DATA SHEET SMP1331-085LF: 50 W Surface Mount Shunt Connected PIN Diode Applications Anode (Pin 3) Anode (Pin 1) Low-loss, high-power switches Low distortion attenuators Features Low-thermal resistance: 28 °C/W Cathode (Pin 2, Exposed Paddle) Suitable for 50 W Continuous Wave T/R switches Low capacitance: 0.35 pF Figure 1. SMP1331-085LF Block Diagram Low distortion performance QFN (3-pin, 2 × 2 mm) package (MSL1, 260 C per JEDEC J-STD-020) Skyworks Green™ products are compliant with all applicable legislation and are halogen-free. For additional information, refer to Skyworks Definition of Green™, document number SQ04-0074. Description The SMP1331-085LF is a surface mountable, low capacitance silicon PIN diode designed as a shunt connected PIN diode for high power, high volume switch and attenuator applications from 10 MHz to beyond 6 GHz. Maximum resistance at 100 mA is 0.5 and typical capacitance at 30 V is 0.35 pF. The combination of low junction capacitance, low parasitic inductance, low thermal resistance, and nominal 30 m I-region width, makes the SMP1331-085LF useful in large signal switches and attenuator applications. The device has a 2.5 W dissipation power rating, making it capable of handling more than 50 W @ 85 °C Continuous Wave (CW) in a shunt-connected transmit/receive (T/R) switch. Design information for high power switches may be found in the Skyworks Application Note, Design With PIN Diodes (document number 200312). A block diagram of the SMP1331-085LF is shown in Figure 1. Skyworks Solutions, Inc. • Phone [781] 376-3000 • Fax [781] 376-3100 • [email protected] • www.skyworksinc.com 203591B • Skyworks Proprietary Information • Products and Product Information are Subject to Change Without Notice • June 19, 2015 1 DATA SHEET • SMP1331-085LF: 50 W SURFACE MOUNT SHUNT CONNECTED PIN DIODE Electrical and Mechanical Specifications Typical DC performance characteristics of the SMP1331-085LF are illustrated in Figures 2 and 3. The absolute maximum ratings of the SMP1331-085LF are provided in Table 1. Electrical specifications are provided in Table 2. Table 1. SMP1331-085LF Absolute Maximum Ratings Maximum Units Reverse voltage Parameter VR Symbol Minimum 200 V Forward current @ 25 °C IF 200 mA CW power dissipation @ 85 °C PD 2.5 W 25 W Peak pulse power dissipation @ 85 °C (10% duty cycle) TSTG –65 +200 C Operating temperature TA –40 +150 C Electrostatic discharge: ESD 1100 1000 400 V V V Storage temperature Charged Device Model (CDM), Class 4 Human Body Model (HBM), Class 1C Machine Model (MM), Class C Note: Exposure to maximum rating conditions for extended periods may reduce device reliability. There is no damage to device with only one parameter set at the limit and all other parameters set at or below their nominal value. Exceeding any of the limits listed here may result in permanent damage to the device. CAUTION: Although this device is designed to be as robust as possible, electrostatic discharge (ESD) can damage this device. This device must be protected at all times from ESD. Static charges may easily produce potentials of several kilovolts on the human body or equipment, which can discharge without detection. Industry-standard ESD precautions should be used at all times. Table 2. SMP1331-085LF Electrical Specifications (Note 1) (TA = +25 C Unless Otherwise Noted) Parameter Symbol Test Condition Reverse current IR VR = 200 V Capacitance CT f = 1 MHz, VR = –30 V Resistance RS f = 100 MHz: IF = 1.0 mA IF = 10.0 mA IF = 100 mA Forward voltage