SKY66105_11_202939F.pdf

DATA SHEET
SKY66105-11: 902 to 931 MHz High-Power RF Front-End
Module
 ISM communications
PA
 Smart thermostats
PA_IN
 Range extender
LPF
CTX
CSD
 Smart meters
ANT_SEL
Applications
Logic
Control
Output
Matching Network
(OMN)
Features
RX_OUT
 Integrated PA with up to +30 dBm output power
LPF
ANT1
LPF
ANT2
202939B-001
Figure 1. SKY66105-11 FEM Block Diagram
 Receive pass-through
 Diversity antenna switching
 Single-ended, 50 Ω transmit/receive RF interfaces
Description
 Fast turn-on/turn-off time: 1 to 2 μs
The SKY66105-11 is a high performance, highly integrated RF
front-end module (FEM) designed for high power Industrial,
Scientific, and Medical (ISM) applications operating in the
902 MHz to 931 MHz frequency band.
 Supply operation: 2.0 V to 4.8 V
 Sleep mode current: < 10 μA
 Small footprint shielded MCM (12-pin, 8.00 x 6.00 x 1.05 mm)
package (MSL3, 260 C per JEDEC J-STD-020)
VCC1
VCC0
Skyworks GreenTM products are compliant with
all applicable legislation and are halogen-free.
For additional information, refer to Skyworks
Definition of GreenTM, document number
SQ04–0074.
12
11
VCC2
PA_IN
2
9
GND
GND
3
8
ANT1
RX_OUT
4
7
ANT2
ANT_SEL
10
CTX
1
6
The RF blocks operate over a wide supply voltage range from
2.0 V to 4.8 V, which allows the SKY66105-11 to be used in
battery powered applications over a wide spectrum of the battery
discharge curve.
The SKY66105-11 is packaged in a 12-pin, 8 x 6 mm Multi-Chip
Module (MCM) with exposed ground paddle and surrounding
shielding.
CSD
5
The SKY66105-11 is designed for ease of use and maximum
flexibility, with fully matched 50 Ω inputs and outputs, and digital
controls compatible with 1.8 V to 3.6 V CMOS levels.
A functional block diagram of the SKY66105-11 is shown in
Figure 1. The 12-pin MCM package and pinout are shown in
Figure 2. Signal pin assignments and functional pin descriptions
are provided in Table 1.
202939B-002
Figure 2. SKY66105-11 Pinout
(Top View)
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202939F • Skyworks Proprietary and Confidential Information • Products and Product Information are Subject to Change Without Notice • June 9, 2016
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DATA SHEET • SKY66105-11: HIGH-POWER RF FEM
Table 1. SKY66105-11 Signal Descriptions
Pin
1
Name
Description
CSD
Pin
Control input, shutdown (PA disable)
7
Name
Description
ANT2
Antenna 2 port
2
PA_IN
PA input
8
ANT1
Antenna 1 port
3
GND
Ground
9
GND
Ground
4
RX_OUT
Receive output (receive signal to transceiver
or application)
10
VCC2
Stage 2 PA supply
5
CTX
Control input, transmit/receive switch
11
VCC0
Logic supply
6
ANT_SEL
Control input, antenna 1 / antenna 2 switch
12
VCC1
Stage 1 PA supply
Technical Description
Electrical and Mechanical Specifications
The SKY66105-11 contains all of the needed RF matching and DC
biasing circuits. The PA is a two-stage amplifier, capable of over
+30 dBm and optimized for power efficiency. This makes the
device suitable for battery-powered applications where PA power
consumption is of critical importance.
The absolute maximum ratings of the SKY66105-11 are provided
in Table 2. The recommended operating conditions are specified
in Table 3 and electrical specifications are provided in Tables 4
through 6.
The state of the SKY66105-11 is determined by the logic provided
in Table 7. Mode control configurations are noted in Tables 8
and 9.
