SKY73020_11_200362G.pdf

DATA SHEET
 Land mobile radio
 ISM band transceivers
 High performance radio links
 RF identification
VCC_LO
 2G/3G base station transceivers:
 GSM/EDGE, CDMA, UMTS/WCDMA, iDEN
IFA+
IFA–
RIFA
Applications
VCC_IFA
SKY73020-11: 700 to 1000 MHz High-Gain and High-Linearity
Diversity Downconversion Mixer for 2G/3G Base Station
Transceiver Applications
RFA
LO1
Features
LO2
 Small, MCM (36-pin, 6 x 6 mm) package
(MSL3, 260 C per JEDEC J-STD-020)
Skyworks Green™ products are compliant with
all applicable legislation and are halogen-free.
For additional information, refer to Skyworks
Definition of Green™, document number
SQ04-0074.
RFB
LO_SEL
VCC_LO
VCC_IFB
IFB+
IFB–
Y2566
RIFB
 Operating frequency range: 700 to 1000 MHz
 IF frequency range: 50 to 250 MHz
 Conversion gain: 7.0 dB
 Input IP3: +27.0 dBm
 Output IP3: +34.0 dBm
 Noise figure: 10.2 dB
 Integrated LO drivers
 Integrated low-loss RF baluns
 High linearity IF amplifiers
 On-chip SPDT LO switch (greater than 65 dB LO-to-LO isolation)
Figure 1. SKY73020-11 Block Diagram
Description
The SKY73020-11 is a fully integrated diversity mixer that
includes local oscillator (LO) drivers, an LO switch, high-linearity
mixers, and large dynamic range intermediate frequency (IF)
amplifiers. Low-loss RF baluns have also been included to reduce
design complications and lower system cost.
The SKY73020-11 features an input IP3 of +27.0 dBm and a
noise figure (NF) of 10.2 dB, making the device an ideal solution
for high dynamic range systems such as 2G/3G base station
receivers. The LO switch provides more than 65 dB of isolation
between LO inputs and supports the switching time required for
GSM/EDGE base stations.
The SKY73020-11 is manufactured using a robust silicon BiCMOS
process and has been designed for optimum long-term reliability.
The SKY73020-11 diversity downconversion mixer is provided in
a compact, 36-pin 6 x 6 mm Multi-Chip Module (MCM). A
functional block diagram is shown in Figure 1. The pin
configuration and package are shown in Figure 2. Signal pin
assignments and functional pin descriptions are provided in
Table 1.
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IFA–
IFA+
N/C
36
33
35
34
32
31
VCC_IFA
RIFA
N/C
VCC_RFA
N/C
GND
DATA SHEET • SKY73020-11 DOWNCONVERSION MIXER
30
29
28
27
LO2
N/C
GND
VCC_LO
GND
VCC_LO
GND
N/C
RFB
2
26
GND
3
25
4
24
5
23
6
22
GND
GND
LO_SEL
GND
7
21
8
20
9
19
11
12
13
14
15
16
17
VCC_LO
GND
LO1
18
IFB+
IFB–
N/C
VCC_IFB
RIFB
N/C
10
N/C
GND
1
VCC_RFB
RFA
S646b
Figure 2. SKY73020-11 Pinout
Table 1. SKY73020-11 Signal Descriptions
Pin
Name
Description
Pin
Name
Description
1
RFA
Channel A RF input
19
LO1
Local oscillator 1 input
2
NC
No connect
20
GND
Ground
3
GND
Ground
21
VCC_LO
DC supply, +5 V
4
VCC_LO
DC supply, +5 V
22
GND
Ground
5
GND
Ground
23
LO_SEL
Local oscillator select switch control
6
VCC_LO
DC supply, +5 V
24
GND
Ground
7
GND
Ground
25
GND
Ground
8
NC
No connect
26
GND
Ground
9
RFB
Channel B RF input
27
LO2
Local oscillator 2 input
10
VCC_RFB
Channel B RF DC supply, +5 V
28
NC
No connect
11
NC
No connect
29
RIFA
Channel A IF bias adjust
12
GND
Ground
30
VCC_IFA
Channel A IF DC supply, +5 V
13
IFB+
Positive channel B IF output
31
NC
No connect
14
IFB–
Negative channel B IF output
32
IFA+
Positive channel A IF output
15
NC
No connect
33
IFA–
Negative channel A IF output
16
VCC_IFB
Channel B IF DC supply, +5 V
34
GND
Ground
17
RIFB
Channel B IF bias adjust
35
NC
No connect
18
NC
No connect
36
VCC_RFA
Channel A RF DC supply, +5 V
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DATA SHEET • SKY73020-11 DOWNCONVERSION MIXER
Functional Description
The SKY73020-11 is a high-gain diversity mixer, optimized for
base station receiver applications. The device consists of two
diversity channels (A and B), each consisting of a low-loss RF
balun, high-linearity passive mixer, and a low-noise IF amplifier.
