200769E.pdf

DATA SHEET
SKY73062-11: 700 – 1000 MHz High Linearity, Single
Up/Downconversion Mixer
IF+
IF–
Applications
• 2G/3G base station transceivers:
− GSM/EDGE, CDMA, UMTS/WCDMA
• Wi-Fi (802.11)
• WiMAX (802.16)
• 3GPP Long-Term Evolution
• Wireless Local Loop
• High performance radio links
• Land mobile radio
• Private mobile radio
LO1
RF
LO2
LO_SEL
VCC_LO
S1162
Features
• Operating frequency range: 700 to 1000 MHz
• IF frequency range: 50 to 300 MHz
• Insertion loss: 6.3 dB
• Input IP3: +28.7 dBm
• Noise Figure: 7.2 dB
• Integrated LO driver
• Integrated low loss RF balun
• On-chip SPDT LO switch (greater than 40 dB LO-to-LO isolation)
• Small, MCM (20-pin, 5 x 5 mm) package (MSL3, 260 °C per
JEDEC J-STD-020)
Skyworks Green™ products are compliant with
all applicable legislation and are halogen-free.
For additional information, refer to Skyworks
Definition of Green™, document number
SQ04-0074.
Figure 1. SKY73062-11 Block Diagram
Description
The SKY73062-11 is a fully integrated up/downconversion mixer
that includes a Local Oscillator (LO) driver, an LO switch, and a
high linearity mixer. A low loss RF balun has also been included to
reduce design complications and lower system cost.
The SKY73062-11 features an input IP3 of +28.7 dBm and an
insertion loss of 6.3 dB, making the device an ideal solution for
high dynamic range systems such as 2G/3G base station
receivers. The LO switch provides more than 40 dB of isolation
between LO inputs and supports the switching time required for
GSM/EDGE base stations.
The SKY73062-11 is manufactured using a robust silicon BiCMOS
process and has been designed for optimum long-term reliability.
The SKY73062-11 single up/downconversion mixer is provided in
a compact, 20-pin 5 x 5 mm Multi-Chip Module (MCM). A
functional block diagram is shown in Figure 1. The pin
configuration and package are shown in Figure 2. Signal pin
assignments and functional pin descriptions are provided in
Table 1.
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N/C
IF+
IF–
GND
N/C
DATA SHEET • SKY73062-11 UP/DOWNCONVERSION MIXER
20
19
18
17
16
2
14
GND
N/C
3
13
GND
GND
4
12
GND
GND
5
11
LO1
6
7
8
9
10
GND
RF
LO_SEL
LO2
VCC_LOSW
15
N/C
1
VCC_LO
VCC
S1163
Figure 2. SKY73062-11 Pinout – 20-Pin MCM
(Top View)
Table 1. SKY73062-11 Signal Descriptions
Pin #
Name
Description
Pin #
Name
Description
1
VCC
DC supply, +5V
11
LO1
LO1 input
2
RF
RF input
12
GND
Ground
3
N/C
No connection
13
GND
Ground
4
GND
Ground
14
GND
Ground
5
GND
Ground
15
LO2
LO2 input
6
VCC_LO
LO DC supply, +5V
16
N/C
No connection
7
N/C
No connection
17
GND
Ground
8
VCC_LOSW
LO switch DC supply, +5V
18
IF–
Negative IF output
9
LO_SEL
LO select switch control
19
IF+
Positive IF output
10
GND
Ground
20
N/C
No connection
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DATA SHEET • SKY73062-11 UP/DOWNCONVERSION MIXER
Functional Description
LO Buffer and SPDT LO Switch
The SKY73062-11 is a high linearity, single up/downconversion
mixer, optimized for base station receiver applications. The device
consists of a low loss RF balun and high linearity passive mixer.
The LO buffer allows the input power of the SKY73062-11 to be in
the range of ±6 dBm. The LO section is optimized for high-side
LO injection. However, each of the two LOs can be driven over a
wide frequency range with some degradation in performance.
An LO amplifier is also included that allow the SKY73062-11 to
connect directly to the output of a Voltage Controlled Oscillator
(VCO). This eliminates the extra gain stages needed by most
discrete passive mixers. A Single Pole, Double Throw (SPDT)
switch has been included to select between two different LO
inputs (LO1 and LO2) for frequency hopping applications such as
GSM.
