200634G.pdf

DATA SHEET
SKY73023-11: 1700 – 2200 MHz High Gain and Linearity
Diversity Downconversion Mixer
Applications
Description
• 2G/3G base station transceivers:
− GSM/EDGE, CDMA, UMTS/WCDMA, PHS
The SKY73023-11 is a fully integrated diversity mixer that
includes Local Oscillator (LO) drivers, an LO switch, high linearity
mixers, and large dynamic range Intermediate Frequency (IF)
amplifiers. Low loss RF baluns have also been included to reduce
design complications and lower system cost.
The SKY73023-11 is manufactured using a robust silicon BiCMOS
process and has been designed for optimum long-term reliability.
The SKY73023-11 diversity downconversion mixer is provided in
a compact, 36-pin 6 x 6 mm Multi-Chip Module (MCM). A
functional block diagram is shown in Figure 1. The pin
configuration and package are shown in Figure 2. Signal pin
assignments and functional pin descriptions are provided in
Table 1.
VCC_LO
• Operating frequency range: 1700 to 2200 MHz
• IF frequency range: 40 to 300 MHz
• Conversion gain: 9.7 dB
• Input IP3: +25.7 dBm
• Output IP3: +35.4 dBm
• Noise figure: 9.9 dB
• Integrated LO drivers
• Integrated low loss RF baluns
• High linearity IF amplifiers
• On-chip SPDT LO switch (greater than 45 dB LO-to-LO isolation)
VCC_IFA
Features
IFA+
IFA–
• Private mobile radio
The SKY73023-11 features an input IP3 of +25.7 dBm and a
Noise Figure (NF) of 9.9 dB, making the device an ideal solution
for high dynamic range systems such as 2G/3G base station
receivers. The LO switch provides more than 45 dB of isolation
between LO inputs and supports the switching time required for
GSM/EDGE base stations.
RIFA
• Land mobile radio
• Wireless Local Loop
• High performance radio links
• Small, MCM (36-pin, 6 x 6 mm) Pb-free package (MSL3, 260 °C
per JEDEC J-STD-020)
RFA
Skyworks offers lead (Pb)-free RoHS (Restriction of
Hazardous Substances) compliant packaging.
LO1
LO2
RFB
VCC_IFB
IFB+
IFB–
RIFB
LO_SEL
VCC_LO
Figure 1. SKY73023-11 Block Diagram
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S643
VCC_RFA
NC
GND
IFA–
IFA+
NC
VCC_IFA
RIFA
NC
DATA SHEET • SKY73023-11 DOWNCONVERSION MIXER
36
35
34
33
32
31
30
29
28
3
25
GND
VCC_LO
4
24
GND
GND
5
23
LO_SEL
VCC_LO
6
22
GND
GND
7
21
VCC_LO
NC
8
20
GND
RFB
9
19
LO1
10
11
12
13
14
15
16
17
18
NC
GND
RIFB
GND
VCC_IFB
26
NC
2
IFB–
NC
IFB+
LO2
GND
27
NC
1
VCC_RFB
RFA
S646
Figure 2. SKY73023-11 Pinout – 36-Pin MCM
Table 1. SKY73023-11 Signal Descriptions
Pin #
Name
Description
Pin #
Name
Description
1
RFA
Channel A RF input
19
LO1
Local oscillator 1 input
2
NC
No connect
20
GND
Ground
3
GND
Ground
21
VCC_LO
DC supply, +5 V
4
VCC_LO
DC supply, +5 V
22
GND
Ground
5
GND
Ground
23
LO_SEL
Local oscillator select switch control
6
VCC_LO
DC supply, +5 V
24
GND
Ground
7
GND
Ground
25
GND
Ground
8
NC
No connect
26
GND
Ground
9
RFB
Channel B RF input
27
LO2
Local oscillator 2 input
10
VCC_RFB
Channel B RF DC supply, +5 V
28
NC
No connect
11
NC
No connect
29
RIFA
Channel A IF bias adjust
12
GND
Ground
30
VCC_IFA
Channel A IF DC supply, +5 V
13
IFB+
Positive channel B IF output
31
NC
No connect
14
IFB–
Negative channel B IF output
32
IFA+
Positive channel A IF output
15
NC
No connect
33
IFA–
Negative channel A IF output
16
VCC_IFB
Channel B IF DC supply, +5 V
34
GND
Ground
17
RIFB
Channel B IF bias adjust
35
NC
No connect
18
NC
No connect
36
VCC_RFA
Channel A RF DC supply, +5 V
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April 13, 2009 • Skyworks Proprietary and Confidential information • Products and Product Information are Subject to Change Without Notice • 200634G
DATA SHEET • SKY73023-11 DOWNCONVERSION MIXER
Functional Description
The SKY73023-11 is a high gain diversity mixer, optimized for
base station receiver applications. The device consists of two
diversity channels (A and B), each consisting of a low loss RF
balun, high linearity passive mixer, and a low noise IF amplifier.
