ADVANCE DATA SHEET SKY77185 Power Amplifier Module for WCDMA / HSDPA (1920–1980 MHz) Applications • WCDMA handsets • HSDPA Features • Low voltage positive bias supply - 3.2 V to 4.2 V • Good linearity • High efficiency - 40% @ 26.5 dBm • Large dynamic range • 10-pad package - 3 x 3 x 0.85 mm • Power down control • InGaP • Supports low collector voltage operation • Digital Enable The SKY77185 Power Amplifier Module (PAM) is a fully matched 10-pad surface mount module developed for Wideband Code Division Multiple Access (WCDMA) applications. This small and efficient module packs full 1920–1980 MHz bandwidth coverage into a single compact package. Because of high efficiencies attained throughout the entire power range, the SKY77185 delivers unsurpassed talk-time advantages. The SKY77185 meets the stringent spectral linearity requirements of High Speed Downlink Packet Access (HSDPA) data transmission with high power added efficiency. A directional coupler is integrated into the module thus eliminating the need for any external coupler. The single Gallium Arsenide (GaAs) Microwave Monolithic Integrated Circuit (MMIC) contains all active circuitry in the module. The MMIC contains on-board bias circuitry, as well as input and interstage matching circuits. Output match into a 50-ohm load is realized off-chip within the module package to optimize efficiency and power performance. The SKY77185 PAM is manufactured with Skyworks’ InGaP GaAs Heterojunction Bipolar Transistor (HBT) BiFET process that provides for all positive voltage DC supply operation while maintaining high efficiency and good linearity. Primary bias to the SKY77185 is supplied directly from any three-cell Ni-Cd, a single-cell Li-Ion, or other suitable battery with an output in the 3.2 to 4.2 volt range. No VREF voltage is required. Power down is accomplished by setting the voltage on VENABLE to zero volts. No external supply side switch is needed as typical “off” leakage is a few microamperes with full primary voltage supplied from the battery. • No VREF required • CMOS compatible control signals Figure 1. Functional Block Diagram Skyworks Solutions, Inc. • Phone [781] 376-3000 • Fax [781] 376-3100 • [email protected] • www.skyworksinc.com 200835B • Skyworks Proprietary and Confidential Information. • Products and product information are subject to change without notice. • May 19, 2008 1 ADVANCE DATA SHEET SKY77185 POWER AMPLIFIER MODULE FOR WCDMA / HSDPA (1920–1980 MHz) Electrical Specifications The following tables list the electrical characteristics of the SKY77185 Power Amplifier. Table 1 lists the absolute maximum ratings, while Table 2 shows the recommended operating conditions to achieve WCDMA and HSDPA performance characteristics listed in Table 4. Table 3 presents a truth table for the power settings. Table 1. Absolute Maximum Ratings 1 Parameter Symbol Minimum Nominal Maximum Unit RF Input Power PIN — 0 10 dBm Supply Voltage VCC1, VCC2 — 3.4 6.0 Volts Control Voltage VEN VMODE_0 VMODE_1 — 1.8 4.2 Volts °C Case Temperature 2 Operating TC –30 25 +110 Storage TSTG –55 — +125 1 No damage assuming only one parameter is set at limit at a time with all other parameters set at nominal value. 2 Case Operating Temperature (TC) refers to the temperature of the GROUND PAD at the underside of the package. Table 2. Recommended Operating Conditions Minimum Nominal Maximum Unit Linear Power Output Parameter PO Symbol — — 26.5 dBm Maximum Power Output PO — — 28.0 Operating Frequency FO 1920.0 1950.0 1980.0 MHz Supply Voltage VCC1, VCC2 3.2 1 3.4 4.2 Volts VEN_L 0.0 — 0.5 Volts Enable Control Voltage Low High VEN_H 1.35 — 3.1 Control Voltage Low VMODE_0 VMODE_1 0.0 — 0.5 High VMODE_0 VMODE_1 1.35 — 3.1 TC –30 +25 +85 Case Operating Temperature Volts °C 1 Recommended minimum VCC for maximum power output is indicated. VCC2 down to 0.5 V may be used for backed-off power when using DC/DC converter to conserve battery current. Table 3. Modes of Operation