Table 2. SKY66105-11 Absolute Maximum Ratings1
Parameter
Symbol
Minimum
Maximum
Units
V
Supply voltage (VCC0, VCC1, VCC2)
VCC
–0.3
+5.5
Logic control voltages
VIH, VIL
–0.3
+3.0
V
Transmit RF input power (at PA_IN port)
PIN_TX
+10
dBm
Receive RF input power (at ANT1 or ANT2 ports)
PIN_RX
+13
dBm
Thermal resistance
θJC
16.3
C/W
Operating case temperature
TC
–40
+85
C
Storage temperature
TSTG
–40
+150
C
Electrostatic discharge:
ESD
1000
V
Human Body Model (HBM), Class 1C
1 Exposure to maximum rating conditions for extended periods may reduce device reliability. There is no damage to device with only one parameter set at the limit and all other parameters
set at or below their typical value as provided in Tables 3, 4, and 5. Exceeding any of the limits listed here may result in permanent damage to the device.
ESD HANDLING: Although this device is designed to be as robust as possible, electrostatic discharge (ESD) can damage this device. This
device must be protected at all times from ESD when handling or transporting. Static charges may easily produce
potentials of several kilovolts on the human body or equipment, which can discharge without detection. Industrystandard ESD handling precautions should be used at all times.
Table 3. SKY66105-11 Recommended Operating Conditions
Parameter
Symbol
Minimum
Typical
Maximum
Units
Operating case temperature
TC
–40
+25
+85
C
RF supply voltage1
VCC0, VCC1, VCC2
2.0
3.6
4.8
V
1 Power supply pins VCC0, VCC1, and VCC2 are independent supplies and are not internally tied together.
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DATA SHEET • SKY66105-11: HIGH POWER RF FEM
Table 4. SKY66105-11 DC Electrical Specifications1
(VCC0/1/2 = +3.6 V, TC = +25 C, PIN = 0 dBm, as Measured on the SKY66105-11 Evaluation Board (De-Embedded to Device), Unless
Otherwise Noted)
Parameter
Symbol
Total supply current in Transmit Mode
Test Condition
Min
Typical
Max
Units
ICC_TX29
POUT = +29 dBm,
VCC1/2 = 3.6 V
450
mA
ICC_TX273
POUT = +27 dBm,
VCC1/2 = 3.6 V
360
mA
No RF
50
mA
Quiescent current in Transmit Mode
ICQ_TX
Total supply current in Receive Bypass Mode
ICC_RXBYPASS
Total supply current in Sleep Mode2
ICC_OFF
280
300
μA
3.7
10
μA
1 Performance is guaranteed only under the conditions listed in this table. Logic levels are compliant with the logic described in Table 7.
2 All controls must be at 0 V to achieve the specified sleep current.
3 Not tested in production. Fully characterized and guaranteed by design.
Table 5. SKY66105-11 Transmit Mode Electrical Specifications1
(VCC0/1/2 = +3.6 V, TC = +25 C, Transmit Mode, as Measured on the SKY66105-11 Evaluation Board (De-Embedded to Device), All
Unused Ports Terminated with 50 Ω, Unless Otherwise Noted)
