DATA SHEET PIN Diode Chips Supplied on Film Frame Applications Switches Attenuators Features Preferred device for module applications PIN diodes supplied are 100% tested, saw cut, and mounted on film frame Low cost Skyworks GreenTM products are compliant with all applicable legislation and are halogen-free. For additional information, refer to Skyworks Definition of GreenTM, document number SQ04–0074. Description The PIN diodes that comprise this family of diodes supplied on film frames are designed for high-volume applications from 10 MHz to over 3 GHz. This family contains two groups of PIN diodes: 1. Low-capacitance, low-resistance PIN diodes designed primarily for RF switching applications: SMP1320-099 SMP1321-099 SMP1322-099 SMP1331-099 SMP1340-099 2. PIN diodes with thick I-layers designed for low-distortion RF variable attenuator applications: SMP1353-099 SMP1302-099 SMP1304-099 SMP1307-099 These PIN diodes are provided as 100 percent tested, diced wafers mounted on film frames for optimal compatibility with high-volume pick-and-place assembly techniques. Absolute maximum ratings are provided in Table 1. Electrical specifications are provided in Table 2. Chip dimensions are shown in Table 3. Typical performance characteristics are illustrated in Figures 1 through 4. Figure 5 describes the wafer film frame. Skyworks Solutions, Inc. • Phone [781] 376-3000 • Fax [781] 376-3100 • [email protected] • www.skyworksinc.com 200140L • Skyworks Proprietary Information • Products and Product Information are Subject to Change Without Notice • January 5, 2016 1 DATA SHEET • PIN DIODE CHIPS SUPPLIED ON FILM FRAME Table 1. PIN Diode Chips Absolute Maximum Ratings1 Parameter Symbol Minimum Maximum Units Voltage rating V Reverse voltage VR Power dissipation @ 25 °C at the base of the chip PD 250 mW Operating temperature TOP –65 +150 °C Storage temperature TSTG –65 +150 °C Electrostatic discharge: ESD 1000 V Human Body Model (HBM), Class 1C 1 Exposure to maximum rating conditions for extended periods may reduce device reliability. There is no damage to device with only one parameter set at the limit and all other parameters set at or below their nominal value. CAUTION: Although these devices are designed to be as robust as possible, electrostatic discharge (ESD) can damage them. These devices must be protected at all times from ESD. Static charges may easily produce potentials of several kilovolts on the human body or equipment, which can discharge without detection. Industry-standard ESD precautions should be used at all times. Table 2. PIN Diode Chips Electrical Specifications1 (TOP = 25 °C) Part Number 1 I Region (μm) Nominal Voltage Rating (V) Max CJ (pF) VR = 30 V, f = 1 MHz Typ VF (mV) @ IF = 10 mA Max RS (Ω) IF = 1 mA, f = 100 MHz Max RS (Ω) IF = 10 mA, f = 100 MHz Typ TL (ns) IF = 10 mA SMP1320-099 7 50 0.175 850 2 typ 0.9 400 Switch SMP1321-099 12 100 0.150 860 3 typ 2.0 400 Switch SMP1322-099 7 50 0.850 825 1.5 0.45 typ 400 Switch SMP1331-099 30 200 0.16 800 14.5 1.7 typ 600 Switch and attenuator SMP1340-099 5 50 0.15 @ 10 V 880 1.7 typ 1.2 100 Switch SMP1353-099 50 200 0.13 @ 20 V 850 15 2.8 2000 Switch and attenuator SMP1302-099 50 200 0.15 800 17 typ 3 700 Switch and attenuator SMP1304-099 100 200 0.15 800 50 7 1000 Attenuator SMP1307-099 175 200 0.20 850 75 typ 15 1500 Attenuator Performance is guaranteed only under the conditions listed in this table. Reverse current is specified @ 10 μA maximum at the voltage rating. This voltage should not be exceeded. The PIN diodes listed here are processed on 100 mm silicon wafers, 100% DC tested, saw cut, and shipped on 6-inch film frame hoops. Electrical rejects are identified with black ink on the film frame. Attenuators are 100% series resistance tested @ 1 mA/100 MHz. Skyworks Solutions, Inc. • Phone [781] 376-3000 • Fax [781] 376-3100 • [email protected] • www.skyworksinc.com 2 Application January 5, 2016 • Skyworks