Two LO amplifiers (independent of channels A and B) are also
included that allow the SKY73023-11 to connect directly to the
output of a Voltage Controlled Oscillator (VCO). This eliminates the
extra gain stages needed by most discrete passive mixers. A
Single Pole, Double Throw (SPDT) switch has been included to
select between two different LO inputs for frequency hopping
applications (i.e., GSM).
RF Baluns and Passive Mixer
The RF baluns provide a single ended input, which can easily be
matched to 50 Ω using a simple external matching circuit. The RF
baluns offer very low loss, and excellent amplitude and phase
balance.
The high linearity SKY73023-11 is a passive, double balanced
mixer that provides a very low conversion loss and an excellent
3rd Order Input Intercept Point (IIP3).
Addtionally, the balanced nature of the mixer provides for high
port-to-port isolation.
LO Buffers and SPDT LO Switch
The LO buffers allow the input power of the SKY73023-11 to be in
the range of ±3 dBm. The LO section is optimized for low-side LO
injection. However, each of the two LOs can be driven over a wide
frequency range with only slight degradation in performance.
LO_SEL Input
LO Path Selected
High
LO1 (pin 19) enabled
Low
LO2 (pin 27) enabled
For applications that do not require frequency hopping, LO_SEL is
fixed to one state and the appropriate LO input is used. An internal
pull-down resistor enables the LO2 input.
IF Amplifier
The SKY73023-11 includes high dynamic range IF amplifiers that
follow the passive mixers in the signal path. The outputs require a
supply voltage connection using inductive chokes. These choke
inductors should be high-Q and have the ability to handle 200 mA
or greater.
A simple matching network allows the output ports to be matched
to a balanced 200 Ω impedance. The IF amplifiers are optimized
for IF frequencies between 40 and 300 MHz. The IF amplifiers can
be operated outside of this range, but with a slight degradation in
performance.
Electrical and Mechanical Specifications
The absolute maximum ratings of the SKY73023-11 are provided
in Table 2 and the recommended operating conditions in Table 3.
Electrical characteristics for the SKY73023-11 are provided in
Table 4.
Typical performance characteristics of the SKY73023-11 are
illustrated in Figures 3 through 34.
A high isolation SPDT switch allows the SKY73023-11 to be used
for frequency hopping applications. This switch provides greater
than 45 dB of LO1 to LO2 isolation:
Table 2. SKY73023-11 Absolute Maximum Ratings
Parameter
Symbol
Minimum
Maximum
Units
4.5
5.5
V
ICC
440
mA
RF input power
PRF
+20
dBm
LO input power
PLO
Operating case temperature
TC
Junction temperature
TJ
Storage case temperature
TSTG
Supply voltage, +5 V (VCC_RFA, VCC_RFB,
VCC_IFA, VCC_IFB, VCC_LO)
VCC
Supply current
+20
dBm
–40
+85
°C
150
°C
–40
+125
°C
Notes: Exposure to maximum rating conditions for extended periods may reduce device reliability. There is no damage to device with only one parameter set at the limit and all other
parameters set at or below their nominal value.
