SMP1331_Series_203720A.pdf

DATA SHEET
SMP1331 Series: Low Capacitance, Plastic Packaged PIN
Diodes
Applications
 High-performance wireless switches
 Low-distortion attenuators
Features
 Capacitance: 0.18 pF typical @ 30 V
 Series resistance: 1.7 Ω typical @ 10 mA
 Packages rated MSL1, 260 C per JEDEC J-STD-020
Skyworks GreenTM products are compliant with
all applicable legislation and are halogen-free.
For additional information, refer to Skyworks
Definition of GreenTM, document number
SQ04–0074.
Description
The SMP1331 series of plastic packaged, surface mountable PIN
diodes is designed for use in high volume switch applications
from 10 MHz to more than 10 GHz. The low capacitance of these
diodes (0.18 pF), combined with a low resistance (1.7 Ω typical at
10 mA), makes the SMP1331 series particularly suited to high
isolation, series-connected PIN diode switches in battery operated
circuits.
The SMP1331 series is available in a selection of plastic
packages and a variety of configurations that include a small
footprint SC-79, a low inductance SOT-23, and a miniature SOD882.
Table 1 describes the various packages and marking of the
SMP1331 series.
Skyworks Solutions, Inc. • Phone [781] 376-3000 • Fax [781] 376-3100 • [email protected] • www.skyworksinc.com
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DATA SHEET • SMP1331 SERIES: LOW CAPACITANCE, PLASTIC PACKAGED PIN DIODES
Table 1. SMP1331 Series Packaging and Marking
Common Anode
Common Cathode
Single
Single
SOT-23
SOT-23
SC-79
Green™
SOD-882
Green™
SMP1331-003LF
Green™
Marking: KE9
♦SMP1331-004LF
SMP1331-079LF
Marking: Cathode and KE
SMP1331-040LF
Marking: KE1
LS = 1.5 nH
LS = 1.5 nH
LS = 0.7 nH
LS = 0.45 nH
Green™
Marking: KE3
The Pb-free symbol or “LF” in the part number denotes a lead-free, RoHS-compliant package unless otherwise noted as
Green™. Tin/lead (Sn/Pb) packaging is not recommended for new designs.
Electrical and Mechanical Specifications
Package and Handling Information
The part number and configuration for the SMP1331 series are
provided in Table 1. The absolute maximum ratings of the
SMP1331 series are provided in Table 2. Electrical specifications
are provided in Table 3.
Instructions on the shipping container label regarding exposure to
moisture after the container seal is broken must be followed.
Otherwise, problems related to moisture absorption may occur
when the part is subjected to high temperature during solder
assembly.
Typical performance characteristics of the SMP1331 series are
illustrated in Figures 1 to 3.
Package Dimensions
Package dimensions are shown in Figures 4 to 8 (even numbers),
and tape and reel dimensions are provided in Figures 5 to 9 (odd
numbers).
The SMP1331 series is rated to Moisture Sensitivity Level 1
(MSL1) at 260 C. It can be used for lead or lead-free soldering.
For additional information, refer to the Skyworks Application Note,
Solder Reflow Information, document number 200164.
Care must be taken when attaching this product, whether it is
done manually or in a production solder reflow environment.
Production quantities of this product are shipped in a standard
tape and reel format.
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DATA SHEET • SMP1331 SERIES: LOW CAPACITANCE, PLASTIC PACKAGED PIN DIODES
Table 2. SMP1331 Series Absolute Maximum Ratings (Per Junction) (Note 1)
Parameter
Symbol
Reverse voltage
Minimum
Maximum
Units
200
V
VR
Power dissipation @ 25 °C lead temperature
PD
250
mW
Storage temperature
TSTG
–65
+150
C
Operating temperature
TA
–65
+150
C
Electrostatic discharge:
ESD
500
V
Human Body Model (HBM), Class 1A
Note 1: Exposure to maximum rating conditions for extended periods may reduce device reliability. There is no damage to device with only one parameter set at the limit and all other
parameters set at or below their nominal value. Exceeding any of the limits listed here may result in permanent damage to the device.