A high-isolation SPDT switch allows the SKY73020-11 to be used
for frequency hopping applications. This switch provides greater
than 65 dB of LO1 to LO2 isolation:
LO_SEL Input
LO Path Selected
High
LO1 (pin 19) enabled
Low
LO2 (pin 27) enabled
Two LO amplifiers (independent of channels A and B) are also
included that allow the SKY73020-11 to connect directly to the
output of a voltage controlled oscillator (VCO). This eliminates the
extra gain stages needed by most discrete passive mixers. A
single-pole, double-throw (SPDT) switch has been included to
select between two different LO inputs for frequency hopping
applications (i.e., GSM).
For applications that do not require frequency hopping, LO_SEL is
fixed to one state and the appropriate LO input is used. An internal
pull-down resistor enables the LO2 input.
RF Baluns and Passive Mixer
IF Amplifier
The RF baluns provide a single-ended input, which can easily be
matched to 50  using a simple external matching circuit. The RF
baluns offer very low loss, and excellent amplitude and phase
balance.
The SKY73020-11 includes high dynamic range IF amplifiers that
follow the passive mixers in the signal path. The outputs require a
supply voltage connection using inductive chokes. These choke
inductors should be high-Q and have the ability to handle 200 mA
or greater.
The high-linearity SKY73020-11 is a passive, double-balanced
mixer that provides a very low conversion loss and an excellent
third order input intercept point (IIP3).
Additionally, the balanced nature of the mixer provides for high
port-to-port isolation.
A simple matching network allows the output ports to be matched
to a balanced 200  impedance. The IF amplifiers are optimized
for IF frequencies between 50 and 250 MHz. The IF amplifiers can
be operated outside of this range, but with a slight degradation in
performance.
LO Buffers and SPDT LO Switch
The LO buffers allow the input power of the SKY73020-11 to be in
the range of 3 dBm. The LO section is optimized for low-side LO
injection. However, each of the two LOs can be driven over a wide
frequency range with only slight degradation in performance.
Electrical and Mechanical Specifications
The absolute maximum ratings of the SKY73020-11 are provided
in Table 2 and the recommended operating conditions in Table 3.
Electrical characteristics for the SKY73020-11 are provided in
Table 4.
Typical performance characteristics of the SKY73020-11 are
illustrated in Figures 3 through 40.
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DATA SHEET • SKY73020-11 DOWNCONVERSION MIXER
Table 2. SKY73020-11 Absolute Maximum Ratings (Note 1)
Maximum
Units
Supply voltage (VCC_LO, VCC_RFB, VCC_IFB,
VCC_IFA, and VCC_RFA)
Parameter
VCC
Symbol
Minimum
5.5
V
Supply current
ICC
420
mA
RF input power
PRF
+20
dBm
LO input power
PLO
Operating case temperature
TC
–40
Storage case temperature
TSTG
–40
Junction temperature
TJ
Thermal resistance
ΘJC
+6
dBm
+85
C
+150
C
+125
C
4.5
C/W
Note 1: Exposure to maximum rating conditions for extended periods may reduce device reliability. There is no damage to device with only one parameter set at the limit and all other
parameters set at or below their nominal value.
CAUTION: Although this device is designed to be as robust as possible, electrostatic discharge (ESD) can damage this device. This device
must be protected at all times from ESD. Static charges may easily produce potentials of several kilovolts on the human body
or equipment, which can discharge without detection. Industry-standard ESD precautions should be used at all times.
