DATA SHEET SKY65174-21: 2.4 to 2.5 GHz WLAN Power Amplifier Module Applications Description IEEE 802.11 b/g/n WLAN systems The SKY65174-21 is a highly integrated power amplifier module (PAM) intended for high performance wireless local area network (WLAN) requiring up to +27 dBm linear output power. ISM band transmitters Wireless access points, routers, gateways The SKY65174-21 is fabricated using Skyworks high reliability Heterojunction Bipolar Transistor (HBT) InGaP process, which allows for single supply operation while maintaining high efficiency and good linearity. Features PA linear output power: +27 dBm @ <2.5% EVM The PAM is packaged in a 10-pin, 4 x 4 mm Multi-Chip Module (MCM) together with power detector, biasing, and input/output matching components. This architecture makes the SKY65174-21 a highly integrated solution requiring a minimum number of external components. High gain: 35 dB Input/Output internally matched to 50 Ω Internal, active bias circuits MCM (10-pin, 4 x 4 mm) package (MSL3, 260 C per JEDEC J-STD-020) Skyworks GreenTM products are compliant with all applicable legislation and are halogen-free. For additional information, refer to Skyworks Definition of GreenTM, document number SQ04–0074. VREF1 A functional block diagram of the SKY65174-21 is shown in Figure 1. The 10-pin MCM package and pinout are provided in Figure 2. Signal pin assignments and functional pin descriptions are provided in Table 1. VREF2 RF_IN InterStage Match Input Match VDET Detector Active Bias InterStage Match VCC Output Match RF_OUT Y2610 Figure 1. SKY65174-21 PAM Block Diagram Skyworks Solutions, Inc. • Phone [781] 376-3000 • Fax [781] 376-3100 • [email protected] • www.skyworksinc.com 201428F • Skyworks Proprietary Information • Products and Product Information are Subject to Change Without Notice • November 19, 2015 1 DATA SHEET • SKY65174-21: WLAN PAM RF_IN 1 10 VREF2 GND 2 9 VREF1 VCC 3 8 GND GND 4 7 GND VDET 5 6 RF_OUT S2019 Figure 2. SKY65174-21 Pinout (Top View) Table 1. SKY65174-21 Signal Descriptions Pin I/O Signal Type 1 RF_IN Name RF transmitter input Description I RF 2 GND Ground – – 3 VCC Supply voltage I Supply 5 V 4 GND Ground – – 5 VDET Power detector output O Analog 6 RF_OUT RF transmitter output O RF 7 GND Ground – – 8 GND Ground – – 9 VREF1 Reference voltage 1 I 2.85 V 10 VREF2 Reference voltage 2 I 2.85 V Technical Description Electrical and Mechanical Specifications The SKY65174-21 meets the stringent WLAN spectral masks for Orthogonal Frequency Division Multiplexing (OFDM) composite signals. The high linearity of the PA enables an Error Vector Magnitude (EVM) of less than 3% at output power levels of +27 dBm. The absolute maximum ratings of the SKY65174-21 are provided in Table 2. The recommended operating conditions are specified in Table 3 and electrical specifications are provided in Tables 4 (VCC = 5 V) and 5 (VCC = 3.3 V). The power detector achieves a dynamic range greater than 25 dB. The PAM is stable up to an 6:1 voltage standing-wave ratio (VSWR). Typical performance characteristics of the SKY65174-21 are illustrated in Figures 3 to 8. The SKY65174-21 PAM supports a battery voltage range of 3.3 V up to 5.5 V. Skyworks Solutions, Inc. • Phone [781] 376-3000 • Fax [781] 376-3100 • [email protected] • www.skyworksinc.com 2 November 19, 2015 • Skyworks Proprietary Information • Products