AOS Semiconductor Product Reliability Report AO8808A/AO8808AL, rev A Plastic Encapsulated Device ALPHA & OMEGA Semiconductor, Inc 495 Mercury Drive Sunnyvale, CA 94085 U.S. Tel: (408) 830-9742 www.aosmd.com 1 This AOS product reliability report summarizes the qualification result for AO8808A/L. Accelerated environmental tests are performed on a specific sample size, and then followed by electrical test at end point. Review of final electrical test result confirms that AO8808A/Lpasses AOS quality and reliability requirements. The released product will be categorized by the process family and be monitored on a quarterly basis for continuously improving the product quality. Table of Contents: I. II. III. IV. Product Description Package and Die information Environmental Stress Test Summary and Result Reliability Evaluation I. Product Description: The AO8808A uses advanced trench technology to provide excellent RDS(ON), low gate charge and operation with gate voltages as low as 1.8V while retaining a 12V VGS(MAX) rating. It is ESD protected. Standard Product AO8808A is Pb-free (meets ROHS & Sony 259 specifications). AO8808A and AO8808AL are electrically identical. -RoHS Compliant -AO8808AL is Halogen Free 2 II. Die / Package Information: Process Package Type Lead Frame Die Attach Bond wire Mold Material Flammability Rating Backside Metallization Moisture Level AO8808A AO8808AL (Green Compound) Standard sub-micron Low voltage N channel process TSSOP-8 Cu, D/pad, Ag spot Ag epoxy S: Cu 2 mils; G: Au, 1mil Epoxy resin with silica filler UL-94 V-0 Ti / Ni / Ag Up to Level 1 * Standard sub-micron low voltage N channel process TSSOP-8 Cu, D/pad, Ag spot Ag epoxy S: Cu 2 mils; G: Au, 1mil Epoxy resin with silica filler UL-94 V-0 Ti / Ni / Ag Up to Level 1* Note * based on info provided by assembler and mold compound supplier III. Result of Reliability Stress for AO8808A (Standard) & AO8808AL (Green) Test Item Test Condition Time Point Solder Reflow Precondition Standard: 1hr PCT+3 cycle reflow@260°°c Green: 168hr 85°°c /85RH +3 cycle reflow@260°°c Temp = 150°°c , Vgs=100% of Vgsmax - HTGB HTRB Temp = 150°°c , Vds=80% of Vdsmax 168hrs 500 hrs 1000 hrs 168hrs 500 hrs 1000 hrs HAST 130 +/- 2°°c , 85%RH, 33.3 psi, Vgs = 80% of Vgs max 100 hrs Pressure Pot 121°°c , 29.7psi, RH=100% 96 hrs Temperature Cycle -65°°c to 150°°c , air to air, 250 / 500 cycles Lot Attribution Standard: 11 lots Green: 4 lots 1 lot 2 lots (Note A*) Total Sample size 1705 pcs 0 241 pcs 0 77 pcs / lot 241 pcs 1 lot 2 lots (Note A*) Number of Failures 0 77 pcs / lot Standard: 6 lots Green: 4 lots 550 pcs 0 (Note B**) Standard: 11 lots Green: 4 lots 55 pcs / lot 825 pcs 0 (Note B**) Standard: 3 lots Green: 3 lots 55 pcs / lot 330 pcs 0 (Note B**) 55 pcs / lot 3 III. Result of Reliability Stress for AO8808A (Standard) & AO8808AL (Green) Continues DPA Internal Vision Cross-section X-ray CSAM NA 5 5 5 5 5 5 0 NA 5 5 0 Bond Integrity Room Temp 150°°c bake 150°°c bake 0hr 250hr 500hr 40 40 40 40 wires 40 wires 40 wires 0 Solderability 245°°c 5 sec 15 15 leads 0 Note A: The HTGB and HTRB reliability data presents total of available AO8808A/L burn-in data up to the published date. Note B: The pressure pot, temperature cycle and HAST reliability data for AO8808A/L comes from the AOS generic package qualification data. IV. Reliability Evaluation FIT rate (per billion): 9 MTTF = 12392 years The presentation of FIT rate for the individual product reliability is restricted by the actual burn-in sample size of the selected product (AOB414). Failure Rate Determination is based on JEDEC Standard JESD 85. FIT means one failure per billion hours. 2 9 9 Failure Rate = Chi x 10 / [2 (N) (H) (Af)] = 1.83 x 10 9 8 MTTF = 10 / FIT = 1.09 x 10 hrs = 12392 years / [2x (4x77x500+2x77x1000) x258] = 9 Chi² = Chi Squared Distribution, determined by the number of failures and confidence interval N = Total Number of units from HTRB and HTGB tests H = Duration of HTRB/HTGB testing Af = Acceleration Factor from Test to Use Conditions (Ea = 0.7eV and Tuse = 55°C) Acceleration Factor [Af] = Exp [Ea / k (1/Tj u – 1/Tj s)] Acceleration Factor ratio list: Af 55 deg C 70 deg C 85 deg C 100 deg C 115 deg C 130 deg C 150 deg C 258 87 32 13 5.64 2.59 1 Tjs = Stressed junction temperature in degree (Kelvin), K = C+273.16 Tju =The use junction temperature in degree (Kelvin), K = C+273.16 k = Boltzmann’s constant, 8.617164 X 10-5eV/K 4