A high isolation SPDT switch allows the SKY73062-11 to be used
for frequency hopping applications. This switch provides greater
than 40 dB of LO1 to LO2 isolation:
RF Balun and Passive Mixer
The RF balun provides a single ended input, which can easily be
matched to 50 Ω using a simple external matching circuit. The
balun offers very low loss, and excellent amplitude and phase
balance.
The high linearity SKY73062-11 is a passive, double-balanced
mixer that provides a very low conversion loss, and excellent 3rd
Order Input Insertion Point (IIP3).
Additionally, the balanced nature of the mixer provides for high
port-to-port isolation.
LO_SEL Input
LO Path Selected
High
LO1 (pin 11) enabled
Low
LO2 (pin 15) enabled
For applications that do not require frequency hopping, LO_SEL is
fixed to one state and the appropriate LO input is used. An internal
pull-down resistor enables the LO2 input.
Electrical and Mechanical Specifications
The absolute maximum ratings of the SKY73062-11 are provided
in Table 2 and the recommended operating conditions in Table 3.
Electrical characteristics for the SKY73062-11 are provided in
Table 4.
Table 2. SKY73062-11 Absolute Maximum Ratings
Parameter
Symbol
Minimum
Maximum
Units
4.5
5.5
V
ICC
100
mA
RF input power
PRF
+20
dBm
IF input power
PIF
+20
dBm
LO input power
PLO
+20
dBm
Operating case temperature
TC
+85
°C
Junction temperature
TJ
+150
°C
Storage case temperature
TSTG
+125
°C
Supply voltage, +5 V
VCC
Supply current
–40
–40
Notes: Exposure to maximum rating conditions for extended periods may reduce device reliability. There is no damage to device with only one parameter set at the limit and all other
parameters set at or below their nominal value. Exceeding any of the limits listed here may result in permanent damage to the device.
CAUTION: Although this device is designed to be as robust as possible, Electrostatic Discharge (ESD) can damage this device. This device
must be protected at all times from ESD. Static charges may easily produce potentials of several kilovolts on the human body
or equipment, which can discharge without detection. Industry-standard ESD precautions should be used at all times.
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DATA SHEET • SKY73062-11 UP/DOWNCONVERSION MIXER
Table 3. SKY73062-11 Recommended Operating Conditions
Parameter
Symbol
Minimum
Typical
Maximum
Units
4.75
5.00
5.25
V
+6
dBm
0.8
V
V
Supply voltage, +5 V
VCC
Supply current
ICC
LO input power
PLO
–6
LO select input:
high
low
LO_SELH
LO_SELL
2.2
Operating case temperature
TC
–40
+85
°C
RF frequency range
FRF
700
1000
MHz
LO frequency range (Note 1)
FLO
900
1200
MHz
IF frequency range
FIF
50
300
MHz
70
mA
0
Note 1: The SKY73062-11 has been optimized for high-side LO injection. However, the LO can be used outside of the specified frequency range with degraded performance.
Table 4. SKY73062-11 Electrical Specifications (Note 1) (1 of 2)
(Voltage Supply = +5 V, TC = +25 °C, LO = 0 dBm, RF Frequency = 900 MHz, IF Frequency = 200 MHz, LO Frequency = 1100 MHz, Unless
Otherwise Noted)
Typical
Max
Units
Downconversion insertion loss
Parameter
ILDOWN
RF input to IF output,
FRF = 900 MHz,
PRF = 0 dBm
6.3
7.5
dB
Upconversion insertion loss
ILUP
IF input to RF output,
FIF = 200 MHz,
PIF = 0 dBm
6.2
7.5
dB
Noise Figure
NF
7.2
10.0
dB
Noise Figure with a blocker signal (Note 2)
NFBLK
Blocking signal input
power = +8 dBm
25
dB
Downconversion third order input intercept
point
IIP3DOWN
RF input, FRF = 900 MHz
and 900.8 MHz,