Proprietary Information • Products and Product Information are Subject to Change Without Notice • 200140L DATA SHEET • PIN DIODE CHIPS SUPPLIED ON FILM FRAME Table 3. PIN Diode Chip Dimensions Quantity of Good Diodes Per Wafer Minimum Nominal Chip Size (In) Chip Height (In) Anode Contact (In) SMP1320-099 40000 46000 0.0135 ± 0.001 0.005 ± 0.001 0.0030 ± 0.0003 SMP1321-099 40000 46000 0.0135 ± 0.001 0.005 ± 0.001 0.0030 ± 0.0003 SMP1322-099 40000 46000 0.0135 ± 0.001 0.005 ± 0.001 0.0075 ± 0.0005 SMP1331-099 40000 46000 0.0135 ± 0.001 0.005 ± 0.001 0.0075 ± 0.0005 SMP1340-099 65000 72000 0.0105 ± 0.001 0.005 ± 0.001 0.0029 ± 0.0003 SMP1353-099 65000 72000 0.0105 ± 0.001 0.005 ± 0.001 0.0070 ± 0.0005 SMP1302-099 40000 46000 0.0135 ± 0.001 0.005 ± 0.001 0.0085 ± 0.0005 SMP1304-099 40000 46000 0.0135 ± 0.001 0.009 ± 0.001 0.0085 ± 0.0005 SMP1307-099 20000 25000 0.0185 ± 0.001 0.009 ± 0.001 0.0110 ± 0.0005 Part Number Typical Performance Characteristics (TOP = 25 °C) 1.2 1000 SMP1340 Capacitance (pF) SMP1322 SMP1321 SMP1331 SMP1353 10 1 0.8 0.6 0.4 0.1 0.01 0.1 1 10 0 100 Y2729 0.2 Y2728 Series Resistance (Ω) 100 SMP1320 SMP1321 SMP1322 SMP1331 SMP1340 SMP1353 1.0 SMP1320 0 5 10 Forward Current (mA) 25 30 0.6 10000 SMP1304 0.5 Capacitance (pF) Series Resistance (Ω) 20 Figure 2. Capacitance vs Reverse Voltage Figure 1. Series Resistance vs Forward Current @ 100 MHz 1000 15 Reverse Voltage (V) SMP1302 SMP1307 100 10 1 SMP1307 0.4 0.3 0.2 SMP1302 0.1 0.1 1 10 100 Forward Current (mA) Figure 3. Series Resistance vs Forward Current @ 100 MHz Y2724 0.1 0.01 Y2725 SMP1304 0 0 5 10 15 20 25 30 Reverse Voltage (V) Figure 4. Capacitance vs Reverse Voltage Skyworks Solutions, Inc. • Phone [781] 376-3000 • Fax [781] 376-3100 • [email protected] • www.skyworksinc.com 200140L • Skyworks Proprietary Information • Products and Product Information are Subject to Change Without Notice • January 5, 2016 3 DATA SHEET • PIN DIODE CHIPS SUPPLIED ON FILM FRAME 0.003 (0.076 mm) Nom. Separation Between Die 0.003 (0.076 mm) Separation Between Die 5.981 (151.92 mm) Outer Ring O.D. 5.520 (140.2 mm) Inner Ring I.D. 3.940 (100 mm) Wafer Dia. Grip Ring 0.236 (5.99 mm) Ring Thickness Wafer on nitto tape Color: light blue Thickness: 2.2 to 3.0 mils Tensile strength: 6.6 lbs (in width) Ring material: plastic Figure 5. Wafer Film Frame Description Skyworks Solutions, Inc. • Phone [781] 376-3000 • Fax [781] 376-3100 • [email protected] • www.skyworksinc.com 4 January 5, 2016 • Skyworks Proprietary Information • Products and Product Information are Subject to Change Without Notice • 200140L DATA SHEET • PIN DIODE CHIPS SUPPLIED ON FILM FRAME Copyright © 2002-2008, 2011-2013, 2015-2016 Skyworks Solutions, Inc. All Rights Reserved. Information in this document is provided in connection with Skyworks Solutions, Inc. (“Skyworks”) products or services. These materials, including the information contained herein, are provided by Skyworks as a service to its customers and may be used for informational purposes only by the customer. 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Skyworks assumes no liability for applications assistance, customer product design, or damage to any equipment resulting from the use of Skyworks products outside of stated published specifications or parameters. Skyworks and the Skyworks symbol are trademarks or registered trademarks of Skyworks Solutions, Inc., in the United States and other countries. Third-party brands and names are for identification purposes only, and are the property of their respective owners. Additional information, including relevant terms and conditions, posted at www.skyworksinc.com, are incorporated by reference. Skyworks Solutions, Inc. • Phone [781] 376-3000 • Fax [781] 376-3100 • [email protected] • www.skyworksinc.com 200140L • Skyworks Proprietary Information • Products and Product Information are Subject to Change Without Notice • January 5, 2016 5