Nominal thermal resistance (junction to center ground pad) is 5.1 °C/W.
Skyworks Solutions, Inc. • Phone [781] 376-3000 • Fax [781] 376-3100 • sales@skyworksinc.com • www.skyworksinc.com
200634G • Skyworks Proprietary and Confidential information • Products and Product Information are Subject to Change Without Notice • April 13, 2009
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DATA SHEET • SKY73023-11 DOWNCONVERSION MIXER
Table 3. SKY73023-11 Recommended Operating Conditions
Parameter
Symbol
Minimum
Typical
Maximum
Units
4.75
5.00
5.25
V
Supply voltage, +5 V (VCC_RFA, VCC_RFB,
VCC_IFA, VCC_IFB, VCC_LO)
VCC
Supply current
ICC
LO input power
PLO
–6
LO select input:
high
low
LO_SELH
LO_SELL
2.2
Operating case temperature
TC
RF frequency range
LO frequency range (Note 1)
IF frequency range
375
mA
0
+6
dBm
0.8
V
V
–40
+85
°C
FRF
1700
2200
MHz
FLO
1460
2000
MHz
FIF
40
300
MHz
Note 1: The SKY73023-11 has been optimized for low-side LO injection. However, the LO can be used outside of the specified frequency range with degraded performance.
Table 4. SKY73023-11 Electrical Specifications (1 of 2)
(Voltage Supply = +5 V, TA = +25 °C, LO = 0 dBm, RF Frequency = 1880 MHz, IF Frequency = 201 MHz, LO Frequency = 1679 MHz, Unless
Otherwise Noted)
Parameter
Conversion gain
Symbol
G
Gain variation over temperature
Noise Figure
NF
Noise Figure variation over temperature
Test Condition
Min
Typical
FRF = 1710 to 1980 MHz,
PLO = –3 to +3 dBm,
VCC = 4.75 to 5.25 V
7.5
9.7
dB
TA = –40 to +85 °C
±0.7
dB
FRF = 1880 MHz
9.9
dB
FRF = 1880 MHz,
TA = –40 to +85 °C
±0.8
dB
18
dB
+25.7
dBm
FRF = 1880 and
1880.8 MHz,
TA = –40 to +85 °C
±0.2
dB
+35.4
dBm
Noise Figure with a blocker signal
NFBLK
Blocking signal input
power = +8 dBm
Third order input intercept point
IIP3
FRF = 1880 and
1880.8 MHz,
PRF = –10 dBm/each tone,
PLO = –3 to +3 dBm,
VCC = 4.75 to 5.25 V
Third order input intercept point variation
over temperature
+23.8
Max
Third order output intercept point
OIP3
FRF = 1880 and
1880.8 MHz,
PRF = –10 dBm/each tone,
PLO = –3 to +3 dBm,
VCC = 4.75 to 5.25 V
2RF – 2LO
2x2
PRF = –10 dBm
–73
3RF – 3LO
3x3
PRF = –10 dBm
–80
dBc
Input 1 dB compression point
IP1dB
FRF = 1710 to 1980 MHz,
PLO = –3 to +3 dBm,
VCC = 4.75 to 5.25 V
+13.6
dBm
Output 1 dB compression point
OP1dB
FRF = 1710 to 1980 MHz,
PLO = –3 to +3 dBm,
VCC = 4.75 to 5.25 V
+22.3
dBm
+12.0
–63
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Units
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dBc
DATA SHEET • SKY73023-11 DOWNCONVERSION MIXER
Table 4. SKY73023-11 Electrical Specifications (2 of 2)
(Voltage Supply = +5 V, TA = +25 °C, LO = 0 dBm, RF Frequency = 1880 MHz, IF Frequency = 201 MHz, LO Frequency = 1679 MHz, Unless
Otherwise Noted)
Parameter
Symbol
Test Condition
Min
Typical