and Product Information are Subject to Change Without Notice • 201428F DATA SHEET • SKY65174-21 WLAN PAM Table 2. SKY65174-21 Absolute Maximum Ratings (Note 1) Parameter Symbol Minimum Maximum Units RF output power (CW) POUT +30 dBm Supply voltage VCC 5.5 V Reference voltages (Note 2) VREF1, VREF2 3.1 V Total supply current ICC 1000 mA Power dissipation PD 2.9 W Thermal resistance ΘJC 28 C/W Storage temperature TSTG –55 +125 C Operating temperature TA –40 +85 C Junction temperature TJ +150 C Note 1: Exposure to maximum rating conditions for extended periods may reduce device reliability. There is no damage to device with only one parameter set at the limit and all other parameters set at or below their nominal value. Exceeding any of the limits listed here may result in permanent damage to the device. Note 2: Measured at the package pins. CAUTION: Although this device is designed to be as robust as possible, electrostatic discharge (ESD) can damage this device. This device must be protected at all times from ESD. Static charges may easily produce potentials of several kilovolts on the human body or equipment, which can discharge without detection. Industry-standard ESD precautions should be used at all times. Table 3. SKY65174-21 Recommended Operating Conditions Parameter Symbol Minimum Typical Units 2483 MHz Operating frequency f Supply voltage (high voltage mode) VCC 4.5 5.0 5.5 V Supply voltage (low voltage mode) VCC 3.0 3.3 3.6 V RF output power POUT Reference voltages (Note 1) VREF1, VREF2 2.75 2.85 2.95 V Reference current 1 IREF1 11 12 mA 1 2 Reference current 2 IREF2 Total supply current (CW signal) ICC Operating temperature TA 2412 Maximum +27 dBm 600 –35 +25 mA mA +85 C Note 1: Measured at the package pins. Skyworks Solutions, Inc. • Phone [781] 376-3000 • Fax [781] 376-3100 • [email protected] • www.skyworksinc.com 201428F • Skyworks Proprietary Information • Products and Product Information are Subject to Change Without Notice • November 19, 2015 3 DATA SHEET • SKY65174-21: WLAN PAM Table 4. SKY65174-21 Electrical Specifications (Note 1) (VCC = +5 V, VREF1 = VREF2 = 3.1 V, TA = +25 C, f = 2.442 GHz, CW, Unless Otherwise Noted) Parameter Symbol Test Condition Min Typical Max Units Continuous Wave (CW) Input Quiescent current ICQ Operational current ICC 1 dB output compression point OP1dB Noise figure NF Small signal gain |S21| Gain variation ΔS21 Input return loss POUT = +27 dBm 275 300 mA 700 800 mA +31.0 +34.5 34.0 34.5 dBm 7 PIN = –25 dBm, f = 2.4 to 2.5 GHz |S11| dB 35.0 dB 1 dB 15 dB Detector voltage VDET 802.11g, POUT = +27 dBm 0.80 V 2nd harmonic distortion 2fo POUT = +27 dBm –50 dBc 3rd harmonic distortion 3fo POUT = +27 dBm –60 dBc PA enable time 0.75 VREF1 toggled, VREF2 = 2.85 V 200 EVM = 2.5% EVM = 3.0% – +27 +27 – dBm dBm Typical Max Units ns IEEE 802.11g OFDM Input Signal, 64 QAM, 54 Mbps Output power POUT Note 1: Performance is guaranteed only under the conditions listed in this table. Table 5. SKY65174-21 Electrical Specifications (Note 1) (VCC = +3.3 V, VREF1 = VREF2 = 2.85 V, TA = +25 C, f = 2.442 GHz, CW, Unless Otherwise Noted) Parameter Symbol Test Condition Min Continuous Wave (CW) Input Quiescent current ICQ Operational current ICC POUT = +24 dBm 230 mA 520 mA 1 dB output compression point OP1dB +31 dBm Small signal gain |S21| 33 dB +24 dBm IEEE 802.11g OFDM Input Signal, 64 QAM, 