PRF = 0 dBm/each tone
+26.0
+28.7
dBm
Upconversion third order input intercept
point
IIP3UP
IF input, FIF = 200 MHz
and 200.8 MHz,
PIF = 0 dBm/each tone
+23.0
+25.8
dBm
2RF – 2LO
2x2
Downconversion,
PRF = –10 dBm
–60
–50
dBc
3RF – 3LO
3x3
Downconversion,
PRF = –10 dBm
–79.9
–65.0
dBc
Input 1 dB compression point
IP1dB
Downconversion
LO1-to-LO2 isolation
RF to IF isolation
Symbol
Test Condition
Min
+16.0
+18.3
dBm
30
45
dB
30.0
43.5
dB
LO leakage:
@ RF port
@ IF port
LO_SEL input (Note 2)
LO switching time (Note 2)
–20
–30.9
–34.9
–25.0
–30.0
dBm
dBm
+150
+250
μA
0.5
μs
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DATA SHEET • SKY73062-11 DOWNCONVERSION MIXER
Table 4. SKY73062-11 Electrical Specifications (Note 1) (2 of 2)
(Voltage Supply = +5 V, TC = +25 °C, LO = 0 dBm, RF Frequency = 900 MHz, IF Frequency = 200 MHz, LO Frequency = 1100 MHz, Unless
Otherwise Noted)
Parameter
Symbol
Test Condition
Min
Typical
Max
Units
RF port input return loss
ZIN_RF
With external matching
components
14
dB
LO port input return loss
ZIN_LO
With external matching
components
14
dB
IF port input return loss
ZOUT_IF
With external matching
components
14
dB
Note 1: Performance is guaranteed only under the conditions listed in this Table.
Note 2: Specification guaranteed by design. Not tested in production.
Evaluation Board Description
The SKY73062-11 Evaluation Board is used to test the
performance of the SKY73062-11 downconversion mixer. An
assembly drawing for the Evaluation Board is shown in Figure 3
and the layer detail is provided in Figure 4.
2. The ground pad of the SKY73062-11 provides critical
electrical and thermal functionality. The connection to the
ground pad should be designed to provide the best ground for
the mixer. For more information on soldering the SKY7306211, refer to the Package and Handling Information section of
this Data Sheet.
Circuit Design Configurations
3. Skyworks recommends including external bypass capacitors
on the VCC voltage inputs of the device.
The following design considerations are general in nature and
must be followed regardless of final use or configuration:
A schematic diagram for the SKY73062-11 Evaluation Board is
shown in Figure 5.
1. Paths to ground should be made as short and as low
impedance as possible.
J9
J5
C16 C15
R5
C13
R6
L2
T2
C17
C3
C2
J8
R7
R8
C19
R1
R4
C18
L5
L4
J4
C14
L3
C12
C11
C20
R3
C1
U1
L1
C10
C7
C5
C8
R2
C9
C4
J3
J1
C6
J2
S1072
Figure 3. SKY73062-11 Evaluation Board Assembly Diagram
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DATA SHEET • SKY73062-11 UP/DOWNCONVERSION MIXER
Layer 1: Top – Metal
Layer 2: Ground
Layer 3: Power Plane
Layer 4: Solid Ground Plane
S1073
Figure 4. SKY73062-11 Evaluation Board Layer Detail
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DATA SHEET • SKY73062-11 UP/DOWNCONVERSION MIXER
3
R6
0Ω
4
L2
8.2 nH
2
T2
1
6
N/C
IF+
15
VCC
LO2
RF
GND
2
J4
C2
15 nH
C3
R1
0 Ω 2.7 pF
L1
3.3 pF
C1
0Ω
×
14
3
13
N/C
GND
GND
GND
4
R2
0Ω
J3
C10
33 pF
12
8
LO1
9
GND
LO_SEL
N/C
VCC_LO
GND
7
11
VCC_LOSW
5
6
J8
16
GND
17
IF–
18
1
VCC
R3
0Ω
×
19
N/C
C20
1 μF
J5
C14
22 pF
×
20
R4
0Ω
C7
33 pF
10
×
VCC
J2
Element Jumper
C5
33 pF
VCC
VCC
C6
12 pF
Notes: Values for all components are subject to change
for matching purposes.
S1164
Figure 5. SKY73062-11 Evaluation Board Schematic
Package Dimensions
The PCB layout footprint for the SKY73062-11 is provided in
Figure 6. Package dimensions for the 20-pin MCM are shown in
Figure 7, and Figure 8 provides the tape and reel dimensions.