LO1-to-LO2 isolation
Channel-to-channel isolation
RF-to IF-isolation
30
LO leakage:
@ RF port
@ IF port
LO_SEL input
–20
Max
Units
45
dB
52
dB
59
dB
–38
–45
–20
–23
dBm
dBm
150
250
µA
0.5
µs
LO switching time
RF port input return loss
ZIN_RF
With external matching
components
14
dB
LO port input return loss
ZIN_LO
With external matching
components
14
dB
IF port input return loss
ZOUT_IF
With external matching
components
14
dB
12
12
4.75 V
5.00 V
5.25 V
11
Mixer A Gain (dB)
Mixer A Gain (dB)
11
10
9
8
10
9
–40 oC
+25 oC
+85 oC
8
7
1710
1740
1770
1800
1830
1860
1890
1920
1950
7
1710
1980
1740
1770
1800
RF Frequency (MHz)
Figure 3. Mixer A Gain vs Frequency and Supply Voltage
1860
1890
1920
1950
1980
Figure 4. Mixer A Gain vs Frequency and Temperature
12
12
11
11
Mixer B Gain (dB)
Mixer A Gain (dB)
1830
RF Frequency (MHz)
10
9
8
10
9
4.75 V
5.00 V
5.25 V
8
–3 dBm
0 dBm
+3 dBm
7
7
1710
1740
1770
1800
1830
1860
1890
1920
1950
RF Frequency (MHz)
Figure 5. Mixer A Gain vs Frequency and LO Power
1980
1710
1740
1770
1800
1830
1860
1890
1920
1950
1980
RF Frequency (MHz)
Figure 6. Mixer B Gain vs Frequency and Supply Voltage
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5
12
12
11
11
Mixer B Gain (dB)
Mixer B Gain (dB)
DATA SHEET • SKY73023-11 DOWNCONVERSION MIXER
10
9
–40 oC
+25 oC
+85 oC
8
7
1710
1740
1770
1800
1830
1860
1890
1920
1950
10
9
8
–3 dBm
0 dBm
+3 dBm
7
1710
1980
1740
1770
1800
RF Frequency (MHz)
Figure 7. Mixer B Gain vs Frequency and Temperature
13
Mixer A Noise Figure (dB)
Mixer A Noise Figure (dB)
1890
1920
11
9
7
1710
1980
1740
1770
1800
1830
1860
1890
1920
1950
11
9
7
5
1710
1980
–40 oC
+25 oC
+85 oC
13
1740
1770
1800
RF Frequency (MHz)
1830
1860
1890
1920
1950
1980
RF Frequency (MHz)
Figure 9. Mixer A Noise Figure vs Frequency and Supply Voltage
Figure 10.Mixer A Noise Figure vs Frequency and Temperature
15
15
13
Mixer B Noise Figure (dB)
4.75 V
5.00 V
5.25 V
11
9
7
5
1710
1740
1770
1800
1830
1860
1890
1920
1950
11
9
7
5
1710
1980
–40 oC
+25 oC
+85 oC
13
1740
1770
1800
RF Frequency (MHz)
1860
1890
1920
1950
1980
Figure 12. Mixer B Noise Figure vs Frequency and Temperature
30
30
4.75 V
5.00 V
5.25 V
–40 oC
+25 oC
+85 oC
28
Mixer A IIP3 (dBm)
28
26
24
22
20
1710
1830
RF Frequency (MHz)
Figure 11. Mixer B Noise Figure vs Frequency and Supply Voltage
26
24
22
20
1740
1770
1800
1830
1860
1890
1920
1950
RF Frequency (MHz)
Figure 13. Mixer A IIP3 vs Frequency and Supply Voltage
1980
1710
1740
1770
1800
1830
1860
1890
1920
1950
RF Frequency (MHz)
Figure 14. Mixer A IIP3 vs Frequency and Temperature
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6
1950
15
4.75 V
5.00 V
5.25 V
5
Mixer B Noise Figure (dB)
1860
Figure 8. Mixer B Gain vs Frequency and LO Power
15
Mixer A IIP3 (dBm)
1830
RF Frequency (MHz)