Parameter
Symbol
Test Condition
Min
Typical
Units
931
MHz
f
Output power at ANT1/2 ports
POUT_TX48V2
VCC1/2 = 4.8 V
+31.5
dBm
POUT_TX40V2
VCC1/2 = 4.0 V
+30
dBm
POUT_TX29
VCC1/2 = 3.6 V
+29
dBm
POUT_TX30V2
VCC1/2 = 3.0 V
+27.5
dBm
PAE
POUT = +29 dBm at PA_OUT
port, at 915 MHz
45
%
29
dB
PA power-added efficiency
902
Max
Frequency range
Small signal gain
S21
Small signal gain variation
ΔS21
Input return loss
S11
Output return loss
S22ANT1/2
ANT1/2 ports, into 50 Ω
–6
dB
2nd harmonic
HD2
POUT = +29 dBm, CW
–22
dBc
3rd to 10th harmonics2
HD3 to HD10
POUT = +29 dBm, CW
–72
dBc
Turn-on time2
tON
From 50% of CTX edge to
90% of final RF output power
2
μs
From 50% of CTX edge to
10% of final RF output power
1
μs
2
μs
Turn-off time2
tOFF
20
Across frequency range
Antenna select switching time2
tANT_SW_TX
From 50% of ANT_SEL edge
Stability2
Stab
PIN = +6 dBm, CW
f = 0.1 GHz to 20 GHz,
load VSWR = 6:1
Ruggedness2
RU
PIN = +6 dBm into
50 Ω, CW,
load VSWR = 10:1
0.5
1
dBp-p
–15
–6
dB
–10
All non-harmonically related outputs < –42 dBm/MHz
No permanent damage
1 Performance is guaranteed only under the conditions listed in this table. Production testing is performed at 915 MHz.
2 Not tested in production. Fully characterized and guaranteed by design.
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DATA SHEET • SKY66105-11: HIGH-POWER RF FEM
Table 6. SKY66105-11 Receive Mode Electrical Specifications1
(VCC0/1/2 = +3.6 V, TC = +25 C, Receive Mode, as Measured on the SKY66105-11 Evaluation Board (De-Embedded to Device), All
Unused Ports Terminated with 50 Ω, Unless Otherwise Noted)
Parameter
Symbol
Test Condition
Min
Frequency range
f
ANT1/2 port input return loss
S11ANT1/2
Into 50 Ω, ANT1/2 ports
Turn-on time2
tON
From 50% of CTX edge
Turn-off time2
tOFF
Antenna select switching time2
tANT_SW_RX
Gain in Receive Bypass Mode
1 dB input compression point2
Typical
902
–20
Max
Units
931
MHz
–10
dB
2
μs
1
μs
2
μs
G_BP
–0.7
dB
IP1dB
+30
dBm
From 50% of ANT_SEL
edge
1 Performance is guaranteed only under the conditions listed in this table. Production testing is performed at 915 MHz.
2 Not tested in production. Fully characterized and guaranteed by design.
Table 7. SKY66105-11 Electrical Specifications: Control Logic Characteristics1
(TC = +25 C, as Measured on the SKY66105-11 Evaluation Board (De-Embedded to Device), Unless Otherwise Noted)
Parameter
Symbol
Control voltage:
High
Low
VIH
VIL
Input current:
High
Low
IIH
IIL
Test Condition
Min
Typical
1.8
0
Max
Units
3.0
0.3
V
V
50
50
μA
μA
1 Performance is guaranteed only under the conditions listed in this table. Control logic input signals are: CSD and CTX. Not tested in production. Fully characterized and guaranteed by
design.
Table 8. SKY66105-11 Mode Control Logic1
Mode
CSD
(Pin 1)
CTX
(Pin 5)
ICC
Total
0
0
3.7 μA
Sleep (all off)
Receive Bypass
1
0
280 μA
Transmit
1
1
50 mA
Not a legal state
0
1
6.2 mA
1 Logic levels “0” and “1” are compliant with VIL and VIH, respectively, as specified in Table 7.
Table 9. SKY66105-11 Mode Control Logic: Antenna Select1
Mode
ANT_SEL
(Pin 6)
Antenna 1 active (ANT1)
1
Antenna 2 active (ANT2)
0
1 Logic levels “0” and “1” are compliant with VIL and VIH, respectively, as specified in Table 7.
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DATA SHEET • SKY66105-11: HIGH POWER RF FEM
Evaluation Board Description
Package and Handling Information
The SKY66105-11 Evaluation Board is used to test the
performance of the SKY66105-11 FEM. A typical application
schematic diagram is provided in Figure 3. An Evaluation Board
schematic is shown in Figure 4. An assembly drawing for the
Evaluation Board is shown in Figure 5 and the layer detail is
provided in Figure 6.
Since the device package is sensitive to moisture absorption, it is
baked and vacuum packed before shipping. Instructions on the
shipping container label regarding exposure to moisture after the
container seal is broken must be followed. Otherwise, problems
related to moisture absorption may occur when the part is
subjected to high temperature during solder assembly.