54 Mbps Output power POUT EVM = 2.5% Note 1: Performance is guaranteed only under the conditions listed in this table. Skyworks Solutions, Inc. • Phone [781] 376-3000 • Fax [781] 376-3100 • [email protected] • www.skyworksinc.com 4 November 19, 2015 • Skyworks Proprietary Information • Products and Product Information are Subject to Change Without Notice • 201428F DATA SHEET • SKY65174-21 WLAN PAM Typical Performance Characteristics (VCC = +5 V, VREF1 = VREF2 = 3.1 V, TA = +25 C, f = 2.442 GHz, Unless Otherwise Noted) 5.0 1800 2.412 GHz 2.442 GHz 2.462 GHz 4.5 4.0 1600 1400 Current (mA) EVM (%) 3.5 3.0 2.5 2.0 1.5 1200 1000 800 600 1.0 400 0.5 200 +1 0 +3 +5 +7 +9 +11 +13 +15 +17 +19 +21 +23 +25 +27 +29 +31 +5 Output Power (dBm) +9 +13 +17 +21 +25 +29 +33 +37 Output Power (dBm) Figure 3. EVM vs Output Power Over Frequency (64 QAM, 54 Mbps, OFDM) Figure 4. Current vs Output Power (CW) 1800 1600 +10 0 1000 800 –20 –30 –40 –50 600 –60 400 200 +1 802.11b –10 1200 Power (dBr) Current (mA) 1400 POUT = +30 dBm –70 +5 +9 +13 +17 +21 +25 +29 –80 –0.06 +33 –0.04 Output Power (dBm) +0.02 +0.04 +0.06 Figure 6. Spectral Mask (11 Mbps) +10 +10 0 0 –10 –10 –20 Power (dBr) Power (dBr) 0 Frequency Offset (GHz) Figure 5. Current vs Output Power (CW, VCC = 3.3 V) 802.11b –30 –40 –50 802.11b –20 –30 –40 –50 –60 –60 POUT = +29 dBm –70 –80 –0.06 –0.02 –0.04 –0.02 0 POUT = +30 dBm –70 +0.02 Frequency Offset (GHz) Figure 7. Spectral Mask (11 Mbps, VCC = 3.3 V) +0.04 +0.06 –80 –0.06 –0.04 –0.02 0 +0.02 +0.04 +0.06 Frequency Offset (GHz) Figure 8. Spectral Mask (1 Mbps) Skyworks Solutions, Inc. • Phone [781] 376-3000 • Fax [781] 376-3100 • [email protected] • www.skyworksinc.com 201428F • Skyworks Proprietary Information • Products and Product Information are Subject to Change Without Notice • November 19, 2015 5 DATA SHEET • SKY65174-21: WLAN PAM +10 Power (dBr) Dectector Voltage (V) 0 802.11b –10 –20 –30 –40 –50 –60 POUT = +30 dBm –70 –80 –0.06 –0.04 –0.02 0 +0.02 +0.04 +0.06 1.4 1.3 1.2 1.1 1.0 0.9 0.8 0.7 0.6 0.5 0.4 0.3 0.2 +1 +5 +9 +13 +25 +29 +5 +9 +13 +17 +21 +25 +29 +33 Output Power (dBm) Figure 11. Detector Voltage vs Output Power (CW, VCC = 3.3 V) +37 +37 +30 +20 +10 0 –10 –20 –30 –40 –50 –60 0 1 2 3 4 5 6 7 8 Frequency (GHz) Figure 12. Small Signal Gain vs Frequency Skyworks Solutions, Inc. • Phone [781] 376-3000 • Fax [781] 376-3100 • [email protected] • www.skyworksinc.com 6 +33 +50 +40 Small Signal Gain (dB) Dectector Voltage (V) +21 Figure 10. Detector Voltage vs Output Power (CW) Figure 9. Spectral Mask (1 Mbps, VCC = 3.3 V) 1.4 1.3 1.2 1.1 1.0 0.9 0.8 0.7 0.6 0.5 0.4 0.3 0.2 +1 +17 Output Power (dBm) Frequency Offset (GHz) November 19, 2015 • Skyworks Proprietary Information • Products and Product Information are Subject to Change Without Notice • 201428F 9 10 DATA SHEET • SKY65174-21 WLAN PAM Evaluation Board Description The SKY65174-21 Evaluation Board is used to test the performance of the SKY65174-21 PAM. Application schematic diagrams are provided in Figures 13 (for applicatios using phase and amplitude tracking) and 14 (for applications that do not use amplitude tracking). An assembly drawing for the Evaluation Board is shown in Figure 15. Circuit Design Configurations The following design considerations are general in nature and must be followed regardless of final use or configuration: 1. Paths to ground should be made as short as possible. 