Power Setting Power Down ENABLE VMODE_0 VMODE_1 VCC Low Low Low On Standby Mode Low X X On High-Power Mode (17.0 dBm ≤ POUT ≤ 26.5 dBm High Low Low On Medium-Power Mode (7.0 dBm ≤ POUT ≤ 17.0 dBm) High High Low On Low-Power Mode (POUT ≤ 7.0 dBm) High High High On Optional Lower VCC in Low-Power Mode (POUT ≤ 7.0 dBm) High Low Low 1.5 V Note: Two pads are available for PA control that allow for a total of four states. Skyworks Solutions, Inc. • Phone [781] 376-3000 • Fax [781] 376-3100 • [email protected] • www.skyworksinc.com 2 May 19, 2008 • Skyworks Proprietary and Confidential Information. • Products and product information are subject to change without notice. • 200835B SKY77185 POWER AMPLIFIER MODULE FOR WCDMA / HSDPA (1920–1980 MHz) ADVANCE DATA SHEET Table 4. Electrical Specifications for Nominal Operating Conditions 1 Characteristics Symbol Gain Conditions Power Added Efficiency Total Supply Current Quiescent Current Condition Minimum Typical Maximum Unit dB GLOW PO = 0 dBm — TBD — GMID PO = 17.0 dBm — 20 — GHIGH PO = 26.5 dBm — 27 — PAELOW PO = 0 dBm — TBD — PAEMID PO = 17.0 dBm — 20 — PAEHIGH PO = 26.5 dBm — 40 — ICC_LOW PO = 0 dBm — TBD — ICC_MID PO = 17.0 dBm — 55 — ICC_HIGH PO = 26.5 dBm — 330 — IQ_MID Medium Power Mode — 25 — IQ_HIGH High Power Mode — 90 — mA mA Enable Current IEN — — 1.0 mA Total Supply Current in Power-down Mode IPD VCC = 3.4 V VEN = Low — — 20 μA ACLR5 PO = 0 dBm — –42 –34 dBc Adjacent Channel Leakage power Ratio 2 5 MHz offset 10 MHz offset Harmonic Suppression ACLR10 Second f02 Third f03 — % PO = 17.0 dBm — –46 –34 PO = 26.5 dBm — –40 –34 PO = 0 dBm — –65 –44 PO = 17.0 dBm — –60 –44 PO = 26.5 dBm — –55 –44 PO ≤ 26.5 dBm — –45 –30 — –35 –30 dBc Noise Power in RX Band 2110-2170 MHz RxBN PO ≤ 26.5 dBm — –140 –138 dBm/Hz Input Voltage Standing Wave Ratio (VSWR) VSWR — — 1.5:1 2.5:1 — Coupling Factor P_CPL PO = 26.5 dBm — 17 — dB Stability (Spurious output) S 5:1 VSWR All phases — — –70 dBc Ruggedness 3 Ru PO ≤ 28.0 dBm 10:1 — — VSWR 1 Unless specified otherwise: VCC = +3.4 V, Temp = +25 °C; Freq. = 1950 MHz for Voice and HSDPA. 2 ACLR is expressed as a ratio of total adjacent power to WCDMA modulated in-band, both measured in 3.84 MHz bandwidth at specified offsets. 3 All phases, time = 10 seconds. Skyworks Solutions, Inc. • Phone [781] 376-3000 • Fax [781] 376-3100 • [email protected] • www.skyworksinc.com 200835B • Skyworks Proprietary and Confidential Information. • Products and product information are subject to change without notice. • May 19, 2008 3 ADVANCE DATA SHEET SKY77185 POWER AMPLIFIER MODULE FOR WCDMA / HSDPA (1920–1980 MHz) Table 5. Modulation STC1 = General Test Conditions (Voice) Modulation HPSK modulated carrier in 3.8 MHz BW UL ref. meas. Chan. (12.2 kbps) from 3GPP TS 25.101 Annex A sec. A.2.1. 1 DPCCH @ 15 ksps, Spread Code = 0, Relative Power = –6.547 dB 1 DPDCH @ 60 ksps, Spread Code = 16, Relative Power = –1.087 dB. Pulse Rate CW testing (not pulsed). Input Power Adjusted to meet output power requirement. Modulation HPSK modulated carrier in 3.8 MHz BW 1 DPCCH @ 15 ksps, Spread Code = 0, Relative Power = –7.095 dB 1 DPCCH @ 60 ksps, Spread Code = 16 Relative Power = –5.157 dB 1 DPDCH @ 15 ksps, Spread Code = 64, Relative Power = –3.012 dB. Pulse Rate CW testing (not pulsed). Input Power Adjusted to meet output power requirement. STC2 = General Test Conditions (HSDPA) NOTES: Measure the power in the 99% bandwidth channel for the ULTRA/FDD UL reference with a root-raised cosine (RRC) filter response of alpha 0.22 and a bandwidth of 3.84 MHz. Measure emission power at ±X MHz offset, P±x MHz, in a Y kHz bandwidth with a root-raised cosine (RRC) filter response of alpha 0.22 and a bandwidth of 3.84 MHz. Efficiency and idle current numbers include current consumption of any control voltages like VEN, VMODE_0 and VMODE_1. Skyworks Solutions, Inc. • Phone [781] 376-3000 • Fax [781] 376-3100 • [email protected] • www.skyworksinc.com 4 May 19, 2008 • Skyworks Proprietary and Confidential Information. • Products and product information are subject to change without notice. • 200835B SKY77185 POWER AMPLIFIER MODULE FOR WCDMA / HSDPA (1920–1980 MHz) ADVANCE DATA SHEET Evaluation Board Description The evaluation board is a platform for testing and interfacing design circuitry. To accommodate the interface testing of the SKY77185, the evaluation board schematic and assembly diagrams are included for preliminary analysis and design. Figure 2 shows the basic schematic of the board for the 1920 MHz to 1980 MHz range. Figure 2. Evaluation Board Schematic Skyworks Solutions, Inc. • Phone [781] 376-3000 • Fax [781] 376-3100 • [email protected] • www.skyworksinc.com 200835B • Skyworks Proprietary and Confidential Information. • Products and product information are subject to change without notice. • May 19, 2008 5 ADVANCE DATA SHEET SKY77185 POWER AMPLIFIER MODULE FOR WCDMA / HSDPA (1920–1980 MHz) Figure 3. Evaluation Board Assembly Diagram Skyworks Solutions, Inc. • Phone [781] 376-3000 • Fax [781] 376-3100 • [email protected] • www.skyworksinc.com 6 May 19, 2008 • Skyworks Proprietary and Confidential Information. • Products and product information are subject to change without notice. • 200835B SKY77185 POWER AMPLIFIER MODULE FOR WCDMA / HSDPA (1920–1980 MHz) ADVANCE DATA SHEET Package Dimensions The SKY77185 is a multi-layer laminate base, overmold encapsulated modular package designed for surface mount solder attachment to a printed circuit board. Figure 4 is a mechanical drawing of the pad layout for this package. Figure 5 provides a recommended phone board layout footprint for the PAM to help the designer attain optimum thermal conductivity, good grounding, and minimum RF discontinuity for the 50-ohm terminals. Figure 4. Dimensional Diagram for 3 mm x 3 mm x 0.85 mm Package – SKY77185 Skyworks Solutions, Inc. • Phone [781] 376-3000 • Fax [781] 376-3100 • [email protected] • www.skyworksinc.com 200835B • Skyworks Proprietary and Confidential Information. • Products and product information are subject to change without notice. • May 19, 2008 7 PRELIMINARY DATA SHEET SKY77185 POWER AMPLIFIER MODULE FOR WCDMA / HSDPA (1920–1980 MHz) Figure 5. Phone PCB Layout Diagram – 3 mm x 3 mm x 0.85 mm Package – SKY77185 Skyworks Solutions, Inc. • Phone [781] 376-3000 • Fax [781] 376-3100 • [email protected] • www.skyworksinc.com 8 May 19, 2008 • Skyworks Proprietary and Confidential Information. • Products and product information are subject to change without notice. • 200835B SKY77185 POWER AMPLIFIER MODULE FOR WCDMA / HSDPA (1920–1980 MHz) ADVANCE DATA SHEET Package Description Package Handling Information Figure 6 shows the pad functions and the pad numbering convention, which starts with pad 1 in the upper left and increments counter-clockwise around the package. Typical case markings are illustrated in Figure 7. Because of its sensitivity to moisture absorption, this device package is baked and vacuum-packed prior to shipment. Instructions on the shipping container label must be followed regarding exposure to moisture after the container seal is broken, otherwise, problems related to moisture absorption may occur when the part is subjected to high temperature during solder assembly. The SKY77185 is capable of withstanding an MSL3/260 °C solder reflow. Care must be taken when attaching this product, whether it is done manually or in a production solder reflow environment. If the part is attached in a reflow oven, the temperature ramp rate should not exceed 3 °C per second; maximum temperature should not exceed 260 °C. If the part is manually attached, precaution should be taken to insure that the part is not subjected to temperatures exceeding 260 °C for more than 10 seconds. For details on attachment techniques, precautions, and handling procedures recommended by Skyworks, please refer to Skyworks Application Note: PCB Design and SMT Assembly/Rework, Document