Table 3. SKY73020-11 Recommended Operating Conditions
Parameter
Symbol
Minimum
Typical
Maximum
Units
4.75
5.00
5.25
V
370
420
mA
0
+3
dBm
0.8
V
V
Supply voltage (VCC_LO, VCC_RFB,
VCC_IFB, VCC_IFA, and VCC_RFA)
VCC
Supply current
ICC
LO input power
PLO
–3
LO_SEL input:
high
low
LO_SELH
LO_SELL
2.2
Operating case temperature
TC
–40
+85
C
RF frequency range
FRF
700
1000
MHz
LO frequency range (Note 1)
FLO
625
950
MHz
IF frequency range
FIF
50
250
MHz
Note 1: The SKY73020-11 has been optimized for low side LO injection. However, the LO can be used outside of the specified frequency range with degraded performance.
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DATA SHEET • SKY73020-11 DOWNCONVERSION MIXER
Table 4. SKY73020-11 Electrical Specifications (Note 1)
(VCC = +5 V, TC = +25 C, LO Input Power = 0 dBm, RF Frequency = 900 MHz, IF Frequency = 70 MHz, LO Frequency = 830 MHz,
Unless Otherwise Noted)
Parameter
Conversion gain
Symbol
Test Condition
G
Noise figure
NF
Noise figure with a blocker signal
NFBLK
Min
Typical
Max
Units
5.0
7.0
8.0
dB
10.2
13.0
dB
23
dB
Blocking signal input
power = +8 dBm
Third order input intercept point
IIP3
Tone spacing = 800 kHz,
Input power = –10 dBm
each tone
Third order output intercept point
OIP3
Tone spacing = 800 kHz,
Input power = –10 dBm
each tone
+32.5
+27.0
dBm
+34.0
dBm
2RF to 2LO
2x2
PRF = –10 dBm
–63
dBc
3RF to 3LO
3x3
PRF = –10 dBm
–70
dBc
Input 1 dB compression point
IP1dB
Output 1 dB compression point
OP1dB
+19.0
+16.5
dBm
+22.5
dBm
LO1-to-LO2 isolation
65
dB
Channel-to-channel isolation
46
dB
RF-to-IF isolation
75
dB
LO leakage:
@ RF port
@ IF port
–45
–80
–30
dBm
dBm
+150
+250
A
1
s
LO_SEL input
–20
LO switching time
RF port input return loss
ZIN_RF
With external matching
components
–14
dB
LO port input return loss
ZIN_LO
With external matching
components
–14
dB
IF port input return loss
ZOUT_IF
With external matching
components
–14
dB
Note 1: Performance is guaranteed only under the conditions listed in this Table.
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DATA SHEET • SKY73020-11 DOWNCONVERSION MIXER
Typical Performance Characteristics
(VCC = +5 V, Tc = +25 C, LO Input Power = 0 dBm, RF Frequency = 900 MHz, IF Frequency = 70 MHz, LO Frequency = 830 MHz,
Unless Otherwise Noted)
10
10
–3 dBm
0 dBm
+3 dBm
9
o
8
Gain (dB)
8
Gain (dB)
0 oC
25 oC
85 C
9
7
7
6
6
5
5
875
880
885
890
895
900
905
910
915
920
875
880
885
890
Frequency (MHz)
Figure 3. Mixer A Gain vs Frequency and LO Power
900
910
905
4.75 V
5.00 V
5.25 V
–3 dBm
0 dBm
+3 dBm
9
Gain (dB)
8
7
6
8
7
6
5
5
875
880
885
890
895
900
905
910
915
920
875
880
885
890
Frequency (MHz)
895
900
905
910
920
Figure 6. Mixer B Gain vs Frequency and LO Power
10
10
0 oC
25 oC
o
9
4.75 V
5.00 V
5.25 V
9
85 C
Gain (dB)
8
7
8
7
6
6
5
875
915
Frequency (MHz)
Figure 5. Mixer A Gain vs Frequency and Supply Voltage
Gain (dB)
920
10
9
880
885
890
895
900
905
910
915
Frequency (MHz)
Figure 7. Mixer B Gain vs Frequency and Temperature
920
5
875
880
885
890
895
900
905
910
915
Frequency (MHz)
Figure 8. Mixer B Gain vs Frequency and Supply Voltage
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915
Figure 4. Mixer A Gain vs Frequency and Temperature
10
Gain (dB)
895
Frequency (MHz)
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920