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1980
30
30
28
28
Mixer B IIP3 (dBm)
Mixer A IIP3 (dBm)
DATA SHEET • SKY73023-11 DOWNCONVERSION MIXER
26
24
22
26
24
–3 dBm
0 dBm
+3 dBm
22
20
1710
1740
1770
1800
1830
1860
1890
1920
1950
4.75 V
5.00 V
5.25 V
20
1710
1980
1740
1770
1800
–40 oC
+25 oC
+85 oC
1920
1950
1980
–3 dBm
0 dBm
+3 dBm
28
Mixer B IIP3 (dBm)
28
Mixer B IIP3 (dBm)
1890
30
30
26
24
22
26
24
22
20
1710
1740
1770
1800
1830
1860
1890
1920
1950
20
1710
1980
1740
1770
1800
1830
1860
1890
1920
1950
1980
RF Frequency (MHz)
RF Frequency (MHz)
Figure 18. Mixer B IIP3 vs Frequency and LO Power
Figure 17. Mixer B IIP3 vs Frequency and Temperature
15
Mixer A Input P1dB (dBm)
15
Mixer A Input P1dB (dBm)
1860
Figure 16. Mixer B IIP3 vs Frequency and Supply Voltage
Figure 15. Mixer A IIP3 vs Frequency and LO Power
14
13
12
11
4.75 V
5.00 V
5.25 V
10
14
13
12
–40 oC
+25 oC
+85 oC
11
10
1710
1740
1770
1800
1830
1860
1890
1920
1950
1980
1710
1740
1770
1800
1830
1860
1890
1920
1950
1980
RF Frequency (MHz)
RF Frequency (MHz)
Figure 19. Mixer A Input P1dB vs Frequency and Supply Voltage
Figure 20. Mixer A Input P1dB vs Frequency and Temperature
15
15
14
Mixer B Input P1dB (dBm)
Mixer A Input P1dB (dBm)
1830
RF Frequency (MHz)
RF Frequency (MHz)
13
12
–3 dBm
0 dBm
+3 dBm
11
10
1710
1740
1770
1800
1830
1860
1890
1920
1950
1980
RF Frequency (MHz)
Figure 21. Mixer A Input P1dB vs Frequency and LP Power
14
13
12
4.75 V
5.00 V
5.25 V
11
10
1710
1740
1770
1800
1830
1860
1890
1920
1950
1980
RF Frequency (MHz)
Figure 22. Mixer B Input P1dB vs Frequency and Supply Voltage
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DATA SHEET • SKY73023-11 DOWNCONVERSION MIXER
15
Mixer B Input P1dB (dBm)
Mixer B Input P1dB (dBm)
15
14
13
12
–40 oC
+25 oC
+85 oC
11
10
1710
14
13
12
–3 dBm
0 dBm
+3 dBm
11
10
1740
1770
1800
1830
1860
1890
1920
1950
1980
1710
1740
1770
1800
RF Frequency (MHz)
Figure 23. Mixer B Input P1dB vs Frequency and Temperature
–61
1920
–67
1980
–73
–79
1740
1770
1800
1830
1860
1890
1920
1950
–67
–73
–79
–85
1710
1980
1740
1770
1800
RF Frequency (MHz)
1830
1860
1890
1920
1950
1980
RF Frequency (MHz)
Figure 25. Mixer A 2RF-2LO vs Frequency and Temperature
Figure 26. Mixer B 2RF-2LO vs Frequency and Temperature
70
Mixer B RF - IF Isolation (dB)
70
62
54
46
–40 oC
+25 oC
+85 oC
38
30
1710
1740
1770
1800
1830
1860
1890
1920
1950
62
54
46
30
1710
1980
–40 oC
+25 oC
+85 oC
38
1740
1770
1800
RF Frequency (MHz)
1830
1860
1890
1920
1950
1980
RF Frequency (MHz)
Figure 27. Mixer A RF to IF Isolation vs Frequency and
Temperature
Figure 28. Mixer B RF to IF Isolation vs Frequency and
Temperature
–35
Mixer B LO - IF Leakage (dBm)
–35
–41
–47
–53
–40 oC
+25 oC
+85 oC
–59
–65
1509
1539
1569
1599
1629
1659
1689
1719
1749
LO Frequency (MHz)
