PRELIMINARY DATA SHEET SMP1302-087LF: Surface-Mount PIN Diode Applications Low-loss, high-power switches Low-distortion attenuators Features High RF power handling: 125 W Low thermal resistance: 22 °C/W Low series resistance: 1.5 Ω maximum @ 100 mA Low total capacitance: 0.35 pF maximum @ 30 V Small QFN (2 x 2 mm) package (MSL1, 260 C per JEDEC JSTD-020) Skyworks Green™ products are compliant with all applicable legislation and are halogen-free. For additional information, refer to Skyworks Definition of Green™, document number SQ04-0074. Description The SMP1302-087LF is a surface-mountable, low-capacitance silicon PIN diode designed as a series-connected PIN diode for high-power, high-volume switch and attenuator applications from 10 MHz to beyond 6 GHz. Maximum resistance at 100 mA is 1.5 Ω and maximum capacitance at 30 V is 0.35 pF. The combination of low capacitance, low parasitic inductance, and nominal 50 μm I-region width, makes the SMP1302-087LF useful in large signal switches and attenuator applications. The device has a 1 W dissipation power rating, which makes it capable of handling up to 125 W @ 25 °C Continuous Wave (CW) in a series-connected transmit/receive (T/R) switch. Design information for high power switches may be found in the Skyworks Application Note, Design With PIN Diodes (document number 200312). Skyworks Solutions, Inc. • Phone [781] 376-3000 • Fax [781] 376-3100 • [email protected] • www.skyworksinc.com 202942A • Skyworks Proprietary Information • Products and Product Information are Subject to Change Without Notice • August 9, 2013 1 PRELIMINARY DATA SHEET • SMP1302-087LF SURFACE-MOUNT PIN DIODE Table 1. SMP1302-087LF Absolute Maximum Ratings Parameter Symbol Maximum Units IF 200 mA Reverse voltage VR 200 V Dissipated power @ 85 °C PD 1 W Forward current Minimum Peak pulse power dissipation @ 85 °C (10% duty cycle) 10 W Operating temperature TA –55 +85 C Storage temperature TSTG –55 +200 C Junction temperature TJ –55 +175 C Electrostatic discharge: Charged-Device Model (CDM), Class 4 Human Body Model (HBM), Class 1C Machine Model (MM), Class C ESD 1100 1000 400 V V V Note: Exposure to maximum rating conditions for extended periods may reduce device reliability. There is no damage to device with only one parameter set at the limit and all other parameters set at or below their nominal value. Exceeding any of the limits listed here may result in permanent damage to the device. CAUTION: Although this device is designed to be as robust as possible, Electrostatic Discharge (ESD) can damage this device. This device must be protected at all times from ESD. Static charges may easily produce potentials of several kilovolts on the human body or equipment, which can discharge without detection. Industry-standard ESD precautions should be used at all times. Table 2. SMP1302-087LF Electrical Specifications (Note 1) (TA = +25 C, Unless Otherwise Noted) Parameter Symbol Test Condition Min Typical Forward voltage VF IF = 10 mA Reverse leakage current IR VR = 200 V Series resistance RS1 IF = 1 mA, f = 100 MHz 18.0 Max 0.80 V 10 μA Ω RS10 IF = 10 mA, f = 100 MHz 2.75 3.0 Ω RS100 IF = 100 mA, f = 100 MHz 0.95 1.5 Ω Total capacitance CT30 VR = 30 V, f = 1 MHz 0.25 0.35 Series inductance LS Minority carrier lifetime TL pF 0.65 nH IF = 10 mA 700 ns I region width W 50 μm Thermal resistance (Note 2) ΘJC Junction-to-case 22 °C/W Peak thermal resistance ΘP Single, 1 μs pulse width, junction-to-case (10% duty cycle) 2.2 °C/W Note 1: Performance is guaranteed only under the conditions listed in this Table. Note 2: Assume a thermal resistance of 90 °C/W for the junction-to-bottom of the circuit board. Skyworks Solutions, Inc. • Phone [781] 376-3000 • Fax [781] 376-3100 • [email protected] • www.skyworksinc.com 2 Units August 9, 2013 • Skyworks Proprietary