201654C.pdf

DATA SHEET
SE2600S: 2.4 GHz WLAN Switch/Low-Noise Amplifier
Front-End
Applications
• IEEE802.11b DSSS WLAN
• IEEE802.11g/n OFDM WLAN
• Embedded systems
Features
• Integrates an SP3T switch and LNA with bypass mode
• Gain: 12 dB
• Noise Figure: 1.8 dB
• Bluetooth® path loss: 0.5 dB
• Small WLCSP (11-bump, 1.07 x 1.05 x 0.38 mm) 250 μm ball
pitch package (MSL1, 260 °C per JEDEC-J-STD-020)
Figure 1. SE2600S Block Diagram
Description
The SE2600S is an integrated Front-End Module (FEM) with a
Bluetooth port to complement WLAN chipsets with an integrated
Power Amplifier (PA).
The SE2600S integrates a Single-Pole, Triple-Throw (SP3T) switch
and Low-Noise Amplifier (LNA) with a bypass mode in an ultracompact package. The device is capable of switching between
WLAN receive, WLAN transmit, and Bluetooth.
The SE2600S is provided in a small, 11-bump, 1.07 x 1.05 mm
Wafer Level Chip Scale Package (WLCSP). A functional block
diagram is shown in Figure 1. The pin configuration and package
are shown in Figure 2. Signal pin assignments and functional pin
descriptions are provided in Table 1.
Figure 2. SE2600S Pinout – 11-Bump CSP
(Top View, Bumps Down)
Skyworks Solutions, Inc. • Phone [781] 376-3000 • Fax [781] 376-3100 • sales@skyworksinc.com • www.skyworksinc.com
201654C • Skyworks Proprietary and Confidential Information • Products and Product Information are Subject to Change Without Notice • November 2, 2011
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DATA SHEET • SE2600S WLAN SWITCH/LNA FEM
Table 1. SE2600S Signal Descriptions
Pin #
Name
Description
Pin #
Name
Description
1
TX
WLAN transmit port
7
GND
Ground
2
GND
Ground
8
BT
Bluetooth port
3
VON
LNA control signal
9
VC1
BT switch control pin
4
RX
WLAN receive port
10
RFC
RF common port (antenna)
5
VDD
Positive power supply voltage
11
VC3
Transmit switch control pin
6
VC2
Receive switch control pin
Table 2. SE2600S Absolute Maximum Ratings
Parameter
Symbol
Supply voltage
VDD
DC input on control pins
Minimum
Maximum
Units
0
3.6
V
–0.5
VDD + 0.5
V
+27
dBm
Transmit input power, RFC terminated in 50 Ω match
PIN
Operating temperature
TA
–40
+85
°C
Storage temperature
TSTG
–40
+150
°C
Note:
Exposure to maximum rating conditions for extended periods may reduce device reliability. There is no damage to device with only one parameter set at the limit and all other
parameters set at or below their nominal value. Exceeding any of the limits listed here may result in permanent damage to the device.
CAUTION: Although this device is designed to be as robust as possible, Electrostatic Discharge (ESD) can damage this device. This device
must be protected at all times from ESD. Static charges may easily produce potentials of several kilovolts on the human body
or equipment, which can discharge without detection. Industry-standard ESD precautions should be used at all times. The
SE2600S ESD threshold level is 1000 VDC using Human Body Model (HBM) testing.
Table 3. Recommended Operating Conditions
Parameter
Symbol
Minimum
Typical
3.3
Supply voltage
VDD
2.7
Control voltage (relative to GND = 0 V)
VCTL
0
Operating temperature
TA
Electrical and Mechanical Specifications
The absolute maximum ratings of the SE2600S are provided in
Table 2. The recommended operating conditions are specified in
Table 3 and electrical specifications are provided in Tables 4
through 7.
–40
+25
Maximum
Units
3.6
V
VDD
V
+85
°C
The state of the SE2600S is determined by the logic provided in
Table 8.
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DATA SHEET • SE2600S WLAN SWITCH/LNA FEM
Table 4. SE2600S Electrical Specifications: DC Characteristics (Note 1)
(VDD = 3.3 V, TA = +25 °C, All Unused Ports Terminated With 50 Ω, Unless Otherwise Noted)
Parameter
Typical
Max
Units
10
13
mA
60
μA
ICTL
20
μA
BT port control current
I C1
20
μA
TX port control current
I C3
20
μA
Control voltage:
High
Low
VIH
VIL
3.6
0.3
V
V
LNA current
Symbol
IDD
Test Condition
Min
High gain mode
Bypass mode
LNA control current
2.7
0
Note 1: Performance is guaranteed only under the conditions listed in this Table.