Figure 29. Mixer A LO to IF Leakage vs Frequency and
Temperature
1779
–41
–47
–53
–40 oC
+25 oC
+85 oC
–59
–65
1509
1539
1569
1599
1629
1659
1689
1719
1749
LO Frequency (MHz)
Figure 30. Mixer B LO to IF Leakage vs Frequency and
Temperature
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8
1950
–40 oC
+25 oC
+85 oC
–61
Mixer B 2RF-2LO (dBc)
Mixer A 2RF-2LO (dBc)
1890
–55
–40 oC
+25 oC
+85 oC
–85
1710
Mixer A RF - IF Isolation (dB)
1860
Figure 24. Mixer B Input P1dB vs Frequency and LO Power
–55
Mixer A LO - IF Leakage (dBm)
1830
RF Frequency (MHz)
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1779
DATA SHEET • SKY73023-11 DOWNCONVERSION MIXER
–30
Mixer B LO - RF Leakage (dBm)
Mixer A LO - RF Leakage (dBm)
–30
–34
–38
–42
–40 oC
+25 oC
+85 oC
–46
–50
1509
1539
1569
1599
1629
1659
1689
1719
1749
–34
–38
–42
–50
1509
1779
–40 oC
+25 oC
+85 oC
–46
1539
1569
1599
LO Frequency (MHz)
Figure 31. Mixer A LO to RF Leakage vs Frequency and
Temperature
1689
1719
1749
1779
60
–40 oC
+25 oC
+85 oC
56
Chan A - Chan B Isolation (dB)
LO1 - LO2 Isolation (dB)
1659
Figure 32. Mixer B LO to RF Leakage vs Frequency and
Temperature
60
52
48
44
40
1509
1629
LO Frequency (MHz)
1539
1569
1599
1629
1659
1689
1719
1749
1779
LO Frequency (MHz)
Figure 33. LO1 to LO2 Isolation vs Frequency and Supply Voltage
Evaluation Board Description
The SKY73023-11 Evaluation Board is used to test the
performance of the SKY73023-11 downconversion mixer. An
assembly drawing for the Evaluation Board is shown in Figure 35
and the layer detail is provided in Figure 36. A schematic diagram
for the SKY73023-11 Evaluation Board is shown in Figure 37.
Circuit Design Configurations
The following design considerations are general in nature and
must be followed regardless of final use or configuration:
1. Paths to ground should be made as short and as low
impedance as possible.
2. The ground pad of the SKY73023-11 provides critical
electrical and thermal functionality. This pad is the main
thermal conduit for heat dissipation. Since the circuit board
56
52
48
–40 oC
+25 oC
+85 oC
44
40
1710
1740
1770
1800
1830
1860
1890
1920
1950
1980
RF Frequency (MHz)
Figure 34. Channel A to Channel B IF Isolation vs Frequency and
Supply Voltage
acts as the heat sink, it must shunt as much heat as possible
from the device. Therefore, design the connection to the
ground pad to dissipate the maximum heat produced by the
circuit board. For more information on soldering the
SKY73023-11, refer to the Package and Handling Information
section of this Data Sheet.
3. Skyworks recommends including external bypass capacitors
on the VCC voltage inputs of the device.
4. Components L5, L6, L14, and L15 (see Figure 37) are high-Q,
low loss inductors. These inductors must be able to pass
currents in excess of 200 mA DC.
