Reliability Report

AOS Semiconductor
Product Reliability Report
AO8801A,
rev A
Plastic Encapsulated Device
ALPHA & OMEGA Semiconductor, Inc
www.aosmd.com
This AOS product reliability report summarizes the qualification result for AO8801A.
Accelerated environmental tests are performed on a specific sample size, and then followed
by electrical test at end point. Review of final electrical test result confirms that AO8801A
passes AOS quality and reliability requirements. The released product will be categorized by
the process family and be monitored on a quarterly basis for continuously improving the
product quality.
Table of Contents:
I.
II.
III.
IV.
Product Description
Package and Die information
Environmental Stress Test Summary and Result
Reliability Evaluation
I. Product Description:
The AO8801A uses advanced trench technology to provide excellent RDS(ON), low gate charge
and operation with gate voltages as low as 1.8V. This device is suitable for use as a load
switch or in PWM applications.
-RoHS Compliant
-Halogen Free
Detailed information refers to datasheet.
II. Die / Package Information:
AO8801A
Standard sub-micron
Low voltage P channel, dual die
Package Type
TSSOP8
Lead Frame
Cu
Die Attach
Ag epoxy
Bonding
Au wire
Mold Material
Epoxy resin with silica filler
MSL (moisture sensitive level) Level 1 based on J-STD-020
Process
Note * based on information provided by assembler and mold compound supplier
III. Result of Reliability Stress for AO8801A
Test Item
Test Condition
Time
Point
Lot
Attribution
Total
Sample
size
MSL
Precondition
168hr 85°c
/85%RH +3 cycle
[email protected]°c
HTGB
Temp = 150 °c,
Vgs=100% of
Vgsmax
Number
of
Failures
Standard
-
4 lots
550pcs
0
JESD22A113
168hrs
500 hrs
1000 hrs
1 lot
308pcs
0
JESD22A108
0
JESD22A108
0
JESD22A110
0
JESD22A102
0
JESD22A104
3 lots
77pcs / lot
Temp = 150 °c,
Vds=80% of
Vdsmax
HTRB
168hrs
500 hrs
1000 hrs
1 lot
308pcs
3 lots
77pcs / lot
HAST
Pressure Pot
130 +/- 2°°c,
85%RH, 33.3 psi,
Vgs = 100% of Vgs
max
100 hrs
121°°c, 29.7psi,
RH=100%
96 hrs
3 lots
(Note A)
4 lots
(Note A)
Temperature
Cycle
-65°°c to 150°°c,
air to air
250 / 500
cycles
3 lots
(Note A)
165pcs
55pcs / lot
220pcs
55pcs / lot
165pcs
55pcs / lot
Note A: The reliability data presents the available generic data up to the published date.
IV. Reliability Evaluation
FIT rate (per billion): 7
MTTF=15704 years
The presentation of FIT rate for the individual product reliability is restricted by the actual
burn-in (HTGB & HTRB) sample size of the selected product (AO8801A).
Failure Rate Determination is based on JEDEC Standard JESD 85. FIT means one failure per
billion hours.
2
9
9
FIT= Chi x 10 / [2 (N) (H) (Af)] = 1.83 x 10 / [2x (2x77x168+3x2x77x1000) x258] = 7
9
8
MTTF = 10 / FIT =1.38 x 10 hrs = 15704 years
Chi² = Chi Squared Distribution, determined by the number of failures and confidence level
N = Total Number of units from HTRB and HTGB tests
H = Duration of HTRB/HTGB testing
Af = Acceleration Factor from Test to Use Conditions (Ea = 0.7eV and Tuse = 55°C)
Acceleration Factor [Af] = Exp [Ea / k (1/Tj u – 1/Tj s)]
Acceleration Factor ratio list:
55 deg C
70 deg C
85 deg C
100 deg C
115 deg C
Af
258
87
32
13
5.64
Tj s = Stressed junction temperature in degree (Kelvin), K = C+273.16
Tj u = The use junction temperature in degree (Kelvin), K = C+273.16
-5
K = Boltzmann’s constant, 8.617164 X 10 eV / K
130 deg C
150 deg C
2.59
1