CAUTION: Although this device is designed to be as robust as possible, electrostatic discharge (ESD) can damage this device. This device
must be protected at all times from ESD. Static charges may easily produce potentials of several kilovolts on the human body
or equipment, which can discharge without detection. Industry-standard ESD precautions should be used at all times.
Table 3. SMP1331 Series Electrical Specifications (Per Junction) (Note 1)
(TA = +25 C, Unless Otherwise Noted)
Parameter
Symbol
Test Condition
Reverse current
IR
Capacitance
CT
F = 1 MHz, V = 30 V
Resistance
RS
F = 100 MHz:
Min
Typical
Max
Units
10
μA
0.35
pF
14.5
1.7
0.5
Ω
Ω
Ω
VR = 200 V
RS @ 1.0 mA
RS @ 10.0 mA
RS @ 100.0 mA
0.18
Forward voltage
VF
IF = 10 mA
0.80
V
Carrier lifetime
TI
IF = 10 mA
0.6
μs
30
μm
I region width
Note 1: Performance is guaranteed only under the conditions listed in this table.
Skyworks Solutions, Inc. • Phone [781] 376-3000 • Fax [781] 376-3100 • [email protected] • www.skyworksinc.com
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DATA SHEET • SMP1331 SERIES: LOW CAPACITANCE, PLASTIC PACKAGED PIN DIODES
Typical Performance Characteristics (Per Junction)
1.0
100.0
Forward Voltage (V)
1.0
0.1
0.1
1
10
0.8
0.7
0.6
0.5
0.4
0.3
Y2368
10.0
Y2369
Series Resistance (Ω)
0.9
0.2
0.1
100
1
10
Forward Current (mA)
Forward Current (mA)
Figure 2. DC Characteristics
Figure 1. Series Resistance vs Current @ 100 MHz
0.3
Capacitance (pF)
0.25
0.2
0.15
0.1
Y2370
0.05
0
0
5
10
15
20
25
30
35
40
Reverse Voltage (V)
Figure 3. Capacitance vs Reverse Voltage @ 1 MHz
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DATA SHEET • SMP1331 SERIES: LOW CAPACITANCE, PLASTIC PACKAGED PIN DIODES
Box
or
Bar
Polarity
Indicator Area
0.006 (0.15 mm) Min.
0.010
(0.25 mm) Min.
0.014
(0.35 mm) Max.
1
2
0.028
(0.70 mm) Min.
0.035
(0.90 mm) Max.
0.060 (1.50 mm) Min.
0.067 (1.70 mm) Max.
0.043 (1.10 mm) Min.
0.051 (1.30 mm) Max.
10° Max.
0.020
(0.50 mm) Min.
0.028
(0.70 mm) Max.
0.003
(0.07 mm) Min.
0.008
(0.20 mm) Max.
10° Max.
Dimensions are in inches (millimeters shown in parentheses)
S1652
Figure 4. SC-79 Package Dimension Drawing
Ø1.50± 0.10
4.00 ± 0.10
4.00 ± 0.10
2.00 ± 0.05
0.229 ± 0.02 (T)
1.75 ± 0.10
B
A
B
Pin 1 Indicator
0.80 ± 0.05 (Ko)
B
8.00 ± 0.20
A
3.50 ± 0.05
1.40 ± 0.05
1.95 ± 0.05 (Bo)
2° Max
Ø0.50± 0.05
0.39 ± 0.05
2o Max
0.90 ± 0.05 (Ao)
A
Notes:
1. Carrier tape: black conductive polycarbonate or polystyrene.
2. Cover tape material: transparent conductive PSA.
3. Cover tape size: 5.4 mm width.
4. ESD-surface resistivity is ≤1 x 108 Ohms/square per
EIA, JEDEC TNR Specification.
5. All measurements are in millimeters.
S2929
Figure 5. SC-79 Tape and Reel Dimensions
Skyworks Solutions, Inc. • Phone [781] 376-3000 • Fax [781] 376-3100 • [email protected] • www.skyworksinc.com
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DATA SHEET • SMP1331 SERIES: LOW CAPACITANCE, PLASTIC PACKAGED PIN DIODES
0.110 (2.80 mm) Min.
