AOS Semiconductor Product Reliability Report AO9926B/AO9926BL, rev A Plastic Encapsulated Device ALPHA & OMEGA Semiconductor, Inc 495 Mercury Drive Sunnyvale, CA 94085 U.S. Tel: (408) 830-9742 www.aosmd.com Mar 21, 2005 1 PDF 文件使用 "pdfFactory Pro" 试用版本创建 www.fineprint.com.cn This AOS product reliability report summarizes the qualification result for AO9926B. Accelerated environmental tests are performed on a specific sample size, and then followed by electrical test at end point. Review of final electrical test result confirms that AO9926B passes AOS quality and reliability requirements. The released product will be categorized by the process family and be monitored on a quarterly basis for continuously improving the product quality. Table of Contents: I. II. III. IV. V. Product Description Package and Die information Environmental Stress Test Summary and Result Reliability Evaluation Quality Assurance Information I. Product Description: The AO9926B uses advanced trench technology to provide excellent RDS(ON), low gate charge and operation with gate voltages as low as 1.8V while retaining a 12V VGS(MAX) rating. This device is suitable for use as a uni-directional or bi-directional load switch. AO9926BL (Green Product) is offered in a lead-free package. Absolute Maximum Ratings TA=25°C unless otherwise noted Parameter Symbol Maximum Units Drain-Source Voltage VDS 20 V Gate-Source Voltage VGS ±12 V TA=25°C Continuous Drain Current G TA=70°C Pulsed Drain Current C TA=25°C B Power Dissipation TA=70°C Junction and Storage Temperature Range Thermal Characteristics Parameter Maximum Junction-toAmbient Maximum Junction-toAmbient Maximum Junction-to-Lead 7.6 ID 6.1 IDM 30 A 2 PD W 1.28 T J, TSTG Symbol T ≤ 10s SteadyState SteadyState °C -55 to 150 RθJA RθJL Typ Max Units 48 62.5 °C/W 74 110 °C/W 35 50 °C/W 2 PDF 文件使用 "pdfFactory Pro" 试用版本创建 www.fineprint.com.cn II. Die / Package Information: Process Package Type Lead Frame Die Attach Bond wire Mold Material Filler % (Spherical/Flake) Flammability Rating Backside Metallization Moisture Level AO9926B AO9926BL (Green Compound) Standard sub-micron low voltage N channel process 8 leads SOIC Copper with Solder Plate Ag epoxy Au 2mils Epoxy resin with silica filler 50/50 UL-94 V-0 Ti / Ni / Ag Up to Level 1 * Standard sub-micron low voltage N channel process 8 leads SOIC Copper with Solder Plate Ag epoxy Au 2 mils Epoxy resin with silica filler 100/0 UL-94 V-0 Ti / Ni / Ag Up to Level 1* Note * based on info provided by assembler and mold compound supplier III. Result of Reliability Stress for AO9926B (Standard) & AO9926BL (Green) Test Item Test Condition Time Point Lot Attribution Total Sample size Solder Reflow Precondition HTGB Normal: 1hr PCT+3 cycle IR reflow@240 °c (260°c for Green) Temp = 150 C, Vgs=100% of Vgsmax 0hr Normal: 73 lots Green: 22 lots 13475 pcs 168 / 500 hrs Normal: 2 lots 164pcs 1000 hrs (Note A*) 168 / 500 hrs Normal: 2 lots 1000 hrs (Note A*) 100 hrs Normal: 47 lots Green: 16 lots HTRB HAST Pressure Pot Temperature Cycle Temp = 150 C, Vds=80% of Vdsmax 130 +/- 2 C, 85%, 33.3 psi, Vgs = 80% of Vgs max 121 C, 15+/-1 PSIG, RH=100% -65 to 150 deg C, air to air, 0.5hr per cycle 96 hrs 250 / 500 cycles (Note B**) Normal: 67 lots Green: 20 lots (Note B**) Normal: 73 lots Green: 22 lots (Note B**) Number of Failures 0 0 77+5 pcs / lot 164pcs 0 77+5 pcs / lot 3465 pcs 0 50+5 pcs / lot 4785 pcs 0 50+5 pcs / lot 5225 pcs 0 50+5 pcs / lot 3 PDF 文件使用 "pdfFactory Pro" 试用版本创建 www.fineprint.com.cn III. Result of Reliability Stress for AO9926B (Standard) & AO9926BL (Green) Continues DPA Internal Vision Cross-section X-ray CSAM NA 5 5 5 5 5 5 0 NA 5 5 0 Bond Integrity Room Temp 150°C bake 150°C bake 0hr 250hr 500hr 40 40 40 40 wires 40 wires 40 wires 0 Solderability 230°C 5 sec 15 15 leads 0 Die shear 150°C 0hr 10 10 0 Note A: The HTGB and HTRB reliability data presents total of available AO9926B and AO9926BL burn-in data up to the published date. Note B: The pressure pot, temperature cycle and HAST reliability data for AO9926BL comes from the AOS generic green compound package qualification data. IV. Reliability Evaluation FIT rate (per billion): 11 MTBF = 10569 years 500 hrs of HTGB, 150 deg C accelerated stress testing is equivalent to 15 years of lifetime at 55 deg C operating conditions (by applying the Arrhenius equation with an activation energy of 0.7eV and 60% of upper confidence level on the failure rate calculation). AOS reliability group also routinely monitors the product reliability up to 1000 hr at and performs the necessary failure analysis on the units failed for reliability test(s). The presentation of FIT rate for the individual product reliability is restricted by the actual burn-in sample size of the selected product (AO9926B). Failure Rate Determination is based on JEDEC Standard JESD 85. FIT means one failure per billion hours. Failure Rate = Chi2 x 109 / [2 (N) (H) (Af)] = 1.83 x 10 9 / [2 (2×164) (1000) (258)] = 11 9 7 MTBF = 10 / FIT = 9.2x 10 hrs = 10569years Chi² = Chi Squared Distribution, determined by the number of failures and confidence interval N = Total Number of units from HTRB and HTGB tests H = Duration of HTRB/HTGB testing Af = Acceleration Factor from Test to Use Conditions (Ea = 0.7eV and Tuse = 55C) Acceleration Factor [Af] = Exp [Ea / k ( 1/Tj u – 1/Tj s )] Acceleration Factor ratio list: Af 55 deg C 70 deg C 85 deg C 100 deg C 115 deg C 130 deg C 150 deg C 258 87 32 13 5.64 2.59 1 Tj s = Stressed junction temperature in degree (Kelvin), K = C+273.16 Tj u =The use junction temperature in degree (Kelvin), K = C+273.16 k = Boltznan’s constant, 8.617164 X 10 E-5V / K 4 PDF 文件使用 "pdfFactory Pro" 试用版本创建 www.fineprint.com.cn V. Quality Assurance Information Acceptable Quality Level for outgoing inspection: 0.1% for electrical and visual. Guaranteed Outgoing Defect Rate: < 25 ppm Quality Sample Plan: conform to Mil-Std-105D Contacts: Wei Liu, Engineer of Failure Analysis and Reliability [email protected] Fred Chang, Manager of Failure Analysis and Reliability [email protected] Wilson Ma, Senior Director of Quality Assurance [email protected] 5 PDF 文件使用 "pdfFactory Pro" 试用版本创建 ÿwww.fineprint.com.cn