Reliability Report

AOS Semiconductor
Product Reliability Report
AO8807
rev A
Plastic Encapsulated Device
ALPHA & OMEGA Semiconductor, Inc
495 Mercury Drive
Sunnyvale, CA 94085
U.S.
Tel: (408) 830-9742
www.aosmd.com
1
This AOS product reliability report summarizes the qualification result for AO8807. Accelerated
environmental tests are performed on a specific sample size, and then followed by electrical test
at end point. Review of final electrical test result confirms that AO8807 passes AOS quality and
reliability requirements. The released product will be categorized by the process family and be
monitored on a quarterly basis for continuously improving the product quality.
Table of Contents:
I.
II.
III.
IV.
Product Description
Package and Die information
Environmental Stress Test Summary and Result
Reliability Evaluation
I. Product Description:
The AO8807 uses advanced trench technology to provide excellent RDS(ON), low gate charge and
operation with gate voltages as low as 1.8V. This device is suitable for use as a load switch.
-RoHS Compliant
-Halogen Free
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II. Die / Package Information:
Process
Package Type
Lead Frame
Die Attach
Bond wire
Mold Material
Flammability Rating
Backside Metallization
Moisture Level
AO8807
Standard sub-micron
Low voltage P channel process
TSSOP-8
Cu, D/pad, Ag spot
Ag epoxy
2 mils Au wire
Epoxy resin with silica filler
UL-94 V-0
Ti / Ni / Ag
Up to Level 1 *
Note * based on info provided by assembler and mold compound supplier
III. Result of Reliability Stress for AO8807
Test Item
Test Condition
Time
Point
Lot Attribution
Solder
Reflow
Precondition
HTGB
168hr 85°°c /85RH +3
cycle [email protected]°°c
-
3 lots
Temp = 150°°c ,
Vgs=100% of Vgsmax
168hrs
500 hrs
1000 hrs
1 lot
Temp = 150°°c ,
Vds=80% of Vdsmax
168hrs
500 hrs
1000 hrs
130 +/- 2°°c , 85%RH,
33.3 psi, Vgs = 80% of
Vgs max
100 hrs
121°°c , 29.7psi,
RH=100%
96 hrs
-65°°c to 150°°c ,
air to air,
250 / 500
cycles
(Note A*)
HTRB
0
77 pcs
0
77 pcs / lot
77 pcs
0
77 pcs / lot
165 pcs
0
55 pcs / lot
165 pcs
0
55 pcs / lot
165 pcs
0
3 lots
(Note B**)
Temperature
Cycle
495 pcs
3 lots
(Note B**)
Pressure Pot
Number of
Failures
1 lot
(Note A*)
HAST
Total
Sample
size
3 lots
(Note B**)
55 pcs / lot
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III. Result of Reliability Stress for AO8807
Continues
DPA
Internal Vision
Cross-section
X-ray
CSAM
NA
5
5
5
5
5
5
0
NA
5
5
0
Bond Integrity
Room Temp
150°°c bake
150°°c bake
0hr
250hr
500hr
40
40
40
40 wires
40 wires
40 wires
0
Solderability
245°°c
5 sec
15
15 leads
0
Note A: The HTGB and HTRB reliability data presents total of available AO8807 burn-in data up
to the published date.
Note B: The pressure pot, temperature cycle and HAST reliability data for AO8807 comes from
the AOS generic package qualification data.
IV. Reliability Evaluation
FIT rate (per billion): 46
MTTF = 2478 years
The presentation of FIT rate for the individual product reliability is restricted by the actual burn-in
sample size of the selected product (AO8807). Failure Rate Determination is based on JEDEC
Standard JESD 85. FIT means one failure per billion hours.
2
9
9
Failure Rate = Chi x 10 / [2 (N) (H) (Af)] = 1.83 x 10
9
7
MTTF = 10 / FIT = 2.17 x 10 hrs = 2478 years
/ [2x2x77x500x258] = 46
Chi² = Chi Squared Distribution, determined by the number of failures and confidence interval
N = Total Number of units from HTRB and HTGB tests
H = Duration of HTRB/HTGB testing
Af = Acceleration Factor from Test to Use Conditions (Ea = 0.7eV and Tuse = 55°C)
Acceleration Factor [Af] = Exp [Ea / k (1/Tj u – 1/Tj s)]
Acceleration Factor ratio list:
Af
55 deg C
70 deg C
85 deg C
100 deg C
115 deg C
130 deg C
150 deg C
258
87
32
13
5.64
2.59
1
Tjs = Stressed junction temperature in degree (Kelvin), K = C+273.16
Tju =The use junction temperature in degree (Kelvin), K = C+273.16
k = Boltzmann’s constant, 8.617164 X 10-5eV/K
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