2. The ground pad of the SKY65174-21 has special electrical and thermal grounding requirements. This pad is the main thermal conduit for heat dissipation. Since the circuit board acts as the heat sink, it must shunt as much heat as possible from the device. Therefore, design the connection to the ground pad to dissipate the maximum wattage produced by the circuit board. Multiple vias to the grounding layer are required. For more details, refer to the Skyworks Application Note, PCB Design Guidelines for HIgh Power Dissipation Packages, document number 201211. 3. Bypass capacitors should be used on the DC supply line (VCC). Refer to the schematic drawings in Figures 13 and 14 for further details. 4. The RF lines should be well separated from each other with solid ground in between traces to maximize input-to-output isolation. NOTE: A poor connection between the slug and ground increases junction temperature (TJ), which reduces the lifetime of the device. Application Circuit Notes Center Ground. It is extremely important to sufficiently ground the bottom ground pad of the device for both thermal and stability reasons. Multiple small vias are acceptable and work well under the device if solder migration is an issue. RF_IN (pin 1). The module includes an on board internal DC blocking capacitor for this pin signal (ZO = 50 Ω). All impedance matching is provided internal to the module. VCC (pin 3). The supply voltage for all three stages is typically set to +5 V. Component C2 is a bypass capacitor, and C16 is a decoupling capacitor and energy storage component. VDET (pin 5). The interstage detector output voltage signal is connected to component C9, which has a filtering function. This value can be adjusted or completely removed to speed up the detector response. Component R1 provides a load to the detector and acts as a biasing resistor. RF_OUT (pin 6). The module includes an on board internal DC blocking capacitor for this pin signal (ZO = 50 Ω). All impedance matching is provided internal to the module. VREF1 (pin 9) and VREF2 (pin 10). Bias reference voltage for the PA. These signals can be operated from 2.75 V to 3.00 V (measured at the device pins). Additional filters may be implemented on VREF1 to enhance dynamic linearity performance. The filter is composed of a series 40 Ω resistor in parallel with a series 90 Ω resistor and 0.1μF capacitor. VREF1 and VREF2 may be used as PA enable pins and can be pulled down to 0 V to disable the PA. Package Dimensions The PCB layout footprint for the SKY65174-21 is provided in Figure 16. Typical part markings are shown in Figure 17. Figure 18 shows the package dimensions for the 10-pin MCM, and Figure 19 provides the tape and reel dimensions. Package and Handling Information Since the device package is sensitive to moisture absorption, it is baked and vacuum packed before shipping. Instructions on the shipping container label regarding exposure to moisture after the container seal is broken must be followed. Otherwise, problems related to moisture absorption may occur when the part is subjected to high temperature during solder assembly. The SKY65174-21 is rated to Moisture Sensitivity Level 3 (MSL3) at 260 C. It can be used for lead or lead-free soldering. For additional information, refer to the Skyworks Application Note, PCB Design and SMT