13
13
12
12
11
11
Noise Figure (dB)
Noise Figure (dB)
DATA SHEET • SKY73020-11 DOWNCONVERSION MIXER
10
9
–3 dBm
0 dBm
+3 dBm
8
10
9
o
0 C
25 oC
85 oC
8
7
7
6
875
880
885
890
895
905
900
910
915
6
920
875
880
885
890
Frequency (MHz)
Figure 9. Mixer A Noise Figure vs Frequency and LO Power
905
910
915
920
13
4.75 V
5.00 V
5.25 V
12
12
11
Noise Figure (dB)
Noise Figure (dB)
900
Figure 10. Mixer A Noise Figure vs Frequency and Temperature
13
10
9
8
7
11
10
9
–3 dBm
0 dBm
+3 dBm
8
7
6
6
875
880
885
890
895
900
905
910
915
920
875
880
885
890
Frequency (MHz)
900
905
910
915
920
Figure 12. Mixer B Noise Figure vs Frequency and LO Power
13
12
12
Noise Figure (dB)
13
11
10
9
o
0 oC
25 C
85 oC
8
11
10
9
4.75 V
5.00 V
5.25 V
8
7
7
6
875
895
Frequency (MHz)
Figure 11. Mixer A Noise Figure vs Frequency and Supply Voltage
Noise Figure (dB)
895
Frequency (MHz)
880
885
890
895
900
905
910
915
920
Frequency (MHz)
Figure 13. Mixer B Noise Figure vs Frequency and Temperature
6
875
880
885
890
895
900
905
910
915
920
Frequency (MHz)
Figure 14. Mixer B Noise Figure vs Frequency and Supply Voltage
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DATA SHEET • SKY73020-11 DOWNCONVERSION MIXER
Output 1 dB Compression Point (dBm)
Output 1 dB Compression Point (dBm)
25
–3 dBm
0 dBm
+3 dBm
24
23
22
21
25
o
0 C
25 oC
85 oC
24
23
22
21
20
20
875
880
885
890
895
905
900
910
915
920
875
880
885
890
Output 1 dB Compression Point (dBm)
Output 1 dB Compression Point (dBm)
25
4.75 V
5.00 V
5.25 V
24
23
22
21
885
890
895
900
905
910
915
915
920
–3 dBm
0 dBm
+3 dBm
24
23
22
21
875
920
880
885
o
0 C
25 oC
85 oC
24
23
22
21
885
890
895
900
895
900
905
910
915
920
Figure 18. Mixer B OP1dB vs Frequency and LO Power
Output 1 dB Compression Point (dBm)
25
880
890
Frequency (MHz)
20
905
910
915
920
Frequency (MHz)
Figure 19. Mixer B OP1dB vs Frequency and Temperature
25
4.75 V
5.00 V
5.25 V
24
23
22
21
20
875
880
885
890
895
900
905
910
915
920
Frequency (MHz)
Figure 20. Mixer B OP1dB vs Frequency and Supply Voltage
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8
910
20
880
Figure 17. Mixer A OP1dB vs Frequency and Supply Voltage
Output 1 dB Compression Point (dBm)
905
25
Frequency (MHz)
875
900
Figure 16. Mixer A OP1dB vs Frequency and Temperature
Figure 15. Mixer A OP1dB vs Frequency and LO Power
20
875
895
Frequency (MHz)
Frequency (MHz)
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DATA SHEET • SKY73020-11 DOWNCONVERSION MIXER
–3 dBm
0 dBm
+3 dBm
36
37
Output 3rd Order Intercept Point (dBm)
Output 3rd Order Intercept Point (dBm)
37
35
34
33
32
31
o
35
34
33
32
31
30
875
880
885
890
895
900
905
910
915
0 oC
25 oC
85 C
36
30
875
920
880
885
890
Output 3rd Order Intercept Point (dBm)
Output 3rd Order Intercept Point (dBm)
37
4.75 V
5.00 V
5.25 V
905
910
915
920
36
35
34
33
32
31
37
–3 dBm
0 dBm
+3 dBm
36
35
34
33
32
31
30
880
885
890
895
900
905
910
915
920
875
880
885
Frequency (MHz)
890
895
900
905
910
915
920
Frequency (MHz)
Figure 23. Mixer A OIP3 vs Frequency and Supply Voltage
Figure 24. Mixer B OIP3 vs Frequency and LO Power
37
0 ooC
25 oC
85 C
36
Output 3rd Order Intercept Point (dBm)
Output 3rd Order Intercept Point (dBm)
900
Figure 22. Mixer A OIP3 vs Frequency and Temperature
Figure 21. Mixer A OIP3 vs Frequency and LO Power