Min Typical Max Units 10 μA 0.35 pF 14.5 1.7 0.5 V VF IF = 10 mA 0.8 Carrier lifetime TL IF = 10 mA 600 ns I region width W 30 m CW thermal resistance JC Junction-to-case 28 C/W Peak thermal resistance P Single 1 μs pulse width, junction-to-case (10% duty cycle) 2.8 C/W Note 1: Performance is guaranteed only under the conditions listed in this table. Skyworks Solutions, Inc. • Phone [781] 376-3000 • Fax [781] 376-3100 • [email protected] • www.skyworksinc.com 2 June 19, 2015 • Skyworks Proprietary Information • Products and Product Information are Subject to Change Without Notice • 203591B DATA SHEET • SMP1331-085LF: 50 W SURFACE MOUNT SHUNT CONNECTED PIN DIODE Typical DC Performance Characteristics (TA = 25 C, Unless Otherwise Noted) 1.0 100.0 0.8 Forward Voltage (V) Series Resistance (Ω) 0.9 10.0 1.0 0.7 0.6 0.5 0.4 1 10 100 Forward Current (mA) Figure 2. Series Resistance vs Current @ 100 MHz High-Power Switch Design Application The SMP1331-085LF PIN diode is designed for shunt applications such as reflective switches or shunt-diode attenuator circuits. Compared to other surface mount packages, the design of the QFN package produces lower thermal resistance and also reduces the effects of the parasitic inductance of the anode bond wires. A cross-sectional view of the SMP1331-085LF PIN diode is shown in Figure 4. The cathode of the die is soldered directly to the top of the exposed paddle. This paddle is composed of copper, so its thermal resistance is very low. The copper ground paddle minimizes the total thermal resistance between the I layer, which is the location where most heat is generated under normal operation, and the surface to which the package is mounted. Minimal thermal resistance between the I layer and the external environment minimizes junction temperature. The electrically equivalent circuit of the SMP1331-085LF PIN diode is shown in Figure 5. The inductances of pins 1 and 2, as well as the inductances of the bond wires are in series with the input and output transmission lines of the external circuit rather than the portion of the circuit that contains the shunt PIN diode. 0.2 0.1 ts613 0.1 0.1 ts612 0.3 1 10 100 Forward Current (mA) Figure 3. Forward Voltage vs Forward Current The effects of these parasitic series inductances are negligible, since they add a very small insertion loss to the shunt PIN but have no effect on the isolation that the diode produces when it is forward biased. A cross section of the suggested printed circuit board design is shown in Figure 6. The via shown in this view is critical, both for electrical performance and for thermal performance. It is recommended that several vias should be placed under the entire footprint of the exposed paddle (pin 2) to minimize both electrical inductance to the system ground and thermal resistance to the system heat sink. A high-power switch has been designed and tested. This circuit is shown in Figure 7, and Table 3 lists the Evaluation Board Bill of Materials for the circuit. Typical RF performance of the SMP1331-087LF using the circuit shown in Figure 7 is summarized in Table 3 and illustrated in Figures 8 through 10. An assembly drawing for the Evaluation Board is shown in Figure 11. The layer detail physical characteristics are provided in Figure 12. Skyworks Solutions, Inc. • Phone [781] 376-3000 • Fax [781] 376-3100 • [email protected] • www.skyworksinc.com 203591B • Skyworks Proprietary Information • Products and Product Information are Subject to Change Without