5. Components R1 and R2 (see Figure 37) allow for external
adjustment of the IF amplifier bias points. For operation as
specified in Tables 3 and 4, these resistors are not required.
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DATA SHEET • SKY73023-11 DOWNCONVERSION MIXER
J9
J5
C34
C35
L17
L16
J4
L12
L13
R4
C25
T2
C32
L1
C2
C28
C29
J8
C33
C39
C26
L2
L14
L15
C38
C3
L11
R2
C27
C1
R5
C23
C22
C20
C4
J1
C24
C21
J2
C5
C17
C8
C7
C41
C6
L5
C14
L6
R6 R1
C40
L4
C13
C12
L3
J7
T1
C18
L10
C11
C19
R3
L18
C36
J10
L8
L19
C37
C15
J3
L9
C16
J6
S905
Figure 35. SKY73023-11 Evaluation Board Assembly Diagram
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DATA SHEET • SKY73023-11 DOWNCONVERSION MIXER
Layer 1: Top -- Metal
Layer 2: Ground
Layer 3: Power Plane
Layer 4: Solid Ground Plane
S904
Figure 36. SKY73023-11 Evaluation Board Layer Detail
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DATA SHEET • SKY73023-11 DOWNCONVERSION MIXER
R4
0Ω
DB714
L14
470 nH
L13
12 nH
T2
J5
C28
15 pF
L15
470 nH
VCC
L12
0Ω
C27
33 pF
C26
1 μF
VCC
R2
DNI
x
RFA
NC
30
29
28
LO2
GND
NC
GND
VCC_LO
GND
Element Jumper
11
12
13
14
15
x
10
16
LO1
17
VCC
J2
C21
33 pF
VCC
22
21
20
L10
0Ω
19
C20
1 μF
J3
C17
33 pF
R1
DNI
NC
RIFB
RFB
GND
C22
12 pF
23
18
x
9
NC
VCC_IFB
8
VCC_LO
NC
C7
5.6 nH
x
GND
IFB–
C8
0Ω
GND
x
L4
1 pF
LO_SEL
VCC_LO
IFB+
L3
0Ω
SKY73023-11
GND
GND
7
C23
33 pF
24
NC
6
J7
GND
VCC_RFB
5
J8
25
4
C5
33 pF
27
26
2
3
VCC
L11
0Ω
NC
31
RIFA
32
IFA+
33
IFA–
34
VCC_IFA
C3
5.6 nH
1
35
NC
C1
0Ω
GND
L2
1 pF
VCC_RFA
L1
0Ω
x
36
J4
x
x
VCC
VCC
L5
470 nH
VCC
C14
33 pF
C13
1 μF
J6
VCC
L6
470 nH
L8
12 nH
T1
DB714
C16
15 pF
L9
0Ω
R3
0Ω
Note: The Evaluation Board can be converted to
provide a differential output by removing components
T1, T2, R3, and R4.
Figure 37. SKY73023-11 Evaluation Board Schematic
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April 13, 2009 • Skyworks Proprietary and Confidential information • Products and Product Information are Subject to Change Without Notice • 200634G
S947
DATA SHEET • SKY73023-11 DOWNCONVERSION MIXER
Package Dimensions
The PCB layout footprint for the SKY73023-11 is provided in
Figure 38. Figure 39 shows the package dimensions for the
36-pin MCM, and Figure 40 provides the tape and reel
dimensions.
Package and Handling Information
Since the device package is sensitive to moisture absorption, it is
baked and vacuum packed before shipping. Instructions on the
shipping container label regarding exposure to moisture after the
container seal is broken must be followed. Otherwise, problems
related to moisture absorption may occur when the part is
subjected to high temperature during solder assembly.
additional information, refer to the Skyworks Application Note,
PCB Design & SMT Assembly/Rework Guidelines for MCM-L
Packages, document number 101752.
Care must be taken when attaching this product, whether it is
done manually or in a production solder reflow environment.