30
875
895
Frequency (MHz)
Frequency (MHz)
35
34
33
32
31
30
875
880
885
890
895
900
905
910
915
Frequency (MHz)
Figure 25. Mixer B OIP3 vs Frequency and Temperature
920
37
4.75 V
5.00 V
5.25 V
36
35
34
33
32
31
30
875
880
885
890
895
900
905
910
915
920
Frequency (MHz)
Figure 26. Mixer B OIP3 vs Frequency and Supply Voltage
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DATA SHEET • SKY73020-11 DOWNCONVERSION MIXER
65
Channel-to-Channel Isolation (dB)
Channel-to-Channel Isolation (dB)
65
4.75 V
5.00 V
5.25 V
60
55
50
880
885
890
895
900
905
910
o
0 oC
25 oC
85 C
60
55
50
880
915
885
890
Frequency (MHz)
Figure 27. Channel A To Channel B Isolation vs Frequency and
Supply Voltage
LO-to-LO Isolation (dB)
LO-to-LO Isolation (dB)
o
75
70
885
890
895
900
905
910
75
70
65
880
915
885
890
–65
–65
2RF x 2LO1 (dBc)
–60
–70
–75
4.75 V
5.00 V
5.25 V
–80
890
895
900
900
905
910
915
Figure 30. LO1-To-LO2 Isolation vs Frequency and Temperature
–60
885
895
Frequency (MHz)
Figure 29. LO1-To-LO2 Isolation vs Frequency and Supply Voltage
2RF x 2LO1 (dBc)
915
0 oC
25 oC
85 C
Frequency (MHz)
905
910
–70
–75
0 oC
25 oC
85 oC
–80
915
Frequency (MHz)
Figure 31. Channel A 2RF – 2LO vs Frequency and Supply Voltage
–85
880
885
890
895
900
905
910
915
Frequency (MHz)
Figure 32. Channel A 2RF – 2LO vs Frequency and Temperature
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10
910
80
4.75 V
5.00 V
5.25 V
–85
880
905
900
Figure 28. Channel A To Channel B Isolation vs Frequency and
Temperature
80
65
880
895
Frequency (MHz)
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–60
–60
4.75 V
5.00 V
5.25 V
–70
–75
–80
–85
880
o
0 C
25 oC
85 oC
–65
2RF x 2LO2 (dBc)
2RF x 2LO2 (dBc)
–65
–70
–75
–80
885
890
895
900
905
910
–85
880
915
885
890
Frequency (MHz)
Figure 33. Channel B 2RF – 2LO vs Frequency and Supply Voltage
LO1-to-IFA Leakage (dBc)
LO1-to-IFA Leakage (dBc)
915
0 oC
25 ooC
85 C
–72
–74
–76
–78
–80
–82
–74
–76
–78
–80
–82
–84
–84
885
890
895
900
905
910
–86
880
915
885
890
Frequency (MHz)
895
900
905
910
915
Frequency (MHz)
Figure 35. Channel A LO1-to-IF Leakage vs Frequency and Supply
Voltage
Figure 36. Channel A LO1-to-IF Leakage vs Frequency and
Temperature
80
80
RF-to-IFA Isolation (dBc)
RF-to-IFA Isolation (dBc)
910
–70
4.75 V
5.00 V
5.25 V
–72
78
76
4.75 V
5.00 V
5.25 V
74
72
880
905
900
Figure 34. Channel B 2RF – 2LO vs Frequency and Temperature
–70
–86
880
895
Frequency (MHz)
78
76
0 oC
o
25 oC
85 C
74
72
885
890
895
900
905
910
915
Frequency (MHz)
Figure 37. Channel A RF-to-IF Isolation vs Frequency and Supply
Voltage
880
885
890
895
900
905
910
915
Frequency (MHz)
Figure 38. Channel A RF-to-IF Isolation vs Frequency and
Temperature
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–40
–40
–42
–42
LO1/LO2-to-RFA Leakage (dBc)
LO1/LO2-to-RFA Leakage (dBc)
DATA SHEET • SKY73020-11 DOWNCONVERSION MIXER
–44
–46
–48
–50
4.75 V
5.00 V
5.25 V
–52
–54
–56
880
885
890
895
900
905
910
915
Frequency (MHz)
Figure 39. Channel A LO1-to-RF Leakage vs Frequency and
Supply Voltage
Evaluation Board Description
The SKY73020-11 Evaluation Board is used to test the
performance of the SKY73020-11 downconversion mixer. An
assembly drawing for the Evaluation board is shown in Figure 41
and the layer detail is provided in Figure 42.