Notice • June 19, 2015 3 DATA SHEET • SMP1331-085LF: 50 W SURFACE MOUNT SHUNT CONNECTED PIN DIODE Bond Wire (2 Places) Encapsulated Epoxy SMP1331-085LF Die Anode (Pin 1) Cathode (Pin 2) Anode (Pin 3) Not to scale Y2094 Figure 4. Cross-Sectional View of the SMP1331-085LF LSERIES LSERIES Pin 3 Pin 1 CPKG CPKG SMP1331-085LF Die LPADDLE Pin 2 Y2095 Figure 5. SMP1331-085LF Electrically Equivalent Circuit Skyworks Solutions, Inc. • Phone [781] 376-3000 • Fax [781] 376-3100 • [email protected] • www.skyworksinc.com 4 June 19, 2015 • Skyworks Proprietary Information • Products and Product Information are Subject to Change Without Notice • 203591B DATA SHEET • SMP1331-085LF: 50 W SURFACE MOUNT SHUNT CONNECTED PIN DIODE SMP1331-085LF Thermal Via Y2096 Figure 6. Cross-Sectional View of Suggested Printed Circuit Board IF = 50 mA VR = –30 V OR DC 100 pF 22 nH 100 pF 100 pF 50 Ω Term 50 Ω Term SMP1331-085LF ts614 Figure 7. High-Power Switch Design Table 3. Evaluation Board Bill of Materials for EN33-D515-001_V4 Component Value Size QTY Manufacturer Mfg. Part Number Characteristics C 100 pF 0402 3 Murata GRM1555C1H101JZ01 5% C0G 50 V L 22 nH 0402 1 Taiyo Yuden HK100522NJ-T 5% 300 mA SRF 1.9 GHz Skyworks Solutions, Inc. • Phone [781] 376-3000 • Fax [781] 376-3100 • [email protected] • www.skyworksinc.com 203591B • Skyworks Proprietary Information • Products and Product Information are Subject to Change Without Notice • June 19, 2015 5 DATA SHEET • SMP1331-085LF: 50 W SURFACE MOUNT SHUNT CONNECTED PIN DIODE Table 4. Typical RF Performance Characteristics @ 25 °C, f = 2.6 GHz (TA = +25 C, Characteristic Impedance [ZO] = 50 , EVB Optimized with Bias Circuit, Unless Otherwise Noted) Parameter Symbol Test Conditions Typical Units Insertion loss IL VR = −30 V −0.18 dB Return loss RL VR = −30 V −18.7 dB Isolation ISO IF = 50 mA 29.8 dB Max power PMAX VR = −30 V 47 dBm Typical RF Performance Characteristics (TOP = +25 °C, Characteristic Impedance [ZO] = 50 Ω, EVB Optimized with Bias Circuit, Unless Otherwise Noted) +10 0 –10 –10 |S-Parameters| (dB) –20 –30 –40 S11 S21 –30 –40 S11 S21 –50 ts615 –50 –20 –60 0 1 2 3 4 5 ts616 |S-Parameters| (dB) 0 –60 6 0 1 2 Frequency (GHz) 3 4 Figure 8. S-Parameter Magnitude vs Frequency, IF = 50 mA Figure 9. S-Parameter Magnitude vs Frequency, VR = −30 V 0 –0.05 –0.15 –0.2 VR = –5 V –0.3 VR = –10 V VR = –20 V –0.35 VR = –30 V –0.4 15 ts617 Insertion Loss (dB) –0.1 –0.25 20 25 30 35 40 45 50 CW Power In (dBm) Figure 10. Insertion Loss vs CW Power In at Different VR, f = 2.6 GHz Skyworks Solutions, Inc. • Phone [781] 376-3000 • Fax [781] 376-3100 • [email protected] • www.skyworksinc.com 6 5 Frequency (GHz) June 19, 2015 • Skyworks Proprietary Information • Products and Product Information are Subject to Change Without Notice • 203591B 6 DATA SHEET • SMP1331-085LF: 50 W SURFACE MOUNT SHUNT CONNECTED PIN DIODE ts618 Figure 11. Evaluation Board Assembly Diagram Cross Section Name Thickness (in) Material Top Soldermask L1 (0.0028) Cu foil 0.012 ± 0.0006 Rogers RO4003C Core L2 (0.0014) Cu foil Laminate (Note 1) FR4 Prepreg L3 (0.0014) Cu foil 0.010 ± 0.0006 FR4 Core (0.0028) Cu foil Laminate Laminate L4 Bottom Soldermask Note 1: Adjust this thickness to meet total thickness goal of 0.062 ± 0.005 inches. S2531 Figure 12. Evaluation Board Layer Detail Physical Characteristics Skyworks Solutions, Inc. • Phone [781] 376-3000 • Fax [781] 376-3100 • [email protected] • www.skyworksinc.com 203591B • Skyworks Proprietary Information • Products and Product Information