Number 101752. Additional information on standard SMT reflow profiles can also be found in the JEDEC Standard J-STD-020. Figure 6. SKY77185 Pad Names and Configuration (Top View) Production quantities of this product are shipped in the standard tape-and-reel format. For packaging details, refer to Skyworks Application Note: Tape and Reel Information – RF Modules, Document Number 101568. Electrostatic Discharge Sensitivity The ESD testing was performed in compliance with MIL-STD883E Method 3015.7 using the Human Body Model. If ESD damage threshold magnitude is found to consistently exceed 2000 volts on a given pad, this so is indicated. If ESD damage threshold below 2000 volts is measured for either polarity, numbers are indicated that represent worst case values observed in product characterization. Various failure criteria can be utilized when performing ESD testing. Many vendors employ relaxed ESD failure standards, which fail devices only after “the pad fails the electrical specification limits” or “the pad becomes completely nonfunctional”. Skyworks employs most stringent criteria and fails devices as soon as the pad begins to show any degradation on a curve tracer. Figure 7. Typical Case Markings Skyworks Solutions, Inc. • Phone [781] 376-3000 • Fax [781] 376-3100 • [email protected] • www.skyworksinc.com 200835B • Skyworks Proprietary and Confidential Information. • Products and product information are subject to change without notice. • May 19, 2008 9 PRELIMINARY DATA SHEET To avoid ESD damage, both latent and visible, it is very important that the product assembly and test areas follow the Class 1 ESD SKY77185 POWER AMPLIFIER MODULE FOR WCDMA / HSDPA (1920–1980 MHz) handling precautions listed below. • Personnel Grounding - Wrist Straps - Conductive Smocks, Gloves and Finger Cots - Antistatic ID Badges • Facility - Relative Humidity Control and Air Ionizers - Dissipative Floors (less than 109 Ω to GND) • Protective Workstation - Dissipative Table Top - Protective Test Equipment (Properly Grounded) - Grounded Tip Soldering Irons - Solder Conductive Suckers - Static Sensors • Protective Packaging and Transportation - Bags and Pouches (Faraday Shield) - Protective Tote Boxes (Conductive Static Shielding) - Protective Trays - Grounded Carts - Protective Work Order Holders Skyworks Solutions, Inc. • Phone [781] 376-3000 • Fax [781] 376-3100 • [email protected] • www.skyworksinc.com 10 May 19, 2008 • Skyworks Proprietary and Confidential Information. • Products and product information are subject to change without notice. • 200835B Ordering Information Model Number Manufacturing Part Number SKY77185 Product Revision Package Operating Temperature SKY77185 MCM 3 x 3 x 0.85 mm –30 °C to +85 °C Date Description Revision History Revision A February 28, 2008 Initial Release – Preliminary Information B May 19, 2008 Revise: Tables 1–5; Figures 1–6 Add: Skyworks Green tag (p1) References Application Note: PCB Design and SMT Assembly/Rework, Document Number 101752. Application Note: Tape and Reel Information – RF Modules, Document Number 101568 Standard SMT Reflow Profiles: JEDEC Standard J–STD–020 Copyright © 2008, Skyworks Solutions, Inc. All Rights Reserved. Information in this document is provided in connection with Skyworks Solutions, Inc. (“Skyworks”) products. These materials are provided by Skyworks as a service to its customers and may be used for informational purposes only by the customer. Skyworks assumes no responsibility for errors or omissions in these materials. Skyworks may make changes to its documentation, products, specifications and product descriptions at any time, without notice. Skyworks makes no commitment to update the information and shall have no responsibility whatsoever for conflicts, incompatibilities, or other difficulties arising from future changes to its documentation, products, specifications and product descriptions. 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