–44
–46
–48
–50
0 ooC
25 oC
85 C
–52
–54
–56
880
885
890
895
900
905
910
915
Frequency (MHz)
Figure 40. Channel A LO1-to-RF Leakage vs Frequency and
Temperature
Therefore, design the connection to the ground pad to dissipate
the maximum heat produced by the circuit board. For more
information on soldering the SKY73020-11, refer to the Package
and Handling Information section of this Data Sheet.
 Skyworks recommends including external bypass capacitors on
the VCC voltage inputs of the device.
The following design considerations are general in nature and
must be followed regardless of final use or configuration:
 Components L5, L6, L14, and L15 (see Figure 3) are high-Q,
low-loss inductors. These inductors must be able to pass
currents in excess of 200 mA DC.
 Paths to ground should be made as short and as low impedance
as possible.
 Components R1 and R2 (see Figure 3) allow for external
adjustment of the IF amplifier bias points. For operation as
specified in Tables 3 and 4, these resistors are not required.
Circuit Design Considerations
 The ground pad of the SKY73020-11 provides critical electrical
and thermal functionality. This pad is the main thermal conduit
for heat dissipation. Since the circuit board acts as the heat
sink, it must shunt as much heat as possible from the device.
A schematic diagram for the SKY73020-11 Evaluation Board is
shown in Figure 43.
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DATA SHEET • SKY73020-11 DOWNCONVERSION MIXER
J5
L12
C28
L13
C29
T2
C32
J4
J8
C33
L14
L15
R2
L1 C2
C3
L2
C25
C27
C26
C1
L11
C23
C24
C4
J1
C20
U1
C5
C21
C17
C8
L4
L10
C7
L3
C22
C18
C19
C14
C6
L5
J7
L6
R1
C11
C12
J3
C15
T1
L8
C16
L9
J6
S811
Figure 41. SKY73020-11 Evaluation Board Assembly Diagram
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DATA SHEET • SKY73020-11 DOWNCONVERSION MIXER
Layer 1: Top -- Metal
Layer 2: Ground
Layer 3: Power Plane
Layer 4: Solid Ground Plane
S903
Figure 42. SKY73020-11 Evaluation Board Layer Detail
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DATA SHEET • SKY73020-11 DOWNCONVERSION MIXER
DB714
L14
470 nH
L13
39 nH
T2
J5
C28
47 pF
L15
470 nH
VCC
C27
33 pF
C28
1 μF
VCC
R2
(Not Req'd)
×
C3
22 nH
×
NC
30
29
28
J8
NC
31
IFA+
32
IFA–
33
LO2
NC
GND
GND
GND
GND
VCC_LO
NC
10
11
12
13
14
15
×
×
VCC_IFB
16
LO1
17
C22
12 pF
23
VCC
22
21
C20
1 μF
20
VCC
J3
19
C17
33 pF
NC
RIFB
RFB
GND
NC
9
GND
IFB–
C7
22 nH
×
LO_SEL
VCC_LO
IFB+
C8
5.6 pF
SKY73020
GND
GND
L4
6.8 pF
8
GND
NC
7
Element Jumper
24
VCC_LO
6
C23
33 pF
25
4
5
27
26
2
3
VCC
J7
RFA
×
34
GND
1
NC
C1
5.6 pF
VCC_RFA
L2
6.8 pF
VCC_RFB
J4
35
RIFA
×
36
VCC_IFA
VCC
18
R1
(Not Req'd)
×
VCC
L5
470 nH
C13
1 μF
VCC
C14
33 pF
J6
VCC
L6
470 nH
T1
L8
39 nH
C16
47 pF
DB714
S685
Figure 43. SKY73020-11 Evaluation Board Schematic
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DATA SHEET • SKY73020-11 DOWNCONVERSION MIXER
Package Dimensions
The PCB layout footprint for the SKY73020-11 is provided in
Figure 44. Figure 45 shows the package dimensions, and
Figure 46 provides the tape and reel dimensions.
Package and Handling Information
Since the device package is sensitive to moisture absorption, it is
baked and vacuum packed before shipping. Instructions on the
shipping container label regarding exposure to moisture after the
container seal is broken must be followed. Otherwise, problems
related to moisture absorption may occur when the part is
subjected to high temperature during solder assembly.