0.120 (3.04 mm) Max.
0.012 (0.30 mm) Min.
0.020 (0.50 mm) Max.
3
0.083 (2.10 mm) Min.
0.104 (2.64 mm) Max.
0.047 (1.20 mm) Min.
0.055 (1.40 mm) Max.
2
1
0.037 (0.95 mm) Ref.
0.020 (0.51 mm) Ref.
0.076 (1.92 mm) Ref.
0.035 (0.89 mm) Min.
0.044 (1.12 mm) Max.
0.003 (0.080 mm) Min.
0.008 (0.20 mm) Max.
8° Max.
0.0005 (0.01 mm) Min.
0.004 (0.10 mm) Max.
0.022 (0.55 mm) Ref.
Dimensions are in inches (millimeters shown in parentheses)
S1389
Figure 6. SOT-23 Package Dimension Drawing
4.00
ø1.00 Min.
ø1.5 + 0.1/–0
4.00
(See Note 5)
2.70 (Bo)
R 0.3 Max
2.2
1.20 (Ko)
1.75 ± 0.10
3.50 ± 0.05
A
1.0
0.8 ± 0.05
R 0.5 Typ.
Pin 1 Indicator
8.00 + 0.3/–0.1
2.00 ± 0.05
0.25 ± 0.05
A
3.10 (Ao)
A
Notes:
1. Carrier tape: black conductive polycarbonate.
2. Cover tape material: transparent conductive PSA.
3. Cover tape size: 5.40 mm width.
4. Tolerance ±0.10 mm.
5. Ten sprocket hole pitch cumulative tolerance: ±0.2 mm.
6. All measurements are in millimeters.
7. Alternative carrier tape dimensions are:
Ao = 3.3
Bo = 2.9
Ko = 1.22
S1684b
Figure 7. SOT-23 Tape and Reel Dimensions
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DATA SHEET • SMP1331 SERIES: LOW CAPACITANCE, PLASTIC PACKAGED PIN DIODES
0.03 C
Seating Plane
0.05/0.00
Pin 1 Indicator
2X
5
2X 0.25 ± 0.05
C
0.05
0.10 M A B
0.325
Terminal 1
1.000
0.650
B
A
0.600
0.46 + 0.04
–0.06
0.05
2X 0.50 ± 0.05
0.10 M A B
4
2X
NOTES:
1. All measurements are in millimeters.
2. Dimensions and tolerances according to ASME Y14.5M-1994.
3. These packages are used principally for discrete devices.
4. This dimension includes stand-off height and package body thickness,
but does not include attached features, e.g., external heatsink or chip capacitors.
An integral heatslug is not considered an attached feature.
5. This dimension is primarily terminal plating, but does not include small metal protrusion.
Y1410
Figure 8. SOD-882 Package Dimension Drawing
4.00 ± 0.10
Cathode
Indicator
2.00 ± 0.05
∅1.55 ± 0.05 (D0)
0.20
8.00 ± 0.1
1.75 ± 0.10
3.50 ± 0.05
1.15 ± 0.05 (Bo)
A
∅0.40 ± 0.05 (D1)
0.47 ± 0.05 (Ko)
2.00 ± 0.05
B
B
A
A
0.70 ± 0.05 (A0)
Notes:
1. Carrier tape: black conductive polycarbonate.
2. Cover tape: transparent conductive material.
3. Cover tape size: 5.4 mm width.
4. ESD surface resistivity is ≥1 x 104 ~ ≤ 1 x 108 Ohms/square.
5. All dimensions are in millimeters.
B
S1922
Figure 9. SOD-882 Tape and Reel Dimensions
Skyworks Solutions, Inc. • Phone [781] 376-3000 • Fax [781] 376-3100 • [email protected] • www.skyworksinc.com
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DATA SHEET • SMP1331 SERIES: LOW CAPACITANCE, PLASTIC PACKAGED PIN DIODES
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