Production quantities of this product are shipped in a standard
tape and reel format. For packaging details, refer to the Skyworks
Application Note, Tape and Reel, document number 101568.
Electrostatic Discharge (ESD) Sensitivity
The SKY73023-11 is a static-sensitive electronic device. Do not
operate or store near strong electrostatic fields. Take proper ESD
precautions.
THE SKY73023-11 is rated to Moisture Sensitivity Level 3 (MSL3)
at 260 °C. It can be used for lead or lead-free soldering. For
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DATA SHEET • SKY73023-11 DOWNCONVERSION MIXER
6.3
36X 0.5
0.35
Component Outline
0.25
0.05
0.15
0.05
0.75 0.85
36X 0.5
12X 0.075
Stencil and
Metallization
6.3
24X 0.65
Component Outline
Soldermask Opening
SMT Pad Detail
Scale: 2X
9X This Rotation
9X Rotated 180o
9X Rotated 90o CW
9X Rotated 90o CCW
Stencil aperture size for center
ground pads should be 80% to
100% (by area) of the solder
mask opening of the package.
12X 0.075
24X 0.65
Stencil Aperture
Top View
6.4
6.3
0.5
Pitch
Typ
2X 2.795
Pin 1
6.4
3.8
2X 2.795
1.9
6.3
4
1.9
Component Outline
3.8
Component Outline
0.25 Around
Ground Pins
4
Metallization
Top View
Thermal Via Array.
∅0.3 mm on 0.5 mm pitch.
Additional vias in common ground
pad will improve thermal performance
NOTE: thermal vias should be tented
and filled with solder mask, 30-35 μm
Cu plating recommended.
Solder Mask Opening
Top View
Note: The cross-hatched area represents the merger of the center
ground pad +10 individual I/O ground pads. All I/O ground
pads should have at least one via connected to internal ground
planes for optimum electrical performance.
All measurements are in millimeters
S1125
Figure 38. PCB Layout Footprint for the SKY73023-11 6 x 6 MCM
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DATA SHEET • SKY73023-11 DOWNCONVERSION MIXER
18X 2.9
Pin 1 Indicator
C
Pin 36
4X 2
B
6
Pin 1 Indicator
(See Detail D)
Pin 1
4X 1.5
4X 0.5
4X 1
A
4X 2
4X 1
4X 1.5
6
4X 0.5
2X 1.9
18X 2.9
A
1.1 ± 0.1
36x SMT Pad
0.15 A B C
3X R0.2
2X 1.9
0.1
0.15 A B C
Top View
Side View
Bottom View
Solder Mask Opening
0.2 A B C
0.5 ± 0.1
(0.2 x 0.2)
(0.1)
0.25 ± 0.05
0.4 ± 0.05
Detail D
Metal Pad Edge
All measurements are in millimeters
Detail A
Pads are solder mask defined on one edge and metal
defined on three edges.
S689_A
Dimensioning and tolerancing according to ASME Y14.5M-1994
Figure 39. SKY73023-11 36-Pin MCM Package Dimensions
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DATA SHEET • SKY73023-11 DOWNCONVERSION MIXER
2.00 ± 0.05
4.00
8.00
∅1.55 ± 0.05
0.30 ± 0.05
B
5.50 ± 0.05
A
1.75 ± 0.10
6.30
A
5o Max.
12.00 ± 0.30
Pin #1
Indicator
B
∅1.50 Min.
1.70
6.30
B
5o Max.
Notes:
1. Carrier tape: black conductive polystyrene
2. Cover tape material: transparent conductive PSA
3. Cover tape size: 9.3 mm width
4. All dimensions are in millimeters
A
C1222
Figure 40. SKY73023-11 Tape and Reel Dimensions
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DATA SHEET • SKY73023-11 DOWNCONVERSION MIXER
Ordering Information
Model Name
SKY73023-11 Downconversion Mixer
Manufacturing Part Number
SKY73023-11 (Pb-free package)
Evaluation Kit Part Number
TW16-D730
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