Assembly/Rework Guidelines for MCM-L Packages, document number 101752. Care must be taken when attaching this product, whether it is done manually or in a production solder reflow environment. Production quantities of this product are shipped in a standard tape and reel format. GND (pins 2, 4, 7, and 8). Attach all ground pins to the RF ground plane with the largest diameter and lowest inductance via that the layout allows. Multiple small vias are acceptable and work well under the device if solder migration is an issue. Skyworks Solutions, Inc. • Phone [781] 376-3000 • Fax [781] 376-3100 • [email protected] • www.skyworksinc.com 201428F • Skyworks Proprietary Information • Products and Product Information are Subject to Change Without Notice • November 19, 2015 7 DATA SHEET • SKY65174-21: WLAN PAM C13 22 pF 1 RF Input 2 3 Supply Voltage C16 47 pF C2 2.2 μF 4 5 Power Detector C17 DNI R1 2.4 kΩ RF_IN VREF2 GND VREF1 VCC GND GND GND VDET RF_OUT 10 Reference Voltage 2 (2.85 V) Reference Voltage 1 (2.85 V) 9 C1 220 pF 8 C19 2200 pF 7 6 RF Output C9 100 pF S2256 Figure 13. SKY65174-21 Application Schematic for Both 3.3 V and 5 V Operation C13 22 pF Reference (3.1 V) 1 RF Input 2 3 Supply Voltage C2 2.2 μF C16 47 pF 4 5 Power Detector C17 DNI R1 2.4 kΩ RF_IN VREF2 GND VREF1 VCC GND GND GND VDET RF_OUT 10 R3 39 Ω 9 8 R2 91 Ω C1 0.1 μF C20 DNI 7 6 C19 100 pF RF Output S2843 Figure 14. SKY65174-21 Application Schematic for Applications That Do Not Implement Amplitude Tracking Skyworks Solutions, Inc. • Phone [781] 376-3000 • Fax [781] 376-3100 • [email protected] • www.skyworksinc.com 8 November 19, 2015 • Skyworks Proprietary Information • Products and Product Information are Subject to Change Without Notice • 201428F DATA SHEET • SKY65174-21 WLAN PAM RF_IN VCC VREF2 GND N/C GND GND GND GND N/C GND VDET VREF1 RF_OUT S2257 Figure 15. SKY65174-21 Evaluation Board Assembly Drawing Skyworks Solutions, Inc. • Phone [781] 376-3000 • Fax [781] 376-3100 • [email protected] • www.skyworksinc.com 201428F • Skyworks Proprietary Information • Products and Product Information are Subject to Change Without Notice • November 19, 2015 9 DATA SHEET • SKY65174-21: WLAN PAM Stencil aperture size for center ground pad should be 80% to 100% (by area) of solder mask opening. Component Outline 0.125 Pin 1 Indicator (0.20 x 45°) Pin 1 10X 0.7 Pin 10 4X 0.875 0.5 Pitch 0.125 Typ 10X 0.3 4X 0.763 8X 0.875 4.3 Thermal Via Array, ∅0.3 mm on 0.6 mm pitch will improve thermal performance. NOTE: thermal vias should be tented and filled with solder mask, 30-35 mm Cu plating recommended. Pin 10 Pin 1 Stencil Aperture Top View 2X 0.938 Pin 1 Indicator (0.20 x 45°) Pin 1 10X 0.8 0.5 Pitch Pin 10 4X 0.875 0.5 Pitch 6X 0.3 6X 0.7 2X 1.825 10X 0.4 Component Outline 4.4 0.25 Typ 4.3 Metallization Top View Opening size of 60 to 100% of exposed center opening shown Solder Mask Opening Top View S2038 All dimensions are in millimeters Figure 16. PCB Layout Footprint for the SKY65174-21 4 x 4 mm MCM Skyworks Solutions, Inc. • Phone [781] 376-3000 • Fax [781] 376-3100 • [email protected] • www.skyworksinc.com 10 Component Outline November 19, 2015 • Skyworks Proprietary Information • Products and Product Information are Subject to Change Without Notice • 201428F DATA SHEET • SKY65174-21 WLAN PAM Pin 1 Identifier Skyworks Part Number Lot Number YY = Manufacture Year WW = Week Packaged Sealed MX = Country Code 65174-21 EXXXXX.XX YYWW MX Y2611 Figure 17. Typical Part Markings (Top View) 4 Solder Mask Opening See Detail C 0.2 A B C B Pin 1 Indicator Pin 1 Indicator See Detail B 0 C 10x SMT Pad 0.1 M A B C Pin 1 Pin 10 8X 0.5 0 4 4X 1 A 0.85 ± 0.1 4X 1.4438 0.1 0.15 A B C Side View Top View See Detail D 8X 0.5 10X 1.9 A Bottom View 0.875 0.45 ± 0.1 2X R(0.05) 0.875 0.2 X 45° 0.875 Solder Mask Edges 0.4 ± 0.05 0.3 ± 0.05 0.7625 0.7625 Solder Mask Edges 0.875 (0.1) Solder Mask Edges Detail A Detail B Pad Scale: 2X Scale: 2X 5X This rotation 5X Rotated 180° 1X This rotation Detail C Detail D Scale: 2X Scale: 2X 3X This rotation 4X This rotation All measurements are in millimeters S2039 Dimensioning and tolerancing according to ASME Y14.5M-1994 Figure 18. SKY65174-21 Package Dimensions Skyworks Solutions, Inc. • Phone [781] 376-3000 • Fax [781] 376-3100 • [email protected] • www.skyworksinc.com 201428F • Skyworks Proprietary Information • Products and Product Information are Subject to Change Without Notice • November 19, 2015 11 DATA SHEET • SKY65174-21: WLAN PAM 8.00 ± 0.10 ∅1.50 2.00 ± 0.05 ± 0.10 1.75 ± 0.10 A A 4.25 ± 0.10 10o Max B ∅1.50 12.00 +0.30/–0.10 B 5.50 ± 0.05 1.13 ± 0.10 4.00 ± 0.10 Reference Pin Indicator ± 0.25 0.229 ± 0.02 B 10o Max Notes: 1. Carrier tape material: black conductive polycarbonate or polysterene 2. Cover tape material: transparent conductive PSA 3. Cover tape size: 9.3 mm width 4. All measurements are in millimeters 4.25 ± 0.10 A Figure 19. SKY65174-21 Tape and Reel Dimensions Skyworks Solutions, Inc. • Phone [781] 376-3000 • Fax [781] 376-3100 • [email protected] • www.skyworksinc.com 12 November 19, 2015 • Skyworks Proprietary Information • Products and Product Information are Subject to Change Without Notice • 201428F S1056 DATA SHEET • SKY65174-21 WLAN PAM Ordering Information Model Name SKY65174-21 WLAN PAM Manufacturing Part Number SKY65174-21 Evaluation Board Part Number EN31-D662 Copyright © 2010-2012, 2015 Skyworks Solutions, Inc. All Rights Reserved. Information in this document is provided in connection with Skyworks Solutions, Inc. (“Skyworks”) products or services. These materials, including the information contained herein, are provided by Skyworks as a service to its customers and may be used for informational purposes only by the customer. Skyworks assumes no responsibility for errors or omissions in these materials or the information contained herein. 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Skyworks assumes no liability for applications assistance, customer product design, or damage to any equipment resulting from the use of Skyworks products outside of stated published specifications or parameters. Skyworks and the Skyworks symbol are trademarks or registered trademarks of Skyworks Solutions, Inc., in the United States and other countries. Third-party brands and names are for identification purposes only, and are the property of their respective owners. Additional information, including relevant terms and conditions, posted at www.skyworksinc.com, are incorporated by reference. Skyworks Solutions, Inc. • Phone [781] 376-3000 • Fax [781] 376-3100 • [email protected] • www.skyworksinc.com 201428F • Skyworks Proprietary Information • Products and Product Information are Subject to Change Without Notice • November 19, 2015 13