Information • Products and Product Information are Subject to Change Without Notice • 202942A PRELIMINARY DATA SHEET • SMP1302-087LF SURFACE-MOUNT PIN DIODE Electrical and Mechanical Specifications Package dimensions for the SMP1302-087LF are provided in Figure 12, and tape and reel dimensions are provided in Figure 13. The absolute maximum ratings of the SMP1302-087LF are provided in Table 1. Electrical specifications are provided in Tables 2 and 3. Package and Handling Information Typical DC performance characteristics of the SMP1302-087LF are illustrated in Figures 1, 2, and 3. Typical RF performance of the SMP1302-087LF using the schematic shown in Figure 4 is summarized in Table 4 and illustrated in Figures 5, 6, and 7. Instructions on the shipping container label regarding exposure to moisture after the container seal is broken must be followed. Otherwise, problems related to moisture absorption may occur when the part is subjected to high temperature during solder assembly. The SMP1302-087LF Evaluation Board is used to test the performance of the SMP1302-087LF PIN Diode. An assembly drawing for the Evaluation Board is shown in Figure 8. The layer detail physical characteristics are provided in Figure 9. Refer to Table 3 for the Evaluation Board Bill of Materials. The SMP1302-087LF is rated to Moisture Sensitivity Level 1 (MSL1) at 260 C. It can be used for lead or lead-free soldering. For additional information, refer to the Skyworks Application Note, Solder Reflow Information, document number 200164. Care must be taken when attaching this product, whether it is done manually or in a production solder reflow environment. Production quantities of this product are shipped in a standard tape and reel format. Package Dimensions The PCB layout footprint for the SMP1302-087LF is provided in Figure 10. Typical case markings are shown in Figure 11. Typical DC Performance Characteristics (TA = 25 °C, Unless Otherwise Noted) 0.40 Series Resistance (Ω) 100 Capacitance (pF) 0.35 0.30 0.25 0.20 10 1 5 0 15 10 20 25 30 35 Reverse Voltage (V) 1 10 100 Forward Current (mA) Figure 1. Capacitance vs Reverse Voltage @ 1 MHz Figure 2. Series Resistance vs Forward Current @ 100 MHz 1.00 Forward Voltage (V) 0.90 0.80 0.70 0.60 0.50 0.40 0.30 0 10 20 30 40 50 Forward Current (mA) Figure 3. Forward Voltage vs Forward Current Skyworks Solutions, Inc. • Phone [781] 376-3000 • Fax [781] 376-3100 • [email protected] • www.skyworksinc.com 202942A • Skyworks Proprietary Information • Products and Product Information are Subject to Change Without Notice • August 9, 2013 3 PRELIMINARY DATA SHEET • SMP1302-087LF SURFACE-MOUNT PIN DIODE +5 V R 82 Ω C 100 pF L 22 nH C 100 pF C 100 pF SMP1302-087LF 50 Ω Term 50 Ω Term L 22 nH C 100 pF Y0040 Figure 4. SMP1302-087LF Bias Schematic Table 3. Evaluation Board Bill of Materials for EN33-D515-01_V3 (Tuned Circuit) Value Size QTY Manufacturer Mfg. Part Number Characteristics C Component 100 pF 0402 4 Murata GRM1555C1H101JZ01 5% C0G 50 V L 22 nH 0402 2 Murata HK100522NJ-T 5% R 82 0402 1 Panasonic ERJ2GEJ820X 5%, 0.1 W Table 4. Typical RF Performance @ 25 °C, f = 2.6 GHz Parameter Typical Units Insertion Loss 0.26 dB Return Loss 15.5 dB Isolation –10 dB Insertion Loss 0.38 dB Return Loss 10.3 dB Isolation –12.6 dB +47 dBm Un-tuned With 22 nH Bias Circuit Max Power Skyworks Solutions, Inc. • Phone [781] 376-3000 • Fax [781] 376-3100 • [email protected] • www.skyworksinc.com 4 August 9, 2013 • Skyworks Proprietary Information • Products and Product Information are Subject to Change Without Notice • 202942A +10 +10 0 0 –10 –10 |S-Parameters| (dB) |S-Parameters| (dB) PRELIMINARY DATA SHEET • SMP1302-087LF SURFACE-MOUNT PIN DIODE –20 –30 –40 S11 S21 –50 –20 –30 –40 S11 S21 –50 –60 –60 0 1 2 3 4 5 6 0 1 Frequency (GHz) 2 3 4 Frequency (GHz) Figure 