Table 5. SE2600S Electrical Specifications: AC Characteristics, Transmit (RFC to TX Port) (Note 1)
(VC1 = VC2 = VON = 0 V, VDD = 3.3 V, TA = +25 °C, All Unused Ports Terminated With 50 Ω, Unless Otherwise Noted)
Parameter
Frequency
Symbol
Test Condition
f
Min
Typical
2.4
Max
Units
2.5
GHz
Insertion loss
IL
0.5
0.7
dB
Input return loss
S11
–16
–14
dB
Output return loss
S22
–16
–14
dB
Switch isolation
Iso
1 dB Input Compression Point
IP1dB
Turn-on/turn-off time
TON, TOFF
VC3 = 0 V
23
dB
+31
dBm
90/10% of final output
power level
400
ns
Note 1: Performance is guaranteed only under the conditions listed in this Table.
Table 6. SE2600S Electrical Specifications: AC Characteristics, Bluetooth (RFC to BT Port) (Note 1)
(VC2 = VC3 = VON = 0 V, VDD = 3.3 V, TA = +25 °C, All Unused Ports Terminated With 50 Ω, Unless Otherwise Noted)
Parameter
Symbol
Max
Units
2.5
GHz
0.5
0.7
dB
S11
–16
–14
dB
S22
–16
–14
dB
Frequency
f
Insertion loss
IL
Input return loss, BT port
Output return loss, BT port
Switch isolation
Iso
1 dB Input Compression Point
IP1dB
Turn-on/turn-off time
TON, TOFF
Test Condition
Min
Typical
2.4
VC1 = 0 V
25
dB
+31
90/10% of final output
power level
dBm
400
ns
Note 1: Performance is guaranteed only under the conditions listed in this Table.
Skyworks Solutions, Inc. • Phone [781] 376-3000 • Fax [781] 376-3100 • sales@skyworksinc.com • www.skyworksinc.com
201654C • Skyworks Proprietary and Confidential Information • Products and Product Information are Subject to Change Without Notice • November 2, 2011
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DATA SHEET • SE2600S WLAN SWITCH/LNA FEM
Table 7. SE2600S Electrical Specifications: Receive Characteristics (RFC to RX Port) (Note 1)
(VC1 = VC3 = 0 V, VDD = 3.3 V, TA = +25 °C, All Unused Ports Terminated With 50 Ω, Unless Otherwise Noted)
Parameter
Symbol
Test Condition
Min
Typical
Max
Units
2.5
GHz
+13
dB
Frequency
f
2.4
Receive gain, LNA enabled
S21
+11
+12
Receive gain, LNA bypassed
S21_BYP
–4
–3
Input return loss
S11
–10
–8
dB
Output return loss
S22
–10
–8
dB
Noise Figure
NF
1.8
2.0
dB
1 dB Input Compression Point
IP1dB
Turn-on/turn-off time
TON, TOFF
–6
dB
–5
dBm
90/10% of final output
power level
400
ns
Note 1: Performance is guaranteed only under the conditions listed in this Table.
Table 8. SE2600S Control Logic
Mode
Note:
Path
VC1
(Pin 9)
VC2
(Pin 6)
VC3
(Pin 11)
VON
(Pin 3)
All off
N/A
0
0
0
0
Transmit
TX to RFC
0
0
1
0
Bluetooth
RFC to BT
1
0
0
0
High gain (receive)
RFC to RX
0
1
0
1
Bypass (receive)
RFC to RX
0
1
0
0
“0” = 0 V to +0.3 V. “1” = +2.7 V to +3.6 V. Any state other than described in this Table places the switch into an undefined state. An undefined state will not damage the device.
Evaluation Board Description
Evaluation Board Losses
The SE2600S Evaluation Board is used to test the performance of
the SE2600S LNA FEM. An Evaluation Board schematic diagram is
provided in Figure 3. Table 9 provides the Bill of Materials (BOM)
list for Evaluation Board components. An assembly drawing for the
Evaluation Board is shown in Figure 4.
The board losses from the RF connectors of the Evaluation Board
to the pins of the SE2600S are:
RFC: 0.175 dB
TX: 0.165 dB
RX: 0.175 dB
BT: 0.21 dB
Evaluation Board Setup Procedure
Step 1: Connect system ground to pin 1 of the J14 header.
Step 2: Apply 3.3 V to pin 14 of the J14 header.
Step 3: Select a path/mode according to the information in
Table 8. For the J14 header pinout, refer to the Evaluation
Board silkscreen and schematic in Figure 3.
Package Dimensions
The PCB layout footprint for the SE2600S is provided in Figure 5.
Typical case markings are shown in Figure 6. Package
dimensions for the 11-bump WLCSP are shown in Figure 7, and
tape and reel dimensions are provided in Figure 8.
NOTE: In case only three controls are available from the
application, (transmit, receive, and Bluetooth), connect the
VC2 and VON signals together. In this configuration, the
LNA is always “on” in receive mode (corresponding to high
gain mode in Table 8). The LNA 3rd Order Input Intercept
Point (IIP3) is > +5 dBm.
