party brands and names are for
identification purposes only, and are the property of their respective owners. Additional information, including relevant terms and conditions, posted at www.skyworksinc.com, are incorporated by
reference.
Skyworks Solutions, Inc. • Phone [781] 376-3000 • Fax [781] 376-3100 • [email protected] • www.skyworksinc.com
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May 11, 2016 • Skyworks Proprietary Information • Products and Product Information are Subject to Change Without Notice • 203354E