6. S-Parameter Magnitude vs Frequency VREV = –30 V Figure 5. S-Parameter Magnitude vs Frequency If = 50 mA Insertion Loss (dB) 0 –0.1 If=50 mA –0.2 If=100 mA –0.3 –0.4 –0.5 –0.6 –0.7 –0.8 15 20 25 30 35 40 45 50 CW Input Power (dBm) Figure 7. Insertion Loss vs CW Input Power f=2.6 GHz Figure 8. SMP1302-087LF Evaluation Board Skyworks Solutions, Inc. • Phone [781] 376-3000 • Fax [781] 376-3100 • [email protected] • www.skyworksinc.com 5 August 9, 2013 • Skyworks Proprietary Information • Products and Product Information are Subject to Change Without Notice • 202942A 5 6 PRELIMINARY DATA SHEET • SMP1302-087LF SURFACE-MOUNT PIN DIODE Cross Section Name Thickness (in) Material Top Soldermask L1 (0.0028) Cu foil 0.012 ± 0.0006 Rogers RO4003C Core L2 (0.0014) Cu foil Laminate (Note 1) FR4 Prepreg L3 (0.0014) Cu foil 0.010 ± 0.0006 FR4 Core (0.0028) Cu foil Laminate Laminate L4 Bottom Soldermask Note 1: Adjust this thickness to meet total thickness goal of 0.062 ± 0.005 inches. S2531 Figure 9. Board Layer Detail Physical Characteristics 0.25 Part Outline 0.55 Exposed Soldering Area, Typical 2X 0.80 Pin 1 Pin 2 0.80 0.35 Y0041 Figure 10. SMP1302-087LF PCB Layout Footprint (Top View) Pin 1 Indicator Skyworks Part Marking RF 1 1 2 2 Figure 11. Typical Case Markings (Top View) Skyworks Solutions, Inc. • Phone [781] 376-3000 • Fax [781] 376-3100 • [email protected] • www.skyworksinc.com 6 August 9, 2013 • Skyworks Proprietary Information • Products and Product Information are Subject to Change Without Notice • 202942A PRELIMINARY DATA SHEET • SMP1302-087LF SURFACE-MOUNT PIN DIODE 2 1 C Pin 1 Indicator Exposed Pad Seating Plane A 2 B 1.15 + 0.1/–0.15 0.0 – 0.05 Detail A 2 1.6 + 0.1/–0.15 2 1 0.05 C 2X 0.90 ± 0.1 2X 2X 0.10 C 0.05 C Top View 0.20 Min. 3 0.20 0.08 C Side View Bottom View 0.4 ± 0.1 0.30 ± 0.05 5 0.10 M C A B Detail A All measurements are in millimeters. Dimensioning and tolerancing according to ASME Y14.5M-1994. Coplanarity applies to the exposed heat sink slug as well as the terminals.. Dimension applies to metalized terminal and is measured between 0.10 mm and 0.30 mm from terminal tip. S1989 Figure 12. SMP1302-087LF Package Dimensions ∅1.50+ 0.10/–0.00 0.30 ± 0.05 (T) Pin #1 4.00 ± 0.10 2.00 ± 0.05 4.00 (see Note 4) 1.75 ± 0.10 2.30 (Bo) A B 1.00 (Ko) 2.30 (Ao) 8.00 +0.30/–0.10 A 3.50 ± 0.05 B ∅1.00 Min. R0.30 Typ. B Notes: 1. Carrier tape: black conductive polystyrene. 2. Cover tape material: transparent conductive HSA. 3. Cover tape size: 5.40 mm width. 4. Ten sprocket hole pitch cumulative tolerance = ±0.20 mm. 5. ESD surface resistivity is ≤1 x 108 Ohms/square per EIA, JEDEC tape and reel specification. 6. Ao and Bo measurement point to be 0.30 mm from bottom pocket. 7. All measurements are in millimeters. A S1601 Figure 13. SMP1302-087LF Tape and Reel Dimensions Skyworks Solutions, Inc. • Phone [781] 376-3000 • Fax [781] 376-3100 • [email protected] • www.skyworksinc.com 202942A • Skyworks Proprietary Information • Products and Product Information are Subject to Change Without Notice • August 9, 2013 7 PRELIMINARY DATA SHEET • SMP1302-087LF SURFACE-MOUNT PIN DIODE Ordering Information Model Name SMP1302-087LF Surface Mount PIN Diode Manufacturing Part Number SMP1302-087LF Evaluation Board Part Number SMP1302-087LF EVB Copyright © 2013 Skyworks Solutions, Inc. All Rights Reserved. Information in this document is provided in connection with Skyworks Solutions, Inc. (“Skyworks”) products or services. These materials, including the information contained herein, are provided by Skyworks as a service to its customers and may be used for informational purposes only by the customer. Skyworks assumes no responsibility for errors or omissions in these materials or the information contained herein. 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