are Subject to Change Without Notice • June 19, 2015 7 DATA SHEET • SMP1331-085LF: 50 W SURFACE MOUNT SHUNT CONNECTED PIN DIODE Package Dimensions Package and Handling Information The PCB layout footprint for the SMP1331-085LF is shown in Figure 13. Typical part markings are shown in Figure 14. Package dimensions for the 3-pin QFN are provided in Figure 15, and Figure 16 provides the tape and reel dimensions. Instructions on the shipping container label regarding exposure to moisture after the container seal is broken must be followed. Otherwise, problems related to moisture absorption may occur when the part is subjected to high temperature during solder assembly. The SMP1331-085LF is rated to Moisture Sensitivity Level 1 (MSL1) at 260 C. It can be used for lead or lead-free soldering. For additional information, refer to the Skyworks Application Note, Solder Reflow Information, document number 200164. Care must be taken when attaching this product, whether it is done manually or in a production solder reflow environment. Production quantities of this product are shipped in a standard tape and reel format. 2X 0.60 Part Outline 2X 0.55 Exposed Soldering Area Typ. 2X 0.27 Pin 3 2X 0.85 Pin 1 Pin 2 R0.20 2X 0.25 S2923 Figure 13. SMP1331-085LF PCB Layout Footprint RJ Skyworks Part Number 3 1 Orientation Indicator 3 1 2 ts619 Figure 14. Typical Part Markings (Top View) Skyworks Solutions, Inc. • Phone [781] 376-3000 • Fax [781] 376-3100 • [email protected] • www.skyworksinc.com 8 June 19, 2015 • Skyworks Proprietary Information • Products and Product Information are Subject to Change Without Notice • 203591B DATA SHEET • SMP1331-085LF: 50 W SURFACE MOUNT SHUNT CONNECTED PIN DIODE 0.5 ± 0.15 2 ± 0.2 Exposed Pad Detail B 2 ± 0.2 1.7 ± 0.15 1 3 2 0.90 ± 0.1 Orientation Indicator Top View Side View Bottom View 1 3 0.4 ± 0.1 2 0.27 ± 0.15 Detail B All dimensions in millimeters S1632 Figure 15. SMP1331-085LF QFN Package Dimension Drawing ∅1.50+ 0.10/–0.00 0.30 ± 0.05 (T) Pin #1 4.00 ± 0.10 2.00 ± 0.05 4.00 (see Note 4) 1.75 ± 0.10 2.30 (Bo) A B 1.00 (Ko) 2.30 (Ao) 8.00 +0.30/–0.10 A 3.50 ± 0.05 B ∅1.00 Min. R0.30 Typ. B Notes: 1. Carrier tape: black conductive polystyrene. 2. Cover tape material: transparent conductive HSA. 3. Cover tape size: 5.40 mm width. 4. Ten sprocket hole pitch cumulative tolerance = ±0.20 mm. 5. ESD surface resistivity is ≤1 x 108 Ohms/square per EIA, JEDEC tape and reel specification. 6. Ao and Bo measurement point to be 0.30 mm from bottom pocket. 7. All measurements are in millimeters. A S1601 Figure 16. SMP1331-085LF Tape and Reel Dimensions Skyworks Solutions, Inc. • Phone [781] 376-3000 • Fax [781] 376-3100 • [email protected] • www.skyworksinc.com 203591B • Skyworks Proprietary Information • Products and Product Information are Subject to Change Without Notice • June 19, 2015 9 DATA SHEET • SMP1331-085LF: 50 W SURFACE MOUNT SHUNT CONNECTED PIN DIODE Ordering Information Model Name SMP1331-085LF: Surface Mount PIN Diode Manufacturing Part Number SMP1331-085LF Copyright © 2015 Skyworks Solutions, Inc. All Rights Reserved. Information in this document is provided in connection with Skyworks Solutions, Inc. (“Skyworks”) products or services. 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Skyworks Solutions, Inc. • Phone [781] 376-3000 • Fax [781] 376-3100 • [email protected] • www.skyworksinc.com 10 June 19, 2015 • Skyworks Proprietary Information • Products and Product Information are Subject to Change Without Notice • 203591B