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November 2, 2011 • Skyworks Proprietary and Confidential Information • Products and Product Information are Subject to Change Without Notice • 201654C
DATA SHEET • SE2600S WLAN SWITCH/LNA FEM
Package and Handling Information
Instructions on the shipping container label regarding exposure to
moisture after the container seal is broken must be followed.
Otherwise, problems related to moisture absorption may occur
when the part is subjected to high temperature during solder
assembly.
The SE2600S is rated to Moisture Sensitivity Level 1 (MSL1) at
260 °C. It can be used for lead or lead-free soldering. For
additional information, refer to the Skyworks Application Note,
PCB Design and SMT Assembly Guidelines for Wafer Level Chip
Scale Packages, document number 201676.
Care must be taken when attaching this product, whether it is
done manually or in a production solder reflow environment.
Production quantities of this product are shipped in a standard
tape and reel format.
Underfill Requirements
low-stress seal that dissipates stress on solder joints and extends
thermal cycling performance. Skyworks recommends the use of
Loctite Hysol 4549 as an underfill material, which should be cured
for 30 minutes at +165 °C.
If the WLCSP is attached without an underfill, the circuit is more
susceptible to mechanical damage. Damage can even occur if
components in close proximity to the WLCSP are soldered or
unsoldered on the substrate without evenly preheating the entire
board and die. Mechanical damage to the solder joint between the
board and die could result, which may impact electrical
connectivity.
Pad Coordinates
The SE2600S pad coordinates are provided in Table 10 (also refer
to the pinout diagram in Figure 2). The origin of the coordinates
(i.e., X = 0, Y = 0) is located at the center of the SE2600S
package. Sense is top view through package (PCB footprint).
The assembly of a WLCSP onto an electrical substrate requires
special handling and normally needs an underfill liquid epoxy mold
compound. When fully cured, the underfill material forms a rigid,
Figure 3. SE2600S Evaluation Board Schematic
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201654C • Skyworks Proprietary and Confidential Information • Products and Product Information are Subject to Change Without Notice • November 2, 2011
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DATA SHEET • SE2600S WLAN SWITCH/LNA FEM
Table 9. SE2600S Evaluation Board Bill of Materials (BOM)
Component
Value
Size
Manufacturer
Manufacturer’s Part #
Characteristics
C7
1 nF
0402
Murata
GRM155R71H102KA01
Multi-layer ceramic
C8
10 pF
0402
Murata
GRM1555C1H100JZ01
Multi-layer ceramic
C11
2.2 μF
0603
Murata
GRM188R71A225KE15D
Monolithic ceramic
J14
–
100 mil
Samtec
TSW-107-07-G-D
7x2 100 mil pin header
R14, R15, R16, R17
100 kΩ
0402
Panasonic
ERJ2GEJ104
Thick film chip resistor
Table 10. SE2600S Bump Pad Coordinates
Bump Coordinates
Bump Number
Bump Label
X
(μm)
Y
(μm)
1
TX
–375
+375
2
GND
–375
+125
3
VON
–375
–375
4
RX
–125
–375
5
VDD
+125
–375
6
VC2
+375
–375
7
GND
+375
–125
8
BT
+375
+125
9
VC1
+375
+375
10
RFC
+125
+375
11
VC3
–125
+375
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November 2, 2011 • Skyworks Proprietary and Confidential Information • Products and Product Information are Subject to Change Without Notice • 201654C
DATA SHEET • SE2600S WLAN SWITCH/LNA FEM
Figure 4. SE2600S Evaluation Board Assembly Diagram
Skyworks Solutions, Inc. • Phone [781] 376-3000 • Fax [781] 376-3100 • sales@skyworksinc.com • www.skyworksinc.com
201654C • Skyworks Proprietary and Confidential Information • Products and Product Information are Subject to Change Without Notice • November 2, 2011
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DATA SHEET • SE2600S WLAN SWITCH/LNA FEM
Figure 5. SE2600S PCB Layout Footprint
Figure 6. Typical Case Markings
Skyworks Solutions, Inc. • Phone [781] 376-3000 • Fax [781] 376-3100 • sales@skyworksinc.com • www.skyworksinc.com
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November 2, 2011 • Skyworks Proprietary and Confidential Information • Products and Product Information are Subject to Change Without Notice • 201654C
DATA SHEET • SE2600S WLAN SWITCH/LNA FEM
Figure 7. SE2600S 11-Bump WLCSP Package Dimensions
Figure 8. SE2600S Tape and Reel Dimensions
Skyworks Solutions, Inc. • Phone [781] 376-3000 • Fax [781] 376-3100 • sales@skyworksinc.com • www.skyworksinc.com
201654C • Skyworks Proprietary and Confidential Information • Products and Product Information are Subject to Change Without Notice • November 2, 2011
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DATA SHEET • SE2600S WLAN SWITCH/LNA FEM
Ordering Information
Model Name
SE2600S LNA Front-End
Manufacturing Part Number
SE2600S-R
Evaluation Board Part Number
SE2600S-EK1
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