Package Dimensions
The SKY66105-11 is rated to Moisture Sensitivity Level 3 (MSL3)
at 260 C. It can be used for lead or lead-free soldering. For
additional information, refer to the Skyworks Application Note,
PCB Design and SMT Assembly/Rework Guidelines for MCM-L
Packages, document number 101752.
Typical part markings are shown in Figure 7. The PCB layout
footprint for the SKY66105-11 is provided in Figure 8. Figure 9
shows the package dimensions for the 12-pin MCM, and
Figure 10 provides the tape and reel dimensions.
Care must be taken when attaching this product, whether it is
done manually or in a production solder reflow environment.
Production quantities of this product are shipped in a standard
tape and reel format.
DCH1
VCC1
CSD
ANT_SEL
1
4
3
6
5
8
7
10
9
12
11
VCC2
VCC1
CTX
VCC0
1
2
J1
VCC1
12
CSD
11
VCC0
VCC2
2
VCC2
GND
GND
ANT_SEL
RX_OUT
ANT1
CTX
4
J2
9
PA_IN
PA_IN
3
10
5
6
RX_OUT
ANT2
8
ANT1
7
ANT2
J4
J3
13
CTX
202939B-003
Figure 3. SKY66105-11 Typical Application Schematic
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DATA SHEET • SKY66105-11: HIGH-POWER RF FEM
DCH1
VCC2
2
1
4
3
6
5
VCC1
8
7
CSD
10
9
ANT_SEL
12
11
VCC2
VCC1
VCC0
CTX
C18
DNI
L3
0Ω
L1
0Ω
C2
DNI
C3
DNI
C4
DNI
1
C16
DNI
J2
50 Ω
PA_IN
2
3
4
50 Ω
RX_OUT
CSD
C17
DNI
11
VCC2
GND
ANT1
GND
RX_OUT
5
ANT2
L2
0Ω
10
C5
DNI
9
PA_IN
CTX
J1
C9
DNI
12
VCC0
C1
DNI
ANT_SEL
C12
DNI
VCC1
VCC1
C6
DNI
50 Ω
8
50 Ω
7
VCC2
C7
DNI
C13
DNI
C8
DNI
ANT1
ANT2
J4
J3
13
6
CTX
ANT_SEL
C14
DNI
C10
DNI
C11
DNI
C15
DNI
Figure 4. SKY66105-11 Evaluation Board Schematic
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202939B-004
DATA SHEET • SKY66105-11: HIGH POWER RF FEM
DCH1
GND
C12
C13
C1
J1
PA_IN
GND_S2
VCC2
VCC2_S
GND_S1
GND
VCC1
VCC1_S
CSD
VCC0
CTX
ANT_SEL
P1
C16
C18
C2
L1
L3
C3
C8
C7
L2
C6
C4
C17 C5
C10
C11
J4
ANT1
C9
J2
RX_OUT
C14
C15
J3
ANT2
EN40-D675-002_V2
EN40-D670
202939B-005
Figure 5. SKY66105-11 Evaluation Board Assembly Drawing
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DATA SHEET • SKY66105-11: HIGH-POWER RF FEM
202939B-006
Figure 6. SKY66105-11 Evaluation Board Layer Detail
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DATA SHEET • SKY66105-11: HIGH POWER RF FEM
Pin 1
Indicator
Skyworks
Part Number
SKY66105-11
XXXXXXX
YYWW CC
Lot Code
Date Code:
YY = Calendar Year
WW = Week
CC = Country Code
202939B-007
Figure 7. SKY66105-11 Typical Part Markings
(Top View)
8X 0.875 mm
Exposed Center Pad
Stencil aperture size of 80% to
100% (by area) of the module/package
solder mask openings
Pin 12
Pin 1 Indicator
0.2 x 0.2
ø0.15 ±0.05
Metal Pad
Pin 1
8X 0.875 mm
1.6 mm Pitch
2X 7.2 mm
12X 0.6 mm
12X 0.6 mm
4X 5.2 mm
Stencil Aperture
Top View
2X 0.95 mm
0.6 mm Pitch
0.25 mm Typ
Pin 12
ø0.15 ±0.05
Metal Pad
Pin 1
Thermal Via Array
ø0.3 mm on 0.6 mm pitch
will improve thermal performance.