The SKY73020-11 is rated to Moisture Sensitivity Level 3 (MSL3)
at 260 C. It can be used for lead or lead-free soldering. For
additional information, refer to the Skyworks Application Note,
PCB Design & SMT Assembly/Rework Guidelines for MCM-L
Packages, document number 101752.
Care must be taken when attaching this product, whether it is
done manually or in a production solder reflow environment.
Production quantities of this product are shipped in a standard
tape and reel format. For packaging details, refer to the Skyworks
Application Note, Tape and Reel, document number 101568.
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DATA SHEET • SKY73020-11 DOWNCONVERSION MIXER
6.3
36X 0.5
0.35
Component Outline
0.25
0.05
0.15
0.05
0.75 0.85
36X 0.5
12X 0.075
Stencil and
Metallization
6.3
24X 0.65
Component Outline
Soldermask Opening
SMT Pad Detail
Scale: 2X
9X This Rotation
9X Rotated 180o
9X Rotated 90o CW
9X Rotated 90o CCW
Stencil aperture size for center
ground pads should be 80% to
100% (by area) of the solder
mask opening of the package.
12X 0.075
24X 0.65
Stencil Aperture
Top View
6.4
6.3
0.5
Pitch
Typ
2X 2.795
Pin 1
6.4
3.8
2X 2.795
1.9
6.3
4
1.9
Component Outline
3.8
Component Outline
0.25 Around
Ground Pins
4
Metallization
Top View
Thermal Via Array.
∅0.3 mm on 0.5 mm pitch.
Additional vias in common ground
pad will improve thermal performance
NOTE: thermal vias should be tented
and filled with solder mask, 30-35 μm
Cu plating recommended.
Solder Mask Opening
Top View
Note: The cross-hatched area represents the merger of the center
ground pad +10 individual I/O ground pads. All I/O ground
pads should have at least one via connected to internal ground
planes for optimum electrical performance.
All measurements are in millimeters
S1125
Figure 44. PCB Layout Footprint for the SKY73020-11
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DATA SHEET • SKY73020-11 DOWNCONVERSION MIXER
18X 2.9
Pin 1 Indicator
C
Pin 36
4X 2
B
6
Pin 1 Indicator
(See Detail D)
Pin 1
4X 1.5
4X 0.5
4X 1
A
4X 2
4X 1
4X 1.5
6
4X 0.5
2X 1.9
18X 2.9
1.45 ± 0.10
A
36x SMT Pad
0.15 A B C
3X R0.2
2X 1.9
0.1
0.15 A B C
Top View
Side View
Bottom View
Solder Mask Opening
0.2 A B C
0.5 ± 0.1
(0.2 x 0.2)
(0.1)
0.25 ± 0.05
0.4 ± 0.05
Detail D
Metal Pad Edge
All measurements are in millimeters
Detail A
Pads are solder mask defined on one edge and metal
defined on three edges.
S689
Dimensioning and tolerancing according to ASME Y14.5M-1994
Figure 45. SKY73020-11 Package Dimensions
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DATA SHEET • SKY73020-11 DOWNCONVERSION MIXER
B
Pin 1
6.45 ± 0.10 (Bo)
4.00 ± 0.10
1.75 ± 0.10
A
A
12.00 ± 0.30
0.30 ±0.05 (T)
8.00 ± 0.10
± 0.10
5.50 ± 0.05
Ø1.50
7° Max
1.70 ± 0.10 (Ko)
B
Ø1.50
Section B
Min
6.45 ± 0.10 (Ao)
8° Max
Section A
Notes:
1. Carrier tape must meet all requirements of Skyworks GP01-D233
procurement spec for tape and reel shipping.
2. Carrier tape: black conductive polycarbonate or polystyrene.
3. Cover tape material: transparent antistatic polyester film.
4. ESD-surface resistivity shall be ≤ 1 x 106 Ω/square per EIA,
JEDEC TNR Specification.
5. All dimensions are in millimeters.
Y2565
Figure 46. SKY73020-11 Tape and Reel Dimensions
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DATA SHEET • SKY73020-11 DOWNCONVERSION MIXER
Ordering Information
Model Name
SKY73020-11 Downconversion Mixer
Manufacturing Part Number
SKY73020-11
Evaluation Kit Part Number
TW17-D660
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information contained herein. Skyworks may change its documentation, products, services, specifications or product descriptions at any time, without notice. Skyworks makes no commitment to
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