Package and Handling Information
Since the device package is sensitive to moisture absorption, it is
baked and vacuum packed before shipping. Instructions on the
shipping container label regarding exposure to moisture after the
container seal is broken must be followed. Otherwise, problems
related to moisture absorption may occur when the part is
subjected to high temperature during solder assembly.
THE SKY73062-11 is rated to Moisture Sensitivity Level 3 (MSL3)
at 260 °C. It can be used for lead or lead-free soldering. For
additional information, refer to the Skyworks Application Note,
PCB Design & SMT Assembly/Rework Guidelines for MCM-L
Packages, document number 101752.
Care must be taken when attaching this product, whether it is
done manually or in a production solder reflow environment.
Production quantities of this product are shipped in a standard
tape and reel format.
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DATA SHEET • SKY73062-11 UP/DOWNCONVERSION MIXER
0.4
5.3
0.15
Component Outline
0.3
0.05
0.05
0.71 0.81
5.3
2.5
Stencil and
Metallization
Component Outline
Soldermask Opening
1.25
Stencil aperture size for center
ground pads should be 60% to
80% (by area) of the solder
mask opening of the package.
1.25
SMT Pad Detail
Scale: 2X
5X This Rotation
5X Rotated 180o
5X Rotated 90o CW
5X Rotated 90o CCW
2.5
Stencil Aperture
Top View
5.3
5.4
2X 2.3
Pin 1
2X 2.3
3
5.4
5.3
1.5
0.65 Pitch
Typ
Thermal Via Array.
∅0.3 mm on 0.5 mm pitch.
Additional vias in common ground
pad will improve thermal performance
NOTE: thermal vias should be tented
and filled with solder mask, 30-35 μm
Cu plating recommended.
1.5
Component Outline
3
0.25 Typ
Metallization
Top View
Solder Mask Opening
Top View
All measurements are in millimeters
Note: The cross-hatched area represents the merger of the center
ground pad +7 individual I/O ground pads. All I/O ground
pads should have at least one via connected to internal ground
planes for optimum electrical performance.
Figure 6. SKY73062-11 PCB Layout Footprint
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S1946
DATA SHEET • SKY73062-11 UP/DOWNCONVERSION MIXER
5
4X 1.3
Pin 1
Indicator
B
C
4X 0.65
0
5X 4.8
Pin 20
Pin 1 indicator
(See Detail B)
Pin 1
4X 1.3
4X 0.65
0
5X 4.8
5
A
20X SMT Pad
0.15 A B C
Solder Mask Opening
A
0.2 A B C
1.05 ± 0.1
0.15 A B C
0.1
Side View
Top View
Bottom View
Solder Mask Edges
0.2 x 0.2
Metal Pad Edge
3
0.45 ± 0.05
0.3 ± 0.03
(0.1)
0.45 ± 0.1
Detail A
3X R0.2
3
Detail B
All measurements are in millimeters.
Dimensioning and tolerancing according to ASME Y14.5M-1994.
S944
Figure 7. SKY73062-11 20-Pin MCM Package Dimensions
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DATA SHEET • SKY73062-11 UP/DOWNCONVERSION MIXER
8.00 (P1)
4.00 (P0)
2.00 ± 0.05
∅1.55 ± 0.05
0.30 ± 0.05
B
1.75 ± 0.10
5.35 (Bo)
A
5o Max.
B
∅1.50 Min.
1.30 (Ko)
5.35 (Ao)
B
5o Max.
Notes:
1. Carrier tape: black conductive polystyrene
2. Cover tape material: transparent conductive PSA
3. Cover tape size: 9.3 mm width 10
4. ESD surface resistivity is ≤1 x 10 Ohms/Square
according to EIA, JEDIC TNR specification.
5. P0/P1 10 pitches cumulative tolerance on tape: ±0.20 mm
6. A and B measurement points are 0.30 mm from bottom pocket.
7. All dimensions are in millimeters
A
Figure 8. SKY73062-11 Tape and Reel Dimensions
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10
12.00 ± 0.30
A
5.50 ± 0.05
Pin #1
Indicator
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S461b
DATA SHEET • SKY73062-11 UP/DOWNCONVERSION MIXER
Ordering Information
Model Name
SKY73062-11 700-1000 MHz Up/Downconversion Mixer
Manufacturing Part Number
SKY73062-11
Evaluation Board Part Number
TW18-D470
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