Exposed Center Pad
Opening size of 60% to
100% of exposed center
opening shown
Pin 12
Pin 1 Indicator
0.2 x 0.2
ø0.15 ±0.05
Metal Pad
Pin 1
0.6 mm Pitch
2X 1.975 mm
1.6 mm Pitch
7.2 mm
1.6 mm Pitch
2X 7.3 mm
12X 0.7 mm
10X 0.6 mm
10X 0.6 mm
12X 0.7 mm
5.2 mm
Metallization
Top View
Notes:
4X 5.3 mm
Solder Mask Opening
Top View
1. Thermal vias should be resin-filled and capped according to IPC-4761, Type VII vias.
2. 30 to 35 um Cu plating is recommended.
3. All measurements are in millimeters.
202939B-008
Figure 8. SKY66105-11 PCB Layout Footprint
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4X 0.8
B
See Detail D
Pin 1 Indicator
See Detail C
Pin 12
0
6
8X 2.6
DATA SHEET • SKY66105-11: HIGH-POWER RF FEM
C
Pin 1
Indicator
4X 3.6
Pin 1
4X 2.4
4X 0.8
0
8
4X 0.5125
A
4X 1.5375
See Detail B
12X SMT Pad
0.1 A B C
8X Solder Mask Openings
0.2 A B C
A
8X 0.5125
1.05 ± 0.1
0.1
0.075 A B C
Top View
Side View
Bottom View
0.7 ± 0.05
Solder Mask
Edges
0.6 ± 0.05
(0.4)
Metal Pad,
All Edges
0.7 ± 0.05
ø0.3 ± 0.05
Solder Mask Pad
(0.35)
(0.35)
Solder Mask
Edges
0.2 X 0.2
0.875
0.6 ± 0.05
0.875
0.875
Detail A
7X Detail B
Pad
Scale: 2X
4X This Rotation
4X Rotated 180°
2X Rotated 90° CW
2X Rotated 90° CCW
Pad
Scale: 2X
Detail D
Scale: 2X
0.875
Detail C
Pad
Scale: 2X
Notes:
1. All measurements are in millimeters.
2. Dimensions and tolerances according to ASME Y14.5M-1994.
3. Pad definitions per details on drawing.
202939B-009
Figure 9. SKY66105-11 Package Dimensions
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1.5
∅
1.75 ± 0.10
DATA SHEET • SKY66105-11: HIGH POWER RF FEM
2.00 ± 0.10
5+
0.30 ± 0.05
4.00 ± 0.10
0.0
5
16.00 ± 0.30
8.35 ± 0.10 (Bo)
7.50 ± 0.10
Pin 1
7° Max
∅1.50 + 0.10
1.30 ± 0.10 (Ko)
8.00 ± 0.10
6.35 ± 0.10 (Ao)
Section B
7° Max
Notes:
1. Carrier tape must meet all requirements of Skyworks GP01-D232
procurement spec for tape and reel shipping.
2. Carrier tape: black conductive polystyrene.
3. Cover tape material: transparent conductive.
4. ESD-surface resistivity shall meet GP01-D232.
5. 10-sprocket hole pitch cumulative tolerance: ±0.20 mm.
6. Ao and Bo are measured on plane 0.30 mm above the bottom of the pocket.
7. All dimensions are in millimeters.
202939B-010
Figure 10. SKY66105-11 Tape and Reel Dimensions
Skyworks Solutions, Inc. • Phone [781] 376-3000 • Fax [781] 376-3100 • [email protected] • www.skyworksinc.com
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DATA SHEET • SKY66105-11: HIGH-POWER RF FEM
Ordering Information
Model Name
SKY66105-11: 902 to 931 MHz High-Power RF Front-End Module
Manufacturing Part Number
SKY66105-11
Evaluation Board Part Number
SKY66105-11-EK1
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